1.3inch SH1106 OLED数据手册(1.3inch-SH1106-OLED).pdf-资料库

Contents Contents RReevviissiioonn HHiissttoorryy CCoonntteennttss 11.. BBaassiicc SSppeecciiffiiccaattiioonnss 1.1 Display Specifications 1.2 Mechanical Specifications 1.3 Active Area / Memory Mapping & Pixel Construction 1.4 Mechanical Drawing 1.5 Pin Definition 22.. AAbbssoolluuttee MMaaxxiimmuumm RRaattiinnggss 33.. Optics & EElleeccttrriiccaall CChhaarraacctteerriissttiiccss 3.1 Optics Characteristics 3.2 DC Characteristics 3.3 AC Characteristics 3.3.1 68XX-Series MPU Parallel Interface Characteristics 3.3.2 80XX-Series MPU Parallel Interface Characteristics 3.3.3 Serial Interface Characteristics (4-wire SPI) 3.3.4 Serial Interface Characteristics (3-wire SPI) 3.3.5 I2C Interface Characteristics 44.. FFuunnccttiioonnaall SSppeecciiffiiccaattiioonn 4.1 Commands 4.2 Power down and Power up Sequence 4.2.1 Power up Sequence 4.2.2 Power down Sequence 4.3 Reset Circuit 4.4 Actual Application Example 4.4.1 VCC Supplied Externally 4.4.2 VCC Generated by Internal DC/DC Circuit 55.. RReelliiaabbiilliittyy 5.1 Contents of Reliability Tests 5.2 Failure Check Standard 66.. OOuuttggooiinngg QQuuaalliittyy CCoonnttrrooll SSppeecciiffiiccaattiioonnss 6.1 Environment Required 6.2 Sampling Plan 6.3 Criteria & Acceptable Quality Level 6.3.1 Cosmetic Check (Display Off) in Non-Active Area 6.3.2 Cosmetic Check (Display Off) in Active Area 6.3.3 Pattern Check (Display On) in Active Area 77.. PPaacckkaaggee SSppeecciiffiiccaattiioonnss 88.. PPrreeccaauuttiioonnss WWhheenn UUssiinngg TThheessee OOEELL DDiissppllaayy MMoodduulleess 8.1 Handling Precautions 8.2 Storage Precautions 8.3 Designing Precautions 8.4 Precautions when disposing of the OEL display modules 8.5 Other Precautions WWaarrrraannttyy NNoottiiccee

11.. BBaassiicc SSppeecciiffiiccaattiioonnss 1.1 Display Specifications 1) Display Mode: 2) Display Color: 3) Drive Duty: Passive Matrix Monochrome (White) 1/64 Duty 1.2 Mechanical Specifications 1) Outline Drawing: 2) Number of Pixels: 3) Panel Size: 4) Active Area: 5) Pixel Pitch: 6) Pixel Size: 7) Weight: According to the annexed outline drawing 128  64 34.5  23.0  1.4 (mm) 29.42  14.7 (mm) 0.23  0.23(mm) 0.21  0.21(mm) 2.18 (g) 1.3 Active Area / Memory Mapping & Pixel Construction P0.23x128-0.02=29.42 "A" . 7 4 1 = 2 0 . 0 - 4 6 x 3 2 . 0 P Segment 129 ( Column 1 ) Common 1 ( Row 63 ) Common 63 ( Row 1 ) Segment 2 ( Column 128 ) Common 0 ( Row 64 ) Common 62 ( Row 2 ) 3 2 . 0 1 2 . 0 0.23 0.21 Detail "A" Scale (10:1)

