Core1081用户手册(Core1801_UserManualV1.0).pdf-资料库

Core1081 Data Sheet Embedded Wi-Fi module 2.2 Date：2014-02-13 Data Sheet Overview Core1081 is an ultra-compact, low-power embedded Wi-Fi module based on MX1081, a fully integrated System-on-Chip that is fully compatible with Broadcom WICED platform. MX1081 integrates a wireless LAN MAC/baseband/radio, and a Cortex-M3 microcontroller STM32F205 that runs a unique "self-hosted" Wi-Fi networking library and software application stack. Core1081 has 1M bytes flash, 128k RAM and rich peripherals for your embedded Wi-Fi applications. Core1081 is also anmxchipWNetTMcompatible platform, users can build their own embedded Wi-Fi applications based on mxchipWNetTM library which manage all of the Wi-Fi MAC and TCP/IP stack processing. We also provide several mxchipWNetTM firmware to meet typical applications:wireless UART, wireless audio, wireless sensor etc. When using mxchipWNetTM-DTU firmware, you can establish Wi-Fi networking for any device with a micro-controller and a UART interface. Quick development cycles enables fast time to market. Applications   Building Automation / Access Control Smart home appliances  Medical/Health Care   Industrial Automation Systems Point Of Sale system (POS)  Auto electronics Product list Module Core1081 - - - Antenna C E On-board chip antenna IPEX connector Firmware/Library Function mxchipWNetTM Predefined firmware:UART/Wi-Fi -DTU conversion mxchipWNetTM Software library used to develop custom Library mxchipWNetTM Library Plus firmware Software library based on RTOS Hardware block 1 / 25 MXCHIP Co., Ltd

contents 1. 2. Introduction .................................................................................................................................................................... 3 Interface .......................................................................................................................................................................... 5 2.1. Pinouts .................................................................................................................................................................. 5 2.2. Pin Arrangement ................................................................................................................................................... 6 2.3. Pin Arrangement for peripherals ........................................................................................................................ 10 3. Electrical Parameters ................................................................................................................................................... 12 3.1. Absolute maximum ratings: ................................................................................................................................ 12 3.1.1. Voltage & Current................................................................................................................................................................................................... 12 3.2. Operating conditions .......................................................................................................................................... 12 3.2.1. Voltage & Current................................................................................................................................................................................................... 12 3.3. Digital I/O port characteristics ............................................................................................................................ 15 3.3.1. Output voltage levels ............................................................................................................................................................................................. 15 3.3.2. Output voltage levels ............................................................................................................................................................................................. 16 3.3.3. nRESET pin characteristics ................................................................................................................................................................................... 16 3.4. Other MCU electrical parameters ...................................................................................................................... 16 3.5. Temperature andHumidity ................................................................................................................................. 16 3.6. ESD ...................................................................................................................................................................... 17 3.7. Static latch-up ..................................................................................................................................................... 17 3.8. RF characteristics ................................................................................................................................................ 17 3.8.1. Basic RF characteristics......................................................................................................................................................................................... 17 3.8.2. IEEE802.11bmode ................................................................................................................................................................................................. 18 3.8.3. IEEE802.11gmode ................................................................................................................................................................................................. 18 3.8.4. IEEE802.11n 20MHz bandwidth mode ............................................................................................................................................................... 20 3.9. Mechanical Dimensions ...................................................................................................................................... 22 3.9.1. Core1081 Mechanical Dimensions ....................................................................................................................................................................... 22 4. Minimizing radio interference .................................................................................................................................... 23 4.1. U.F.L RF Connector .............................................................................................................................................. 23 5. U.F.L RF Connector ....................................................................................................................................................... 24 5.1. Recommended Reflow Profile ............................................................................................................................ 24 5.2. MSL/Storage Condition ....................................................................................................................................... 25 2 / 25

