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Absolute Maximum Ratings
Operating Conditions
General Characteristics
Electrical Specifications
Current Consumption
RF Receive Section
RF Transmit Section
Crystal Oscillator
Low Power RC Oscillator
Frequency Synthesizer Characteristics
Analog Temperature Sensor
DC Characteristics
Power-On Reset
Pin Configuration
Circuit Description
Application Circuit
Configuration Overview
Configuration Software
4-wire Serial Configuration and Data Interface
Register Access
SPI Read
Command Strobes
FIFO Access
PATABLE Access
Microcontroller Interface and Pin Configuration
Configuration Interface
General Control and Status Pins
Optional Radio Control Feature
Data Rate Programming
Receiver Channel Filter Bandwidth
Demodulator, Symbol Synchronizer, and Data Decision
Frequency Offset Compensation
Bit Synchronization
Byte Synchronization
Packet Handling Hardware Support
Data Whitening
Packet Format
Arbitrary Length Field Configuration
Packet Length > 255
Packet Filtering in Receive Mode
Address Filtering
Maximum Length Filtering
CRC Filtering
Packet Handling in Transmit Mode
Packet Handling in Receive Mode
Packet Handling in Firmware
Modulation Formats
Frequency Shift Keying
Amplitude Modulation
Received Signal Qualifiers and Link Quality Information
Sync Word Qualifier
Preamble Quality Threshold (PQT)
RSSI
Carrier Sense (CS)
CS Absolute Threshold
CS Relative Threshold
Clear Channel Assessment (CCA)
Link Quality Indicator (LQI)
Forward Error Correction with Interleaving
Forward Error Correction (FEC)
Interleaving
Radio Control
Power-On Start-Up Sequence
Automatic POR
Manual Reset
Crystal Control
Voltage Regulator Control
Active Modes
Wake On Radio (WOR)
RC Oscillator and Timing
Timing
RX Termination Timer
Data FIFO
Frequency Programming
VCO
VCO and PLL Self-Calibration
Voltage Regulators
Output Power Programming
Shaping and PA Ramping
Selectivity
Crystal Oscillator
Reference Signal
External RF Match
PCB Layout Recommendations
General Purpose / Test Output Control Pins
Asynchronous and Synchronous Serial Operation
Asynchronous Operation
Synchronous Serial Operation
System Considerations and Guidelines
SRD Regulations
Frequency Hopping and Multi-Channel Systems
Wideband Modulation not using Spread Spectrum
Data Burst Transmissions
Continuous Transmissions
Crystal Drift Compensation
Spectrum Efficient Modulation
Low Cost Systems
Battery Operated Systems
Increasing Output Power
Configuration Registers
Configuration Register Details – Registers with preserved va
Configuration Register Details – Registers that Loose Progra
Status Register Details
Package Description (QLP 20)
Recommended PCB Layout for Package (QLP 20)
Package Thermal Properties
Soldering Information
Tray Specification
Carrier Tape and Reel Specification
Ordering Information
References
General Information
Document History
Product Status Definitions
Address Information
TI Worldwide Technical Support
CC1101 CC1101 Low-Cost Low-Power Sub-1GHz RF Transceiver (Enhanced CC1100 ) Applications • Ultra operating ISM/SRD bands low-power wireless applications the 315/433/868/915 MHz in • Wireless alarm and security systems • Industrial monitoring and control is a for very Product Description low-cost sub- 1 GHz The CC1101 transceiver designed low-power wireless applications. The circuit is mainly intended for the ISM (Industrial, Scientific and Medical) and SRD (Short Range Device) frequency bands at 315, 433, 868, and 915 MHz, but can easily be programmed for operation at other frequencies in the 300-348 MHz, 387-464 MHz and 779-928 MHz bands. CC1101 is an improved and code compatible version of the CC1100 RF transceiver. The main improvements on the CC1101 include: Improved spurious response • • Better close-in phase noise improving (ACP) Adjacent Channel Power performance • Higher input saturation level • • Extended frequency bands of Improved output power ramping operation, i.e. CC1100: 400-464 MHz and 800-928 MHz CC1101: 387-464 MHz and 779-928 MHz • Wireless sensor networks • AMR – Automatic Meter Reading • Home and building automation The RF transceiver is integrated with a highly configurable baseband modem. The modem supports various modulation formats and has a configurable data rate up to 500 kBaud. CC1101 provides extensive hardware support for packet handling, data buffering, burst transmissions, clear channel assessment, link quality indication, and wake-on-radio. The main operating parameters and the 64- byte transmit/receive FIFOs of CC1101 can be controlled via an SPI interface. In a typical system, the CC1101 will be used together with a microcontroller and a few additional passive components. 1 2 3 4 5 0 2 9 1 8 1 7 1 6 1 CC1101 0 6 7 8 9 1 15 14 13 12 11 SWRS061B Page 1 of 93
CC1101 Key Features RF Performance • High sensitivity (–111 dBm at 1.2 kBaud, 868 MHz, 1% packet error rate) • Low current consumption (14.7 mA in RX, 1.2 kBaud, 868 MHz) • Programmable output power up to +10 dBm for all supported frequencies • Excellent receiver selectivity and blocking • Programmable data rate from 1.2 to 500 performance kBaud • Frequency bands: 300-348 MHz, 387-464 MHz and 779-928 MHz Analog Features • 2-FSK, GFSK, and MSK supported as well as OOK and flexible ASK shaping • Suitable for frequency hopping systems frequency due settling synthesizer: 90us settling time to a fast • Automatic Frequency Compensation (AFC) can be used to align the frequency synthesizer received center frequency Integrated analog temperature sensor the to • Digital Features • Flexible support for packet oriented systems: On-chip support for sync word detection, address check, flexible packet length, and automatic CRC handling • Efficient SPI interface: All registers can be programmed with one “burst” transfer • Digital RSSI output • Programmable channel filter bandwidth • Programmable Carrier Sense (CS) indicator • Programmable Preamble Quality Indicator (PQI) for improved protection against false sync