Si4463 datasheet.pdf

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Features

Applications

Description

Pin Assignments

Functional Block Diagram

Product

Freq. Range

Max Output Power

TX Current

RX Current

Narrow Channel + Part90

Image Cal + IF Shift

Si4464

Continuous 119–960 MHz

+20 dBm

169 MHz: 70 mA

915 MHz: 85 mA

10.6/13.6 mA

Si4463

Major bands

142-1050 MHz

+20 dBm

169 MHz: 70 mA

915 MHz: 85 mA

10/13 mA

Si4461

Major bands

142-1050 MHz

+16 dBm

+13 dBm: 29 mA

+14 dBm: 33 mA

10/13 mA

Si4460

Major bands

142-1050 MHz

+13 dBm

+10 dBm: 18 mA

+11 dBm: 20 mA

10/13 mA

1. Electrical Specifications

Table 1. DC Characteristics1

Symbol

Conditions

Min

Typ

Max

Units

VDD

1.8

3.3

3.6

IShutdown

RC Oscillator, Main Digital Regulator, and Low Power Digital Regulator OFF

—

IStandby

—

ISleepRC

RC Oscillator/WUT ON and all register values maintained, and all other blocks OFF

—

900

—

ISleepXO

Sleep current using an external 32 kHz crystal.2

—

1.7

—

µA

ISensor -LBD

Low battery detector ON, register values maintained, and all other blocks OFF

—

µA

IReady

Crystal Oscillator and Main Digital Regulator ON, all other blocks OFF

—

1.8

—

ITune_RX

RX Tune, High Performance Mode

—

7.2

—

ITune_TX

TX Tune, High Performance Mode

—

IRXH

High Performance Mode

—

IRXL

Low Power Mode2

—

ITX_+20

+20 dBm output power, class-E match, 915 MHz, 3.3 V

—

+20 dBm output power, class-E match, 460 MHz, 3.3 V

—

+20 dBm output power, square-wave match, 169 MHz, 3.3 V

—

ITX_+16

+16 dBm output power, class-E match, 868 MHz, 3.3 V2

—

ITX_+14

+14 dBm output power, Switched-current match, 868 MHz, 3.3 V2

—

ITX_+13

+13 dBm output power, switched-current match, 868 MHz, 3.3 V2

—

ITX_+10

+10 dBm output power, Class-E match, 868 MHz, 3.3 V2

—

Table 2. Synthesizer AC Electrical Characteristics1

Symbol

Conditions

Min

Typ

Max

Units

FSYN

142

—

175

MHz

284

—

350

MHz

425

—

525

MHz

850

—

1050

MHz

FSYN

See Notes 1, 2, and 3

119

—

960

MHz

FRES-960

850–1050 MHz

—

28.6

—

FRES-525

425–525 MHz

—

14.3

—

FRES-350

283–350 MHz

—

9.5

—

FRES-175

142–175 MHz

—

4.7

—

tLOCK

Measured from exiting Ready mode with XOSC running to any frequency. Including VCO Calibration.

—

µs

Lf(fM)

