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2.13inch e-Paper V2 数据手册(2.13inch_e-Paper_Specification).pdf
页面提取自－
1. General Description
1.1 Over View
1.2 Features
1.3 Mechanical Specifications
页面提取自－
3. Electrical Characteristics
3.1 ABSOLUTE MAXIMUM RATING
Table 3.1-1: Maximum Ratings
3.2 DC CHARACTERISTICS
Table 3.2-1: DC Characteristics
3.3 Serial Peripheral Interface Timing
Write mode
页面提取自－
3.5-1) MCU interface selection
Table 3.5-1: MCU interface selection
Table 3.5-2 : Control pins status of 4-wire SPI
Figure 3.5-1: Write procedure in 4-wire SPI mode
3.5-3) MCU Serial Peripheral Interface (3-wire SPI)
Table 3.5-3 : Control pins status of 3-wire SPI
Figure 7-3: Read procedure in 3-wire SPI mode
HINK-E0213A50-A2 Spec 21.pdf
5. COMMAND TABLE
6. Optical characteristics
未标题
SPECIFICATION
Product
Description
Model Name
Date
2.13inch e-Paper
2.13” E-PAPER, B/W
2.13inch e-Paper v2
2019/06/13
Revision
2.0
2.13inch e-Paperwww.waveshare.com1/39
Table of Contents
1. General Description ............................................................................ 4
1.1 Overview ........................................................................................ 4
1.2 Feature ........................................................................................... 4
1.3 Mechanical Specification ........................................................... 4
1.4 Mechanical Drawing of EPD module .................................... 5
1.5 Input/Output Terminals .......................................................... 6
1.6 Reference Circuit ....................................................................... 8
2. Environmental .............................................................. 9
2.1 Handling, Safety and Environmental Requirements... 9
2.2 Reliability test ......................................................11
3. Electrical Characteristics ................................................ 12
3.1 Absolute maximum rating ...................................... 12
3.2 Panel DC Characteristics ........................................ 12
3.3 Serial Peripheral Interface Timing .............................. 13
3.4 Power Consumption ................................................ 13
3.5 MCU Interface ....................................................... 14
3.6 Temperature sensor operation ................................. 17
4. Typical Operating Sequence ........................................... 18
4.1 Normal Operation Flow .......................................... 18
5. Command Table ............................................................ 19
6. Optical characteristics .................................................... 35
6.1 Specifications ........................................................ 35
6.2 Definition of contrast ratio ..................................... 36
6.3 Reflection Ratio ....................................................36
7. Point and line standard ................................................. 37
8. Packing ........................................................................ 38
9. Precautions .................................................................. 39
2.13inch e-Paperwww.waveshare.com2/39
Revision History
June.26.2018 Preliminary
Rev. Issued Date
1.0
1.1 Dec.07.2018 Increasing the Brand of components
2.0 May.23.2019 Update the reliability test conditions
Revised Contents
2.13inch e-Paperwww.waveshare.com3/39
1. General Description
1.1 Over View
2.13inch e-Paper is an Active Matrix Electrophoretic Display (AMEPD), with interface
and a reference system design. The 2.13” active area contains 250×122 pixels, and has
1-bit B/W full display capabilities. An integrated circuit contains gate buffer, source buffer,
interface, timing control logic, oscillator, DC-DC. SRAM.LUT, VCOM and border are supplied
with each panel.
1.2 Features
• Support partial refresh
• 250×122 pixels display
• High contrast
• High reflectance
• Ultra wide viewing angle
• Ultra low power consumption
• Pure reflective mode
• Bi-stable display
• Commercial temperature range
• Landscape, portrait modes
• Hard-coat antiglare display surface
• Ultra Low current deep sleep mode
• On chip display RAM
• Low voltage detect for supply voltage
• High voltage ready detect for driving voltage
• Internal temperature sensor
• 10-byte OTP space for module identification
• Waveform stored in On-chip OTP
• Serial peripheral interface available
• On-chip oscillator
• On-chip booster and regulator control for generating VCOM, Gate and Source driving
voltage
• I2C signal master interface to read external temperature sensor/built-in temperature
sensor
1.3 Mechanical Specifications
Parameter
Screen Size
Specifications
2.13
Display Resolution
122(H)×250(V)
Active Area
Pixel Pitch
23.7(H)×48.55(V)
0.1942×0.1943
Pixel Configuration
Rectangle
Outline Dimension
29.2(H)×59.2 (V) ×1.05(D)
Weight
3.0±0.2
Unit
Inch
Pixel
mm
mm
mm
g
Remark
Dpi:130
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1.4 Mechanical Drawing of EPD module
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1.5 Input/Output Terminals
Pin # Single
Description
Remark
NC No connection and do not connect with other NC pins Keep Open
GDR
RESE
N-Channel MOSFET Gate Drive Control
Current Sense Input for the Control Loop
NC No connection and do not connect with other NC pins e Keep Open
VSH2
This pin is Positive Source driving voltage
TSCL
I2C Interface to digital temperature sensor Clock pin
TSDA
I2C Interface to digital temperature sensor Date pin
Bus selection pin
Busy state output pin
Reset
Data /Command control pin
Chip Select input pin
serial clock pin (SPI)
serial data pin (SPI)
Note 1.5-5
Note 1.5-4
Note 1.5-3
Note 1.5-2
Note 1.5-1
1
2
3
4
5
6
7
8
9
BS1
BUSY
10 RES #
11 D/C #
12
13
14
CS #
SCL
SDA
15 VDDIO
Power for interface logic pins
16
17
18
19
20
21
22
23
VCI
VSS
VDD
VPP
Power Supply pin for the chip
Ground
Core logic power pin
Power Supply for OTP Programming
VSH1
This pin is Positive Source driving voltage
VGH
VSL
VGL
This pin is Positive Gate driving voltage
This pin is Negative Source driving voltage
This pin is Negative Gate driving voltage
24 VCOM
These pins are VCOM driving voltage
2.13inch e-Paperwww.waveshare.com6/39
Note 1.5-1: This pin (CS#) is the chip select input connecting to the MCU. The
chip is enabled for MCU communication: only when CS# is pulled LOW.
Note 1.5-2: This pin (D/C#) is Data/Command control pin connecting to the MCU.
When the pin is pulled HIGH, the data will be interpreted as data. When the pin is
pulled LOW, the data will be interpreted as command.
Note 1.5-3: This pin (RES#) is reset signal input. The Reset is active low.
Note 1.5-4: This pin (BUSY) is Busy state output pin. When Busy is High the operation
of chip should not be interrupted and any commands should not be issued to the
module. The driver IC will put Busy pin High when the driver IC is working such as:
- Outputting display waveform; or
- Communicating with digital temperature sensor
Note 1.5-5: This pin (BS1) is for 3-line SPI or 4-line SPI selection. When it is
“Low”, 4-line SPI is selected. When it is “High”, 3-line SPI (9 bits SPI) is selected.
2.13inch e-Paperwww.waveshare.com7/39
1.6 Reference Circuit
Note：
1. Inductor L1 is wire-wound inductor. There are no special requirements
for other parameters.
2. Suggests using Si1304BDL or Si1308EDL TUBE MOS (Q1) , otherwise it
may affect the normal boost of the circuit.
3. The default circuit is 4-wire SPI. If the user wants to use 3-wire SPI.
4. Default voltage value of all capacitors is 50V.
2.13inch e-Paperwww.waveshare.com8/39
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