MIL-STD-883H 2010.pdf

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Front Cover Page

Table of Contents

Main Body

1. Scope

2. Applicable Documents

3. Abbreviations, Symbols, and Definitions

4. General Reequirements

5. Detailed Requirements

6. Notes

Environmental Tests (TM 1000's)

TM 1001 Barometric Pressure, Reduced (Altitude Operation)

TM 1002 Immersion

TM 1003 Insulation Resistance

TM 1004 Moisture Resistance

TM 1005 Steady-state Life

TM 1006 Intermittent Life

TM 1007 Agree Life

TM 1008 Stabilization Bake

TM 1009 Salt Atmosphere (Corrosion)

TM 1010 Temperature Cycling

TM 1011 Thermal Shock

TM 1012 Thermal Characteristics

TM 1013 Dew Point

TM 1014 Seal

Appendix A Cumulative Helium Leat Test

TM 1015 Burn-in Test

TM 1016 Life/Reliability Characterization Tests

TM 1017 Neutron Irradiation

TM 1018 Internal Gas Analysis

TM 1019 Ionizing Radiation (Total Dose) Test Procedure

TM 1020 Dose Rate Induced Latchup Test Procedure

TM 1021 Dose Rate Upset Testing of Digital Microcircuits

TM 1022 MOSFET Threshold Voltage

TM 1023 Dose Rate Response and Threshold for Upset of Linear Microcircuits

TM 1030 Preseal Burn-in

TM 1031 Thin Film Corrosion Test

TM 1032 Package Induced Soft Error Test Procedure (Due to Alpha Particles)

TM 1033 Endurance Life

TM 1034 Dye Penetrant Test

Mechanical Tests (TM 2000's)

TM 2001 Constant Acceleration

TM 2002 Mechanical Shock

TM 2003 Solderability

TM 2004 Lead Integrity

TM 2005 Vibration Fatigue

TM 2006 Vibration Noise

TM 2007 Vibration, Variable Frequency

TM 2008 Visual and Mechanical

TM 2009 External Visual

TM 2010 Internal Visual (Monolithic)

TM 2011 Bond Strength (Destructive Bond Pull Test)

TM 2012 Radiography

TM 2013 Internal Visual Inspection for DPA

TM 2014 Internal Visual and Mechanical

TM 2015 Resistance to Solvents

TM 2016 Physical Dimensions

TM 2017 Internal Visual (Hybrid)

TM 2018 Scanning Electron Microscope (SEM) Inspections

TM 2019 Die Shear Strength

TM 2020 Particle Impact Noise Detection Test

TM 2021 Glassivation Layer Integrity

TM 2022 Wetting Balance Soderability

TM 2023 Nondestructive Bond Pull

TM 2024 Lid Torque for Glass Frit Sealed Packages

TM 2025 Adhesion of Lead Finish

TM 2026 Random Vibration

TM 2027 Substrate Attach Strength

TM 2028 Pin-grid Package Destructive Lead Pull Test

TM 2029 Ceramic Chip Carrier Bond Strength (Destructive Push Test)

TM 2030 Ultrasonic Inspection of Die Attach

TM 2031 Flip-chip Pull-off Test

TM 2032 Visual Inspection of Passive Elements

TM 2035 Ultrasonic Inspection of TAB Bonds

TM 2036 Resistance to Soldering Heat

Electrical Tests (Digital) (TM 3000's)

TM 3001 Drive Source, Dynamic

TM 3002 Load Conditions

TM 3003 Delay Measurements

TM 3004 Transition Time Measurements

TM 3005 Power Supply Current

TM 3006 High Level Output Voltage

TM 3007 Low Level Output Voltage

TM 3008 Breakdown Voltage, Input or Outpput

TM 3009 Input Current, Low Level

TM 3010 Input Current, High Level

TM 3011 Output Short Circuit Current

TM 3012 Terminal Capacitance

TM 3013 Noise Margin Measurements for Digital Microelectronic Devices

TM 3014 Functional Testing

TM 3015 Electrostatic Discharge Sensitivity Classification

TM 3016 Activation Time Verification

TM 3017 Microelectronics Package Digital Signal Transmission

TM 3018 Crosstalk Measurements for Digital Microelectonics Device Package

TM 3019 Ground and Power Supply Impedance Measurements for Microelectronics Device Package