DF = 10 kHz, 460 MHz, High Perf Mode

—

–106

—

dBc/Hz

DF = 100 kHz, 460 MHz, High Perf Mode

—

–110

—

dBc/Hz

DF = 1 MHz, 460 MHz, High Perf Mode

—

–123

—

dBc/Hz

DF = 10 MHz, 460 MHz, High Perf Mode

—

–130

—

dBc/Hz

Table 3. Receiver AC Electrical Characteristics1

Symbol

Conditions

Min

Typ

Max

Units

FRX

142

—

175

MHz

284

—

350

MHz

425

—

525

MHz

850

—

1050

MHz

FRX

See Notes 1, 2, 3, 4, and 5

119

—

960

MHz

PRX_0.5

(BER < 0.1%) (500 bps, GFSK, BT = 0.5, Df = ±250Hz)3

—

–126

—

dBm

PRX_40

(BER < 0.1%) (40 kbps, GFSK, BT = 0.5, Df = ±20 kHz)3

—

–110

—

dBm

PRX_100

(BER < 0.1%) (100 kbps, GFSK, BT = 0.5, Df = ±50 kHz)1

—

–106

—

dBm

PRX_125

(BER < 0.1%) (125 kbps, GFSK, BT = 0.5, Df = ±62.5 kHz)3

—

–105

—

dBm

PRX_500

(BER < 0.1%) (500 kbps, GFSK, BT = 0.5, Df = ±250 kHz)3

—

–97

—

dBm

PRX_9.6

(PER 1%) (9.6 kbps, 4GFSK, BT = 0.5, Df = ±2.4 kHz)3,4

—

–110

—

dBm

PRX_1M

(PER 1%) (1 Mbps, 4GFSK, BT = 0.5, Df = 1.25 kHz)3,4

—

–88

—

dBm

PRX_OOK

(BER < 0.1%, 4.8 kbps, 350 kHz BW, OOK, PN15 data)3

—

–109

—

dBm

(BER < 0.1%, 40 kbps, 350 kHz BW,

OOK, PN15 data)3

—

–104

—

dBm

(BER < 0.1%, 120 kbps, 350 kHz BW, OOK, PN15 data)3

—

–99

—

dBm

1.1

—

850

kHz

PRX_RES

Up to +5 dBm Input Level

—

0.1

ppm

RESRSSI

—

±0.5

—

C/I1-CH

Desired Ref Signal 3 dB above sensitivity, BER < 0.1%. Interferer is CW, and desired is modulated with 2.4 kbps DF = 1.2 kHz GFSK with BT = 0.5, RX channel BW=4.8 kHz, channel spacing = 12.5 kHz

—

–60

—

C/I1-CH

—

–58

—

C/I1-CH

—

–53

—

1MBLOCK

Desired Ref Signal 3 dB above sensitivity. Interferer is CW, and desired is modulated with 2.4 kbps, DF = 1.2 kHz GFSK

—

–75

—

8MBLOCK

—

–84

—

ImREJ

No image rejection calibration. Rejection at the image frequency. IF = 468 kHz

—

With image rejection calibration in Si446x. Rejection at the image frequency. IF = 468 kHz

—

POB_RX1

Measured at RX pins

—

–54

dBm

Table 4. Transmitter AC Electrical Characteristics1

Symbol

Conditions

Min

Typ

Max

Units

FTX

142

—

175

MHz

284

—

350

MHz

425

—

525

MHz

850

—

1050

MHz

FTX

See Notes 1, 2,3, 4, 5, and 6

119

—

960

MHz

DRFSK

0.123

—

500

kbps

DR4FSK

0.123

—

Mbps

DROOK

0.123

—

120

kbps

Df960

850–1050 MHz

—

1.5

—

MHz

Df525

425–525 MHz

—

750

—

kHz

Df350

283–350 MHz

—

500

—

kHz

Df175

142–175 MHz

—

250

—

kHz

FRES-960

850–1050 MHz

—

28.6

—

FRES-525

425–525 MHz

—

14.3

—

FRES-350

283–350 MHz

—

9.5

—

FRES-175

142–175 MHz

—

4.7

—

PTX

–20

—

+20

dBm

PTX61

–40

—

+16

dBm

PTX60

–40

—

+13

dBm

DPRF_OUT

Using switched current match within 6 dB of max power

—

0.1

—

DPRF_TEMP

–40 to +85 °C

—

DPRF_FREQ

Measured across 902–928 MHz

—

0.5

—

B*T

Gaussian Filtering Bandwith Time Product

—

0.5

—

POB-TX1

POUT = +13 dBm, Frequencies <1 GHz

—

–54

dBm

POB-TX2

1–12.75 GHz, excluding harmonics

—

–42

dBm

P2HARM

Using reference design TX matching network and filter with max output power. Harmonics reduce linearly with output power.

—

–42

dBm

P3HARM

—

–42

dBm

Table 5. Auxiliary Block Specifications1

Symbol

Conditions

Min

Typ

Max

Units

TSS

—

1.78

—

mV/°C

LBDRES

—

FMC

Configurable to Fxtal or Fxtal divided by 2, 3, 7.5, 10, 15, or 30 where Fxtal is the reference XTAL frequency. In addition, 32.768 kHz is also supported.

32.768K

—

Fxtal

TEMPCT

Programmable setting

—

XTALRange

MHz

t30M

Using XTAL and board layout in reference design. Start-up time will vary with XTAL type and board layout.

