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PICMG COMe规范.pdf
1 Introduction
1.1 Objective
1.2 COM.0R2.0 Changes from R1.0
1.3 COM.0 Revision 1.0 vs. 2.0 Compatibility Considerations
1.4 COM.0 R2.1 Changes from R2.0
1.5 Name and Logo Usage
1.6 Intellectual Property
1.6.1 Necessary Claims (referring to mandatory or recommended features)
1.6.2 Unnecessary Claims (referring to optional features or non-normative elements)
1.6.3 Third Party Disclosures
1.7 Copyright Notice
1.8 Special Word Usage
1.9 Acronyms / Definitions
Table 1.1: Terms and Definitions
1.10 Applicable Documents and Standards
1.11 Statement of Compliance
2 Module Overview
2.1 Module Configuration
2.2 Feature Overview - Size
2.2.1 Mini Module
2.2.2 Compact Module
2.2.3 Basic Module
2.2.4 Extended Module
2.3 Feature Overview - Pin-out Types
2.3.1 Pin-out Type 1
2.3.2 Pin-out Type 10
2.3.3 Pin-out Type 2
2.3.4 Pin-out Type 3
2.3.5 Pin-out Type 4
2.3.6 Pin-out Type 5
2.3.7 Pin-out Type 6
3 Required and Optional Features
3.1 Module Pin-out Type Definitions
Table 3.1: Module Pin-out Type Overview
3.2 Module Pin-out Types 1-6 & 10 - Required and Optional Features
Table 3.2: Module Pin-out - Required and Optional Features A-B Connector
Table 3.3: Module Pin-out - Required and Optional Features C-D Connector
3.3 Feature Fill Order
Table 3.4: Module Feature Fill Order
3.4 EAPI - Embedded Application Programming Interface
4 Signal Descriptions
4.1 Signal Naming Convention
4.2 Pin and Signal Buffer Types
4.2.1 Pin Types
4.2.2 Buffer Types
4.2.3 Power Rails and Tolerances
4.3 Signal List
4.3.1 AC97 Audio / High Definition Audio
Table 4.1: AC97/HDA Signals, Pin Types, and Descriptions
4.3.2 Ethernet
Table 4.2: Gigabit Ethernet Signals, Pin Types, and Descriptions
4.3.3 IDE
Table 4.3: IDE Signals, Pin Types, and Descriptions
4.3.4 Serial ATA
Table 4.4: SATA Signals, Pin Types, and Descriptions
4.3.5 General Purpose PCI Express Lanes
Table 4.5: PCI Express Lanes Signals, Pin Types, and Descriptions
4.3.6 PEG PCI Express Lanes
Table 4.6: PEG Signals, Pin Types, and Descriptions
4.3.7 ExpressCard
Table 4.7: ExpressCard Signals, Pin Types, and Descriptions
4.3.8 PCI Bus
Table 4.8: PCI Signals, Pin Types, and Descriptions
4.3.9 USB
Table 4.9: USB Signals, Pin Types, and Descriptions
4.3.10 LVDS Flat Panel
Table 4.10: LVDS Signals, Pin Types, and Descriptions
4.3.11 LPC Interface
Table 4.11: LPC Signals, Pin Types, and Descriptions
4.3.12 SPI Interface
Table 4.12: SPI Signals, Pin Types, and Descriptions
Table 4.13: Effect of the BIOS disable signals
4.3.13 Analog VGA
Table 4.14: VGA Signals, Pin Types, and Descriptions
4.3.14 PEG Multiplexed SDVO
Table 4.15: SDVO Signals, Pin Types, and Descriptions
4.3.15 Digital Display Interfaces (DDI) - Module Type 6 and 10
Figure 4-1: Dual-Mode COM Express Module Implementation
Table 4.16: Module and Carrier Combinations
Table 4.17: Type 6 DDI Signals, Pin Types, and Descriptions
Table 4.18: Type 10 DDI Signals, Pin Types, and Descriptions
Table 4.19: Type 6 DDI
Table 4.20: Type 10 DDI
4.3.16 DDI Signals: DisplayPort
Table 4.21: DisplayPort Signals, Pin Types, and Descriptions
4.3.17 DDI Signals: SDVO
