ADS1115(Ads1115).pdf

发布时间：2023-11-25 发布人：admin 分类：养殖资料大小：1.65M 资料格式：pdf 举报版权申诉

第1页 / 共54页

第2页 / 共54页

第3页 / 共54页

第4页 / 共54页

第5页 / 共54页

第6页 / 共54页

第7页 / 共54页

第8页 / 共54页

1 Features

2 Applications

3 Description

Table of Contents

4 Revision History

5 Device Comparison Table

6 Pin Configuration and Functions

7 Specifications

7.1 Absolute Maximum Ratings

7.2 ESD Ratings

7.3 Recommended Operating Conditions

7.4 Thermal Information

7.5 Electrical Characteristics

7.6 Timing Requirements: I2C

7.7 Typical Characteristics

8 Parameter Measurement Information

8.1 Noise Performance

9 Detailed Description

9.1 Overview

9.2 Functional Block Diagrams

9.3 Feature Description

9.3.1 Multiplexer

9.3.2 Analog Inputs

9.3.3 Full-Scale Range (FSR) and LSB Size

9.3.4 Voltage Reference

9.3.5 Oscillator

9.3.6 Output Data Rate and Conversion Time

9.3.7 Digital Comparator (ADS1114 and ADS1115 Only)

9.3.8 Conversion Ready Pin (ADS1114 and ADS1115 Only)

9.3.9 SMbus Alert Response

9.4 Device Functional Modes

9.4.1 Reset and Power-Up

9.4.2 Operating Modes

9.4.2.1 Single-Shot Mode

9.4.2.2 Continuous-Conversion Mode

9.4.3 Duty Cycling For Low Power

9.5 Programming

9.5.1 I2C Interface

9.5.1.1 I2C Address Selection

9.5.1.2 I2C General Call

9.5.1.3 I2C Speed Modes

9.5.2 Slave Mode Operations

9.5.2.1 Receive Mode

9.5.2.2 Transmit Mode

9.5.3 Writing To and Reading From the Registers

9.5.4 Data Format

9.6 Register Map

9.6.1 Address Pointer Register (address = N/A) [reset = N/A]

9.6.2 Conversion Register (P[1:0] = 0h) [reset = 0000h]

9.6.3 Config Register (P[1:0] = 1h) [reset = 8583h]

9.6.4 Lo_thresh (P[1:0] = 2h) [reset = 8000h] and Hi_thresh (P[1:0] = 3h) [reset = 7FFFh] Registers

10 Application and Implementation

10.1 Application Information

10.1.1 Basic Connections

10.1.2 Single-Ended Inputs

10.1.3 Input Protection

10.1.4 Unused Inputs and Outputs

10.1.5 Analog Input Filtering

10.1.6 Connecting Multiple Devices

10.1.7 Quickstart Guide

10.2 Typical Application

10.2.1 Design Requirements

10.2.2 Detailed Design Procedure

10.2.2.1 Shunt Resistor Considerations

10.2.2.2 Operational Amplifier Considerations

10.2.2.3 ADC Input Common-Mode Considerations

10.2.2.4 Resistor (R1, R2, R3, R4) Considerations

10.2.2.5 Noise and Input Impedance Considerations

10.2.2.6 First-order RC Filter Considerations

10.2.2.7 Circuit Implementation

10.2.2.8 Results Summary

10.2.3 Application Curves

11 Power Supply Recommendations

11.1 Power-Supply Sequencing

11.2 Power-Supply Decoupling

12 Layout

12.1 Layout Guidelines

12.2 Layout Example

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

13.2 Related Links

13.3 Receiving Notification of Documentation Updates

13.4 Community Resources

13.5 Trademarks

13.6 Electrostatic Discharge Caution

13.7 Glossary

