BTA24-600B_datasheet(BTA24-600B_datasheet).pdf-资料库

BTA24, BTB24, BTA25, BTA26 and T25 series 25 A Triacs A2 A1 G A2 A1 A2 G TO-220AB (BTB24) A1 A2 G TO-220AB Insulated (BTA24) A1 G A2 A1 A2 G RD91 (BTA25) TOP3 Insulated (BTA26) A2 A1 A2 G D2PAK (T25-G) Snuberrless™ and Standard Main features Symbol IT(RMS) VDRM/VRRM IGT (Q1) Value 25 600 and 800 35 to 50 Unit A V mA Description Available either in through-hole or surface-mount packages, the BTA24, BTB24, BTA25, BTA26 and T25 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers, ... The snubberless versions (BTA/BTB...W and T25 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500VRMS) complying with UL standards (File ref.: E81734). Order codes Part Number Marking BTA24-xxxxxRG BTB24-xxxxxRG BTA25-xxxxxRG BTA26-xxxxxRG T25xx-xxxG T25xx-xxxG-TR See Table 6 on page 6 TM: Snubberless is a trademark of STMicroelectronics July 2006 Rev 9 1/12 www.st.com 12

Characteristics BTA24, BTB24, BTA25, BTA26 and T25 series 1 Characteristics Table 1. Absolute maximum ratings Symbol Parameter Value Unit IT(RMS) RMS on-state current (full sine wave) ITSM I²t dI/dt VDSM/VRSM IGM PG(AV) Tstg Tj Non repetitive surge peak on-state current (full cycle, Tj initial = 25° C) I²t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Non repetitive surge peak off-state voltage Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range D2PAK / TO-220AB RD91 / TOP3 Ins. TO-220AB Ins. F = 50 Hz F = 60 Hz tp = 10 ms Tc = 100° C Tc = 90° C Tc = 75° C t = 20 ms t = 16.7 ms F = 120 Hz Tj = 125° C tp = 10 ms tp = 20 µs Tj = 25° C Tj = 125° C Tj = 125° C 25 A 250 260 340 50 VDSM/VRSM + 100 4 1 - 40 to + 150 - 40 to + 125 A A²s A/µs V A W ° C Table 2. Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless™ and Logic Level (3 quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W Symbol Test Conditions Quadrant T25 BTA/BTB T2535 CW BW 50 75 80 100 1000 22 Unit mA V V mA mA V/µs A/ms (1) IGT VGT VGD (2) IH VD = 12 V RL = 33 Ω VD = VDRM RL = 3.3 kΩ Tj = 125° C IT = 500 mA IL IG = 1.2 IGT (2) dV/dt (dI/dt)c VD = 67 %VDRM gate open (2) Without snubber I - II - III I - II - III MAX. MAX. 35 I - II - III MIN. MAX. MAX. I - III II Tj = 125° C MIN. Tj = 125° C MIN. 50 70 80 500 13 35 1.3 0.2 50 70 80 500 13 1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. 2/12

BTA24, BTB24, BTA25, BTA26 and T25 series Characteristics Table 3. Electrical characteristics (Tj = 25° C, unless otherwise specified), Standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B Symbol Test Conditions Quadrant Value (1) IGT VGT VGD (2)) IH VD = 12 V RL = 33 Ω VD = VDRM RL = 3.3 kΩ Tj = 125° C IT = 500 mA IL IG = 1.2 IGT dV/dt(2) (dV/dt)c (2) VD = 67 %VDRM gate open (dI/dt)c = 13.3 A/ms 1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. Table 4. Static characteristics I - II - III - IV MAX. ALL ALL I - III - IV II Tj = 125° C Tj = 125° C MAX. MIN. MAX. MAX. MIN. MIN. 50 100 1.3 0.2 80 70 160 500 10 Unit mA V V mA mA V/µs V/µs Symbol Test Conditions Value Unit (1) VT Vt0 Rd (1) (1) ITM = 35 A tp = 380 µs Threshold voltage Dynamic resistance IDRM IRRM VDRM = VRRM 1. for both polarities of A2 referenced to A1. Table 5. Thermal resistance Tj = 25° C Tj = 125° C Tj = 125° C Tj = 25° C Tj = 125° C MAX. MAX. MAX. MAX. 1.55 0.85 16 5 3 V V mΩ µA mA Symbol Parameter Value Unit Rth(j-c) Junction to case (AC) RD91 (Insulated) / TOP3 Insulated D2PAK / TO-220AB Rth(j-a) Junction to ambient 1. S = Copper surface under tab. (1)S = 1 cm² TO-220AB Insulated D2PAK TOP3 Insulated TO-220AB / TO-220AB Insulated 0.8 1.1 1.7 45 50 60 ° C/W ° C/W 3/12