Table 4.22: SDVO Signals, Pin Types, and Descriptions
4.3.18 DDI Signals: HDMI / DVI
Table 4.23: HDMI/DVI Signals, Pin Types, and Descriptions
4.3.19 General Purpose Serial Interface
Table 4.24: Serial Interface Signals (Type 10), Pin Types, and Descriptions
4.3.20 I2C Bus
Table 4.25: I2C Signals, Pin Types, and Descriptions
4.3.21 Miscellaneous
Table 4.26: Misc Signals, Pin Types, and Descriptions
4.3.22 Power and System Management
Table 4.27: Power and System Management Signals, Pin Types, and Descriptions
4.3.23 Thermal Protection
Table 4.28: Thermal Protection Signals, Pin Types, and Descriptions
4.3.24 SM Bus
Table 4.29: SM Bus Signals, Pin Types, and Descriptions
4.3.25 General Purpose Input Output
Table 4.30: GPIO Signals, Pin Types, and Descriptions
4.3.26 SDIO
Table 4.31: SD card interface signals
Table 4.32: SDIO Signals, Pin Types, and Descriptions
4.3.27 Module Type Definition
Table 4.33: Module Type Signals, Pin Types, and Descriptions
4.3.28 Power and Ground
Table 4.34: Power Signals, Pin Types, and Descriptions
4.3.29 eDP - Embedded DisplayPort
Table 4.35: Module and Carrier Combinations Type 6 and Type 10 Modules
Table 4.37: LVDS / eDP Pin Assignment
4.3.30 CAN Bus
4.4 Signals Requiring Carrier Board Termination
4.4.1 Ethernet
4.4.2 Analog VGA
4.4.3 LVDS
4.4.4 USB
4.4.5 SDVO (Types 2-5)
4.4.6 Digital Display Interfaces (DDI)
4.4.7 VCC_RTC
4.5 Signals Requiring Module Termination
4.5.1 AC coupled on the Module
4.5.2 Misc
4.6 Pin-out Tables
4.6.1 Type 1
Table 4.39: Pin List for Pin-out Type 1
4.6.2 Type 10
Table 4.40: Pin List for Pin-out Type 10
4.6.3 Type 2
Table 4.41: Pin List for Pin-out Type 2
4.6.4 Type 3
Table 4.42: Pin List for Pin-out Type 3
4.6.5 Type 4
Table 4.43: Pin List for Pin-out Type 4
4.6.6 Type 5
Table 4.44: Pin List for Pin-out Type 5
4.6.7 Type 6
Table 4.45: Pin List for Pin-out Type 6
5 Module and Carrier Board Implementation Specifications
5.1 PCI Express Link Configuration Definitions
5.2 PCI Express Link Configuration Guidelines
Table 5.1: PCI Express Lane Numbers and Bucket Groupings
Table 5.2: Module Pin-out Type 1 - Preferred PCI Express Lane Groupings
Table 5.3: Module Pin-out Types 2 and 3 - Preferred Lane Groupings: Bucket B1
Table 5.4: Module Pin-out Types 2 and 3 - Preferred Lane Groupings: Buckets B3 and B4
Table 5.5: Module Pin-out Types 4 and 5 - Preferred PCI Express Lane Groupings
Table 5.6: Module Pin-out Type 6 - Preferred Lane Groupings: Bucket B1
Table 5.7: Module Pin-out Type 6 - Preferred Lane Groupings: Buckets B3 and B4
5.3 COM Express EEPROMs
5.3.1 EEPROM Device Information
5.3.2 COM Express Module EEPROM
5.3.3 COM Express Carrier Board EEPROM
5.4 Loss Budgets for High Speed Differential Interfaces
5.4.1 PCI Express Insertion Loss Budget with Slot Card
Figure 5-1: PCI Express Insertion Loss Budget with Slot Card
Table 5.8: PCI Express Insertion Loss Budget, 1.25 GHz with Carrier Board Slot Card
Table 5.9: PCI Express Insertion Loss Budget, 2.5 GHz with Carrier Board Slot Card
5.4.2 PCI Express Insertion Loss Budget with Carrier Board PCIE Device
Figure 5-2: PCI Express Insertion Loss Budget with Carrier Board PCIE Device