14 Mechanical, Packaging, and Orderable Information

ADS111x Ultra-Small, Low-Power, I2C-Compatible, 860-SPS, 16-Bit ADCs With Internal Reference, Oscillator, and Programmable Comparator ADS1113, ADS1114, ADS1115 SBAS444D –MAY 2009–REVISED JANUARY 2018 1 Features 1• Ultra-Small X2QFN Package: 2 mm × 1.5 mm × 0.4 mm • Wide Supply Range: 2.0 V to 5.5 V Low Current Consumption: 150 μA • (Continuous-Conversion Mode) • Programmable Data Rate: 8 SPS to 860 SPS • Single-Cycle Settling • Internal Low-Drift Voltage Reference • Internal Oscillator I2C Interface: Four Pin-Selectable Addresses • • Four Single-Ended or Two Differential Inputs (ADS1115) • Programmable Comparator (ADS1114 and ADS1115) • Operating Temperature Range: –40°C to +125°C 2 Applications • Portable Instrumentation • Battery Voltage and Current Monitoring • Temperature Measurement Systems • Consumer Electronics • Factory Automation and Process Control low-power, 16-bit, 3 Description The ADS1113, ADS1114, and ADS1115 devices I2C- (ADS111x) are precision, converters compatible, analog-to-digital (ADCs) offered in an ultra-small, leadless, X2QFN-10 package, and a VSSOP-10 package. The ADS111x devices incorporate a low-drift voltage reference and an oscillator. The ADS1114 and ADS1115 also incorporate a programmable gain amplifier (PGA) and a digital comparator. These features, along with a wide operating supply range, make the ADS111x well suited for power- and space-constrained, sensor measurement applications. The ADS111x perform conversions at data rates up to 860 samples per second (SPS). The PGA offers input ranges from ±256 mV to ±6.144 V, allowing precise large- and small-signal measurements. The ADS1115 features an input multiplexer (MUX) that four single-ended input allows two differential or measurements. Use the digital comparator in the ADS1114 and ADS1115 for under- and overvoltage detection. The ADS111x continuous- conversion mode or single-shot mode. The devices are automatically powered down after one conversion in single-shot mode; therefore, power consumption is significantly reduced during idle periods. operate in either Device Information(1) PART NUMBER ADS111x BODY SIZE (NOM) PACKAGE 1.50 mm × 2.00 mm X2QFN (10) VSSOP (10) 3.00 mm × 3.00 mm (1) For all available packages, see the package option addendum at the end of the data sheet. Simplified Block Diagrams 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. VoltageReferenceOscillatorSCLSDAADDRADS1113AIN1GNDAIN0VDDI2CInterface16-Bit ßﬂADCADS1114OscillatorComparatorALERT/RDYPGAADS1115AIN0AIN1AIN2AIN3Copyright © 2016, Texas Instruments IncorporatedAIN1AIN0MUXSCLSDAADDRI2CInterface16-Bit ßﬂADCVoltageReferenceOscillatorComparatorALERT/RDYPGASCLSDAADDRI2CInterface16-Bit ßﬂADCVoltageReferenceGNDVDDGNDVDDProductFolderOrderNowTechnicalDocumentsTools &SoftwareSupport &Community

