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2.9inch e-Paper B V3 数据手册(2.9inch-e-apepr-b-v3-specification).pdf

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1. General Description
1.1 Overview
1.2 Features
1.3 Mechanical Specifications
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Product Specifications Customer Description Model Name Date Revision Standard 2.9” E-PAPER DISPLAY 2.9inch e-Paper (B) 2020/02/10 3.1 Waveshare Electronics 10F, International Science & Technology Building, Fuhong Rd, Futian District, Shenzhen, China 2.9inch e-Paper BRev3.11/50
Table of Contents 1. General Description.................................................... 1.1 Overview............................................................ 1.2 Feature .............................................................. 1.3 Mechanical Specification........................................ 1.4 Mechanical Drawing of EPD module ....................... 1.5 Input/Output Terminals........................................ 1.6 Reference Circuit ................................................ 2. Environmental............................................................ 2.1 Handling, Safety and Environmental Requirements... 2.2 Reliability test..................................................... 3. Electrical Characteristics ............................................. 3.1 Absolute maximum rating..................................... 3.2 DC Characteristics.............................................. 3.3 Serial Peripheral Interface Timing ......................... 3.4 Power Consumption.............................................. 4 4 4 4 5 6 8 9 9 11 12 12 13 14 14 3.5 MCU Interface..................................................... 15 4. Typical Operating Sequence......................................... 18 4.1 Normal Operation Flow......................................... 18 5. Command Table......................................................... 19 6. Temperature Range ................................................... 42 7. Panel Break Check ..................................................... 44 8. Optical characteristics................................................. 45 8.1 Specifications .................................................... 45 8.2 Definition of contrast ratio................................... 46 8.3 Reflection Ratio.................................................. 46 9. Point and line standard............................................... 47 10. Packing................................................................... 49 11. Precautions .............................................................. 50 2.9inch e-Paper BRev3.12/50
Version 3.1 Content New release Date Producer 2020/1/16 2.9inch e-Paper BRev3.13/50
1. General Description 1.1 Overview This display is an Active Matrix Electrophoretic Display (AMEPD), with interface and a reference system design. The 2.9” active area contains 128×296 pixels, and has 1-bit B/W/R full display capabilities. An integrated circuit contains gate buffer, source buffer, interface, timing control logic, oscillator, DC- DC. SRAM.LUT, VCOM and border are supplied with each panel. 1.2 Features  128×296 pixels display  High contrast  High reflectance  Ultra wide viewing angle  Ultra low power consumption  Pure reflective mode  Bi-stable display  Commercial temperature range  Landscape, portrait modes  Hard-coat antiglare display surface  Ultra Low current deep sleep mode  On chip display RAM  Waveform stored in On-chip OTP  Serial peripheral interface available  On-chip oscillator  On-chip booster and regulator control for generating VCOM, Gate and Source driving voltage  I2C signal master interface to read external temperature sensor/built-in temperature sensor 1.3 Mechanical Specifications Parameter Screen Size Display Resolution Active Area Pixel Pitch Specifications 2.9 128(H)×296(V) 29.06(H)×66.90(V) 0.227×0.226 Unit Inch Pixel mm mm Remark Dpi:112 Pixel Configuration Outline Dimension 36.7(H)×79.0(V) ×1.15(D) mm g Rectangle Weight 3.0±0.2 2.9inch e-Paper BRev3.14/50