Table 5.10: PCI Express Insertion Loss Budget, 1.25 GHz with Carrier Board PCIE Device
Table 5.11: PCI Express Insertion Loss Budget, 2.5 GHz with Carrier Board PCIE Device
5.4.3 SATA Insertion Loss Budget
Figure 5-3: SATA Insertion Loss Budget
Table 5.12: SATA Gen 1 Insertion Loss Budget, 1.5 GHz
Table 5.13: SATA Gen 2 Insertion Loss Budget, 3.0 GHz
5.4.4 USB 2.0 Insertion Loss Budget
Figure 5-4: USB 2.0 Insertion Loss Budget
Table 5.14: USB Insertion Loss Budget, 400 MHz
5.4.5 SuperSpeed USB Insertion Loss Budget
Figure 5-5: SuperSpeed USB Insertion Loss Budget
Table 5.15: SuperSpeed USB Insertion Loss Budget
5.4.6 10/100/1000 Ethernet Insertion Loss Budget
Figure 5-6: 10/100/1000 Ethernet Insertion Loss Budget
Table 5.16: 10/100/1000 Ethernet Insertion Loss Budget, 100 MHz
5.4.7 DDI Loss Budget
Figure 5-7: DDI Loss Budget
5.5 PCI Bus Implementation
5.5.1 Carrier Board PCI Resource Allocation
Table 5.17: Carrier Board PCI Resource Allocation
5.5.2 PCI Clocks
Figure 5-8: PCI Clocks - Carrier Board PCI Device
Figure 5-9: PCI Clocks - Slot Card PCI Device
5.6 Carrier Board LPC Devices
Figure 5-10: Typical routing topology for a Module LPC device
5.7 SPI Devices
Figure 5-11: Typical SPI topology
5.8 10 Gigabit Ethernet Option
Table 5.18: 10 Gigabit Ethernet Pin Mapping
5.9 Watchdog Timer
5.9.1 Output Modes and Characteristics
Table 5.19: Watchdog Timer Output Modes
5.9.2 Watchdog Enable and Strobe
Table 5.20: Watchdog Enable and Strobe Parameter Range
5.10 Protecting COM.0 Pins Reclaimed From the VCC_12V Pool
5.10.1 Logic Level Signals on Pins Reclaimed from VCC_12V
5.10.2 TYPE10# Strap - Reclaimed from VCC_12V
6 Mechanical Specifications
6.1 Module Size – Mini Module
Figure 6-1: Mini Module Form Factor
6.2 Module Size - Compact Module
Figure 6-2: Compact Module Form Factor
6.3 Module Size - Basic Module
Figure 6-3: Basic Module Form Factor
6.4 Module Size - Extended Module
Figure 6-4: Extended Module Form Factor
6.5 Module Connector
Figure 6-5: Module Receptacle
6.6 Carrier Board Connector
Figure 6-6: Carrier Board Plug
6.7 Connector PCB Pattern
Figure 6-7: Connector PCB Pattern
6.8 Module Connector Pin Numbering
Figure 6-8: Module Connector Pin Numbering
6.9 Carrier Board Connector Pin Numbering
Figure 6-9: Carrier Board Connector Pin Numbering
6.10 Heat-Spreader
Figure 6-10: Overall Height for Heat-Spreader in Mini, Compact, Basic and Extended Modules
Figure 6-11: Mini Module Heat-Spreader
Figure 6-12: Compact Module Heat-Spreader
Figure 6-13: Basic Module Heat-Spreader
Figure 6-14: Heat-Spreader Specification for Extended Module
6.11 Component Height - Module Back and Carrier Board Top
Figure 6-15: Component Clearances Underneath Module
7 Electrical Specifications
7.1 Input Power - General Considerations
7.2 Input Power - Current Load
Table 7.1: Input Power - Pin-out Type 1/10 Modules (Single Connector, 220 pins)
Table 7.2: Input Power - Pin-out Type 2/3/4/5/6 Modules (Dual Connector, 440 pins)
7.3 Input Power - Sequencing
Figure 7-1: Power Sequencing
Table 7.3: Power Sequencing
7.4 Input Power - Rise Time
Figure 7-2: Input Power Rise Time
7.5 Signal Integrity Requirements
Table 7.4: Signal Integrity Requirements
8 Environmental Specifications