1. Introduction Core1081 is an ultra-compact, low-power embedded Wi-Fi module based on MX1080, a fully integrated System-on-Chip that is fully compatible with Broadcom WICED platform. MX1081 integrates a Broadcom BCM43362 wireless LAN MAC/baseband/radio, and an embedded processor core that runs a unique "self-hosted" Wi-Fi networking library and software application stack. Core1081 has 1M bytes flash, 128k RAM and rich peripherals for your embedded Wi-Fi applications. Core1081 is also an mxchipWNetTM compatible platform, users can build their own embedded Wi-Fi applications based on mxchipWNetTM library which manage all of the Wi-Fi MAC and TCP/IP stack processing. We also provide several mxchipWNetTM firmware to meet typical applications: wireless UART, wireless audio, wireless sensor etc. When using mxchipWNetTM-DTU firmware, you can establish Wi-Fi networking for any device with a micro-controller and a serial interface. Quick development cycles enables fast time to market. 3 / 25

1.1. Features  Single operation voltage：3.3V  Power consumption: Only ~7mA while module is connected to access point and no data is transmitting, Only ~24mA while sending data under 20kbps, Only 8μA under standby mode.    STM32F2 MCU frequency: 120MHz，flash size: 1M bytes，RAM size: 128k bytes.  On-chip functionality Single-chip: MAC/BB/RF  Peripherals： 42 x GPIOs 3 x UARTs，UART2 include hardware flow control 2 x SPI, 1xIIS 8 x ADC input channels，2 DAC output channel 1 x USB device, 1 x CAN 2 x I2C PWM/Timer input/output       DCMI  SWD debug interface  Wi-Fi connectivity 802.11b, 802.11g, 802.11n (single stream) on channel 1-14@2.4GHz   WEP, WPA/WPA2 PSK/Enterprise Transmit power：18.5dBm@11b，15.5dBm@11g，14.5dBm@11n   MIN Receiver Sensitivity: -96 dBm  Max Data rate：11Mbps@11b，54Mbps@11g，72Mbps@11n HT20  Wi-Fi modes：Station, Soft AP and Wi-Fi direct  Advanced 1x1 802.11n features Full/Half Guard Interval Frame Aggregation Space Time Block Coding (STBC) Low Density Parity Check (LDPC) Encoding  Hardware Encryption: WEP, WPA/WPA2  WPS 2.0  Multiple power save modes  On-board chip antenna，IPEX connector for external antenna  CE，FCC compliant  Operating Temperature: -40℃ to 85℃  MSL level 3 4 / 25

2. Interface 2.1. Pinouts Core1081 has Three groups of pins . The lead pitch is 2mm. Core1081 pinout is shown in the Figure 2.1. Table 2.2 lists the pin functions. Figure2.1 Core1081: appearance and pinout 5 / 25

2.2. Pin Arrangement Figure 2.2 Core1081 pin arrangement Pins Number Pin Name Type IO Main function level (after reset) 1 PA6 I/O FT PA6 2 PA7 I/O FT PA7 3 PB15 I/O FT PB15 4 PB14 I/O FT PB14 5 PB12 I/O FT PB12 PH8 I/O FT PH9 I/O FT PH8 PH9 PH10 I/O FT PH10 PH11 I/O FT PH11 6 7 8 9 Alternate functions Other functions SPI1_MISO / TIM8_BKIN/TIM13_CH1 / DCMI_PIXCLK / TIM3_CH1 / TIM1_BKIN/ EVENTOUT SPI1_MOSI/ TIM8_CH1N / TIM14_CH1 TIM3_CH2/ ETH_MII_RX_DV / TIM1_CH1N / RMII_CRS_DV / EVENTOUT SPI2_MOSI / I2S2_SD / TIM1_CH3N / TIM8_CH3N / TIM12_CH2 / OTG_HS_DP / RTC_50Hz/ EVENTOUT SPI2_MISO/ TIM1_CH2N / TIM12_CH1 / OTG_HS_DM USART3_RTS/ TIM8_CH2N/ EVENTOUT SPI2_NSS/I2S2_WS/ I2C2_SMBA/ USART3_CK/ TIM1_BKIN / CAN2_RX / OTG_HS_ULPI_D5/ ETH_RMII_TXD0 / ETH_MII_TXD0/ OTG_HS_ID/ EVENTOUT I2C3_SDA / DCMI_HSYNC/ EVENTOUT I2C3_SMBA / TIM12_CH2/ DCMI_D0/ EVENTOUT TIM5_CH1 / DCMI_D1/ EVENTOUT TIM5_CH2 / DCMI_D2/ EVENTOUT 6 / 25 ADC12_IN6 ADC12_IN7