1.4 Mechanical Drawing ) 2 w o R ( 2 6 n o m m o C ) 4 6 w o R ( 0 n o m m o C 2 t n e m g e S ) 8 2 1 n m u l o C ( 9 2 1 t n e m g e S ) 1 n m u l o C ( . . 2 4 9 2 = 2 0 0 - 8 2 1 x 3 2 0 P . " A " P0.23x64-0.02=14.7 1 n o m m o C ) 3 6 w o R ( 3 6 n o m m o C ) 1 w o R ( k r a m e R g n i w a r D l a n i g i r O e t a D 9 1 6 0 3 1 0 2 m e t I A ) e z i S l e n a P ( 2 . 0 ± 5 . 4 3 ) e z i S p a C ( 2 . 0 ± 5 4 3 . ) r e z i r a l o P ( 2 . 0 ± 5 . 3 3 ) A V / ( 2 . 0 ± 2 4 . 1 3 ) 4 5 . 1 ( 5 . 0 ± 5 . 0 ) A A / ( 2 . 0 ± 2 4 . 9 2 ) 4 5 . 2 ( l o b m y S ) D N G ( . . C N P 2 C N 2 C P 1 C N 1 C T A B V S S V S S V D D V 0 S B 1 S B 2 S B # S C # S E R # C D / # W R / # D R E / 0 D 1 D 2 D 3 D 4 D 5 D 6 D 7 D F E R I H M O C V C C V C N ) D N G ( . . C N n i P 5 76431 2 8 9 0 1 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 1 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 2 0 3 . v e R A r e b m u N g n i w a r D 1 0 G L W S K 4 6 8 2 - G Q l a i r e t a M e d i m i y l o P i / e m L a d o S e z i S 3 A t e e h S 1 f o 1 e l a c S 1 : 1 . M P . ) 1 : 0 1 ( e l a c S " A " l i a t e D 3 2 0 . 1 2 0 . 0.21 0.23 . c n I y g o l o n h c e T n o i s i v l l A . E / l e n a P . E E . n w a r D e l t i T m m t i n U d e i f i c e p S e s i w r e h t O s s e l n U y B e t a D . 3 0 ± 1 ± n o i s n e m D i e l g n A e c n a r e l o T s s e n h g u o R l a r e n e G . 1 0 ± 4 . 1 Glue Contact Side . 3 0 0 ± 1 . 0 t=0.15mm Max Remove Tape t=0.2mm Polarizer 15x8x0.05mm Protective Tape Contact Side 6 5 0 1 . " 3 1 a e r A e v i t c A s l e x i P 4 6 x 8 2 1 2-R0.4± 0.05 0 3 N.C. (GND) . 2 0 ± 2 1 VCC IREF D6 D4 D2 D0 R/W# RES# BS2 NC VSS VBAT C1P C2P NC VCOMH D7 D5 D3 D1 E/RD# D/C# CS# BS1 VDD VSS C1N C2N 1 N.C. (GND) (2.1) (1.1) 0.5± 0.5 14.7± 0.2 (A/A) 16.7± 0.2 (V/A) 18.2± 0.2 (Polarizer) 19.2± 0.2 (Cap Size) 23± 0.2 (Panel Size) 4 4.75 6.887 11 12± 0.3 (35) l a v o r p p A r e m o t s u C e r u t a n g i S ) 3 0 . . 0 ± 0 4 0 W ( 5 0 . . 0 ± 3 0 2 = ) 1 - 0 3 ( x 0 7 . 0 P 1 . 0 ± 5 8 . 0 . 2 0 ± 2 2 C 2 I , I P S e r i w - 4 / 3 , l e l l a r a P X X 0 8 / X X 8 6 t i b - 8 0 3 . 0 ± : e c n a r e l o T l a r e n e G . 5 : e c a f r e t n I . 4 7 0 P 6 0 1 1 T Q : r e b m u N C P F G 6 0 1 1 D S S : C I r e v i r D . 2 . 3 e t i h W : r o l o C . 1 ) 5 2 . 6 ( : s e t o N ) k r a M t n e m n g i l A ( 1 . 0 ± 6 1 2± 0.3