8.1 Thermal Specification
8.1.1 Objectives
8.1.2 Definitions
8.1.3 Tcase_max Measurement Setup
Figure 8-1: Tcase_Max Measurement Point
8.1.4 Module Thermal Specification Requirements
8.1.5 Shock and Vibration
9 Appendix
9.1 Mounting positions and connector location for Carrier Boards
Figure 9-1: Carrier Board mounting positions
9.2 Comparison of single connector Types 1 and 10
Table 9.1: Comparison of Type 1 and Type 10 Pin-Out vs. 84X55 (Mini)
9.3 Comparison of Types 2 and 6
Table 9.2: Comparison of Type 2 and Type 6 Pin-Out
9.4 Comparison of Types 2 to 5
Table 9.3: Comparison of Type 2, Type 3, Type 4 and Type 5 Pin-Out
PICMG® COM.0
COM Express® Module Base Specification
Revision 2.1
May 14, 2012
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
© 2005, 2010, 2011, 2012 PCI Industrial Computer Manufacturers Group. The attention of
adopters is directed to the possibility that compliance with or adoption of PICMG®
specifications may require use of an invention covered by patent rights. PICMG® shall not
be responsible for identifying patents for which a license may be required by any PICMG®
specification or for conducting legal inquiries into the legal validity or scope of those patents
that are brought to its attention. PICMG® specifications are prospective and advisory only.
Prospective users are responsible for protecting themselves against liability for infringement
of patents.
NOTICE:
The information contained in this document is subject to change without notice. The material
in this document details a PICMG® specification in accordance with the license and notices
set forth on this page. This document does not represent a commitment to implement any
portion of this specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE,
PICMG® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH
REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF
TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY
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In no event shall PICMG® be liable for errors contained herein or for indirect, incidental,
special, consequential, reliance or cover damages, including loss of profits, revenue, data or
use, incurred by any user or any third party. Compliance with this specification does not
absolve manufacturers of equipment from the requirements of safety and regulatory
agencies (UL, CSA, FCC, IEC, etc.).
IMPORTANT NOTICE:
This document includes references to specifications, standards or other material not created
by PICMG. Such referenced materials will typically have been created by organizations that
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therefore make such investigations regarding referenced materials, and the organizations
that have created them, as they deem appropriate.
PICMG®, CompactPCI®, AdvancedTCA®, AdvancedTCA® 300,ATCA®, ATCA® 300,
CompactPCI® Express, COM Express®, SHB Express®, and the PICMG, CompactPCI,
AdvancedTCA, µTCA and ATCA logos are registered trademarks, and MicroTCA™, xTCA™
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All other brand or product names may be trademarks or registered trademarks of their
respective holders.