—

250

—

µs

30MRES

—

t32k

—

sec

32KRCRES

—

2500

—

ppm

tPOR

—

Table 6. Digital IO Specifications (GPIO_x, SCLK, SDO, SDI, nSEL, nIRQ)1

Symbol

Conditions

Min

Typ

Max

Units

TRISE

0.1 x VDD to 0.9 x VDD, CL = 10 pF, DRV<1:0> = HH

—

2.3

—

TFALL

0.9 x VDD to 0.1 x VDD, CL = 10 pF, DRV<1:0> = HH

—

CIN

—

VIH

VDD x 0.7

—

VIL

—

VDD x 0.3

IIN

–10

—

µA

IINP

VIL = 0 V

—

µA

IOmaxLL

DRV[1:0] = LL3

—

18.7

—

IOmaxLH

DRV[1:0] = LH3

—

13.7

—

IOmaxHL

DRV[1:0] = HL3

—

8.5

—

IOmaxHH

DRV[1:0] = HH3

—

IOmaxLL

DRV[1:0] = LL3

—

15.3

—

IOmaxLH

DRV[1:0] = LH3

—

11.6

—

IOmaxHL

DRV[1:0] = HL3

—

7.4

—

IOmaxHH

DRV[1:0] = HH3

—

2.7

—

IOmaxLL

DRV[1:0] = LL3

—

6.3

—

IOmaxLH

DRV[1:0] = LH3

—

5.6

—

IOmaxHL

DRV[1:0] = HL3

—

4.4

—

IOmaxHH

DRV[1:0] = HH3

—

2.1

—

VOH

DRV[1:0] = HL

VDD x 0.8

—

VOL

DRV[1:0] = HL

—

VDD x 0.2

Table 7. Absolute Maximum Ratings

Value

Unit

–0.3, +3.6

–0.3, +8.0

–0.3, +6.5

–0.3, VDD + 0.3

+10

dBm

–40 to +85

°C

°C/W

+125

°C

–55 to +125

°C

1.1. Definition of Test Conditions

2. Functional Description

Figure 1. Si4461 Direct-Tie Application Example

Figure 2. Si4463 Single Antenna with RF Switch Example

3. Controller Interface

3.1. Serial Peripheral Interface (SPI)

Table 8. Serial Interface Timing Parameters

Symbol

Parameter

Min (ns)

Diagram

tCH

Clock high time

tCL

Clock low time

tDS

Data setup time

tDH

Data hold time

tDD

Output data delay time

tEN

Output enable time

tDE

Output disable time

tSS

Select setup time

tSH

Select hold time

tSW

Select high period

Figure 3. SPI Write Command

Figure 4. SPI Read Command—Check CTS Value

Figure 5. SPI Read Command—Clock Out Read Data

3.2. Fast Response Registers

3.3. Operating Modes and Timing

Figure 6. State Machine Diagram

Table 9. Operating State Response Time and Current Consumption

State/Mode

Response Time to

Current in State /Mode

Shutdown State

15 ms

30 nA

Standby State

Sleep State

SPI Active State

Ready State

TX Tune State

RX Tune State

460 µs

300 µs

130 µs

65 µs

460 µs

310 µs

140 µs

90 µs

50 nA

900 nA

1.35 mA

1.8 mA

8 mA

7.2 mA

TX State

—

120 µs

18 mA @ +10 dBm

RX State

120 µs

75 µs

10 or 13 mA

Figure 7. Start-Up Timing and Current Consumption using Shutdown State

Figure 8. Start-Up Timing and Current Consumption using Standby State

3.3.1. Shutdown State

3.3.2. Standby State

3.3.3. Sleep State

3.3.4. SPI Active State

3.3.5. Ready State

3.3.6. TX State

Figure 9. Start_TX Commands and Timing

3.3.7. RX State

3.4. Application Programming Interface (API)

Table 10. API Commands

Number

Name

Description

0x00

NOP

0x01

PART_INFO

0x02

POWER_UP

0x10

FUNC_INFO

0x11

SET_PROPERTY

0x12

GET_PROPERTY

0x13

GPIO_PIN_CFG

0x14

GET_SENSOR_READING

0x15

FIFO_RESET

0x20

GET_INT_STATUS

0x21

GET_PH_STATUS

0x22

GET_MODEM_STATUS

0x23

GET_CHIP_STATUS

0x31

START_TX

0x32

START_RX

0x33

REQUEST_DEVICE_

STATE

0x34

CHANGE_STATE

0x50

FAST RESPONSE A

0x51

FAST RESPONSE B

0x53

FAST RESPONSE C

0x57

FAST RESPONSE D

0x66

TX_FIFO_WRITE

0x77

RX_FIFO_READ

3.5. START_TX

START_TX Command

CMD

0x31

CHANNEL

CHANNEL[7:0]

CONDITION

TXCOMPLETE_STATE[3:0]

RETRANSMIT

START[1:0]

TX_LEN

TX_LEN[15:8]

TX_LEN

TX_LEN[7:0]

START_TX Reply

CMD_COMPLETE

CTS[7:0]

3.6. Interrupts

Number

Command

Summary

0x20

GET_INT_STATUS

0x21

GET_PH_STATUS

0x22

GET_MODEM_STATUS

0x23

GET_CHIP_STATUS

Number

Property

Default

Summary

0x0100

INT_CTL_ENABLE

0x04

0x0101

INT_CTL_PH_ENABLE

0x00

0x0102

INT_CTL_MODEM_ENABLE

0x00

0x0103

INT_CTL_CHIP_ENABLE

0x04

3.7. GPIO

Table 11. GPIOs

SDN State

POR Default

GPIO0

POR

GPIO1

CTS

GPIO2

POR

GPIO3

POR

nIRQ

resistive VDD pull-up

nIRQ

SDO

resistive VDD pull-up

SDO

SDI

High Z

SDI

4. Modulation and Hardware Configuration Options

4.1. MODEM_MOD_TYPE

MODEM_MOD_TYPE

TX_DIRECT_MODE_TYPE

TX_DIRECT_MODE_GPIO[1:0]