word detection in random noise • Support for automatic Clear Channel Assessment (CCA) before transmitting (for listen-before-talk systems) • Support for per-package Link Quality • Optional automatic whitening and de- Indication (LQI) whitening of data Low-Power Features • 400 nA sleep mode current consumption • Fast startup time: 240us from sleep to RX or TX mode (measured on EM reference design [5] and [6]) • Wake-on-radio functionality for automatic low-power RX polling • Separate 64-byte RX and TX data FIFOs (enables burst mode data transmission) General • Few external components: Completely on- chip frequency synthesizer, no external filters or RF switch needed • Green package: RoHS compliant and no antimony or bromine • Small size (QLP 4x4 mm package, 20 pins) • Suited for systems targeting compliance with EN 300 220 (Europe) and FCC CFR Part 15 (US). • Support for asynchronous and synchronous serial receive/transmit mode for backwards compatibility with existing radio communication protocols SWRS061B Page 2 of 93
CC1101 Abbreviations Abbreviations used in this data sheet are described below. MSK N/A NRZ OOK PA PCB PD PER PLL POR PQI PQT PTAT QLP QPSK RC RF RSSI RX SAW SMD SNR SPI SRD TBD T/R TX UHF VCO WOR XOSC XTAL Adjacent Channel Power Analog to Digital Converter Automatic Frequency Compensation Automatic Gain Control Automatic Meter Reading Amplitude Shift Keying Bit Error Rate Bandwidth-Time product Clear Channel Assessment Code of Federal Regulations Cyclic Redundancy Check Carrier Sense Continuous Wave (Unmodulated Carrier) Direct Current Digital Variable Gain Amplifier Equivalent Series Resistance Federal Communications Commission Forward Error Correction First-In-First-Out Frequency Hopping Spread Spectrum Binary Frequency Shift Keying Gaussian shaped Frequency Shift Keying Intermediate Frequency In-Phase/Quadrature Industrial, Scientific, Medical Inductor-Capacitor Low Noise Amplifier Local Oscillator Least Significant Bit Link Quality Indicator Microcontroller Unit Most Significant Bit ACP ADC AFC AGC AMR ASK BER BT CCA CFR CRC CS CW DC DVGA ESR FCC FEC FIFO FHSS 2-FSK GFSK IF I/Q ISM LC LNA LO LSB LQI MCU MSB Minimum Shift Keying Not Applicable Non Return to Zero (Coding) On-Off Keying Power Amplifier Printed Circuit Board Power Down Packet Error Rate Phase Locked Loop Power-On Reset Preamble Quality Indicator Preamble Quality Threshold Proportional To Absolute Temperature Quad Leadless Package Quadrature Phase Shift Keying Resistor-Capacitor Radio Frequency Received Signal Strength Indicator Receive, Receive Mode Surface Aqustic Wave Surface Mount Device Signal to Noise Ratio Serial Peripheral Interface Short Range Devices To Be Defined Transmit/Receive Transmit, Transmit Mode Ultra High frequency Voltage Controlled Oscillator Wake on Radio, Low power polling Crystal Oscillator Crystal SWRS061B Page 3 of 93
CC1101 Table Of Contents APPLICATIONS..................................................................................................................................................1 PRODUCT DESCRIPTION................................................................................................................................1 KEY FEATURES .................................................................................................................................................2 RF PERFORMANCE ..........................................................................................................................................2 ANALOG FEATURES ........................................................................................................................................2 DIGITAL FEATURES.........................................................................................................................................2 LOW-POWER FEATURES................................................................................................................................2 GENERAL ............................................................................................................................................................2 ABBREVIATIONS...............................................................................................................................................3 TABLE OF CONTENTS .....................................................................................................................................4 ABSOLUTE MAXIMUM RATINGS.....................................................................................................7 1 2 OPERATING CONDITIONS .................................................................................................................7 GENERAL CHARACTERISTICS.........................................................................................................7 3 ELECTRICAL SPECIFICATIONS.......................................................................................................8 4 4.1 CURRENT CONSUMPTION ............................................................................................................................8 4.2 RF RECEIVE SECTION................................................................................................................................10 RF TRANSMIT SECTION .............................................................................................................................12 4.3 CRYSTAL OSCILLATOR..............................................................................................................................13 4.4 4.5 LOW POWER RC OSCILLATOR...................................................................................................................14 4.6 FREQUENCY SYNTHESIZER CHARACTERISTICS..........................................................................................14 ANALOG TEMPERATURE SENSOR ..............................................................................................................15 