ADS1113, ADS1114, ADS1115 SBAS444D –MAY 2009–REVISED JANUARY 2018 www.ti.com Table of Contents 1 Features.................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Device Comparison Table..................................... 5 6 Pin Configuration and Functions ......................... 5 7 Specifications......................................................... 6 7.1 Absolute Maximum Ratings ...................................... 6 7.2 ESD Ratings.............................................................. 6 7.3 Recommended Operating Conditions....................... 6 7.4 Thermal Information.................................................. 6 7.5 Electrical Characteristics.......................................... 7 7.6 Timing Requirements: I2C......................................... 8 7.7 Typical Characteristics.............................................. 9 8 Parameter Measurement Information ................ 13 8.1 Noise Performance ................................................. 13 9 Detailed Description ............................................ 14 9.1 Overview ................................................................. 14 9.2 Functional Block Diagrams ..................................... 14 9.3 Feature Description................................................. 15 9.4 Device Functional Modes........................................ 21 9.5 Programming........................................................... 22 9.6 Register Map........................................................... 27 10 Application and Implementation........................ 31 10.1 Application Information.......................................... 31 10.2 Typical Application ............................................... 36 11 Power Supply Recommendations ..................... 40 11.1 Power-Supply Sequencing.................................... 40 11.2 Power-Supply Decoupling..................................... 40 12 Layout................................................................... 41 12.1 Layout Guidelines ................................................. 41 12.2 Layout Example .................................................... 42 13 Device and Documentation Support ................. 43 13.1 Documentation Support ........................................ 43 13.2 Related Links ........................................................ 43 13.3 Receiving Notification of Documentation Updates 43 13.4 Community Resources.......................................... 43 13.5 Trademarks ........................................................... 43 13.6 Electrostatic Discharge Caution............................ 43 13.7 Glossary ................................................................ 43 14 Mechanical, Packaging, and Orderable Information ........................................................... 44 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (December 2016) to Revision D Page • Changed Digital input voltage max value from VDD + 0.3 V to 5.5 V in Absolute Maximum Ratings table.......................... 6 • Added "over temperature" to Offset drift parameter for clarity ............................................................................................... 7 • Added Long-term Offset drift parameter in Electrical Characteristics table ........................................................................... 7 • Added "over temperature" to Gain drift parameter for clarity ................................................................................................. 7 • Added Long-term gain drift parameter in Electrical Characteristics table .............................................................................. 7 • Changed VIH parameter max value from VDD to 5.5 V in Electrical Characteristics table .................................................... 7 • Added Output Data Rate and Conversion Time section for clarity....................................................................................... 17 • Changed Figure 28, ALERT Pin Timing Diagram, for clarity................................................................................................ 19 • Changed Figure 39, Typical Connections of the ADS1115, for clarity................................................................................. 31 • Changed the resistor values in Figure 43, Basic Hardware Configuration, from 10 Ω to 10 kΩ.......................................... 35 Changes from Revision B (October 2009) to Revision C Page • Added Device Information, ESD Ratings, Recommended Operating Conditions, and Thermal Information tables, and Parameter Measurement Information, Detailed Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections................................................................................................................................................................ 1 • Changed Title, and Description, Features, and Applications sections for clarity ................................................................... 1 • Deleted temperature range text from Description section and moved to Features section ................................................... 1 • Changed Product Family table title to Device Comparison Table and deleted Package Designator column........................ 5 • Changed Pin Functions table for clarity.................................................................................................................................. 5 • Changed Power-supply voltage max value from 5.5 V to 7 V in Absolute Maximum Ratings table...................................... 6 • Changed Analog input voltage min value from –0.3 V to GND – 0.3 V in Absolute Maximum Ratings table ....................... 6 2 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated Product Folder Links: ADS1113 ADS1114 ADS1115

