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VL53L1X数据手册(VL53L1X).pdf
1 Product overview
1.1 Technical specification
Table 1. Technical specification
1.2 System block diagram
Figure 1. VL53L1X block diagram
1.3 Device pinout
Figure 2. VL53L1X pinout (bottom view)
Table 2. VL53L1X pin description
1.4 Application schematic
Figure 3. VL53L1X schematic
Table 3. Suggested pull up and series resistors for I2C Fast mode
2 Functional description
2.1 System functional description
Figure 4. VL53L1X system functional description
2.2 System state machine description
Figure 5. System state machine
2.3 Customer manufacturing calibration flow
2.4 Ranging description
2.5 Key parameters
2.5.1 Distance mode
Table 4. Maximum distance vs. Distance mode under ambient light
2.5.2 Timing budget (TB)
Figure 6. Maximum distance and repeatability error vs. timing budget
2.6 Power sequence
2.6.1 Power up and boot sequence
Figure 7. Power up and boot sequence
Figure 8. Power up and boot sequence with XSHUT not controlled
2.7 Ranging sequences
Figure 9. Autonomous sequence
2.8 Sensing array optical center
Table 5. Optical center specification
Figure 10. Optical center specification
3 Ranging performances
3.1 Test conditions
3.2 Accuracy, repeatability, and ranging error definitions
3.2.1 Accuracy definition
3.2.2 Repeatability definition
3.2.3 Ranging error definition
3.3 Minimum ranging distance
3.4 Performances in dark conditions
Table 6. Performances in dark conditions
3.5 Performances in ambient light conditions
3.5.1 Long distance mode
Table 7. Typical performances in ambient light with long distance mode
3.5.2 Short distance mode
Table 8. Typical performances in ambient light conditions with short distance mode
3.6 Performances in partial ROI in dark conditions
Table 9. Typical performances in partial ROI in dark conditions
4 Control interface
Figure 11. Data transfer protocol
Figure 12. VL53L1X I2C device address: 0x52
Figure 13. VL53L1X data format (write)
Figure 14. VL53L1X data format (read)
Figure 15. VL53L1X data format (sequential write)
Figure 16. VL53L1X data format (sequential read)
4.1 I2C interface - timing characteristics
Table 10. I2C interface - timing characteristics for Fast mode (400 kHz)
Figure 17. I2C timing characteristics
4.2 I2C interface - reference registers
Table 11. Reference registers
Table 12. 32-bit register example
5 Electrical characteristics
5.1 Absolute maximum ratings
Table 13. Absolute maximum ratings
5.2 Recommended operating conditions
Table 14. Recommended operating conditions
5.3 ESD
Table 15. ESD performances
5.4 Current consumption
Table 16. Power consumption at ambient temperature
5.5 Digital I/O electrical characteristics
Table 17. Digital I/O electrical characteristics
6 Outline drawing
Figure 18. Outline drawing (page 1/3)
Figure 19. Outline drawing (page 2/3)
Figure 20. Outline drawing (page 3/3
7 Laser safety considerations
Figure 21. Class 1 laser product label
8 Packaging and labeling
8.1 Product marking
Figure 22. Example of prototype marking
8.2 Inner box labeling
8.3 Packing
8.4 Tape outline drawing
Figure 23. Tape outline drawing
8.5 Pb-free solder reflow process
Table 18. Recommended solder profile
Figure 24. Solder profile
8.6 Handling and storage precautions
8.6.1 Shock precaution
8.6.2 Part handling
8.6.3 Compression force
8.6.4 Moisture sensitivity level
8.7 Storage temperature conditions
Table 19. Recommended storage conditions
9 Ordering information
Table 20. Order codes
10 Acronyms and abbreviations
Table 21. Acronyms and abbreviations
11 ECOPACK®
12 Revision history
Table 22. Document revision history
VL53L1X
A new generation, long distance ranging Time-of-Flight sensor
based on ST’s FlightSense™ technology
Datasheet - production data
Applications
• User detection (Autonomous low-power mode) to
power on/off and lock/unlock devices like
personal computers/laptops and the IoT
• Service robots and vacuum cleaners (long
distance and fast obstacle detection)
• Drones (landing assistance, hovering, ceiling
detection)
• Smart shelves and vending machines (goods
inventory monitoring)
• Sanitary (robust user detection whatever the
target reflectance)
• Smart building and smart lighting (people
detection, gesture control)
• 1 D gesture recognition
• Laser assisted autofocus which enhances the
camera autofocus system speed and robustness,
especially in difficult scenes (low light and low
contrast) and video focus tracking assistance
Description
The VL53L1X is a state-of-the-art, Time-of-Flight
(ToF), laser-ranging sensor, enhancing the ST
FlightSense™ product family. It is the fastest
miniature ToF sensor on the market with accurate
ranging up to 4 m and fast ranging frequency up to
50 Hz
Housed in a miniature and reflowable package, it
integrates a SPAD receiving array, a 940 nm
invisible Class1 laser emitter, physical infrared
filters, and optics to achieve the best ranging
performance in various ambient lighting conditions
with a range of cover window options.
Unlike conventional IR sensors, the VL53L1X uses