MOD_SOURCE[1:0]

MOD_TYPE[2:0]

0x0

0x2

4.2. Modulation Types

4.3. Hardware Configuration Options

4.3.1. Receive Demodulator Options

4.3.2. RX/TX Data Interface With MCU

4.4. Preamble Length

Table 12. Recommended Preamble Length

Mode

AFC

Antenna Diversity

Preamble Type

Recommended Preamble Length

Recommended Preamble Detection Threshold

(G)FSK

Disabled

Standard

4 Bytes

20 bits

(G)FSK

Enabled

Disabled

Standard

5 Bytes

20 bits

(G)FSK

Disabled

Non-standard

2 Bytes

0 bits

(G)FSK

Enabled

Non-standard

Not Supported

(G)FSK

Disabled

Enabled

Standard

7 Bytes

24 bits

(G)FSK

Enabled

Standard

8 Bytes

24 bits

4(G)FSK

Disabled

Standard

40 symbols

16 symbols

4(G)FSK

Enabled

Disabled

Standard

48 symbols

16 symbols

4(G)FSK

Non-standard

Not Supported

OOK

Disabled

Standard

4 Bytes

20 bits

OOK

Disabled

Non-standard

2 Bytes

0 bits

OOK

Enabled

Not Supported

5. Internal Functional Blocks

5.1. RX Chain

5.1.1. RX Chain Architecture

Figure 10. RX Architecture vs. Data Rate

5.2. RX Modem

5.2.1. Automatic Gain Control (AGC)

5.2.2. Auto Frequency Correction (AFC)

5.2.3. Image Rejection and Calibration

5.2.4. Received Signal Strength Indicator

5.3. Synthesizer

5.3.1. Synthesizer Frequency Control

Table 13. Output Divider (Outdiv) Values for the Si4460/61/63

Outdiv

Lower (MHz)

Upper (MHz)

142

175

284

350

425

525

850

1050

Table 14. Output Divider (Outdiv) for the Si4464

Outdiv

Lower (MHz)

Upper (MHz)

119

168.99

169

224.99

225

337.99

338

449.99

450

675.99

675

960

5.4. Transmitter (TX)

Number

Command

Summary

0x2200

PA_MODE

0x2201

PA_PWR_LVL

0x2202

PA_BIAS_CLKDUTY

0x2203

PA_TC

5.4.1. Si4464/63: +20 dBm PA

Figure 11. +20 dBm TX Power vs. PA_PWR_LVL

Figure 12. +20 dBm TX Power vs. VDD

Figure 13. +20 dBm TX Power vs. Temp

5.4.2. Si4461 +16 dBm PA

Figure 14. +13 dBm TX Power vs. PA_PWR_LVL

Figure 15. +13 dBm TX Power vs. Supply Voltage (VDD)

5.5. Crystal Oscillator

Figure 16. Capacitor Bank Frequency Offset Characteristics

6. Data Handling and Packet Handler

6.1. RX and TX FIFOs

Figure 17. TX and RX FIFOs

6.2. Packet Handler

Figure 18. Packet Handler Structure

7. RX Modem Configuration

8. Auxiliary Blocks

8.1. Wake-up Timer and 32 kHz Clock Source

Table 15. WUT Specific Commands and Properties

API Properties

Description

Requirements/Notes

GLOBAL_WUT_CONFIG

GLOBAL WUT configuration

GLOBAL_WUT_M_15_8

Sets HW WUT_M[15:8]

GLOBAL_ WUT_M_7_0

Sets HW WUT_M[7:0]

GLOBAL_WUT_R

Sets WUT_R[4:0]

Sets WUT_SLEEP to choose WUT state

GLOBAL_WUT_LDC

Sets FW internal WUT_LDC

Table 16. WUT Related API Commands and Properties

Command/Property

Description

Requirements/Notes

WUT Interrupt Enable

INT_CTL_ENABLE

Interrupt enable property

INT_CTL_CHIP_ENABLE

Chip interrupt enable property

32 kHz Clock Source Selection

GLOBAL_CLK_CFG

Clock configuration options

WUT Interrupt Output

GPIO_PIN_CFG

Host can enable interrupt on WUT expire

RX/TX Operation

START_RX/TX

START RX/TX when wake up timer expire

8.2. Low Duty Cycle Mode (Auto RX Wake-Up)

Figure 19. RX and TX LDC Sequences

Figure 20. Low Duty Cycle Mode for RX

8.3. Temperature, Battery Voltage, and Auxiliary ADC

GET_ADC_READING Command

CMD

0x14

ADC_EN

TEMPERATURE_EN

BATTERY_VOLTAGE_EN

ADC_GPIO_EN

ADC_GPIO_PIN[1:0]