TM 3020 High Impedance (Off-state) Low-level Output Leakage Current

TM 3021 High Impedance (Off-state) High-level Output Leakage Current

TM 3022 Input Clamp Voltage

TM 3023 Static Latch-up Measurements for Digital CMOS Microelectronic Devices

TM 3024 Simultaneous Switching Noise Measurements for Digital Microelectronic Devices

Electrical Tests (Linear) (TM 4000's)

TM 4001 Input Offset Voltage and Current and Bias Current

TM 4002 Phase Margin and Slew Rate Measurements

TM 4003 Common Mode Input Votage Range Common Mode Rejection Ration Supply Voltage Rejection Ratio

TM 4004 Open Loop Performance

TM 4005 Output Performance

TM 4006 Power Gain and Noise Figure

TM 4007 Automatic Gain Control Range

Test Procedures (TM 5000's)

TM 5001 Parameter Mean Value Control

TM 5002 Parameter Distribution Control

TM 5003 Failure Analysis Procedures for Microcircuits

TM 5004 Screening Procedures

TM 5005 Qualification and Quality Conformance Procedures

TM 5006 Limit Testing

TM 5007 Wafer Lot Acceptance

TM 5008 Test Procedures for Hybrid and Multichip Microcircuits

TM 5009 Destructive Physical Analysis

TM 5010 Test Procedures for Complex Monolithic Microcircuits

TM 5011 Evaluation and Acceptance Procedures for Polymeric Materials

TM 5012 Fault Coverage Measurement for Digital Microcircuits

TM 5013 Wafer Fabrication Control and Wafer Acceptance Procedures for Processed GaAs Wafers

The documentation and process conversion measures necessary to comply with this revision shall be completed by 30 September 2010. INCH - POUND MIL-STD-883H 26 February 2010 SUPERSEDING MIL-STD-883G 28 February 2006 DEPARTMENT OF DEFENSE TEST METHOD STANDARD MICROCIRCUITS AMSC N/A FSC 5962

1. This standard is approved for use by all Departments and Agencies of the Department of Defense. FOREWORD 2. Comment, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus ATTN: DSCC-VA, P.O. Box 3990, Columbus, OH 43218-3990, or by email to STD883@dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at: https://assist.daps.dla.mil. * * MIL-STD-883H ii

* * * * * 1. SCOPE ......................................................................................................................................... 1 1.1 Purpose ....................................................................................................................................... 1 1.2 Intended use of or reference to MIL-STD-883 ............................................................................ 1 2. APPLICABLE DOCUMENTS ....................................................................................................... 3 2.1 General ....................................................................................................................................... 3 2.2 Government documents ............................................................................................................. 3 2.3 Non-Government publications .................................................................................................... 4 2.4 Order of precedence ................................................................................................................... 5 3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS ................................................................... 6 3.1 Abbreviations, symbols, and definitions ..................................................................................... 6 4. GENERAL REQUIREMENTS ...................................................................................................... 8 4.1 Numbering system ...................................................................................................................... 8 4.2 Test results ................................................................................................................................. 9 4.3 Test sample disposition .............................................................................................................. 9 4.4 Orientation .................................................................................................................................. 9 4.5 Test conditions ............................................................................................................................ 12 4.6 General precautions ................................................................................................................... 14 4.7 Recycled, recovered, and environmentally preferable materials 14 5. DETAIL REQUIREMENTS ........................................................................................................... 15 6. NOTES .......................................................................................................................................... 16 direction of applied force .............................................................................................................. 10 direction of applied force .............................................................................................................. 11 CONTENTS PARAGRAPH MIL-STD-883H Page FIGURES FIGURE 1. Orientation of noncylindrical microelectronic devices to 2. Orientation of cylindrical microelectronic device to iii