1.5 Pin Definition Pin Number Symbol PPoowweerr SSuuppppllyy I/O Function 9 8 28 29 DDrriivveerr 26 27 VDD VSS VCC VLSS IREF VCOMH DDCC//DDCC CCoonnvveerrtteerr 6 VBAT 4 / 5 2 / 3 C1P / C1N C2P / C2N IInntteerrffaaccee 10 11 12 14 13 BS0 BS1 BS2 RES# CS# I O P I I I I 15 D/C# I 17 E/RD# I P P PPoowweerr SSuuppppllyy ffoorr LLooggiicc This is a voltage supply pin. It must be connected to external source. GGrroouunndd ooff LLooggiicc CCiirrccuuiitt This is a ground pin. It acts as a reference for the logic pins. It must be connected to external ground. PPoowweerr SSuuppppllyy ffoorr OOEELL PPaanneell This is the most positive voltage supply pin of the chip. A stabilization capacitor should be connected between this pin and VSS when the converter is used. It must be connected to external source when the converter is not used. P P GGrroouunndd ooff AAnnaalloogg CCiirrccuuiitt This is an analog ground pin. It should be connected to VSS externally. CCuurrrreenntt RReeffeerreennccee ffoorr BBrriigghhttnneessss AAddjjuussttmmeenntt This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current at 12.5A maximum. VVoollttaaggee OOuuttppuutt HHiigghh LLeevveell ffoorr CCOOMM SSiiggnnaall This pin is the input pin for the voltage output high level for COM signals. A capacitor should be connected between this pin and VSS. PPoowweerr SSuuppppllyy ffoorr DDCC//DDCC CCoonnvveerrtteerr CCiirrccuuiitt This is the power supply pin for the internal buffer of the DC/DC voltage converter. It must be connected to external source when the converter is used. It should be connected to VDD when the converter is not used. PPoossiittiivvee TTeerrmmiinnaall ooff tthhee FFllyyiinngg IInnvveerrttiinngg CCaappaacciittoorr NNeeggaattiivvee TTeerrmmiinnaall ooff tthhee FFllyyiinngg BBoooosstt CCaappaacciittoorr The charge-pump capacitors are required between the terminals. They must be floated when the converter is not used. CCoommmmuunniiccaattiinngg PPrroottooccooll SSeelleecctt These pins are MCU interface selection input. See the following table: I2C 3-wire SPI 4-wire SPI 8-bit 68XX Parallel 8-bit 80XX Parallel BS0 0 1 0 0 0 BS1 1 0 0 0 1 BS2 0 0 0 1 1 PPoowweerr RReesseett ffoorr CCoonnttrroolllleerr aanndd DDrriivveerr This pin is reset signal input. When the pin is low, initialization of the chip is executed. Keep this pin pull high during normal operation. CChhiipp SSeelleecctt This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low. DDaattaa//CCoommmmaanndd CCoonnttrrooll This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. When the pin is pulled high and serial interface mode is selected, the data at SDIN will be interpreted as data. When it is pulled low, the data at SDIN will be transferred to the command register. In I2C mode, this pin acts as SA0 for slave address selection. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams. RReeaadd//WWrriittee EEnnaabbllee oorr RReeaadd This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low. When serial or I2C mode is selected, this pin must be connected to VSS.

1.5 Pin Definition (Continued) Pin Number Symbol IInntteerrffaaccee ((CCoonnttiinnuueedd)) I/O 16 R/W# I 18~25 D0~D7 I/O RReesseerrvvee Function RReeaadd//WWrriittee SSeelleecctt oorr WWrriittee This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to “High” for read mode and pull it to “Low” for write mode. When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low. When serial or I2C mode is selected, this pin must be connected to VSS. HHoosstt DDaattaa IInnppuutt//OOuuttppuutt BBuuss These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. When I2C mode is selected, D2 & D1 should be tired together and serve as SDA out & SDAin in application and D0 is the serial clock input SCL. Unused pins must be connected to VSS except for D2 in serial mode. 7 N.C. 1, 30 N.C. (GND) - - RReesseerrvveedd PPiinn The N.C. pin between function pins are reserved for compatible and flexible design. RReesseerrvveedd PPiinn ((SSuuppppoorrttiinngg PPiinn)) The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground as the ESD protection circuit.