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
Contents
1 Introduction
1
1.1 Objective......................................................................................................................................2
1.2 COM.0R2.0 Changes from R1.0...................................................................................................3
Type 6
Type 10
All Types
1.3 COM.0 Revision 1.0 vs. 2.0 Compatibility Considerations............................................................5
AC97 / HDA
Carrier based BIOS devices
SDVO
TV Out
12V Pin Reclamation
1.4 COM.0 R2.1 Changes from R2.0..................................................................................................6
Mini form factor
I/Os
Power
Updates
2 Module Overview
1.5 Name and Logo Usage.................................................................................................................7
1.6 Intellectual Property......................................................................................................................8
1.6.1 Necessary Claims (referring to mandatory or recommended features)...........................................8
1.6.2 Unnecessary Claims (referring to optional features or non-normative elements)...........................8
1.6.3 Third Party Disclosures....................................................................................................................9
1.7 Copyright Notice.........................................................................................................................10
1.8 Special Word Usage...................................................................................................................10
1.9 Acronyms / Definitions................................................................................................................11
1.10 Applicable Documents and Standards......................................................................................13
1.11 Statement of Compliance.........................................................................................................15
16
2.1 Module Configuration.................................................................................................................16
2.2 Feature Overview - Size.............................................................................................................17
2.2.1 Mini Module....................................................................................................................................17
2.2.2 Compact Module............................................................................................................................17
2.2.3 Basic Module..................................................................................................................................17
2.2.4 Extended Module...........................................................................................................................17
2.3 Feature Overview - Pin-out Types..............................................................................................18
2.3.1 Pin-out Type 1................................................................................................................................18
2.3.2 Pin-out Type 10..............................................................................................................................18
2.3.3 Pin-out Type 2................................................................................................................................19
2.3.4 Pin-out Type 3................................................................................................................................19
2.3.5 Pin-out Type 4................................................................................................................................19
2.3.6 Pin-out Type 5................................................................................................................................19
PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012
iii
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
4 Signal Descriptions
3 Required and Optional Features
2.3.7 Pin-out Type 6................................................................................................................................19
20
3.1 Module Pin-out Type Definitions.................................................................................................20
3.2 Module Pin-out Types 1-6 & 10 - Required and Optional Features.............................................21
3.3 Feature Fill Order.......................................................................................................................23
3.4 EAPI - Embedded Application Programming Interface...............................................................24
25
4.1 Signal Naming Convention.........................................................................................................25
4.2 Pin and Signal Buffer Types.......................................................................................................25
4.2.1 Pin Types.......................................................................................................................................25
4.2.2 Buffer Types...................................................................................................................................25
4.2.3 Power Rails and Tolerances..........................................................................................................26
4.3 Signal List...................................................................................................................................27
4.3.1 AC97 Audio / High Definition Audio...............................................................................................27
4.3.2 Ethernet..........................................................................................................................................28
4.3.3 IDE.................................................................................................................................................30
4.3.4 Serial ATA......................................................................................................................................31
4.3.5 General Purpose PCI Express Lanes............................................................................................32
4.3.6 PEG PCI Express Lanes................................................................................................................33
4.3.7 ExpressCard..................................................................................................................................34
4.3.8 PCI Bus..........................................................................................................................................35
4.3.9 USB................................................................................................................................................36
4.3.10 LVDS Flat Panel...........................................................................................................................37
4.3.11 LPC Interface...............................................................................................................................38
4.3.12 SPI Interface................................................................................................................................39
SPI Power
Module Vs Carrier Board Pull-ups
4.3.13 Analog VGA.................................................................................................................................41
