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2.13inch e-Paper V3 数据手册(2.13inch_e-Paper_V3_Specificition).pdf
Product Specifications
Customer
Description
Model Name
Date
Revision
Standard
2.13” E-PAPER DISPLAY
2.13inch e-Paper
2022/02/22
3.0
2.13inch e-Paper V31 / 34
Revision History
Version
3.0
Content
New release
Date
Producer
2022/02/22
2.13inch e-Paper V32 / 34
CONTENTS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
5
Over
View...............................................................................
5
Features
...............................................................................
5
Mechanical Specification...........................................................
6
Mechanical Drawing of EPD Module............................................
7
Input/output Pin Assignment....................................................
Electrical Characteristics........................................................... 8
6.1 Absolute Maximum Rating................................................... 8
6.2 Panel DC Characteristics..................................................... 9
6.3 Panel DC Characteristics(Driver IC Internal Regulators)..........
10
6.4 Panel AC Characteristics.....................................................
10
6.4.1 MCU Interface Selection...............................................
10
6.4.2 MCU Serial Interface (4-wire SPI)..................................
10
6.4.3 MCU Serial Interface (3-wire SPI)..................................
12
6.4.4 Interface Timing.........................................................
13
Command Table......................................................................
15
Optical Specification................................................................
23
Handling, Safety, and Environment Requirements.......................
23
Reliability Test........................................................................
24
2.13inch e-Paper V33 / 34
11.
12.
13.
14.
15.
16.
Block Diagram........................................................................
Typical Application Circuit with SPI Interface...............................
Typical Operating Sequence......................................................
13.1
Normal Operation Flow.....................................................
13.2 Normal Operation Reference Program Code.........................
Inspection condition................................................................
14.1 Environment...................................................................
14.2 Illuminance.....................................................................
14.3 Inspect method...............................................................
14.4 Display area....................................................................
14.5 Inspection standard.........................................................
14.5.1 Electric inspection standard........................................
14.5.2 Appearance inspection standard..................................
Packaging..............................................................................
Precautions............................................................................
25
26
27
27
28
29
29
29
29
30
30
30
31
33
34
2.13inch e-Paper V34 / 34
1.
View
Over
This display is
and
a
1-bit
interface
imagesat
contains 250×122
display,
interface,
used
in
withintegrated
timingcontroller,
portableelectronic
an
Active
Matrix
reference
white,
pixels.
black
The
system
full
module
design.
display
is
including
circuits
Electrophoretic
The
display
capabilities.
TFT-array
a
gate
capable
(AM
Display
is
to
The 2.13inch
driving
EPD),
display
active
with
area
electrophoresis
MCU
can
Module
driver,
be
oscillator,
DC-DC,
SRAM,
LUT,
VCOM.
devices,
such as
Electronic
Shelf
Label
(ESL)
System.
driver,
source
low
power
consumption
Features
display
2.
◆250×122
pixels
reflectance
contrast
High
◆High
◆Ultra
wide
angle
viewing
Ultra
◆Pure
reflective
mode
◆Bi-stable
display
temperature
◆Commercial
range
◆Landscape
portrait
modes
antiglare
◆Hard-coat
display
current
deep
◆Ultra
Low
◆On
RAM
display
chip
stored
can
◆Waveform
in
On-chip
◆Serial
peripheral
interface
oscillator
◆On-chip
◆On-chip booster and regulator control for generating VCOM, Gate and Source driving voltage
surface
mode
sleep
OTP
available
written
MCU
by
or
2
◆I
C signal master interface to read external temperature sensor
◆Built-in
temperature
sensor
◆Support partial update mode
3. Mechanical Specification
Parameter
Screen Size
Display Resolution
Active Area
Pixel Pitch
Pixel Configuration
Outline Dimension
Weight
Specifications
2.13
122(H)×250(V)
23.70×48.55
0.1942×0.1942
Square
29.2(H)×59.2 (V) ×1.0(D)
3.2±0.5
Unit
Inch
Pixel
mm
mm
mm
g
Remark
DPI:130
2.13inch e-Paper V35 / 34
4.Mechanical Drawing of EPD Module
Confirmation:
DATE
REV.