www.ti.com ADS1113, ADS1114, ADS1115 SBAS444D –MAY 2009–REVISED JANUARY 2018 • Changed Digital input voltage min value from –0.5 V to GND – 0.3 V in Absolute Maximum Ratings table......................... 6 • Changed Digital input voltage max value from 5.5 V to VDD + 0.3 V in Absolute Maximum Ratings table.......................... 6 • Deleted Analog input current rows in Absolute Maximum Ratings table................................................................................ 6 • Added Input current row in Absolute Maximum Ratings table ............................................................................................... 6 • Added Operating temperature range of –40°C to +125°C back into Absolute Maximum Ratings table................................ 6 • Added minimum specification of –40°C for TJ in Absolute Maximum Ratings table ............................................................. 6 • Changed Electrical Characteristics table conditions line for clarity ........................................................................................ 7 • Changed all instances of "FS" to "FSR" ................................................................................................................................. 7 • Deleted FSR from Electrical Characteristics and moved to Recommended Operating Conditions table .............................. 7 • Added values from Table 2 to Differential input impedance parameter in Electrical Characteristics table............................ 7 • Changed Output noise parameter link from "see Typical Characteristics" to "see Noise Performance section" in Electrical Characteristics table ............................................................................................................................................... 7 • Changed Offset error empty min value to –3, and max value from ±3 to 3 for clarity in Electrical Characteristics table ...... 7 • Changed VIH parameter max value from 5.5 V to VDD in Electrical Characteristics table .................................................... 7 • Changed VIL parameter min value from GND – 0.5 V to GND in Electrical Characteristics table ......................................... 7 • Changed Input leakage current parameters from two rows to one row, changed test conditions from VIH = 5.5V and VIL = GND to GND < VDIG < VDD, and changed min value from 10 µA to –10 µA in Electrical Characteristics table........... 7 • Changed text in note 1 of Electrical Characteristics table from "In no event should more than VDD + 0.3 V be applied to this device" to "No more than VDD + 0.3 V or 5.5 V (whichever is smaller) must be applied to this device. See Table 3 for more information."......................................................................................................................................... 7 • Deleted Power-supply voltage parameter from Electrical Characteristics and moved to Recommended Operating Conditions table...................................................................................................................................................................... 8 • Deleted Specified temperature parameter from Electrical Characteristics and moved to Recommended Operating Conditions table...................................................................................................................................................................... 8 • Deleted Storage temperature parameter from Electrical Characteristics and moved to Absolute Maximum Ratings table .. 8 • Added condition statement in Timing Requirements: I2C table.............................................................................................. 8 • Added note 1 to Timing Requirements table.......................................................................................................................... 8 • Changed Figure 22; deleted "Gain = 2/3, 1, 2, 4, 8, or 16" ................................................................................................. 14 • Added Functional Block Diagrams for ADS1114 and ADS1113 .......................................................................................... 14 • Changed Analog Inputs section to provide LSB size information instead of PGA setting ................................................... 16 • Changed Full-Scale Input section title to Full-Scale Range (FSR) and LSB Size, and updated section for clarity ............. 17 • Added Voltage Reference and Oscillator sections ............................................................................................................... 17 • Changed Comparator section title to Digital Comparator, and updated section for clarity. ................................................. 17 • Changed Conversion Ready Pin section for clarity .............................................................................................................. 19 • Changed Register Map section for clarity ............................................................................................................................ 27 • Changed Application Information section for clarity ............................................................................................................. 31 • Added Input Protection section............................................................................................................................................. 32 • Added Unused Inputs and Outputs section.......................................................................................................................... 32 • Changed Aliasing section title to Analog Input Filtering and updated section for clarity...................................................... 33 • Added Typical Application section........................................................................................................................................ 36 Changes from Revision A (August 2009) to Revision B Page • Deleted Operating Temperature bullet from Features section ............................................................................................... 1 • Deleted Operating temperature range from Absolute Maximum Ratings table...................................................................... 6 • Deleted Operating temperature parameter from Temperature section of Electrical Characteristics table............................. 8 • Changed Figure 2, Operating Current vs Temperature, to reflect maximum operating temperature .................................... 9 • Changed Figure 3, Power-Down Current vs Temperature, to reflect maximum operating temperature................................ 9 Copyright © 2009–2018, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: ADS1113 ADS1114 ADS1115