4.3.14 PEG Multiplexed SDVO...............................................................................................................42
4.3.15 Digital Display Interfaces (DDI) - Module Type 6 and 10.............................................................43
4.3.16 DDI Signals: DisplayPort..............................................................................................................48
4.3.17 DDI Signals: SDVO......................................................................................................................49
4.3.18 DDI Signals: HDMI / DVI.............................................................................................................50
4.3.19 General Purpose Serial Interface.................................................................................................51
4.3.20 I2C Bus.........................................................................................................................................52
4.3.21 Miscellaneous..............................................................................................................................53
4.3.22 Power and System Management.................................................................................................54
4.3.23 Thermal Protection.......................................................................................................................56
4.3.24 SM Bus.........................................................................................................................................57
4.3.25 General Purpose Input Output.....................................................................................................58
4.3.26 SDIO.............................................................................................................................................59
4.3.27 Module Type Definition................................................................................................................60
4.3.28 Power and Ground.......................................................................................................................61
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PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
4.3.29 eDP - Embedded DisplayPort......................................................................................................62
4.3.30 CAN Bus......................................................................................................................................64
4.4 Signals Requiring Carrier Board Termination.............................................................................65
4.4.1 Ethernet..........................................................................................................................................65
4.4.2 Analog VGA...................................................................................................................................65
4.4.3 LVDS..............................................................................................................................................65
4.4.4 USB................................................................................................................................................65
4.4.5 SDVO (Types 2-5)..........................................................................................................................65
4.4.6 Digital Display Interfaces (DDI)......................................................................................................66
4.4.7 VCC_RTC......................................................................................................................................66
4.5 Signals Requiring Module Termination.......................................................................................68
4.5.1 AC coupled on the Module.............................................................................................................68
4.5.2 Misc................................................................................................................................................68
4.6 Pin-out Tables............................................................................................................................70
4.6.1 Type 1............................................................................................................................................70
4.6.2 Type 10..........................................................................................................................................73
4.6.3 Type 2............................................................................................................................................76
4.6.4 Type 3............................................................................................................................................79
4.6.5 Type 4............................................................................................................................................82
4.6.6 Type 5............................................................................................................................................85
4.6.7 Type 6............................................................................................................................................88
91
5.1 PCI Express Link Configuration Definitions................................................................................91
5.2 PCI Express Link Configuration Guidelines................................................................................92
5.3 COM Express EEPROMs.........................................................................................................100
5.3.1 EEPROM Device Information......................................................................................................100
5.3.2 COM Express Module EEPROM.................................................................................................100
5.3.3 COM Express Carrier Board EEPROM.......................................................................................100
5.4 Loss Budgets for High Speed Differential Interfaces.................................................................101
5.4.1 PCI Express Insertion Loss Budget with Slot Card......................................................................103
5.4.2 PCI Express Insertion Loss Budget with Carrier Board PCIE Device..........................................105
5.4.3 SATA Insertion Loss Budget........................................................................................................107
5.4.4 USB 2.0 Insertion Loss Budget....................................................................................................108
5.4.5 SuperSpeed USB Insertion Loss Budget.....................................................................................109
5.4.6 10/100/1000 Ethernet Insertion Loss Budget...............................................................................110
5.4.7 DDI Loss Budget..........................................................................................................................111
5.5 PCI Bus Implementation...........................................................................................................113
5.5.1 Carrier Board PCI Resource Allocation.......................................................................................113
5.5.2 PCI Clocks...................................................................................................................................114
