2.66inch e-Paper (B) 数据手册(2.66inch-e-paper-b-specification).pdf-资料库

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Product Specification Model NO. : 2.66inch e-Paper (B) 10F, International Science & Technology Building, Fuhong Rd, Futian District, Shenzhen, China Email: sales@waveshare.com Website: www.waveshare.com 2.66inch e-Paper (B)PAGE 1/33

Revision History Version 1.0 1.1 Content New release Update 8 : Optical Specification Date Producer 2020/08/01 2020/9/22 2.66inch e-Paper (B)PAGE 2/33

CONTENTS 1. Over View..................................................................................................................... 5 2. Features.........................................................................................................................5 3. Mechanical Specification............................................................................................. 5 4.Mechanical Drawing of EPD Module...........................................................................6 5. Input/output Pin Assignment........................................................................................7 6. Electrical Characteristics..............................................................................................8 6.1 Absolute Maximum Rating.................................................................................... 8 6.2 Panel DC Characteristics........................................................................................9 6.3 Panel DC Characteristics(Driver IC Internal Regulators)................................ 10 6.4 Panel AC Characteristics......................................................................................10 6.4.1 MCU Interface Selection...............................................................................10 6.4.2 MCU Serial Interface (4-wire SPI)............................................................... 10 6.4.3 MCU Serial Interface (3-wire SPI)............................................................... 12 6.4.4 Interface Timing............................................................................................ 13 7.Command Table...........................................................................................................15 8. Optical Specification.................................................................................................. 23 9. Handling, Safety, and Environment Requirements....................................................23 10. Reliability Test..........................................................................................................24 11. Block Diagram..........................................................................................................25 12. Typical Application Circuit with SPI Interface........................................................26 13 Typical Operating Seque........................................................................................... 27 13.1 OTP Operation Flow.......................................................................................... 27 13.2OTP Operation Reference Program Code...........................................................28 14. Inspection condition................................................................................................. 29 2.66inch e-Paper (B)PAGE 3/33

14.1 Environment....................................................................................................... 29 14.2 Illuminance......................................................................................................... 29 14.3 Inspect method....................................................................................................29 14.4 Display area........................................................................................................ 29 14.5 Inspection standard.............................................................................................30 14.5.1 Electric inspection standard........................................................................ 30 14.5.2 Appearance inspection standard..................................................................31 15.Packaging...................................................................................................................33 2.66inch e-Paper (B)PAGE 4/33

1. Over View This display is an Active Matrix Electrophoretic Display (AM EPD), with interface and a reference system design. The display is capable to display images at 1-bit white, black and red full display capabilities. The 2.66 inch active area contains 296×152 pixels. The module is a TFT-array driving electrophoresis display, with integrated circuits including gate driver, source driver, MCU interface, timing controller, oscillator, DC-DC, SRAM, LUT, VCOM. Module can be used in portable electronic devices, such as Electronic Shelf Label (ESL) System. 2. Features ◆296×152pixels display ◆High contrast High reflectance ◆Ultra wide viewing angle Ultra low power consumption ◆Pure reflective mode ◆Bi-stable display ◆Commercial temperature range ◆Landscape portrait modes ◆Hard-coat antiglare display surface ◆Ultra Low current deep sleep mode ◆On chip display RAM ◆Waveform can stored in On-chip OTP or written by MCU ◆Serial peripheral interface available ◆On-chip oscillator ◆On-chip booster and regulator control for generating VCOM, Gate and Source driving voltage ◆I2C signal master interface to read external temperature sensor ◆Built-in temperature sensor 3. Mechanical Specification Parameter Screen Size Display Resolution Active Area Pixel Pitch Pixel Configuration Outline Dimension Weight Specifications 2.66 152(H)×296(V) 30.704×60.088 0.202×0.203 Rectangle 36.304(H)×71.820 (V) ×1.0(D) 4.7±0.5 Remark DPI:125 Unit Inch Pixel mm mm mm g 2.66inch e-Paper (B)PAGE 5/33

