2004 年上海华东师范大学半导体物理考研真题
一、名词解释(每题 4 分,共 32 分)
施主
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受主
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本征半导体
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功函数
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迁移率
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费米能级
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雪崩击穿
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俄歇复合
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二、简答题(每题 7 分,共 56 分)
1.讨论有效质量的物理意义
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2.分析 Si 和 GaAs 能带结构的特点
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3.定性分析掺杂半导体中电阻率随温度的变化情况,并说明原因
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4.分析金在硅中形成的深能级情况,并说明掺金对载流子寿命的影响
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5.试画出金属和 n 型半导体接触时的能带示意图(假设金属功函数 Wm>半导体功函数 Ws)
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6.分析隧道二极管中负阻特性的形成机制
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7.什么是耿氏效应?分析其形成机制和应用
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8.试画出 p-n 节正偏和反偏时的能带示意图,并分析 p-n 节单向导电的机制
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三、计算和讨论题(共 62 分)
1.(10 分)已知一维电子系统的能带
其中 a 为晶格常数,m 为电子质量,h 为普朗克常数。
试求
(1)能带宽度,
(2)能带底部和顶部的有效质量。
2.(10 分)77K 时掺磷的硅半导体中费米能级
,其中 为硅的导带底位
置,
为磷在硅中的能级位置。
试求
(1)77K 时的电子浓度
(2)需要掺入的磷的浓度。
3.(10 分)施主浓度为
的两个 Si 样品。设杂质全部电离,分别计算
(1)室温时的电导率。
(2)500K 时的电导率
4.(11 分)已知 p-n 结势垒区中空间电荷密度为
(a>0),其中 q 为电子电荷,
为受主与施主浓度,,势垒区的边界在
和 x=Xp/2 处,求
(1)该 p-n 结的电场和电势分布。
(2)画出电场、电势和电势能的分布示意图
5.(10 分)室温下 p 型 Ge 半导体中电子寿命为 350 微秒,电子迁移率为 3600cm2/V·s,求
电子的扩散长度
6.(11 分)已知一个由 n 型半导体构成的理想 MIS 结构。试分析加不同偏压时的半导体表
面状况,分别画出 MIS 结构的能带示意图,并说明表面强反型的形成条件。
附∶相关参数