5.6 Carrier Board LPC Devices......................................................................................................116
5.7 SPI Devices..............................................................................................................................117
5.8 10 Gigabit Ethernet Option.......................................................................................................118
5 Module and Carrier Board Implementation Specifications
PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012
v
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
6 Mechanical Specifications
9 Appendix
5.9 Watchdog Timer.......................................................................................................................119
5.9.1 Output Modes and Characteristics...............................................................................................119
5.9.2 Watchdog Enable and Strobe......................................................................................................119
5.10 Protecting COM.0 Pins Reclaimed From the VCC_12V Pool.................................................120
5.10.1 Logic Level Signals on Pins Reclaimed from VCC_12V............................................................121
5.10.2 TYPE10# Strap - Reclaimed from VCC_12V.............................................................................122
123
6.1 Module Size – Mini Module.......................................................................................................123
6.2 Module Size - Compact Module................................................................................................124
6.3 Module Size - Basic Module.....................................................................................................125
6.4 Module Size - Extended Module...............................................................................................126
6.5 Module Connector....................................................................................................................127
6.6 Carrier Board Connector...........................................................................................................128
6.7 Connector PCB Pattern............................................................................................................129
6.8 Module Connector Pin Numbering............................................................................................130
6.9 Carrier Board Connector Pin Numbering..................................................................................130
6.10 Heat-Spreader........................................................................................................................131
6.11 Component Height - Module Back and Carrier Board Top......................................................136
137
7.1 Input Power - General Considerations......................................................................................137
7.2 Input Power - Current Load......................................................................................................138
7.3 Input Power - Sequencing........................................................................................................139
7.4 Input Power - Rise Time...........................................................................................................140
7.5 Signal Integrity Requirements...................................................................................................141
142
8.1 Thermal Specification...............................................................................................................142
8.1.1 Objectives....................................................................................................................................142
8.1.2 Definitions....................................................................................................................................143
8.1.3 Tcase_max Measurement Setup.................................................................................................144
8.1.4 Module Thermal Specification Requirements..............................................................................144
8.1.5 Shock and Vibration.....................................................................................................................145
146
9.1 Mounting positions and connector location for Carrier Boards..................................................146
9.2 Comparison of single connector Types 1 and 10......................................................................147
9.3 Comparison of Types 2 and 6...................................................................................................151
9.4 Comparison of Types 2 to 5......................................................................................................159
8 Environmental Specifications
7 Electrical Specifications
vi
PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
List of Tables
Table 1.1: Terms and Definitions...................................................................................................................11
Table 3.1: Module Pin-out Type Overview.....................................................................................................20
Table 3.2: Module Pin-out - Required and Optional Features A-B Connector..............................................21
Table 3.3: Module Pin-out - Required and Optional Features C-D Connector..............................................22
Table 3.4: Module Feature Fill Order.............................................................................................................23
Table 4.1: AC97/HDA Signals, Pin Types, and Descriptions.........................................................................27
Table 4.2: Gigabit Ethernet Signals, Pin Types, and Descriptions................................................................28
Table 4.3: IDE Signals, Pin Types, and Descriptions....................................................................................30
Table 4.4: SATA Signals, Pin Types, and Descriptions.................................................................................31
Table 4.5: PCI Express Lanes Signals, Pin Types, and Descriptions...........................................................32
Table 4.6: PEG Signals, Pin Types, and Descriptions...................................................................................33
Table 4.7: ExpressCard Signals, Pin Types, and Descriptions.....................................................................34
Table 4.8: PCI Signals, Pin Types, and Descriptions....................................................................................35
Table 4.9: USB Signals, Pin Types, and Descriptions...................................................................................36
Table 4.10: LVDS Signals, Pin Types, and Descriptions...............................................................................37
Table 4.11: LPC Signals, Pin Types, and Descriptions.................................................................................38
Table 4.12: SPI Signals, Pin Types, and Descriptions..................................................................................39
Table 4.13: Effect of the BIOS disable signals...............................................................................................40
Table 4.14: VGA Signals, Pin Types, and Descriptions.................................................................................41