ST’s latest generation ToF technology which allows
absolute distance measurement whatever the target
color and reflectance.
It is also possible to program the size of the ROI on
the receiving array, allowing the sensor FoV to be
reduced.
Features
• Fully integrated miniature module
– Size: 4.9x2.5x1.56 mm
– Emitter: 940 nm invisible laser (Class1)
– SPAD (single photon avalanche diode)
receiving array with integrated lens
– Low-power microcontroller running advanced
digital firmware
• Pin-to-pin compatible with the VL53L0X
FlightSense™ ranging sensor
• Fast and accurate long distance ranging
– Up to 400 cm distance measurement
– Up to 50 Hz ranging frequency
• Typical full field-of-view (FoV): 27 °
• Programmable region-of-interest (ROI) size on
the receiving array, allowing the sensor FoV to be
reduced
• Programmable ROI position on the receiving
array, providing multizone operation control from
the host
• Easy integration
– Single reflowable component
– Can be hidden behind many cover window
materials
– Software driver and code examples for
turnkey ranging
– Single power supply (2v8)
– I²C interface (up to 1 MHz)
– Shutdown and interrupt pins
February 2018
This is information on a product in full production.
DocID031281 Rev 2
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www.st.com
Contents
Contents
VL53L1X
1
2
3
Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1
1.2
System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3
1.4
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
System functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
System state machine description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Customer manufacturing calibration flow . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
2.4
Ranging description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Key parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5
Distance mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5.1
2.5.2
Timing budget (TB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Power sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.6.1
Power up and boot sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Ranging sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Sensing array optical center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.7
2.8
2.6
Ranging performances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1
3.2
Accuracy, repeatability, and ranging error definitions . . . . . . . . . . . . . . . . 16
Accuracy definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2.1
Repeatability definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2.2
3.2.3
Ranging error definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Minimum ranging distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Performances in dark conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Performances in ambient light conditions . . . . . . . . . . . . . . . . . . . . . . . . . 17
Long distance mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.5.1
3.5.2
Short distance mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Performances in partial ROI in dark conditions . . . . . . . . . . . . . . . . . . . . 18
3.3
3.4
3.5
3.6
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Contents
4
5
6
7
8
9
10
11
12
Control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
I2C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1
I2C interface - reference registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2
5.3
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.4
5.5
Digital I/O electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Laser safety considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Packaging and labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.1
Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Inner box labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.2
Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.3
8.4
Tape outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Pb-free solder reflow process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.5
8.6
Handling and storage precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Shock precaution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.6.1
Part handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.6.2
8.6.3
Compression force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.6.4
Moisture sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Storage temperature conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.7
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
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Product overview
1
Product overview
1.1
Technical specification
VL53L1X
Table 1. Technical specification
Feature
Detail
Package
Size
Operating voltage
Operating temperature:
Receiver Field Of View (diagonal
FOV)
Infrared emitter
I2C
Optical LGA12
4.9 x 2.5 x 1.56 mm
2.6 to 3.5 V
-20 to 85 °C
Programmable from 15 to 27 degrees
940 nm
Up to 400 kHz (Fast mode) serial bus
Programmable address. Default is 0x52.
