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2.7inch e-Paper V2 数据手册(当前版本)(2.7inch_e-Paper_V2_Specification).pdf

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Product Specifications Customer Description Model Name Date Revision Standard 2.7” E-PAPER DISPLAY 2.7inch e-Paper V2 2022/10/10 1.0 2.7inch e-Paper 1
REVISION HISTORY Rev Date Item Page Remark 1.0 Oct.10.2022 New Creation ALL 2.7inch e-Paper 2
CONTENTS 1. 2. 3. 4. 5. 6. View............................................................................. Over . 5 Features .............................................................................. 5 Mechanical Specification.......................................................... 5 Mechanical Drawing of EPD Module............................................ 6 7 Input/output Pin Assignment.................................................... Electrical Characteristics.......................................................... 8 6.1 Absolute Maximum Rating......................................................8 6.2 Panel DC Characteristics........................................................ 8 6.3 Panel AC Characteristics...................................................... 10 6.3.1 MCU Interface Selection.................................................. 10 6.3.2 MCU Serial Interface (4-wire SPI)..................................... 10 6.3.3 MCU Serial Interface (3-wire SPI)..................................... 11 6.3.4 Interface Timing............................................................. 12 Command Table...................................................................... 13 Optical Specification................................................................ 26 Handling, Safety, and Environment Requirements....................... 27 Reliability Test........................................................................ 28 7. 8. 9. 10. 2.7inch e-Paper 3
11. Block Diagram....................................................................... 29 12. Reference Circuit.................................................................... 30 Typical Operating Sequence......................................................31 14. 14.1 Normal Operation Flow..................................................... 31 15. Inspection condition................................................................ 32 15.1 Environment................................................................... 32 15.2 Illuminance..................................................................... 32 15.3 Inspect method............................................................... 32 15.4 Display area.................................................................... 32 15.5 Inspection standard......................................................... 33 15.5.1 Electric inspection standard............................................ 33 15.5.2 Appearance inspection standard...................................... 34 16. Packaging..............................................................................36 17. Precautions............................................................................37 2.7inch e-Paper (B)42.7inch e-Paper 4
Matrix Over 1. View This display is an Active reference system design. The 2.7inch capabilities. The display electrophoresis driving TFT-array interface, MCU source driver, Module can used be , VCOM. (ESL) System. Electrophoretic display capable is area active display, contains with controller, with at EPD), image (AM display a interfaceand Display black 1-bit white, full to module 264×176pixels. The a integrated oscillator, DC-DC, SRAM, LUT Electronic including devices, timing in circuits portable electronic such as driver, Shelf Label is gate pixels display with touchscreen 2.Features 264×176 High cntrast High reflectance Ultra wide viewing angle Ultra low power consumption Pure reflective mode Bi-stable display Commercial temperature range Landscape portrait modes Hard-coat antiglare display surface Ultra Low current deep sleep mode On chip display RAM Waveform can stored in On-chip OTP or written by MCU Serial peripheral interface available On-chip oscillator On-chip booster and regulator control for generating VCOM, Gate and Source driving voltage I2C signal master interface to read external temperature sensor Built-in temperature sensor Specifications 3.Mechanical Specifications Parameter Screen Size Display Resolution Active Area Pixel Pitch Pixel Configuration Outline Dimension Weight 2.7 264(H)×176(V) 38.19×57.29 0.217×0.217 Rectangle 45.8 (H)×70.42(V) ×1.23(D) TBD Unit Remark Dpi:117 Inch Pixel mm mm mm g 2.7inch e-Paper 5
4. Mechanical Drawing of EPD module 2.7inch e-Paper 6
5. Input /Output Pin Assignment No. Name 1 NC GDR 2 RESE 3 NC 4 VSH2 5 TSCL 6 TSDA 7 BS1 8 9 BUSY 10 RES# 11 D/C# 12 CS# SCL 13 14 SDA 15 VDDIO 16 17 VCI VSS I/O Description Do not connect with other NC pins O N-Channel MOSFET Gate Drive Control I Current Sense Input for the Control Loop NC Do not connect with other NC pins C Positive Source driving voltage(Red) I2C Interface to digital temperature sensor Clock pin O I/O I2C Interface to digital temperature sensor Data pin I Bus Interface selection pin O Busy state output pin I Reset signal input. Active Low. I Data /Command control pin I Chip select input pin I Serial Clock pin (SPI) I Serial Data pin (SPI) P Power Supply for interface logic pins It should be P Power Supply for the chip P Ground connected with VCI 18 VDD C Core logic power pin VDD can be regulated internally from VCI. A capacitor should be connected between VDD and VSS Remark Keep Open Keep Open Note 5-5 Note 5-4 Note 5-3 Note 5-2 Note 5-1 VPP 19 20 VSH1 21 VGH 22 VSL 23 VGL 24 VCOM and VSH1 P FOR TEST C Positive Source driving voltage C Power Supply pin for Positive Gate driving voltage C Negative Source driving voltage C Power Supply pin for Negative Gate driving voltage C VCOM driving voltage VCOM and VSL 2.7inch e-Paper 7
I = Input Pin, O =Output Pin, I/O = Bi-directional Pin (Input/output), P = Power Pin, C = Capacitor Pin Note 5-1: This pin (CS#) is the chip select input connecting to the MCU. The chip is enabled for MCU communication only when CS# is pulled LOW. Note 5-2: This pin is (D/C#) Data/Command control pin connecting to the MCU in 4-wire SPI mode. When the pin is pulled HIGH, the data at SDA will be interpreted as data. When the pin is pulled LOW, the data at SDA will be interpreted as command. Note 5-3: This pin (RES#) is reset signal input. The Reset is active low. Note 5-4: This pin is Busy state output pin. When Busy is High, the operation of chip should not be interrupted, command should not be sent. The chip would put Busy pin High when –Outputting display waveform -Communicating with digital temperature sensor Note 5-5: Bus interface selection pin BS1 State L H 4-lines serial peripheral interface(SPI) - 8 bits SPI 3- lines serial peripheral interface(SPI) - 9 bits SPI MCU Interface Electrical Characteristics 6. 6.1 Absolute Maximum Rating Parameter Logic supply voltage Logic Input voltage Logic Output voltage Operating Temp range Storage Temp range Optimal Storage Temp Optimal Storage Humidity Symbol VCI VIN VOUT TOPR TSTG TSTGo HSTGo Rating -0.5 to +6.0 -0.5 to VCI +0.5 -0.5 to VCI +0.5 0 to +50 -25 to+70 23±2 55±10 Unit V V V ºC ºC ºC %RH Note: Maximum ratings are those values beyond which damages to the device may occur. Functional operation should be restricted to the limits in the Panel DC Characteristics tables. 6.2 Panel DC Characteristics The following specifications apply for: VSS=0V, VCI=3.0V, TOPR =25ºC. 2.7inch e-Paper 8
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