Table 4.15: SDVO Signals, Pin Types, and Descriptions..............................................................................42
Table 4.16: Module and Carrier Combinations..............................................................................................44
Table 4.17: Type 6 DDI Signals, Pin Types, and Descriptions......................................................................44
Table 4.18: Type 10 DDI Signals, Pin Types, and Descriptions....................................................................45
Table 4.19: Type 6 DDI .................................................................................................................................46
Table 4.20: Type 10 DDI................................................................................................................................47
Table 4.21: DisplayPort Signals, Pin Types, and Descriptions......................................................................48
Table 4.22: SDVO Signals, Pin Types, and Descriptions..............................................................................49
Table 4.23: HDMI/DVI Signals, Pin Types, and Descriptions........................................................................50
Table 4.24: Serial Interface Signals (Type 10), Pin Types, and Descriptions...............................................51
Table 4.25: I2C Signals, Pin Types, and Descriptions...................................................................................52
Table 4.26: Misc Signals, Pin Types, and Descriptions.................................................................................53
Table 4.27: Power and System Management Signals, Pin Types, and Descriptions....................................55
Table 4.28: Thermal Protection Signals, Pin Types, and Descriptions..........................................................56
Table 4.29: SM Bus Signals, Pin Types, and Descriptions............................................................................57
Table 4.30: GPIO Signals, Pin Types, and Descriptions...............................................................................58
Table 4.31: SD card interface signals............................................................................................................59
Table 4.32: SDIO Signals, Pin Types, and Descriptions...............................................................................59
Table 4.33: Module Type Signals, Pin Types, and Descriptions...................................................................60
Table 4.34: Power Signals, Pin Types, and Descriptions..............................................................................61
Table 4.35: Module and Carrier Combinations Type 6 and Type 10 Modules..............................................62
Table 4.37: LVDS / eDP Pin Assignment.......................................................................................................63
Table 4.39: Pin List for Pin-out Type 1...........................................................................................................70
PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012
vii
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
Table 4.40: Pin List for Pin-out Type 10.........................................................................................................73
Table 4.41: Pin List for Pin-out Type 2...........................................................................................................76
Table 4.42: Pin List for Pin-out Type 3...........................................................................................................79
Table 4.43: Pin List for Pin-out Type 4...........................................................................................................82
Table 4.44: Pin List for Pin-out Type 5...........................................................................................................85
Table 4.45: Pin List for Pin-out Type 6...........................................................................................................88
Table 5.1: PCI Express Lane Numbers and Bucket Groupings.....................................................................93
Table 5.2: Module Pin-out Type 1 - Preferred PCI Express Lane Groupings................................................94
Table 5.3: Module Pin-out Types 2 and 3 - Preferred Lane Groupings: Bucket B1......................................95
Table 5.4: Module Pin-out Types 2 and 3 - Preferred Lane Groupings: Buckets B3 and B4........................96
Table 5.5: Module Pin-out Types 4 and 5 - Preferred PCI Express Lane Groupings....................................97
Table 5.6: Module Pin-out Type 6 - Preferred Lane Groupings: Bucket B1..................................................98
Table 5.7: Module Pin-out Type 6 - Preferred Lane Groupings: Buckets B3 and B4....................................99
Table 5.8: PCI Express Insertion Loss Budget, 1.25 GHz with Carrier Board Slot Card.............................103
Table 5.9: PCI Express Insertion Loss Budget, 2.5 GHz with Carrier Board Slot Card...............................104
Table 5.10: PCI Express Insertion Loss Budget, 1.25 GHz with Carrier Board PCIE Device.....................105
Table 5.11: PCI Express Insertion Loss Budget, 2.5 GHz with Carrier Board PCIE Device.......................106
Table 5.12: SATA Gen 1 Insertion Loss Budget, 1.5 GHz...........................................................................107
Table 5.13: SATA Gen 2 Insertion Loss Budget, 3.0 GHz...........................................................................107
Table 5.14: USB Insertion Loss Budget, 400 MHz......................................................................................108
Table 5.15: SuperSpeed USB Insertion Loss Budget..................................................................................109
Table 5.16: 10/100/1000 Ethernet Insertion Loss Budget, 100 MHz...........................................................110
Table 5.17: Carrier Board PCI Resource Allocation....................................................................................113
Table 5.18: 10 Gigabit Ethernet Pin Mapping..............................................................................................118
Table 5.19: Watchdog Timer Output Modes................................................................................................119
Table 5.20: Watchdog Enable and Strobe Parameter Range.....................................................................119
Table 7.1: Input Power - Pin-out Type 1/10 Modules (Single Connector, 220 pins)....................................138
Table 7.2: Input Power - Pin-out Type 2/3/4/5/6 Modules (Dual Connector, 440 pins)...............................138
Table 7.3: Power Sequencing......................................................................................................................139
Table 7.4: Signal Integrity Requirements.....................................................................................................141
Table 9.1: Comparison of Type 1 and Type 10 Pin-Out vs. 84X55 (Mini)...................................................147
Table 9.2: Comparison of Type 2 and Type 6 Pin-Out................................................................................151
Table 9.3: Comparison of Type 2, Type 3, Type 4 and Type 5 Pin-Out......................................................159
viii
PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
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