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VL53L0X数据手册(Vl53l0x).pdf

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1 Overview
1.1 Technical specification
Table 1. Technical specification
1.2 System block diagram
Figure 1. VL53L0X block diagram
1.3 Device pinout
Figure 2. VL53L0X pinout (bottom view)
Table 2. VL53L0X pin description
1.4 Application schematic
Figure 3. VL53L0X schematic
2 Functional description
2.1 System functional description
Figure 4. VL53L0X system functional description
2.2 Firmware state machine description
Figure 5. Firmware state machine
2.3 Customer manufacturing calibration flow
Figure 6. Customer manufacturing calibration flow
2.3.1 SPAD and temperature calibration
2.3.2 Ranging offset calibration
Figure 7. Range offset
2.3.3 Cross-talk calibration
Figure 8. Cross-talk compensation
2.4 Ranging operating modes
2.5 Ranging profiles
2.6 Ranging profile phases
Figure 9. Typical initialization / ranging / housekeeping phases
2.6.1 Initialization and load calibration data phase
2.6.2 Ranging phase
2.6.3 Digital housekeeping
2.7 Getting the data: interrupt or polling
2.8 Device programming and control
2.9 Power sequence
2.9.1 Power up and boot sequence
Figure 10. Power up and boot sequence
Figure 11. Power up and boot sequence with XSHUT not controlled
2.10 Ranging sequence
Figure 12. Ranging sequence
3 Control interface
Figure 13. Data transfer protocol
Figure 14. VL53L0X I2C device address: 0x52
Figure 15. VL53L0X data format (write)
Figure 16. VL53L0X data format (read)
Figure 17. VL53L0X data format (sequential write)
Figure 18. VL53L0X data format (sequential read)
3.1 I2C interface - timing characteristics
Table 3. I2C interface - timing characteristics
Figure 19. I2C timing characteristics
3.2 I2C interface - reference registers
Table 4. Reference registers
Table 5. 32-bit register example
4 Electrical characteristics
4.1 Absolute maximum ratings
Table 6. Absolute maximum ratings
4.2 Recommended operating conditions
Table 7. Recommended operating conditions
4.3 ESD
Table 8. ESD performances
4.4 Current consumption
Table 9. Consumption at ambient temperature
4.5 Electrical characteristics
Table 10. Digital I/O electrical characteristics
5 Performance
5.1 Measurement conditions
Figure 20. Typical ranging (default mode)
Figure 21. Typical ranging - long range mode
5.2 Max ranging distance
Table 11. Max ranging capabilities with 33ms timing budget
5.3 Ranging accuracy
5.3.1 Standard deviation
Table 12. Ranging accuracy
5.3.2 Range profile examples
Table 13. Range profiles
5.3.3 Ranging offset error
Table 14. Ranging offset
6 Outline drawing
Figure 22. Outline drawing (page 1/3)
Figure 23. Outline drawing (page 2/3)
Figure 24. Outline drawing - with liner (page 3/3)
7 Laser safety considerations
Figure 25. Class 1 laser product label
8 Packaging and labeling
8.1 Product marking
Figure 26. Example of marking
8.2 Inner box labeling
8.3 Packing
8.3.1 Tape outline drawings
Figure 27. Tape outline drawing
8.4 Pb-free solder reflow process
Table 15. Recommended solder profile
Figure 28. Solder profile
8.5 Handling and storage precautions
8.5.1 Shock precaution
8.5.2 Part handling
8.5.3 Compression force
8.5.4 Moisture sensitivity level
8.6 Storage temperature conditions
Table 16. Recommended storage conditions
9 Ordering information
Table 17. Ordering information
10 Acronyms and abbreviations
Table 18. Acronyms and abbreviations
11 ECOPACK®
12 Revision history
Table 19. Document revision history
VL53L0X World’s smallest Time-of-Flight ranging and gesture detection sensor Datasheet - production data Applications • User detection for personal computers/ laptops/tablets and IoT (energy saving) • Robotics (obstacle detection) • White goods (hand detection in automatic faucets, soap dispensers etc.) • 1D gesture recognition. • Laser assisted autofocus. Enhances and speeds up camera autofocus system performance, especially in difficult scenes (low light levels, low contrast) or fast moving video mode. reflectances unlike in laser-ranging module housed Description The VL53L0X is a new generation Time-of-Flight (ToF) the smallest package on the market today, providing accurate distance measurement whatever the target conventional technologies. It can measure absolute distances up to 2m, setting a new benchmark in ranging performance levels, opening the door to various new applications. The VL53L0X integrates a leading-edge SPAD array (Single Photon Avalanche Diodes) and embeds ST’s second generation FlightSenseTM patented technology. The VL53L0X’s 940 nm VCSEL emitter (Vertical Cavity Surface-Emitting Laser), is totally invisible to the human eye, coupled with internal physical infrared filters, it enables longer ranging distances, higher immunity to ambient light, and better robustness to cover glass optical crosstalk. Features • Fully integrated miniature module – 940 nm laser VCSEL – VCSEL driver – Ranging sensor with advanced embedded micro controller – 4.4 x 2.4 x 1.0 mm • Fast, accurate distance ranging – Measures absolute range up to 2 m – Reported range is independent of the target reflectance – Advanced embedded optical cross-talk compensation to simplify cover glass selection • Eye safe – Class 1 laser device compliant with latest standard IEC 60825-1:2014 - 3rd edition • Easy integration – Single reflowable component – No additional optics – Single power supply – I2C interface for device control and data transfer – Xshutdown (reset) and interrupt GPIO – Programmable I2C address April 2018 This is information on a product in full production. DocID029104 Rev 2 1/10 www.st.com
Contents Contents VL53L0X 1 2 3 4 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 1.2 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.3 1.4 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 2.5 2.6 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 System functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Firmware state machine description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.2 Customer manufacturing calibration flow . . . . . . . . . . . . . . . . . . . . . . . . . .11 2.3 2.3.1 SPAD and temperature calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Ranging offset calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.3.2 2.3.3 Cross-talk calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Ranging operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Ranging profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Ranging profile phases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6.1 Initialization and load calibration data phase . . . . . . . . . . . . . . . . . . . . . 15 Ranging phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.6.2 2.6.3 Digital housekeeping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Getting the data: interrupt or polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Device programming and control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power up and boot sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.9.1 2.10 Ranging sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.7 2.8 2.9 Control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 I2C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.1 I2C interface - reference registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.2 2/40 DocID029104 Rev 2