MODIFICATION
NOTE
1 DISPLAY MODULE 2.13" ARRAY FOR EPD
2 DRIVER IC:SSD1680Z8
3 RESOLUTION:250gateX122source
4 PIXEL SIZE:0.1942mmX0.1942mm
ANGLES±5°
.X=±0.4mm
.XX=±0.20mm
.XXX=±0.200mm
EPD
2.13inch e-paper B
A
22.02.08
SY HAO
mm
1/1
2.13inch e-Paper V36 / 34
5. Input/output Pin Assignment
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Name
NC
GDR
RESE
NC
VSH2
TSCL
TSDA
BS1
BUSY
RES#
D/C#
CS#
SCL
SDA
VDDIO
VCI
VSS
VDD
VPP
VSH1
VGH
VSL
VGL
VCOM
I/O
Description
Do not connect with other NC pins
N-Channel MOSFET Gate Drive Control
Current Sense Input for the Control Loop
O
I
NC Do not connect with other NC pins
Positive Source driving voltage(Red)
C
O
I2C Interface to digital temperature sensor Clock pin
I/O I2C Interface to digital temperature sensor Data pin
Bus Interface selection pin
I
Busy state output pin
O
Reset signal input. Active Low.
I
Data /Command control pin
I
Chip select input pin
I
I
Serial Clock pin (SPI)
I/O Serial Data pin (SPI)
P
P
P
C
P
C
C
C
C
C
Power Supply for interface logic pins It should be
connected with VCI
Power Supply for the chip
Ground
Core logic power pin VDD can be regulated internally
from VCI. A capacitor should be connected between
VDD and VSS
FOR TEST
Positive Source driving voltage
Power Supply pin for Positive Gate driving voltage and
VSH1
Negative Source driving voltage
Power Supply pin for Negative Gate driving voltage
VCOM and VSL
VCOM driving voltage
Remark
Keep Open
Keep Open
Note 5-5
Note 5-4
Note 5-3
Note 5-2
Note 5-1
Keep Open
2.13inch e-Paper V37 / 34
I = Input Pin, O =Output Pin,I /O = Bi-directional Pin (Input/output), P = Power Pin, C
= Capacitor Pin
Note 5-1: This pin (CS#) is the chip select input connecting to the MCU. The chip is
enabled for MCU communication only when CS# is pulled LOW.
Note 5-2: This pin is (D/C#) Data/Command control pin connecting to the MCU in 4-
wire SPI mode. When the pin is pulled HIGH, the data at SDA will be interpreted as
data. When the pin is pulled LOW, the data at SDA will be interpreted as command.
Note 5-3: This pin (RES#) is reset signal input. The Reset is active low.
Note 5-4: This pin is Busy state output pin. When Busy is High, the operation of chip
should not be interrupted, command should not be sent. The chip would put Busy pin
High when -Outputting display waveform -Communicating with digital temperature
sensor
Note 5-5: Bus interface selection pin
BS1 State
MCU Interface
L
H
4-lines serial peripheral interface(SPI) - 8 bits SPI
3- lines serial peripheral interface(SPI) - 9 bits SPI
6. Electrical Characteristics
6.1 Absolute Maximum Rating
Parameter
Logic supply voltage
Logic Input voltage
Logic Output voltage
Operating Temp range
Storage Temp range
Optimal Storage Temp
Optimal Storage Humidity
Symbol
VCI
VIN
VOUT
TOPR
TSTG
TSTGo
HSTGo
Rating
-0.5 to +4.0
-0.5 to VCI +0.5
-0.5 to VCI +0.5
0 to +50
-25 to+70
23±3
55±10
Unit
V
V
V
ºC.
ºC.
ºC.
%RH
Note: Maximum ratings are those values beyond which damages to the device
may occur. Functional operation should be restricted to the limits in the Panel DC
Characteristics tables.
2.13inch e-Paper V38 / 34
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