GET_ADC_READING Reply

CMD_COMPLETE

CTS[7:0]

GPIO_ADC

GPIO_ADC[15:8]

GPIO_ADC

GPIO_ADC[7:0]

BATTERY_ADC

BATTERY_ADC[15:8]

BATTERY_ADC

BATTERY_ADC[7:0]

TEMP_ADC

TEMP_ADC[15:8]

TEMP_ADC

TEMP_ADC[7:0]

TEMP_SLOPE

TEMP_SLOPE[7:0]

TEMP_INTERCEPT

TEMP_INTERCEPT[7:0]

8.4. Low Battery Detector

8.5. Antenna Diversity

9. Pin Descriptions: Si4464/63/62/61/60

Pin Name

I/0

Description

SDN

RXp

RXn

VDD

TXRAMP

VDD

GPIO0

I/O

GPIO1

I/O

nIRQ

SCLK

SDO

SDI

nSEL

XOUT

XIN

GND

GPIO2

I/O

GPIO3

I/O

PKG

PADDLE_GND

GND

10. Ordering Information

Part Number1,2

Description

Package Type

Operating Temperature

Si4464-Bxx-FM

QFN-20

Pb-free

–40 to 85 °C

Si4463-Bxx-FM

QFN-20

Pb-free

–40 to 85 °C

Si4461-Bxx-FM

QFN-20

Pb-free

–40 to 85 °C

Si4460-Bxx-FM

QFN-20

Pb-free

–40 to 85 °C

11. Package Outline: Si4464/63/61/60

Figure 21. 20-Pin Quad Flat No-Lead (QFN)

Table 17. Package Dimensions

Symbol

Millimeters

Min

Nom

Max

0.80

0.85

0.90

0.00

0.02

0.05

0.18

0.25

0.30

4.00 BSC

2.45

2.60

2.75

0.50 BSC

4.00 BSC

2.45

2.60

2.75

0.30

0.40

0.50

aaa

—

0.15

bbb

—

0.08

ccc

—

0.10

ddd

—

0.10

eee

—

0.10

ggg

—

0.05

12. PCB Land Pattern: Si4464/63/61/60

Figure 22. PCB Land Pattern

Table 18. PCB Land Pattern Dimensions

Symbol

Millimeters

Min

Max

3.90

4.00

3.90

4.00

0.50 REF

0.20

0.30

2.55

2.65

0.65

0.75

2.55

2.65

13. Top Marking

13.1. Si4464/63/61/60 Top Marking

13.2. Top Marking Explanation

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Si4464/63/61/60 HIGH-PERFORMANCE, LOW-CURRENT TRANSCEIVER Features  Frequency range = 119–1050 MHz  Receive sensitivity = –126 dBm  Modulation  Fast wake and hop times  Power supply = 1.8 to 3.6 V  Excellent selectivity performance (G)FSK, 4(G)FSK, (G)MSK OOK and ASK  Max output power +20 dBm (Si4464/63) +16 dBm (Si4461) +13 dBm (Si4460)  PA support for +27 or +30 dBm  Low active power consumption 10/13 mA RX 18mA TX at +10 dBm (Si4460)  Ultra low current powerdown modes 30 nA shutdown, 50 nA standby  Data rate = 0.123 kbps to 1 Mbps 60 dB adjacent channel 75 dB blocking at 1 MHz  Antenna diversity and T/R switch control  Highly configurable packet handler  TX and RX 64 byte FIFOs  Auto frequency control (AFC)  Automatic gain control (AGC)  Low BOM  Low battery detector  Temperature sensor  20-Pin QFN package  IEEE 802.15.4g compliant  FCC Part 90 Mask D  ETSI Class-I Operation with SAW Applications  Smart metering (802.15.4g & MBus)  Remote control  Home security and alarm  Telemetry  Garage and gate openers Description  Remote keyless entry  Home automation  Industrial control  Sensor networks  Health monitors  Electronic shelf labels Silicon Laboratories' Si446x devices are high-performance, low-current transceivers covering the sub-GHz frequency bands from 119 to 1050 MHz. The radios are part of the EZRadioPRO® family, which includes a complete line of transmitters, receivers, and transceivers covering a wide range of applications. All parts offer outstanding sensitivity of –126 dBm while achieving extremely low active and standby current consumption. The Si4464 offers continuous frequency coverage across the entire sub-GHz band from 119–960 MHz with extremely fine frequency resolution. The Si4463 includes optimal phase noise, blocking, and selectivity performance for narrow band and licensed band applications, such as FCC Part90 and 169 MHz wireless Mbus. The 60 dB adjacent channel selectivity with 12.5 kHz channel spacing ensures robust receive operation in harsh RF conditions, which is particularly important for narrowband operation. The Si4464/63 offers exceptional output power of up to +20 dBm with outstanding TX efficiency. The high output power and sensitivity results in an industry-leading link budget of 146 dB allowing extended ranges and highly robust communication links. The Si4460 active mode TX current consumption of 18 mA at +11 dBm and RX current of 10 mA coupled with extremely low standby current and fast wake times ensure extended battery life in the most demanding applications. The Si4464/63 can achieve up to +27 dBm output power with built-in ramping control of a low-cost external FET. The devices are compliant with all worldwide regulatory standards: FCC, ETSI, and ARIB. All devices are designed to be compliant with 802.15.4g and WMbus smart metering standards. Pin Assignments I 3 O P G 20 I 2 O P G 19 D N G 18 N X I 17 GND PAD 7 8 9 10 T U O X 16 15 14 13 12 11 nSEL SDI SDO SCLK nIRQ SDN RXp RXn TX NC 1 2 3 4 5 6 D D V p m a R X T D D V I 0 O P G I 1 O P G Patents pending Rev 1.0 2/12 Copyright © 2012 by Silicon Laboratories Si4464/63/62/61/60

