MSM261S4030H0R(Microphone)(MSM261S4030H0R).pdf-资料库

Data Sheet V 1.0 / Apr. 2017 MSM261S4030H0R I2S digital output MEMS microphone with Multi‐modes

MSM261S4030H0R I2S digital output MEMS microphone GENERAL DESCRIPTION APPLICATIONS  Mobile Phone  Laptop  Tablet computer  Bluetooth headset  Earphone  Wearable intelligent equipment PRODUCT VIEW MSM261S4030H0R is an omnidirectional, Top‐ported, I2S digital output MEMS microphone. It has high performance and reliability. MSM261S4030H0R is available in a 4 mm × 3 mm × 1.0 mm metal can LGA package. It is SMT compatible with no sensitivity degradation. FEATURES  Cost effective  Low Power mode  Digital I2S output  Compatible with Sn/Pb and Pb‐free solder processes  RoHS/Halogen free compliant  Sensitivity Matching within +/‐1dB © 2011‐2017 MEMSensing Microsystems (Suzhou,China) Co. Ltd, — Ver.1.0. DOC NO:DS‐050. All rights reserved 2

MSM261S4030H0R I2S digital output MEMS microphone ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Sound Pressure Level Mechanical Shock Temperature Range Electrostatic discharge protection SPECIFICATIONS Maximum value −0.3 to 4.0 140 10,000 −40 to 100 2 (HBM) Unit V dB SPL g °C kV All data taken at 25°C, Relative Humidity 45±5% L/R pin grounded unless otherwise specified Directivity Sensitivity Operation voltage Freq. range Sensitivity loss across supply voltage Vdd=1.8V, clock frequency=3.072MHz Limits Nom. Omni directional ‐26 Min. ‐27 Max. ‐25 1.6 3.6 Refer to the frequency response No change across the voltage range Signal to noise ratio THD AOP Polarity PSR Current consumption Clock frequency Storage temperature ‐ ‐ ‐ ‐ ‐ 1.0 150 ‐40 61 ‐ 120 Increasing sound ‐72 750 400 3 ‐ ‐ ‐ 1 ‐ 1000 ‐ 4.0 800 100 unit dB V Hz dB dB % dB SPL dBFS(A) μA μA MHz KHz °C condition dBFS @1kHz 1Pa 20 kHz bandwidth, A‐weighted 94dB SPL @1kHz S =Nom, Rload > 2 k 　 10% THD @1kHz S =Nom, Rload > 2 k 　 Increasing density of 1’s Normal mode Low power mode Normal mode Low power mode © 2011‐2017 MEMSensing Microsystems (Suzhou,China) Co. Ltd, — Ver.1.0. DOC NO:DS‐050. All rights reserved 3

MSM261S4030H0R I2S digital output MEMS microphone TYPICAL FREQUENCY RESPONSE Frequency Response @94dB SPL 200 500 1K 2K 5K Frequence (Hz) 10K 20 10 0 ‐10 ‐20 100 ) a P / S F B d ( y t i v i t i s n e S LOGIC TABLE Digital Input SD Digital Output Parameter Low Voltage Input(L/R, WS, SCK) High Voltage Input(L/R, WS, SCK) Voltage Output Low Voltage Output Low Voltage Output High Voltage Output High Voltage Output Low Voltage Output Low Voltage Output High Voltage Output High Symbol VIL VIH VOL VOL VOH VOH VOL VOL VOH VOH Min 0 0.7 × VDD VDD 0.7 × VDD 0.9 × VDD 0.7 × VDD 0.9 × VDD 0.1 × VDD 0.3 × VDD 0.1 × VDD 0.3 × VDD Max Unit 0.25 × VDD V V V V V V V V V V © 2011‐2017 MEMSensing Microsystems (Suzhou,China) Co. Ltd, — Ver.1.0. DOC NO:DS‐050. All rights reserved 4