Pins Number Pin Name Type IO Main function level (after reset) 10 11 PH12 I/O FT PH12 PH14 I/O FT PH14 12 PA9 I/O FT PA9 13 PA10 I/O FT PA10 14 15 16 17 18 19 20 PD0 I/O FT PD1 I/O FT PD5 I/O FT PD6 PA13 PA14 I/O I/O I/O FT FT FT PD0 PD1 PD5 PD6 PA13 PA14 PA15 I/O FT PA15 21 PB3 I/O FT PB3 22 23 24 25 26 27 PB4 I/O FT PB4 GND 3.3V GND 3.3V PH13 I/O FT PH13 PH15 I/O FT PH15 PI2 I/O FT PI2 28 PI0 I/O FT PI0 Alternate functions Other functions TIM5_CH3 / DCMI_D3/ EVENTOUT TIM8_CH2N / DCMI_D4/ EVENTOUT USART1_TX/ TIM1_CH2 / I2C3_SMBA / DCMI_D0/ EVENTOUT USART1_RX/ TIM1_CH3/ OTG_FS_ID/DCMI_D1/ EVENTOUT FSMC_D2/CAN1_RX/ EVENTOUT FSMC_D3 / CAN1_TX/ EVENTOUT FSMC_NWE/USART2_TX/ EVENTOUT FSMC_NWAIT/ USART2_RX/ EVENTOUT JTMS-SWDIO/ EVENTOUT JTCK-SWCLK/ EVENTOUT JTDI/ SPI3_NSS/ I2S3_WS/TIM2_CH1_ETR / SPI1_NSS/ EVENTOUT JTDO/ TRACESWO/ SPI3_SCK / I2S3_SCK / TIM2_CH2 / SPI1_SCK/ EVENTOUT NJTRST/ SPI3_MISO / TIM3_CH1 / SPI1_MISO/ EVENTOUT TIM8_CH1N / CAN1_TX/ EVENTOUT TIM8_CH3N / DCMI_D11/ EVENTOUT TIM8_CH4 /SPI2_MISO / DCMI_D9/ EVENTOUT TIM5_CH4 / SPI2_NSS / I2S2_WS / DCMI_D13/ EVENTOUT OTG_FS_ VBUS 7 / 25

Pins Number Pin Name Type IO Main function level (after reset) Alternate functions Other functions 29 PB7 I/O FT PB7 30 PB6 I/O FT PB6 31 PC6 I/O FT PC6 32 33 34 35 36 37 38 3.3V GND PI1 BOOT0 PI6 I/O I/O I/O FT FT PI4 I/O FT 3.3V GND PI1 BOOT0 PI6 PI4 39 PI3 I/O FT PI3 40 PI5 I/O FT PI5 41 PI7 I/O FT PI7 42 PE5 I/O FT PE5 43 PE6 I/O FT PE6 44 PF9 I/O FT PF9 I2C1_SDA / FSMC_NL(8)/ DCMI_VSYNC / USART1_RX/ TIM4_CH2/ EVENTOUT I2C1_SCL/ TIM4_CH1 / CAN2_TX / DCMI_D5/USART1_TX/ EVENTOUT I2S2_MCK / TIM8_CH1/SDIO_D6 / USART6_TX / DCMI_D0/TIM3_CH1/ EVENTOUT SPI2_SCK / I2S2_SCK / DCMI_D8/ EVENTOUT TIM8_CH2 / DCMI_D6/ EVENTOUT TIM8_BKIN / DCMI_D5/ EVENTOUT TIM8_ETR / SPI2_MOSI / I2S2_SD / DCMI_D10/ EVENTOUT TIM8_CH1 / DCMI_VSYNC/ EVENTOUT TIM8_CH3 / DCMI_D7/ EVENTOUT TRACED2 / FSMC_A21 / TIM9_CH1 / DCMI_D6/ EVENTOUT TRACED3 / FSMC_A22 / TIM9_CH2 / DCMI_D7/ EVENTOUT TIM14_CH1 / FSMC_CD/ EVENTOUT 8 / 25 ADC3_IN7

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Core1081用户手册(Core1801_UserManualV1.0).pdf

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