Si4464/63/61/60 Functional Block Diagram GPIO3 GPIO2 XIN XOUT Loop Filter PFD / CP Frac-N Div VCO FBDIV TX DIV LO Gen 30 MHz XO Bootup OSC SDN RXP RXN TX RF PKDET LNA IF PKDET PGA ADC PA PowerRamp Cntl PA LDO LDOs POR LBD 32K LP OSC MODEM FIFO Packet Handler Digital Logic VDD TXRAMP VDD GPIO0 GPIO1 C o n t r o e r l l S P I I t n e r f a c e nSEL SDI SDO SCLK nIRQ Product Freq. Range Max Output Power TX Current RX Current Narrow Channel + Part90 Image Cal + IF Shift Si4464 Si4463 Si4461 Si4460 Continuous 119–960 MHz Major bands 142-1050 MHz Major bands 142-1050 MHz Major bands 142-1050 MHz +20 dBm +20 dBm +16 dBm +13 dBm 169 MHz: 70 mA 915 MHz: 85 mA 169 MHz: 70 mA 915 MHz: 85 mA +13 dBm: 29 mA +14 dBm: 33 mA +10 dBm: 18 mA +11 dBm: 20 mA 10.6/13.6 mA 10/13 mA 10/13 mA 10/13 mA         2 Rev 1.0

Si4464/63/61/60 TABLE OF CONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.1. Definition of Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 3. Controller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 3.1. Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 3.2. Fast Response Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 3.3. Operating Modes and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 3.4. Application Programming Interface (API) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 3.5. START_TX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 3.6. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 3.7. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 4. Modulation and Hardware Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 4.1. MODEM_MOD_TYPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 4.2. Modulation Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 4.3. Hardware Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 4.4. Preamble Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 5. Internal Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 5.1. RX Chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 5.2. RX Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 5.3. Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 5.4. Transmitter (TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 5.5. Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 6. Data Handling and Packet Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 6.1. RX and TX FIFOs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 6.2. Packet Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 7. RX Modem Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 8. Auxiliary Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 8.1. Wake-up Timer and 32 kHz Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 8.2. Low Duty Cycle Mode (Auto RX Wake-Up) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 8.3. Temperature, Battery Voltage, and Auxiliary ADC . . . . . . . . . . . . . . . . . . . . . . . . . .44 8.4. Low Battery Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 8.5. Antenna Diversity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 9. Pin Descriptions: Si4464/63/62/61/60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 10. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 11. Package Outline: Si4464/63/61/60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 12. PCB Land Pattern: Si4464/63/61/60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 13. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 13.1. Si4464/63/61/60 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 13.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Rev 1.0 3