VL53L0X Contents 5 6 7 8 9 10 11 12 4.3 4.4 4.5 ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.1 Measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Max ranging distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.2 5.3 Ranging accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Standard deviation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.3.1 Range profile examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.3.2 5.3.3 Ranging offset error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Laser safety considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Packaging and labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 8.1 Inner box labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 8.2 8.3 Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 8.3.1 Tape outline drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Pb-free solder reflow process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Handling and storage precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Shock precaution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.5.1 Part handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.5.2 8.5.3 Compression force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.5.4 Moisture sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Storage temperature conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.4 8.5 8.6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 DocID029104 Rev 2 3/40 3
List of tables List of tables VL53L0X Technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 1. VL53L0X pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 2. I2C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 3. Reference registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 4. 32-bit register example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 5. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 6. Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 7. ESD performances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 8. Consumption at ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 9. Table 10. Digital I/O electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 11. Max ranging capabilities with 33ms timing budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Ranging accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 12. Table 13. Range profiles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Ranging offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 14. Recommended solder profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 15. Table 16. Recommended storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 17. Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Table 18. Table 19. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4/40 DocID029104 Rev 2
VL53L0X List of figures List of figures VL53L0X block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 1. VL53L0X pinout (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 2. VL53L0X schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 3. VL53L0X system functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 4. Firmware state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5. Customer manufacturing calibration flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 6. Range offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 7. Cross-talk compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 8. Figure 9. Typical initialization / ranging / housekeeping phases . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 10. Power up and boot sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 11. Power up and boot sequence with XSHUT not controlled . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 12. Ranging sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 13. Data transfer protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 14. VL53L0X I2C device address: 0x52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 15. VL53L0X data format (write). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 16. VL53L0X data format (read) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 17. VL53L0X data format (sequential write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 18. VL53L0X data format (sequential read) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 I2C timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 19. Figure 20. Typical ranging (default mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 21. Typical ranging - long range mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 22. Outline drawing (page 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 23. Outline drawing (page 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 24. Outline drawing - with liner (page 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 25. Class 1 laser product label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Figure 26. Example of marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 27. Tape outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 28. Solder profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 DocID029104 Rev 2 5/40 5
Overview 1 Overview VL53L0X 1.1 Technical specification Table 1. Technical specification Feature Package Size Operating voltage Operating temperature: Infrared emitter I2C Detail Optical LGA12 4.40 x 2.40 x 1.00 mm 2.6 to 3.5 V -20 to 70°C 940 nm Up to 400 kHz (FAST mode) serial bus Address: 0x52 1.2 System block diagram Figure 1. VL53L0X block diagram 6/40 DocID029104 Rev 2
VL53L0X 1.3 Device pinout Figure 2 shows the pinout of the VL53L0X (see also Figure 22). Figure 2. VL53L0X pinout (bottom view) Overview Table 2. VL53L0X pin description Pin number Signal name Signal type Signal description 1 2 3 4 5 6 7 8 9 10 11 12 AVDDVCSEL AVSSVCSEL GND GND2 XSHUT GND3 GPIO1 DNC SDA SCL AVDD GND4 Supply Ground Ground Ground Digital input Ground Digital output Digital input Digital input/output Digital input Supply Ground VCSEL Supply, to be connected to main supply VCSEL Ground, to be connected to main ground To be connected to main ground To be connected to main ground Xshutdown pin, Active LOW To be connected to main ground Interrupt output. Open drain output. Do Not Connect, must be left floating. I2C serial data I2C serial clock input Supply, to be connected to main supply To be connected to main ground DocID029104 Rev 2 7/40 37
Overview 1.4 Application schematic Figure 3 shows the application schematic of the VL53L0X. Figure 3. VL53L0X schematic VL53L0X Note: Note: Note: Note: Note: Capacitors on external supply AVDD should be placed as close as possible to the AVDDVCSEL and AVSSVCSEL module pins. External pull-up resistors values can be found in I2C-bus specification. Pull-up are typically fitted only once per bus, near the host. Recommended values for pull-up resistors for an AVDD of 2.8V and 400KHz I2C clock would be 1.5k to 2k Ohms. XSHUT pin must always be driven to avoid leakage current. Pull-up is needed if the host state is not known. XSHUT is needed to use HW standby mode (no I2C comm). XSHUT and GPIO1 pull up recommended values are 10k Ohms GPIO1 to be left unconnected if not used 8/40 DocID029104 Rev 2
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