4.7 4.8 DC CHARACTERISTICS ..............................................................................................................................15 POWER-ON RESET.....................................................................................................................................15 4.9 5 PIN CONFIGURATION........................................................................................................................16 CIRCUIT DESCRIPTION ....................................................................................................................17 6 APPLICATION CIRCUIT....................................................................................................................18 7 CONFIGURATION OVERVIEW........................................................................................................21 8 9 CONFIGURATION SOFTWARE........................................................................................................23 10 4-WIRE SERIAL CONFIGURATION AND DATA INTERFACE ..................................................23 10.1 CHIP STATUS BYTE ...................................................................................................................................25 10.2 REGISTER ACCESS.....................................................................................................................................25 10.3 SPI READ ..................................................................................................................................................26 10.4 COMMAND STROBES .................................................................................................................................26 10.5 FIFO ACCESS ............................................................................................................................................26 10.6 PATABLE ACCESS...................................................................................................................................27 11 MICROCONTROLLER INTERFACE AND PIN CONFIGURATION ..........................................27 11.1 CONFIGURATION INTERFACE.....................................................................................................................27 11.2 GENERAL CONTROL AND STATUS PINS .....................................................................................................27 11.3 OPTIONAL RADIO CONTROL FEATURE ......................................................................................................28 12 DATA RATE PROGRAMMING..........................................................................................................28 RECEIVER CHANNEL FILTER BANDWIDTH ..............................................................................29 13 14 DEMODULATOR, SYMBOL SYNCHRONIZER, AND DATA DECISION..................................29 14.1 FREQUENCY OFFSET COMPENSATION........................................................................................................29 14.2 BIT SYNCHRONIZATION.............................................................................................................................29 14.3 BYTE SYNCHRONIZATION..........................................................................................................................30 15 PACKET HANDLING HARDWARE SUPPORT ..............................................................................30 15.1 DATA WHITENING.....................................................................................................................................31 15.2 PACKET FORMAT.......................................................................................................................................31 15.3 PACKET FILTERING IN RECEIVE MODE......................................................................................................33 SWRS061B Page 4 of 93
CC1101 15.4 PACKET HANDLING IN TRANSMIT MODE...................................................................................................33 15.5 PACKET HANDLING IN RECEIVE MODE .....................................................................................................34 15.6 PACKET HANDLING IN FIRMWARE.............................................................................................................34 16 MODULATION FORMATS.................................................................................................................35 16.1 FREQUENCY SHIFT KEYING.......................................................................................................................35 16.2 MINIMUM SHIFT KEYING...........................................................................................................................35 16.3 AMPLITUDE MODULATION ........................................................................................................................35 17 RECEIVED SIGNAL QUALIFIERS AND LINK QUALITY INFORMATION ............................36 17.1 SYNC WORD QUALIFIER............................................................................................................................36 17.2 PREAMBLE QUALITY THRESHOLD (PQT) ..................................................................................................36 17.3 RSSI..........................................................................................................................................................36 17.4 CARRIER SENSE (CS).................................................................................................................................38 17.5 CLEAR CHANNEL ASSESSMENT (CCA) .....................................................................................................39 17.6 LINK QUALITY INDICATOR (LQI)..............................................................................................................39 18 FORWARD