4.Mechanical Drawing of EPD Module Confirmation: DATE REV. MODIFICATION 1 1 55 NOTE 1 DISPLAY MODULE 2.66" ARRAY FOR EPD 2 DRIVER IC:SSD1680Z8 3 RESOLUTION:296gateX152source 4 PIXEL SIZE: 0.202mmX 0.203 mm ANGLES±5° .X=±0.4mm .XX=±0.20mm .XXX=±0.200mm EPD A 19.08.13 XZ FAN PP SUN SY ZHAO mm 1/1 RoHS 2.66inch e-Paper (B)PAGE 6/33

I/O Description Do not connect with other NC pins N-Channel MOSFET Gate Drive Control Current Sense Input for the Control Loop 5. Input/output Pin Assignment No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 O I NC Do not connect with other NC pins C Positive Source driving voltage(Red) O I2C Interface to digital temperature sensor Clock pin I/O I2C Interface to digital temperature sensor Data pin Bus Interface selection pin I Busy state output pin O Reset signal input. Active Low. I Data /Command control pin I Chip select input pin I I Serial Clock pin (SPI) I/O Serial Data pin (SPI) Name NC GDR RESE NC VSH2 TSCL TSDA BS1 BUSY RES# D/C# CS# SCL SDA 15 16 17 18 19 20 21 22 23 24 VDDIO VCI VSS VDD VPP VSH1 VGH VSL VGL VCOM P P P C P C C C C C Power Supply for interface logic pins It should be connected with VCI Power Supply for the chip Ground Core logic power pin VDD can be regulated internally from VCI. A capacitor should be connected between VDD and VSS FOR TEST Positive Source driving voltage Power Supply pin for Positive Gate driving voltage and VSH1 Negative Source driving voltage Power Supply pin for Negative Gate driving voltage VCOM and VSL VCOM driving voltage Remark Keep Open Keep Open Note 5-5 Note 5-4 Note 5-3 Note 5-2 Note 5-1 Keep Open I = Input Pin, O =Output Pin, I/O = Bi-directional Pin (Input/output), P = Power Pin, C = Capacitor Pin 2.66inch e-Paper (B)PAGE 7/33

Note 5-1: This pin (CS#) is the chip select input connecting to the MCU. The chip is enabled for MCU communication only when CS# is pulled LOW. Note 5-2: This pin is (D/C#) Data/Command control pin connecting to the MCU in 4-wire SPI mode. When the pin is pulled HIGH, the data at SDA will be interpreted as data. When the pin is pulled LOW, the data at SDA will be interpreted as command. Note 5-3: This pin (RES#) is reset signal input. The Reset is active low. Note 5-4: This pin is Busy state output pin. When Busy is High, the operation of chip should not be interrupted, command should not be sent. The chip would put Busy pin High when -Outputting display waveform -Communicating with digital temperature sensor Note 5-5: Bus interface selection pin BS1 State MCU Interface L H 4-lines serial peripheral interface(SPI) - 8 bits SPI 3- lines serial peripheral interface(SPI) - 9 bits SPI 6. Electrical Characteristics Parameter Operating Temp range Max Logic supply voltage Logic Input voltage Logic Output voltage Operating Temp range 6.1 Absolute Maximum Rating Symbol VCI VIN VOUT TOPR TOPRm TSTG TSTGo HSTGo Storage Temp range Optimal Storage Temp Optimal Storage Humidity Rating -0.5 to +6.0 -0.5 to VCI +0.5 -0.5 to VCI +0.5 10 to +40 0 to +40 -25 to+40 23±3 55±10 Unit V V V ºC. ºC. ºC. ºC. %RH Note: Maximum ratings are those values beyond which damages to the device may occur. operation should be restricted to the limits in the Panel DC Characteristics tables. Functional 2.66inch e-Paper (B)PAGE 8/33

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