METHOD NO. ENVIRONMENTAL TESTS MIL-STD-883H TEST METHODS MECHANICAL TESTS iv Barometric pressure, reduced (altitude operation) Immersion Insulation resistance Moisture resistance Steady state life Intermittent life Agree life Stabilization bake Salt atmosphere (corrosion) Temperature cycling Thermal shock Thermal characteristics Dew point Seal Burn-in test Life/reliability characterization tests Neutron irradiation Internal gas analysis Ionizing radiation (total dose) test procedure Dose rate induced latchup test procedure Dose rate upset testing of digital microcircuits Mosfet threshold voltage Dose rate response of linear microcircuits Preseal burn-in Thin film corrosion test Package induced soft error test procedure (due to alpha particles) Endurance life test Die penetrant test (for plastic devices) Constant acceleration Mechanical shock Solderability Lead integrity Vibration fatigue Vibration noise Vibration, variable frequency Visual and mechanical External visual Internal visual (monolithic) Bond strength (destructive bond pull test) Radiography Internal visual inspection for DPA Internal visual and mechanical Resistance to solvents Physical dimensions Internal visual (hybrid) Scanning electron microscope (SEM) inspection of metallization Die shear strength Particle impact noise detection test 1001 1002 1003 1004.7 1005.9 1006 1007 1008.2 1009.8 1010.8 1011.9 1012.1 1013 1014.13 1015.10 1016.2 1017.2 1018.6 1019.8 1020.1 1021.3 1022 1023.3 1030.2 1031 1032.1 1033 1034.1 2001.3 2002.5 2003.9 2004.6 2005.2 2006.1 2007.3 2008.1 2009.10 2010.12 2011.8 2012.8 2013.1 2014 2015.13 2016 2017.9 2018.5 2019.8 2020.9 * * ** ** * * * ** * * * * * * * **

METHOD NO. MECHANICAL TESTS MIL-STD-883H TEST METHODS Glassivation layer integrity Wetting balance solderability Nondestructive bond pull Lid torque for glass-frit-sealed packages Adhesion of lead finish Random vibration Substrate attach strength Pin grid package destructive lead pull test Ceramic chip carrier bond strength Ultrasonic inspection of die attach Flip chip pull-off test Visual inspection of passive elements Ultrasonic inspection of TAB bonds Resistance to soldering heat ELECTRICAL TESTS (DIGITAL) * * * 2021.3 2022.2 2023.6 2024.2 2025.4 2026 2027.2 2028.4 2029 2030.1 2031.1 2032.2 2035 2036 3001.1 3002.1 3003.1 3004.1 3005.1 3006.1 3007.1 3008.1 3009.1 3010.1 3011.1 3012.1 3013.1 3014 3015.8 3016 3017 3018 3019.1 3020 3021 3022 3023.1 3024 4001.1 4002.1 4003.1 4004.2 4005.1 4006.1 4007 * Drive source, dynamic Load conditions Delay measurements Transition time measurements Power supply current High level output voltage Low level output voltage Breakdown voltage, input or output Input current, low level Input current, high level Output short circuit current Terminal capacitance Noise margin measurements for digital microelectronic devices Functional testing Electrostatic discharge sensitivity classification Activation time verification Microelectronics package digital signal transmission Crosstalk measurements for digital microelectronic device packages Ground and power supply impedance measurements for digital microelectronics device packages High impedance (off-state) low-level output leakage current High impedance (off-state) high-level output leakage current Input clamp voltage Static latch-up measurements for digital CMOS microelectronic devices Simultaneous switching noise measurements for digital microelectronic devices ELECTRICAL TESTS (LINEAR) Input offset voltage and current and bias current Phase margin and slew rate measurements Common mode input voltage range Common mode rejection ratio Supply voltage rejection ratio Open loop performance Output performance Power gain and noise figure Automatic gain control range v

METHOD NO. TEST PROCEDURES MIL-STD-883H TEST METHODS 5001 5002.1 5003 5004.11 5005.15 5006 5007.7 5008.9 5009.1 5010.4 5011.5 5012.1 5013 Parameter mean value control Parameter distribution control Failure analysis procedures for microcircuits Screening procedures Qualification and quality conformance procedures Limit testing Wafer lot acceptance Test procedures for hybrid and multichip microcircuits Destructive physical analysis Test procedures for custom monolithic microcircuits Evaluation and acceptance procedures for polymeric adhesives. Fault coverage measurement for digital microcircuits. Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers * * * vi