ERROR CORRECTION WITH INTERLEAVING .....................................................39 18.1 FORWARD ERROR CORRECTION (FEC)......................................................................................................39 INTERLEAVING ..........................................................................................................................................40 18.2 19 RADIO CONTROL................................................................................................................................41 19.1 POWER-ON START-UP SEQUENCE.............................................................................................................41 19.2 CRYSTAL CONTROL...................................................................................................................................42 19.3 VOLTAGE REGULATOR CONTROL..............................................................................................................43 19.4 ACTIVE MODES .........................................................................................................................................43 19.5 WAKE ON RADIO (WOR)..........................................................................................................................43 19.6 TIMING ......................................................................................................................................................44 19.7 RX TERMINATION TIMER ..........................................................................................................................45 DATA FIFO ............................................................................................................................................45 20 FREQUENCY PROGRAMMING........................................................................................................47 21 22 VCO .........................................................................................................................................................47 22.1 VCO AND PLL SELF-CALIBRATION ..........................................................................................................47 VOLTAGE REGULATORS .................................................................................................................48 23 OUTPUT POWER PROGRAMMING ................................................................................................48 24 25 SHAPING AND PA RAMPING............................................................................................................49 SELECTIVITY.......................................................................................................................................51 26 27 CRYSTAL OSCILLATOR....................................................................................................................52 27.1 REFERENCE SIGNAL ..................................................................................................................................53 28 EXTERNAL RF MATCH .....................................................................................................................53 PCB LAYOUT RECOMMENDATIONS.............................................................................................53 29 30 GENERAL PURPOSE / TEST OUTPUT CONTROL PINS.............................................................54 31 ASYNCHRONOUS AND SYNCHRONOUS SERIAL OPERATION ..............................................56 31.1 ASYNCHRONOUS OPERATION ....................................................................................................................56 31.2 SYNCHRONOUS SERIAL OPERATION ..........................................................................................................56 32 SYSTEM CONSIDERATIONS AND GUIDELINES.........................................................................56 32.1 SRD REGULATIONS...................................................................................................................................56 32.2 FREQUENCY HOPPING AND MULTI-CHANNEL SYSTEMS............................................................................57 32.3 WIDEBAND MODULATION NOT USING SPREAD SPECTRUM........................................................................57 32.4 DATA BURST TRANSMISSIONS...................................................................................................................57 32.5 CONTINUOUS TRANSMISSIONS ..................................................................................................................58 32.6 CRYSTAL DRIFT COMPENSATION ..............................................................................................................58 32.7 SPECTRUM EFFICIENT MODULATION.........................................................................................................58 32.8 LOW COST SYSTEMS .................................................................................................................................58 32.9 BATTERY OPERATED SYSTEMS .................................................................................................................58 32.10 INCREASING OUTPUT POWER ................................................................................................................58 SWRS061B Page 5 of 93