ADS1113, ADS1114, ADS1115 SBAS444D –MAY 2009–REVISED JANUARY 2018 www.ti.com • Changed Figure 4, Single-Ended Offset Error vs Temperature, to reflect maximum operating temperature........................ 9 • Changed Figure 5, Differential Offset vs Temperature, to reflect maximum operating temperature ..................................... 9 • Changed Figure 6, Gain Error vs Temperature, to reflect maximum operating temperature................................................. 9 • Changed 140°C to 125°C in Figure 9, INL vs Input Signal .................................................................................................... 9 • Changed +140°C to +125°C in Figure 10, INL vs Input Signal.............................................................................................. 9 • Changed +140°C to +125°C in Figure 11, INL vs Input Signal.............................................................................................. 9 • Changed +140°C to +125°C in Figure 12, INL vs Input Signal.............................................................................................. 9 • Changed Figure 13, INL vs Temperature, to reflect maximum operating temperature.......................................................... 9 • Changed Figure 16, Noise vs Temperature, to reflect maximum operating temperature .................................................... 10 • Changed Figure 20, Data Rate vs Temperature, to reflect maximum operating temperature ............................................. 11 4 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated Product Folder Links: ADS1113 ADS1114 ADS1115

www.ti.com 5 Device Comparison Table DEVICE ADS1115 ADS1114 ADS1113 ADS1015 ADS1014 ADS1013 ADS1118 ADS1018 RESOLUTION (Bits) 16 16 16 12 12 12 16 12 MAXIMUM SAMPLE RATE (SPS) 860 860 860 3300 3300 3300 860 3300 6 Pin Configuration and Functions ADS1113, ADS1114, ADS1115 SBAS444D –MAY 2009–REVISED JANUARY 2018 PGA INTERFACE Yes Yes No Yes Yes No Yes Yes I2C I2C I2C I2C I2C I2C SPI SPI SPECIAL FEATURES Comparator Comparator None Comparator Comparator None Temperature sensor Temperature sensor INPUT CHANNELS Differential (Single-Ended) 2 (4) 1 (1) 1(1) 2 (4) 1 (1) 1 (1) 2 (4) 2 (4) RUG Package 10-Pin X2QFN Top View DGS Package 10-Pin VSSOP Top View PIN(1) Pin Functions ADS1113 ADS1114 ADS1115 TYPE DESCRIPTION 1 4 5 — — — 3 2, 6, 7 10 9 8 1 4 5 — — 2 3 6, 7 10 9 8 1 4 5 6 7 2 3 — 10 9 8 I2C slave address select Digital input Analog input Analog input 0 Analog input Analog input 1 Analog input Analog input 2 (ADS1115 only) Analog input Analog input 3 (ADS1115 only) Digital output Comparator output or conversion ready (ADS1114 and ADS1115 only) Analog — Digital input Digital I/O Analog Ground Not connected Serial clock input. locks data on SDA Serial data. Transmits and receives data Power supply. Connect a 0.1-μF, power-supply decoupling capacitor to GND. NAME ADDR AIN0 AIN1 AIN2 AIN3 ALERT/RDY GND NC SCL SDA VDD (1) See the Unused Inputs and Outputs section for unused pin connections. Copyright © 2009–2018, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ADS1113 ADS1114 ADS1115 1ADDR2ALERT/RDY3GND4AIN05AIN16AIN27AIN38VDD9SDA10SCLNot to scale1ADDR10 SCL2ALERT/RDY9 SDA3GND8 VDD4AIN07 AIN35AIN16 AIN2Not to scale

ADS1113, ADS1114, ADS1115 SBAS444D –MAY 2009–REVISED JANUARY 2018 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) www.ti.com Power-supply voltage Analog input voltage Digital input voltage Input current, continuous Temperature VDD to GND AIN0, AIN1, AIN2, AIN3 SDA, SCL, ADDR, ALERT/RDY Any pin except power supply pins Operating ambient, TA Junction, TJ Storage, Tstg MIN –0.3 GND – 0.3 GND – 0.3 –10 –40 –40 –60 MAX 7 VDD + 0.3 5.5 10 125 150 150 UNIT V V V mA °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) Charged-device model (CDM), per JEDEC specification JESD22-C101(2) (1) (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. VALUE ±2000 ±500 UNIT V 7.3 Recommended Operating Conditions POWER SUPPLY Power supply (VDD to GND) MIN 2 NOM MAX UNIT 5.5 V Full-scale input voltage range(2) (VIN = V(AINP) – V(AINN)) Absolute input voltage ANALOG INPUTS(1) FSR V(AINx) DIGITAL INPUTS VDIG TEMPERATURE TA (1) AINP and AINN denote the selected positive and negative inputs. AINx denotes one of the four available analog inputs. (2) This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3 V must be applied to the analog inputs of Operating ambient temperature Digital input voltage ±6.144 VDD ±0.256 GND GND –40 V V V 5.5 125 °C the device. See Table 3 more information. 7.4 Thermal Information THERMAL METRIC(1) DGS (VSSOP) RUG (X2QFN) UNIT ADS111x RθJA RθJC(top) RθJB ψJT ψJB RθJC(bot) (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application Junction-to-ambient thermal resistance Junction-to-case (top) thermal resistance Junction-to-board thermal resistance Junction-to-top characterization parameter Junction-to-board characterization parameter Junction-to-case (bottom) thermal resistance °C/W °C/W °C/W °C/W °C/W °C/W 10 PINS 182.7 67.2 103.8 10.2 102.1 N/A 10 PINS 245.2 69.3 172.0 8.2 170.8 N/A report. 6 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated Product Folder Links: ADS1113 ADS1114 ADS1115