MSM261S4030H0R I2S digital output MEMS microphone TIMING DIAGRAM Parameter Description tSCH tSCL tSCP fSCK tWSS tWSH fWS SCK High SCK Low SCK Period SCK Frequency WS Setup WS Hold WS Frequency Norm. 50 50 325 3.072 0 20 48 Max. — — — — — — — Unit ns ns ns MHz ns ns kHz Min. — — — — — — — SMT Parameters： 1. Recommend PCB land pattern layout：（unit: mm） © 2011‐2017 MEMSensing Microsystems (Suzhou,China) Co. Ltd, — Ver.1.0. DOC NO:DS‐050. All rights reserved 5

MSM261S4030H0R I2S digital output MEMS microphone 2. Recommend reflow profile: Description Average ramp rate Preheat Minimum temperature Maximum temperature Time(TSMIN to TSMAX) Ramp‐up rate Time maintained above liquidus temperature Liquidus temperature Peak temperature Time within 5°C of actual peak temperature Ramp‐down rate Time 25 °C (t25 °C) to peak temperature Pb free 3 °C/sec max 150 °C 200 °C 60 sec to 120 sec 1.25 °C/sec 60 sec to 150 sec 217 °C 260 °C 20 sec to 40 sec 6 °C/sec max 8 minutes max Parameter TL to TP TSMIN TSMAX tS TSMAX to TL tL TL TP tP TP to T smax t © 2011‐2017 MEMSensing Microsystems (Suzhou,China) Co. Ltd, — Ver.1.0. DOC NO:DS‐050. All rights reserved 6

MSM261S4030H0R I2S digital output MEMS microphone OUTLINE DIMENSIONS AND PIN DEFINITION： TOP VIEW SIDE VIEW BOTTOM VIEW 1 2 3 4 5 6 7 8 GND N/C WS Ground — Input CHIPEN Input L/R Input SCK Input SD Output Power VDD Connect to ground on the PCB. Do not connect Serial Data‐Word Select for I²S Interface. Microphone Enable. When set low (ground), the microphone is disabled and put in power‐down mode. When set high (VDD), the microphone is enabled. Left/Right Channel Select. When set low, the microphone outputs its signal in the left channel of the I²S frame; when set high, the microphone outputs its signal in the right channel. Serial Data Clock for I²S Interface. Serial Data Output for I²S Interface. This pin tristates when not actively driving the appropriate output channel. The SD trace should have a 100 kΩ pull‐down resistor to discharge the line during the time that all microphones on the bus have tristated their outputs. 1.8 to 3.3 V. This pin should be decoupled to Pin 1 with a 0.1 μF capacitor and a 10μF capacitor. Item Length (L) Width (W) Height (H) Acoustic Port (AP) Dimension 4.0 3.0 1.25 Ø0.65 Tolerance ±0.10 ±0.10 ±0.10 ±0.05 Dimensions are in millimeters Tolerance is ±0.1mm unless otherwise specified. © 2011‐2017 MEMSensing Microsystems (Suzhou,China) Co. Ltd, — Ver.1.0. DOC NO:DS‐050. All rights reserved 7

MSM261S4030H0R I2S digital output MEMS microphone ADDITIONAL NOTES (A) MSL (moisture sensitivity level) Class 2a. (B) Maximum of 3 reflow cycles is recommended. (C) In order to minimize device damage: 　 Do not board wash or clean after the reflow process. 　 Do not brush board with or without solvents after the reflow process. 　 Do not directly expose to ultrasonic processing, welding, or cleaning. 　 Do not insert any object in port hole of device at any time. 　 Do not apply air pressure into the port hole. 　 Do not pull a vacuum over port hole of the microphone. 　 MATERIALS STATEMENT Meets the requirements of the European RoHS and Halogen‐Free. © 2011‐2017 MEMSensing Microsystems (Suzhou,China) Co. Ltd, — Ver.1.0. DOC NO:DS‐050. All rights reserved 8

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