M1081 芯片手册(MX1081).pdf-资料库

WiFi MCU Module Specification Nov.2012 WiFi MCU Module Embedded Wireless LAN Controller SIP Module The Specification maybe changed. . 1

REVISION HISTORY Version No. Revised Date Revised by Description Notes 1.0 2012-03-28 Ken Preliminary specification released Proposal 1.1 2012-04-09 James 1. Add Revision History information 2. Modify Pin Description of the Pin24, Proposal 1.2 2012-04-20 James 1.3 2012-06-27 James 1.4 2012-07-19 James 1.5 2012-08-08 James Pin25, &Pin26 1. Update Block diagram (add DCMI Interface) 2. Modify Pin Out Counts (change from 51 to 58), Pin Description 3. Add DCMI Interface Characteristics 4. Modify Mechanical Dimension 1. Update Block Diagram 2. Update Pin out counts & Pin Description 3. Update Mechanical Dimension 1. Update Block Diagram (add Timer Function) 2. Update Pin out counts & Pin Description 3. Add TIM timer Interface Characteristics 4. Add pin definition Mapping to STM32F20x LQFP176 information. 1. Update Block Diagram (add I2S/USB, Potentiometer Function) 2. Update Pin out counts & Pin Description 3. Add I2S Interface Characteristics 4. Modify Mechanical Dimension 5. Update Module Recommend Footprint & Stencil information Proposal Proposal Proposal Proposal 1.6 2012-08-14 James 1. Update Module Recommend Footprint & Stencil information Proposal 1.7 2012-11-05 James Recommend Stencil Proposal 1. Modify the Recommend footprint & 1.8 2012-11-23 James 2. Add Alternate function mapping Table 1. Modify current Consumption data of TX mode & RX mode. Proposal The Specification maybe changed. . 2

TABLE OF CONTENTS 7.3 Mechanical Dimension ................................... 29 8. Recommend Footprint ..................... 30 9. Recommend Stencil ......................... 31 10. Recommended Reflow Profile ....... 32 11. Package and Storage Condition .... 32 11.1 Package Dimension ..................................... 32 11.2 Laser Mark ................................................... 33 11.3 Pin 1 Location in the Tape/Reel ................... 33 11.4 Ordering Information .................................... 33 11.5 MSL & Moisture Sensitive LEVEL ................ 34 12. Application Reference Design ....... 35 Revision History ........................................... 2 1. Introduction ........................................ 4 1.1 1.2 Description ................................................ 4 Features .................................................... 5 2. Block Diagram .................................... 6 3. Electrical Specification ...................... 7 3.1 Absolute Maximum Rating ............................... 7 3.2 Recommendable Operation Condition ............. 7 3.2.1 Temperature, Humidity ............................. 7 3.2.2 Voltage ...................................................... 8 3.3 Current Consumption ....................................... 8 3.3.1 WLAN ....................................................... 8 4. RF Specification ................................. 9 4.1 wireless Specification ....................................... 9 4.2 WiFi RF Transmitter Specification ................. 10 4.3 WIFi RF Receiver Specification ..................... 12 5. Pin Definition .................................... 14 5.1 The detail pin definition information ............... 14 5.2 Alternate function mapping Table ......... 18 6. Addition Information ........................ 21 6.1 Low Speed External Clock Source Characteristics ..................................................... 21 6.2 Communications Interfaces ........................... 23 6.2.1 I2C Interface Characteristics....................... 23 6.2.2 SPI Interface Characteristics ...................... 25 6.2.3 DCMI Interface Characteristics ................... 25 6.2.4 TIM timer Interface Characteristics ............. 26 6.2.5 I2S timer Interface Characteristics .............. 27 6.2.5 USB HS characteristics ............................... 28 7. Mechanical & Weight Specification 29 7.1 Size of the Module ......................................... 29 7.2 Weight of the Module ..................................... 29 The Specification maybe changed. . 3