Si4464/63/61/60 1. Electrical Specifications Table 1. DC Characteristics1 Symbol Parameter Supply Voltage Range Power Saving Modes IShutdown VDD IStandby TUNE Mode Current RX Mode Current TX Mode Current (Si4464/63) TX Mode Current (Si4461) TX Mode Current (Si4460) Notes: Conditions Min 1.8 Typ Max Units 3.3 3.6 V RC Oscillator, Main Digital Regulator, and Low Power Digital Regulator OFF Register values maintained and RC oscillator/WUT OFF ISleepRC RC Oscillator/WUT ON and all register values main- tained, and all other blocks OFF ISleepXO ISensor -LBD IReady ITune_RX ITune_TX IRXH IRXL ITX_+20 ITX_+16 ITX_+14 ITX_+13 ITX_+10 Sleep current using an external 32 kHz crystal.2 Low battery detector ON, register values maintained, and all other blocks OFF Crystal Oscillator and Main Digital Regulator ON, all other blocks OFF RX Tune, High Performance Mode TX Tune, High Performance Mode High Performance Mode Low Power Mode2 +20 dBm output power, class-E match, 915 MHz, 3.3 V +20 dBm output power, class-E match, 460 MHz, 3.3 V +20 dBm output power, square-wave match, 169 MHz, 3.3 V +16 dBm output power, class-E match, 868 MHz, 3.3 V2 +14 dBm output power, Switched-current match, 868 MHz, 3.3 V2 +13 dBm output power, switched-current match, 868 MHz, 3.3 V2 +10 dBm output power, Class-E match, 868 MHz, 3.3 V2 — 30 — nA — 50 — nA — 900 — nA — 1.7 — µA — — µA 1 — 1.8 — mA 8 — 7.2 — mA — — mA — 13 — mA — 10 — mA — 85 — mA — 75 — mA — 70 — mA — 43 — mA — 37 — mA — 29 — mA — 18 — mA 1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section of "1.1. Definition of Test Conditions" on page 13. 2. Guaranteed by qualification. Qualification test conditions are listed in the “Qualification Test Conditions” section in "1.1. Definition of Test Conditions" on page 13. 4 Rev 1.0

Table 2. Synthesizer AC Electrical Characteristics1 Parameter Synthesizer Frequency Range (Si4463/61/60) Symbol FSYN Conditions Synthesizer Frequency Range (Si4464) Synthesizer Frequency Resolution4 Synthesizer Settling Time2 Phase Noise2 FSYN FRES-960 FRES-525 FRES-350 FRES-175 tLOCK L(fM) See Notes 1, 2, and 3 850–1050 MHz 425–525 MHz 283–350 MHz 142–175 MHz Measured from exiting Ready mode with XOSC running to any frequency. Including VCO Calibration. Si4464/63/61/60 Min 142 284 425 850 119 Typ Max Units — MHz 175 — — 350 525 MHz MHz — 1050 MHz — 960 MHz — 28.6 — — 14.3 — — — — 9.5 4.7 50 — — — Hz Hz Hz Hz µs F = 10 kHz, 460 MHz, High Perf Mode — –106 — dBc/Hz F = 100 kHz, 460 MHz, High Perf Mode — –110 — dBc/Hz F = 1 MHz, 460 MHz, High Perf Mode — –123 — dBc/Hz F = 10 MHz, 460 MHz, High Perf Mode — –130 — dBc/Hz Notes: 1. All specification guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the “Production Test Conditions” section in "1.1. Definition of Test Conditions" on page 13. 2. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 13. 3. For applications that use the major bands covered by Si4463/61/60, customers should use those parts instead of Si4464. 4. Default API setting for modulation deviation resolution is double the typical value specified. Rev 1.0 5

Si4464/63/61/60 Table 3. Receiver AC Electrical Characteristics1 Parameter RX Frequency Range (Si4463/61/60) RX Frequency Range (Si4464) RX Sensitivity Symbol FRX FRX PRX_0.5 PRX_40 PRX_100 PRX_125 PRX_500 PRX_9.6 PRX_1M Conditions See Notes 1, 2, 3, 4, and 5 (500 bps, GFSK, BT = 0.5, (40 kbps, GFSK, BT = 0.5, (BER < 0.1%) f = 250Hz)3 (BER < 0.1%) f = 20 kHz)3 (BER < 0.1%) f = 50 kHz)1 (BER < 0.1%) (100 kbps, GFSK, BT = 0.5, (125 kbps, GFSK, BT = 0.5, f = 62.5 kHz)3 (BER < 0.1%) (500 kbps, GFSK, BT = 0.5, f = 250 kHz)3 (PER 1%) (9.6 kbps, 4GFSK, BT = 0.5, f =  kHz)3,4 (PER 1%) (1 Mbps, 4GFSK, BT = 0.5, f = 1.25 kHz)3,4 PRX_OOK (BER < 0.1%, 4.8 kbps, 350 kHz BW, OOK, PN15 data)3 (BER < 0.1%, 40 kbps, 350 kHz BW, OOK, PN15 data)3 (BER < 0.1%, 120 kbps, 350 kHz BW, OOK, PN15 data)3 BW Min 142 284 425 850 119 — — — — — — — — — — 1.1 Typ Max Units — — — — — 175 MHz 350 MHz 525 MHz 1050 MHz 960 MHz –126 — dBm –110 — dBm –106 — dBm –105 — dBm –97 — dBm –110 — dBm –88 — dBm –109 — dBm –104 — dBm –99 — — dBm 850 kHz RX Channel Bandwidth5 Notes: Si4464. Definition of Test Conditions" on page 13. in the 450–470 MHz band. 5. Guaranteed by bench characterization. 1. All specification guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section in "1.1. Definition of Test Conditions" on page 13. 2. For applications that use the major bands covered by Si4463/61/60, customers should use those parts instead of 3. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. 4. For PER tests, 48 preamble symbols, 4 byte sync word, 10 byte payload and CRC-32 was used. PER and BER tested 6 Rev 1.0