MIL-STD-883H 1. SCOPE 1.1 Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. The test methods, controls, and procedures described herein have been prepared to serve several purposes: a. To specify suitable conditions obtainable in the laboratory and at the device level which give test results equivalent to the actual service conditions existing in the field, and to obtain reproducibility of the results of tests. The tests described herein are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic or outer space location, since it is known that the only true test for operation in a specific application and location is an actual service test under the same conditions. b. To describe in one standard all of the test methods of a similar character which now appear in the various joint-services and NASA microelectronic device specifications, so that these methods may be kept uniform and thus result in conservation of equipment, manhours, and testing facilities. In achieving this objective, it is necessary to make each of the general tests adaptable to a broad range of devices. c. To provide for a level of uniformity of physical, electrical and environmental testing; manufacturing controls and workmanship; and materials to ensure consistent quality and reliability among all devices screened in accordance with this standard. 1.2 Intended use of or reference to MIL-STD-883. When this document is referenced or used in conjunction with the processing and testing of JAN devices in conformance with the requirements of appendix A of MIL-PRF-38535, QML devices in conformance with MIL-PRF-38535 or non-JAN devices in accordance with 1.2.1 or 1.2.2 herein, such processing and testing is required to be in full conformance with all the applicable general requirements and those of the specifically referenced test methods and procedures. For contracts negotiated prior to 31 December 1984, device types that have been classified as manufacturer's 883 (B or S) product prior to 31 December 1984 are not required to meet 1.2.1 or 1.2.2. Existing contracts as of the 31 December 1984, previously negotiated add-ons to these contracts, and future spares for these contracts may continue to use device types which were classified as manufacturer's 883 (B or S) prior to 31 December 1984. New contracts, and any device types classified as compliant to MIL-STD-883 after 31 December 1984 are required to comply with 1.2.1. Any devices meeting only the provisions of 1.2.2 are noncompliant to MIL-STD-883. 1

MIL-STD-883H 1.2.1 Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices. When any manufacturer, contractor, subcontractor, or original equipment manufacturer requires or claims a non-JAN part compliant with MIL-STD-883, all provisions of Appendix A of MIL-PRF-38535 are required to be met. In addition, manufacturers that have produced or are producing products in accordance with 1.2.1a are subject to a Government compliance validation audit on a drop-in basis with a minimum of notice. Such processing and testing are required to be in compliance with all of the applicable general controls and requirements defined herein and those of the specifically referenced test methods and procedures with no reinterpretations, deviations or omissions except as specifically allowed in the device specification or standard microcircuit drawing covering the same generic device. Deviations specifically granted in the device specification or standard microcircuit drawing may also be applied to devices manufactured in the same process, to the same design criteria, and using elements of the same microcircuit group as those used for devices covered by the device specification or standard microcircuit drawing. Such reference include the following: Manufacturers who use MIL-STD-883 in device marking, or make statements in applicable certificates of conformance that parts are compliant with MIL-STD-883, or make statements in advertisements or in published brochures or other marketing documents that parts provided are compliant with MIL-STD-883. Contractors, sub-contractors, or original equipment manufacturers who prepare vendor item drawings, (previously called Specification Control drawings), or Selected Item drawings which require compliance with MIL-STD-883, or invoke it in its entirety as the applicable standard (see 1.2.2 for noncompliant devices). a. Custom monolithic, non-JAN multichip and all other non-JAN microcircuits except non-JAN hybrids described or implied to be compliant with methods 5004 and 5005 or 5010 of MIL-STD-883 are required to meet all of the non- JAN requirements of Appendix A of MIL-PRF-38535. b. Hybrid microcircuits described as compliant or multichip microcircuits described as compliant to MIL-PRF-38534 are required to meet all the requirements of MIL-PRF-38534 (or equivalent procedures/ requirements of reciprocal listing provisions for product of other nations based on existing international agreements): 1.2.2 Provisions for the use of MIL-STD-883 in conjunction with non-compliant non -JAN devices. Any device that is processed with deviations and which is not processed in compliance with the provisions of 1.2.1 defined herein cannot be claimed to be compliant and cannot be marked "/883", "/883B", "/883S", or any variant thereof. All applicable documentation (including device specifications or manufacturer's data sheets and responses to RFQ's invoking MIL-STD-883) are required to clearly and specifically define any and all areas of nonconformance and identify them as deviations in language that is not subject to misinterpretation by the acquiring authority. If the contract or order specifically requires compliance with, equivalence to, or a product that is equal to or better than MIL-STD-883 class B or class S, any exceptions taken to the requirements of the referenced quality level (i.e., 1.2.1 above) prohibit the manufacturer from claiming or implying equivalence to that level. Specific reference to one or more MIL-STD-883 method(s) on a stand-alone basis requires compliance to only the specifically referenced method(s). Such devices are not considered compliant in accordance with 1.2.1 above. However, compliance with only the test procedures contained in test methods 5004, 5005, and 5010 on a stand-alone basis (without specifying compliance or noncompliance to 1.2.1) does not satisfy the requirement for form, fit, and function defined in MIL- PRF-38535 for configuration items, and any reference to these methods on a stand alone basis requires compliance to all the provisions of 1.2.1. 2

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