Characteristics BTA24, BTB24, BTA25, BTA26 and T25 series Figure 1. Maximum power dissipation versus Figure 2. RMS on-state current (full cycle) RMS on-state current versus case temperature (full cycle) P(W) 30 25 20 15 10 5 0 I T(RMS) (A) I T(RMS) (A) 30 25 20 15 10 5 0 BTB / T25 BTA24 BTA25 / BTA26 T (°C) C 0 5 10 15 20 25 0 25 50 75 100 125 Figure 3. D2PAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) Figure 4. Relative variation of thermal impedance versus pulse duration I T(RMS) (A) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 K=[Z /Rth th] 1E+0 Zth(j-c) 2 D PAK 2 (S=1cm ) 1E-1 1E-2 1E-3 Z th(j-a) BTA / BTB24 / T25 Z th(j-a) BTA26 t (s)p T amb (°C) 0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 5. On-state characteristics Figure 6. (maximum values) Surge peak on-state current versus number of cycles I TM (A) j T max. to d V = 0.85V Ω R = 16 m 300 100 10 1 T =j T max. j T = 25°C . j V (V) TM I TSM (A) 300 250 200 150 100 50 0 t=20ms One cycle Non repetitive T initial=25°C j Repetitive T =75°C C Number of cycles 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1 10 100 1000 4/12

BTA24, BTB24, BTA25, BTA26 and T25 series Characteristics Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t Figure 8. Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) I 3000 1000 TSM 2 (A), I t (A s) 2 dI/dt limitation: 50A/µs T initial=25°C j ITSM I t2 t (ms) p I GT H L j ,I [T ] / ,I I GT H L j ,I [T =25°C] ,I IGT IH & IL T (°C) j 2.5 2.0 1.5 1.0 0.5 0.0 100 0.01 Figure 9. 0.10 1.00 10.00 -40 -20 0 20 40 60 80 100 120 140 Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (dI/dt)c [T ] / j (dI/dt)c [T sj pecified] T (°C) j 0 25 50 75 100 125 (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 B T2535/CW/BW (dV/dt)c (V/µs) 0.1 1.0 10.0 100.0 6 5 4 3 2 1 0 Figure 11. D2PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) 80 70 60 50 40 30 20 10 0 R th(j-a) (°C/W) D PAK2 S(cm²) 0 4 8 12 16 20 24 28 32 36 40 5/12

Ordering information scheme BTA24, BTB24, BTA25, BTA26 and T25 series 2 Ordering information scheme Figure 12. BTA and BTB series BT A 24 - 600 BW RG Triac series Insulation A = insulated B = non insulated Current 24 = 25A in TO-220AB 25 = 25A in RD91 26 = 25A in TOP3 Voltage 600 = 600V 800 = 800V Sensitivity and type B = 50mA Standard CW = 35mA Packing mode RG = Tube Snubberless BW = 50mA Snubberless Figure 13. T25 series T 25 35 - 600 G (-TR) Triac series Current 25 = 25A Sensitivity 35 = 35mA Voltage 600 = 600V 800 = 800V Package G = D PAK Packing mode Blanck = Tube -TR = Tape & Reel 2 Table 6. Product Selector Part Numbers BTA24-xxxBRG BTA/BTB(1)24-xxxBWRG BTA/BTB(1)24-xxxCWRG BTA25-xxxBRG BTA25-xxxBWRG BTA25-xxxCWRG BTA26-xxxBRG BTA26-xxxBWRG BTA26-xxxCWRG T2535-xxxG Voltage (xxx) 600 V 800 V Sensitivity Type Package X X X X X X X X X X X X X X X X X X X X 50 mA 50 mA 35 mA 50 mA 50 mA 35 mA 50 mA 50 mA 35 mA 35 mA Standard TO-220AB Snubberless TO-220AB Snubberless TO-220AB Standard Snubberless Snubberless RD91 RD91 RD91 Standard TOP3 Ins. Snubberless TOP3 Ins. Snubberless TOP3 Ins. Snubberless D2PAK 1. BTB: non insulated TO-220AB package 6/12

BTA24, BTB24, BTA25, BTA26 and T25 series Package information 3 Package information Table 7. D2PAK Package dimensions L2 L L3 E G A C2 D A1 B2 B C R A2 2mm min. FLAT ZONE V2 DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A A1 A2 B B2 C C2 D E G L L2 L3 R V2 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 4.60 0.169 2.69 0.098 0.23 0.001 0.93 0.027 1.40 0.048 0.055 0.60 0.017 1.36 0.047 9.35 0.352 10.28 0.393 5.28 0.192 15.85 0.590 1.40 0.050 1.75 0.055 0.181 0.106 0.009 0.037 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.40 0.016 0° 8° 0° 8° Figure 14. D2PAK Foot Print Dimensions (in millimeters) 16.90 10.30 5.08 1.30 8.90 3.70 7/12

Package information BTA24, BTB24, BTA25, BTA26 and T25 series Table 8. RD91 Package dimensions L2 A2 L1 B2 C C2 N2 E3 B1 A1 C1 N1 B F I A DIMENSIONS REF. Millimeters Inches Min. Max. Min. Max. A A1 A2 B B1 B2 C C1 C2 E3 F I L1 L2 N1 N2 40.00 30.30 22.00 27.00 16.50 24.00 14.00 3.50 3.00 0.90 4.50 29.90 13.50 1.95 0.70 4.00 1.177 0.531 1.575 1.193 0.867 1.063 0.650 0.945 0.551 0.138 0.077 0.118 0.027 0.157 0.035 0.177 11.20 13.60 0.441 0.535 3.10 1.70 33° 28° 3.50 1.90 43° 38° 0.122 0.067 0.138 0.075 33° 28° 43° 38° 8/12

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