1.4 Mechanical Drawing of EPD module E T A D N O I T P I R C S E D : : e t a D d e m r i f n o c 0 A W E I V M O T T O B W E I V E D I S * 2 . 0 ± 0 7 . 6 3 D O T F T W E I V T N O R F : e r u t a n g i S C N R D G E S E R C N 2 H S V L C S T A D S T 1 S B Y S U B L A N G I S # S E R # C D / # S C L C S A D S I O D D V I C V S S V D D V P P V M O C V 1 H S HV G V L S LV G V N 0 1234567891 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 1 0 2 1 2 2 2 3 2 4 2 I P 线 位 对 色 白 印 丝 , a e r A g n i d n e B s s e c o r p t f o s e t i h w t n i r p e n i l k r a m 8.46 6.49 2 . 0 = T r e n e f f i t s I P 7.55 * 14.30 15.51 . 5 0 0 ± 0 5 . 0 ) S S A L G ( T F T * . 1 0 ± 5 0 . 1 l a t o T 0 1 0 . m l i f - t i l p S g n i l a e S e g d E e u l G - n o c i l i S 3 0 . 0 ± 0 1 . 0 C P F * 3 0 . r e n e f f i t s I P + C P F 0 ± 0 3 . 0 s s e n k c i T l a t o T C I 0 8 2 1 . 2pcs V C O M ?1.70 * 4 5 1 1 . 6 6 . 2 1 " A " 2 8 . 3 * 1 . 0 ± 6 0 . 9 2 A A T F T 3.00 * TFT AA 66.90±0.1 * TFT OD 79.00±0.2 * * ** 5 0 2 . 3 0 . 0 ± 5 1 . 0 4 2 3 0 . 0 ± 0 5 . 0 ± 0 5 2 1 . 0 ± 0 5 1 1 . . 0 1 * 3.50±0.2 1 : T E E H S 6 0 . 8 0 . 9 1 0 2 . : E T A D N O I T C E J O R P : R E B M U N L E D O M E T A D m m : S T I N U L L A : O N R E M O T S U C N / P 6 1 . 1 . 0 2 0 2 : N W D : K H C : P P A 3.32 3.33 2.40 ) 1 : 1 ( " A " L A T E D 0 7 . 1 ? d r a d n a t s S H O R e h t o t m r o f n o c l a i r e t a M . 7 l ; 0 2 . 0 ± : e c n a r e o T d e i f i c e p s n U . 6 e z i s l o r t n o c s u c o f e h t s a * . 8 3.50 6.00±0.2 0 5 0 0 0 8 . . . 2 5 7 ; D P E R O F Y E R R A " 9 . 2 E D O M Y L A P S I D . 1 ; ; e t a g 6 9 2 X e c r u o s 8 2 1 : N O I T U L O S E R . 3 m m 6 2 2 . 0 X m m 7 2 2 . 0 : e z i s l e x p . 4 i ; D 1 5 1 8 C U : C I E V I R D . 2 2 1 1 : I P D . 5 : S E T O N 2.9inch e-Paper BRev3.15/50
1.5 Input/Output Terminals Pin # Single Description BONDING PIN Remark No connection and do not connect with other NC pins Keep Open N-Channel MOSFET Gate Drive Control Current Sense Input for the Control Loop B P NC GDR RESE NC No connection and do not connect with other NC pins Keep Open VDHR Positive Source driving voltage TSCL I2C Interface to digital temperature sensor Clock pin TSDA I2C Interface to digital temperature sensor Date pin BS BUSY_N RST_N DC CSB SCL SDA Bus selection pin Busy state output pin Reset Data /Command control pin Chip Select input pin serial clock pin (SPI) serial data pin (SPI) VDDIO Power for interface logic pins Note 1.5-5 Note 1.5-4 Note 1.5-3 Note 1.5-2 Note 1.5-1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 VCI GND VDD VPP 20 VDH(VSH) 21 VGH 22 VDL(VSL) 23 24 VGL VCOM B P Power Supply pin for the chip Ground Core logic power pin Power Supply for OTP Programming Positive source driver Voltage Positive Gate driving voltage Negative Source driving voltage Negative Gate voltage. VCOM driving voltage BONDING PIN 2.9inch e-Paper BRev3.16/50
Note 1.5-1: This pin (CSB) is the chip select input connecting to the MCU. The chip is enabled for MCU communication: only when CSB is pulled LOW. Note 1.5-2: This pin (DC) is Data/Command control pin connecting to the MCU. When the pin is pulled HIGH, the data will be interpreted as data. When the pin is pulled LOW, the data will be interpreted as command. Note 1.5-3: This pin (RST_N) is reset signal input. The Reset is active low. Note 1.5-4: This pin (BUSY_N) is Busy state output pin. When Busy_N is low operation of chip should not be interrupted and any commands should not be issued to the module. The driver IC will put Busy_N pin low en the driver IC is working such as: - Outputting display waveform; or - Communicating with digital temperature sensor Note 1.5-5: This pin (BS) is for 3-line SPI or 4-line SPI selection. When it is “Low”, 4-line SPI is selected. When it is “High”, 3-line SPI (9 bits SPI) is selected. 2.9inch e-Paper BRev3.17/50
1.6 Reference Circuit 2.9inch e-Paper BRev3.18/50
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