22.. AAbbssoolluuttee MMaaxxiimmuumm RRaattiinnggss Parameter Symbol Supply Voltage for Logic Supply Voltage for Display Supply Voltage for DC/DC Operating Temperature Storage Temperature Life Time (120 cd/m2) Life Time (80 cd/m2) Life Time (60 cd/m2) VDD VCC VBAT TOP TSTG Min -0.3 0 -0.3 -40 -40 10,000 30,000 50,000 Max 4 14 5 85 85 - - - Unit V V V C C hour hour hour Notes 1, 2 1, 2 1, 2 3 4 4 4 Note 1: All the above voltages are on the basis of “VSS = 0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. “Optics & Electrical Characteristics”. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. Note 3: The defined temperature ranges do not include the polarizer. The maximum withstood temperature of the polarizer should be 80C. Note 4: VCC = 12.0V, Ta = 25°C, 50% Checkerboard. Software configuration follows Section 4.4 Initialization. End of lifetime is specified as 50% of initial brightness reached. The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions.

33.. OOppttiiccss && EElleeccttrriiccaall CChhaarraacctteerriissttiiccss 3.1 Optics Characteristics Characteristics Symbol Conditions Brightness Lbr Brightness (VCC Supplied Externally) (VCC Generated by Internal DC/DC) Lbr (x) (y) CR Dark Room Contrast Viewing Angle C.I.E. (White) Note 5 Note 6 C.I.E. 1931 Min 120 Typ Max Unit - - cd/m2 100 150 0.32 0.28 0.35 0.31 2000:1 Free - - - 0.36 0.39 - - cd/m2 degree * Optical measurement taken at VDD = 2.8V, VCC = 12V & 7.25V. Software configuration follows Section 4.4 Initialization. 3.2 DC Characteristics Characteristics Symbol Conditions Supply Voltage for Logic Supply Voltage for Display (Supplied Externally) VDD VCC Supply Voltage for DC/DC VBAT Supply Voltage for Display (Generated by Internal DC/DC) VCC VIH VIL VOH VOL IDD High Level Input Low Level Input High Level Output Low Level Output Operating Current for VDD Note 5 Min 1.65 - Note 6 (Internal DC/DC Disable) Internal DC/DC Enable 3.5 (Internal DC/DC Enable) 6.4 IOUT = 100μA, 3.3MHz 0.8VDD IOUT = 100μA, 3.3MHz IOUT = 100μA, 3.3MHz 0.9VDD IOUT = 100μA, 3.3MHz 0 0 - Typ 2.8 12.0 - - - - - - 180 Max 3.3 - 4.2 9 VDD 0.2VDD VDD 0.1VDD 300 Unit V V V V V V V V μA Operating Current for VCC (VCC Supplied Externally) Operating Current for VBAT (VCC Generated by Internal DC/DC) ICC IBAT Note 7 - 23 32 mA Note 8 - 45 50 mA Sleep Mode Current for VDD Sleep Mode Current for VCC Note 5 & 6: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of the panel IDD, SLEEP ICC, SLEEP μA μA 5 10 1 2 - - characteristics and the customer’s request. VDD = 2.8V, VCC = 12V, IREF=910K 100% Display Area Turn on. Note 7: Note 8: VDD = 2.8V, VCC = 8V, IREF=560K 100% Display Area Turn on. * Software configuration follows Section 4.4 Initialization.

3.3 AC Characteristics 3.3.1.1 68XX-Series MPU Parallel Interface Timing Characteristics: Symbol Description Clock Cycle Time Address Setup Time Address Hold Time tcycle tAS tAH tDSW Write Data Setup Time Write Data Hold Time tDHW tDHR Read Data Hold Time Output Disable Time tOH Access Time tACC Chip Select Low Pulse Width (Read) Chip Select Low Pulse width (Write) Chip Select High Pulse Width (Read) Chip Select High Pulse Width (Write) Rise Time Fall Time tR tF PWCSL PWCSH * (VDD - VSS = 1.65V to 3.3V, Ta = 25°C) Min 300 5 0 40 7 20 - - 120 60 60 60 - - Max - - - - - - 70 140 - - 40 40 Unit ns ns ns ns ns ns ns ns ns ns ns ns

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1.3inch SH1106 OLED数据手册(1.3inch-SH1106-OLED).pdf

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