www.ti.com ADS1113, ADS1114, ADS1115 SBAS444D –MAY 2009–REVISED JANUARY 2018 7.5 Electrical Characteristics At VDD = 3.3 V, data rate = 8 SPS, and full-scale input voltage range (FSR) = ±2.048 V (unless otherwise noted). Maximum and minimum specifications apply from TA = –40°C to +125°C. Typical specifications are at TA = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUT Common-mode input impedance Differential input impedance SYSTEM PERFORMANCE Resolution (no missing codes) Data rate Data rate variation Output noise Integral nonlinearity DR INL Offset error Offset drift over temperature Long-term Offset drift Offset power-supply rejection Offset channel match Gain error(3) Gain drift over temperature(3) Long-term gain drift(3) Gain power-supply rejection Gain match(3) Gain channel match CMRR Common-mode rejection ratio DIGITAL INPUT/OUTPUT VIH VIL VOL High-level input voltage Low-level input voltage Low-level output voltage Input leakage current FSR = ±6.144 V(1) FSR = ±4.096 V(1), FSR = ±2.048 V FSR = ±1.024 V FSR = ±0.512 V, FSR = ±0.256 V FSR = ±6.144 V(1) FSR = ±4.096 V(1) FSR = ±2.048 V FSR = ±1.024 V FSR = ±0.512 V, ±0.256 V All data rates DR = 8 SPS, FSR = ±2.048 V(2) FSR = ±2.048 V, differential inputs FSR = ±2.048 V, single-ended inputs FSR = ±2.048 V FSR = ±2.048 V, TA = 125°C, 1000 hrs FSR = ±2.048 V, DC supply variation Match between any two inputs FSR = ±2.048 V, TA = 25°C FSR = ±0.256 V FSR = ±2.048 V FSR = ±6.144 V(1) FSR = ±2.048 V, TA = 125°C, 1000 hrs Match between any two gains Match between any two inputs At DC, FSR = ±0.256 V At DC, FSR = ±2.048 V At DC, FSR = ±6.144 V(1) fCM = 60 Hz, DR = 8 SPS fCM = 50 Hz, DR = 8 SPS IOL = 3 mA GND < VDIG < VDD 0.7 VDD GND GND –10 (1) This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3 V must be applied to the analog inputs of the device. See Table 3 more information. (2) Best-fit INL; covers 99% of full-scale. (3) Includes all errors from onboard PGA and voltage reference. Copyright © 2009–2018, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: ADS1113 ADS1114 ADS1115 10 6 3 100 22 15 4.9 2.4 710 16 8, 16, 32, 64, 128, 250, 475, 860 –10% See Noise Performance section 10% –3 MΩ MΩ kΩ Bits SPS LSB LSB 1 3 LSB/°C LSB LSB/V LSB 0.15% 40 ppm/°C % ppm/V 0.1% 0.1% dB V V V µA 5.5 0.3 VDD 0.4 10 ±1 ±3 0.005 ±1 1 3 0.01% 7 5 5 ±0.05 80 0.02% 0.05% 105 100 90 105 105 0.15

ADS1113, ADS1114, ADS1115 SBAS444D –MAY 2009–REVISED JANUARY 2018 www.ti.com Electrical Characteristics (continued) At VDD = 3.3 V, data rate = 8 SPS, and full-scale input voltage range (FSR) = ±2.048 V (unless otherwise noted). Maximum and minimum specifications apply from TA = –40°C to +125°C. Typical specifications are at TA = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER-SUPPLY IVDD Supply current PD Power dissipation TA = 25°C TA = 25°C Power-down Operating VDD = 5.0 V VDD = 3.3 V VDD = 2.0 V 0.5 150 0.9 0.5 0.3 2 5 200 300 µA mW 7.6 Timing Requirements: I2C over operating ambient temperature range and VDD = 2.0 V to 5.5 V (unless otherwise noted) FAST MODE HIGH-SPEED MODE fSCL tBUF SCL clock frequency Bus free time between START and STOP condition Hold time after repeated START condition. After this period, the first clock is generated. Setup time for a repeated START condition Setup time for STOP condition Data hold time Data setup time Low period of the SCL clock pin High period for the SCL clock pin Rise time for both SDA and SCL signals(1) Fall time for both SDA and SCL signals(1) tHDSTA tSUSTA tSUSTO tHDDAT tSUDAT tLOW tHIGH tF tR (1) For high-speed mode maximum values, the capacitive load on the bus line must not exceed 400 pF. 300 300 MAX 0.4 MIN 0.01 600 600 600 600 0 100 1300 600 MIN 0.01 160 160 160 160 0 10 160 60 MAX 3.4 UNIT MHz ns ns ns ns ns ns ns ns ns ns 160 160 Figure 1. I2C Interface Timing 8 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated Product Folder Links: ADS1113 ADS1114 ADS1115 SCLSDAtLOWtRtFtHDSTAtHDSTAtHDDATtBUFtSUDATtHIGHtSUSTAtSUSTOPSSP

分享到：

赞收藏

资料库

ADS1115(Ads1115).pdf

相关推荐

树莓派

热门标签

最新资料