1. Introduction 1.1 Description This is a complete WiFi MCU module which is designed for embedded wireless solution and a cost-effective, low power capabilities high performance MCU in M2M applications. It includes standards-based wired and wireless technologies to enable IP infrastructures for smart grid, smart home, security, building automation, toys, robots, remote health and wellness monitoring and other M2M applications. The module integrates ARM CortexTM-M3 MCU, clock, WIFi and front end into a smallest form factor LGA package. It is based on Broadcom IEEE802.11 b/g/n antenna diversity single-stream Broadcom align technology. Thus, it can be used to enable wireless connectivity to the simplest existing sensor products with minimal engineering effort. The solution is provided as a module to reduce development time, lower manufacturing costs, save board space, ease certification, and minimize RF expertise required. Additionally it is provided as a complete platform solution including software drivers, sample applications, API guide, user documentation and a world-class support community. The Specification maybe changed. . 4

1.2 Features  MCU STM32 ARM 32-bit CortexTM-M3 Frequency up to 120 MHz  Diverse serial interface SPI, USART  Sensor applications support ADC, I2C, I2S,GPIO, CAN bus, 8-bit parallel camera interface, Timers,USB  Debug interface support JTAG  On-chip functionality Single-chip MAC/BB/RF  Frequency Band 2.4 GHz  Transmit Power +17 dBm @b mode/11 Mbps  MIN Receiver Sensitivity -96 dBm  Network Standard 802.11b, 802.11g, 802.11n (single stream)  Modulation Modes CCK and OFDM with BPSK, QPSK, 16 QAM, 64QAM  Hardware Encryption WEP, WPA/WPA2  Supported Data Rates IEEE 802.11b 1 – 11 Mbps IEEE 802.11g 6 – 54 Mbps  Advanced 1x1 802.11n features Full/Half Guard Interval IEEE 802.11n (2.4 GHz) 7.2 – 72.2 Mbps Frame Aggregation Space Time Block Coding (STBC) Low Density Parity Check (LDPC) Encoding  Two antenna configurations Supported antenna diversity  Operating Temperature -40℃ to 85℃  MSL level 3  Certification FCC and CE compliant The Specification maybe changed. . 5

2. Block Diagram ADC DAC I2C SPI CAN USART DCMI TIM I2S Analog to Digital Converter Digital to Analog Converter Intelligent Interface Controller Serial Peripheral Interface Controller Area Network Universal synchronous/asynchronous receiver transmitters Digital Camera Interface (8-bit parallel) Timers Inter-integrated sound Potentiometer Thermal meter or sensor USB Universal serial bus on-the-go high-speed The Specification maybe changed. . 6

3. Electrical Specification 3.1 Absolute Maximum Rating Supply Power Max +4.35 Volt Storage Temperature Voltage ripple +/- 2% - 40° to 85° Celsius Power Supply Absolute Maximum Ratings Power VBAT VDD3V3_1 VDD3V3_2 VDD3V3_3 VDD_3V3_WIFI VDD_3V3_WIFI_PA VDDIO_WIFI 3.2 Recommendable Operation Condition 3.2.1 Temperature, Humidity Max. Values not exceeding Operating voltage min Max 0 0 0 0 0 0 0 4 4 4 4 6 6 4 The WiFi Network Controller module has to withstand the operational requirements as listed in the table below. Operating Temperature Humidity range -40° to 85° Celsius Max 95% Non condensing, relative humidity The Specification maybe changed. . 7

3.2.2 Voltage Power supply for the WiFi Network Controller module will be provided by the host via the power pins Parameter MCU VBAT Voltage GPIO I/O Supply GPIO I/O Supply GPIO I/O Supply WiFi Voltage WiFi PA Voltage MCU With WiFi Min 2.0 2.4 2.4 2.4 Only WiFi Function 1.8 Typ 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 Max 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.6 Unit V V V V V V V V Symbol VBAT VDD3V3_1 VDD3V3_2 VDD3V3_3 VDD_3V3_WIFI VDD_3V3_WIFI_PA VDDIO_WIFI 3.3 Current Consumption 3.3.1 WLAN Condition: Condition: 25deg.C, includes Both WiFi and Micro-Controller Item Condition Min Nom Max Unit Tx mode(11b Max current) Tx mode(11g Max current) Tx mode(11n Max current) Rx mode 11Mbps 54Mbps MCS7 11b (11Mbps) 11g (54Mbps) 11n (MCS7) 345 250 210 115 115 115 150 150 150 mA mA mA mA mA mA The Specification maybe changed. . 8

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