1.2
System block diagram
Figure 1. VL53L1X block diagram
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VL53L1X
1.3
Device pinout
Figure 2 shows the pinout of the VL53L1X (see also Figure 18).
Figure 2. VL53L1X pinout (bottom view)
Product overview
Table 2. VL53L1X pin description
Pin number
Signal name
Signal type
Signal description
1
2
3
4
5
6
7
8
9
10
11
12
AVDDVCSEL
AVSSVCSEL
GND
GND2
XSHUT
GND3
GPIO1
DNC
SDA
SCL
AVDD
GND4
Supply
Ground
Ground
Ground
Digital input
Ground
Digital output
Digital input
Digital
input/output
Digital input
Supply
Ground
VCSEL supply, to be connected to main supply
VCSEL ground, to be connected to main ground
To be connected to main ground
To be connected to main ground
Xshutdown pin, active low
To be connected to main ground
Interrupt output. Open drain output
Do not connect, must be left floating
I2C serial data
I2C serial clock input
Supply, to be connected to main supply
To be connected to main ground
Note:
AVSSVCSEL and GND are ground pins and can be connected together in the application
schematics.
GND2, GND3, and GND4 are standard pins that we force to the ground domain in the
application schematics to avoid possible instabilities if set to other states.
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Product overview
VL53L1X
1.4
Application schematic
Figure 3 shows the application schematic of the VL53L1X.
Figure 3. VL53L1X schematic
Note:
Note:
Note:
Note:
Note:
Capacitors on external supply AVDD should be placed as close as possible to the
AVDDVCSEL and AVSSVCSEL module pins.
External pull up resistor values can be found in I2C-bus specification. Pull ups are typically
fitted only once per bus, near the host. For suggested values see Table 3.
XSHUT pin must always be driven to avoid leakage current. A pull up is needed if the host
state is not known.
XSHUT is needed to use HW standby mode (no I2C communication).
XSHUT and GPIO1 pull up recommended values are 10 kOhms
GPIO1 to be left unconnected if not used
Table 3 show recommended values for the pull up and series resistors for an AVDD of 1.8 V
to 2.8 V in I2C Fast mode (up to 400 kHz).
Table 3. Suggested pull up and series resistors for I2C Fast mode
I2C load capacitance (CL) (1)
Pull up resistor (Ohms)
CL ≤ 90 pF
90 pF < CL ≤ 140 pF
140 pF < CL ≤ 270 pF
270 pF < CL ≤ 400 pF
3.6 k
2.4 k
1.2 k
0.8 k
1. For each bus line, CL is measured in the application PCB by the customer.
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VL53L1X
2
2.1
Functional description
Functional description
System functional description
Figure 4 shows the system level functional description. The host customer application
controls the VL53L1X device using an API (application programming interface). The API
implementation is delivered to the customer as a driver (Bare C code).
The driver shares with the customer application a set of high-level functions that allow
control of the VL53L1X like initialization, ranging start/stop, and setting the system
accuracy.
The driver enables fast development of end user applications without the complication of
direct multiple register access. The driver is structured in a way that it can be compiled on
any kind of platform through a good hardware abstraction layer.
A detailed description of the driver is available in the VL53L1X API user manual (UM2356).
Figure 4. VL53L1X system functional description
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Functional description
VL53L1X
2.2
System state machine description
Figure 5 shows the system state machine.
Figure 5. System state machine
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