Table 3. Receiver AC Electrical Characteristics1 (Continued) Si4464/63/61/60 Parameter BER Variation vs Power Level3 RSSI Resolution 1-Ch Offset Selectivity, 169 MHz3 1-Ch Offset Selectivity, 450 MHz3 1-Ch Offset Selectivity, 868 / 915 MHz3 Blocking 1 MHz Offset3 Symbol PRX_RES RESRSSI C/I1-CH C/I1-CH C/I1-CH Conditions Min Up to +5 dBm Input Level Desired Ref Signal 3 dB above sensitiv- ity, BER < 0.1%. Interferer is CW, and desired is modulated with 2.4 kbps F = 1.2 kHz GFSK with BT = 0.5, RX channel BW=4.8 kHz, channel spacing = 12.5 kHz 1MBLOCK Desired Ref Signal 3 dB above sensitiv- ity. Interferer is CW, and desired is modulated with 2.4 kbps, F = 1.2 kHz GFSK Blocking 8 MHz Offset3 Image Rejection3 8MBLOCK ImREJ No image rejection calibration. Rejec- tion at the image frequency. IF = 468 kHz With image rejection calibration in Si446x. Rejection at the image fre- quency. IF = 468 kHz Measured at RX pins POB_RX1 Typ 0 ±0.5 –60 –58 –53 –75 –84 35 55 — Max Units 0.1 ppm — — — — — — — — dB dB dB dB dB dB dB dB –54 dBm — — — — — — — — — — Spurious Emissions3 Notes: Si4464. 1. All specification guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section in "1.1. Definition of Test Conditions" on page 13. 2. For applications that use the major bands covered by Si4463/61/60, customers should use those parts instead of 3. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 13. 4. For PER tests, 48 preamble symbols, 4 byte sync word, 10 byte payload and CRC-32 was used. PER and BER tested in the 450–470 MHz band. 5. Guaranteed by bench characterization. Rev 1.0 7

Si4464/63/61/60 Table 4. Transmitter AC Electrical Characteristics1 Parameter TX Frequency Range (Si4463/61/60) Symbol Conditions TX Frequency Range (Si4464) (G)FSK Data Rate2,3 4(G)FSK Data Rate2,3 OOK Data Rate2,3 Modulation Deviation Range2 Modulation Deviation Resolution2,4 Output Power Range (Si4464/63)5 Output Power Range (Si4461)5 Output Power Range (Si4460)5 TX RF Output Steps2 Notes: FTX FTX DRFSK DR4FSK DROOK f960 f525 f350 f175 FRES-960 FRES-525 FRES-350 FRES-175 PTX PTX61 PTX60 See Notes 1, 2,3, 4, 5, and 6 850–1050 MHz 425–525 MHz 283–350 MHz 142–175 MHz 850–1050 MHz 425–525 MHz 283–350 MHz 142–175 MHz — 0.123 — 0.123 — 0.123 — Min 142 284 425 850 119 — — — — — — — — –20 –40 –40 Typ Max Units — — — 175 350 525 MHz MHz MHz — 1050 MHz 960 500 1 120 — — — 1.5 750 500 250 — 28.6 — 14.3 — 9.5 — 4.7 — MHz kbps Mbps kbps MHz kHz kHz kHz Hz Hz Hz Hz — — — +20 dBm +16 dBm +13 dBm PRF_OUT Using switched current match within 6 dB of max power — 0.1 — dB 1. All specification guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section in "1.1. Definition of Test Conditions" on page 13. 2. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 13. 3. The maximum data rate is dependant on the XTAL frequency and is calculated as per the formula: Maximum Symbol Rate = Fxtal/60, where Fxtal is the XTAL frequency (typically 30 MHz). 4. Default API setting for modulation deviation resolution is double the typical value specified. 5. Output power is dependent on matching components and board layout. 6. For applications that use the major bands covered by Si4463/61/60, customers should use those parts instead of Si4464. 8 Rev 1.0

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