CC1101 33 CONFIGURATION REGISTERS........................................................................................................59 33.1 CONFIGURATION REGISTER DETAILS – REGISTERS WITH PRESERVED VALUES IN SLEEP STATE...............63 33.2 CONFIGURATION REGISTER DETAILS – REGISTERS THAT LOOSE PROGRAMMING IN SLEEP STATE .........83 33.3 STATUS REGISTER DETAILS.......................................................................................................................84 34 PACKAGE DESCRIPTION (QLP 20).................................................................................................87 34.1 RECOMMENDED PCB LAYOUT FOR PACKAGE (QLP 20) ...........................................................................88 34.2 PACKAGE THERMAL PROPERTIES ..............................................................................................................88 34.3 SOLDERING INFORMATION ........................................................................................................................88 34.4 TRAY SPECIFICATION ................................................................................................................................88 34.5 CARRIER TAPE AND REEL SPECIFICATION.................................................................................................89 ORDERING INFORMATION..............................................................................................................89 35 36 REFERENCES .......................................................................................................................................90 37 GENERAL INFORMATION................................................................................................................91 37.1 DOCUMENT HISTORY ................................................................................................................................91 37.2 PRODUCT STATUS DEFINITIONS ................................................................................................................91 38 ADDRESS INFORMATION.................................................................................................................92 39 TI WORLDWIDE TECHNICAL SUPPORT......................................................................................92 SWRS061B Page 6 of 93
CC1101 1 Absolute Maximum Ratings Under no circumstances must the absolute maximum ratings given in Table 1 be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. ESD sensitive Caution! device. Precaution should be used when handling the device in order to prevent permanent damage. Parameter Supply voltage Voltage on any digital pin Voltage on the pins RF_P, RF_N, and DCOUPL Voltage ramp-up rate Input RF level Storage temperature range Solder reflow temperature ESD ESD Min –0.3 –0.3 –0.3 –50 Max 3.9 VDD + 0.3 max 3.9 2.0 120 +10 150 260 750 400 Units V V V kV/µs dBm °C °C V V Condition All supply pins must have the same voltage According to IPC/JEDEC J-STD-020C According to JEDEC STD 22, method A114, Human Body Model (HBM) According to JEDEC STD 22, C101C, Charged Device Model (CDM) Table 1: Absolute Maximum Ratings 2 Operating Conditions The operating conditions for CC1101 are listed Table 2 in below. Parameter Operating temperature Operating supply voltage Min -40 1.8 Max 85 3.6 Unit °C V Condition All supply pins must have the same voltage Table 2: Operating Conditions 3 General Characteristics Parameter Frequency range Data rate Min 300 387 779 1.2 1.2 26 Typ Max 348 464 928 500 250 500 Unit MHz MHz MHz kBaud kBaud kBaud Condition/Note 2-FSK GFSK, OOK, and ASK (Shaped) MSK (also known as differential offset QPSK) Optional Manchester encoding (the data rate in kbps will be half the baud rate) Table 3: General Characteristics SWRS061B Page 7 of 93
CC1101 4 Electrical Specifications 4.1 Current Consumption Tc = 25°C, VDD = 3.0V if nothing else stated. All measurement results are obtained using the CC1101EM reference designs ([5] and [6]). Reduced current settings (MDMCFG2.DEM_DCFILT_OFF=1) gives a slightly lower current consumption at the cost of a reduction in sensitivity. See for additional details on current consumption and sensitivity. Parameter Current consumption in power down modes Current consumption Current consumption, 315MHz Min Typ Max Unit Condition 0.2 1 µA Voltage regulator to digital part off, register values retained (SLEEP state). All GDO pins programmed to 0x2F (HW to 0) 0.5 100 165 9.8 34.2 1.5 39.3 1.7 8.4 15.4 14.4 15.2 14.3 16.5 15.1 27.4 15.0 12.3 µA Voltage regulator to digital part off, register values retained, low- power RC oscillator running (SLEEP state with WOR enabled µA Voltage regulator to digital part off, register values retained, XOSC running (SLEEP state with MCSM0.OSC_FORCE_ON set) µA Voltage regulator to digital part on, all other modules in power down (XOFF state) µA Automatic RX polling once each second, using low-power RC oscillator, with 460 kHz filter bandwidth and 250 kBaud data rate, PLL calibration every 4th wakeup. Average current with signal in channel below carrier sense level (MCSM2.RX_TIME_RSSI=1). µA Same as above, but with signal in channel above carrier sense level, 1.95 ms RX timeout, and no preamble/sync word found. µA Automatic RX polling every 15th second, using low-power RC oscillator, with 460kHz filter bandwidth and 250 kBaud data rate, PLL calibration every 4th wakeup. Average current with signal in channel below carrier sense level (MCSM2.RX_TIME_RSSI=1). µA Same as above, but with signal in channel above carrier sense level, 29.3 ms RX timeout, and no preamble/sync word found. mA Only voltage regulator to digital part and crystal oscillator running (IDLE state) mA Only the frequency synthesizer is running (FSTXON state). This currents consumption is also representative for the other intermediate states when going from IDLE to RX or TX, including the calibration state. mA Receive mode, 1.2 kBaud, reduced current, input at sensitivity limit mA Receive mode, 1.2 kBaud, reduced current, input well above sensitivity limit mA Receive mode, 38.4 kBaud, reduced current, input at sensitivity limit mA Receive mode,38.4 kBaud, reduced current, input well above sensitivity limit mA Receive mode, 250 kBaud, reduced current, input at sensitivity limit mA Receive mode, 250 kBaud, reduced current, input well above sensitivity limit mA Transmit mode, +10 dBm output power mA Transmit mode, 0 dBm output power mA Transmit mode, –6 dBm output power SWRS061B Page 8 of 93
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