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PICMG-EXP.0-R1.0 CPCI-E规范.pdf
PICMG EXP.0 R1.0 Specification
Introduction 1
1.1 Statement of Compliance
1.2 Terminology
1.3 Applicable Documents
1.4 Objectives
1.5 Name and Logo Usage
1.5.1 Logo Use
1.5.2 Trademark Policy
1.6 Intellectual Property
1.7 Special Word Usage
1.8 Connectors
1.8.1 Legacy CompactPCI Connectors
1.8.2 High-Speed Advanced Differential Fabric Connectors
1.8.3 UPM Power Connectors
1.8.3.1 System Slot/Board and Type 1 Peripheral Slot/Board
1.8.3.2 Switch Slot/Board
1.8.4 eHM Connector
1.8.5 CompactPCI Pluggable Power Supply Connector
1.9 Slot and Board Descriptions
1.9.1 Connector Reference Designators
1.9.2 System Slot and Board
1.9.3 Type 1 Peripheral Slot and Board
1.9.4 Type 2 Peripheral Slot and Board
1.9.5 Hybrid Peripheral Slot
1.9.6 Legacy Slot
1.9.7 Switch Slot and Board
1.9.7.1 3U Switch Slot and Board
1.9.7.2 6U Switch Slot and Board
1.10 Example Configurations
Mechanical Requirements 2
2.1 Mechanical Overview
2.2 Drawing Standard
2.3 Units
2.4 Keepout Zones
2.5 Connector Requirements
2.5.1 ADF Connectors
2.5.1.1 Board Connectors
2.5.1.2 Backplane Connectors without Hot-Plug Support
2.5.1.3 Backplane Connectors with Hot-Plug Support
2.5.2 eHM Connectors
2.5.2.1 Board Connector Type Designation
2.5.2.2 Backplane Connectors without Hot-Plug Support
2.5.2.3 Backplane Connectors with Hot-Plug Support
2.5.3 UPM Connectors
2.5.3.1 Backplane Connectors
2.5.3.2 Board Connectors without Hot-Plug Support
2.5.3.3 Board Connectors with Hot-Plug Support
2.5.4 HM Connectors
2.5.5 47-Position Pluggable Power Supply Connector
2.6 Chassis Subrack Requirements
2.7 Backplane Requirements
2.7.1 3U Backplane Dimensions and Connector Locations
2.7.2 6U Backplane Dimensions and Connector Locations
2.8 Slot Numbering and Glyphs
2.9 Board Requirements
2.9.1 3U System/Type 1/Type 2 Board Dimensions and Connector Locations
2.9.2 6U System/Type 1/Type 2 Board Dimensions and Connector Locations
2.9.3 3U Switch Board Dimensions and Connector Locations
2.9.4 6U Switch Board Dimensions and Connector Locations
2.9.5 Board PCB Thickness
2.9.6 ESD Discharge Strip
2.9.7 ESD Clip
2.9.8 Front Panels
2.9.9 CompactPCI Express Logo
2.9.10 PMC/XMC Support
2.9.11 Cross Sectional View
2.9.12 Component Outline and Warpage
2.9.13 Solder Side Cover (Optional)
2.9.14 Component Heights
2.9.15 System Slot Identification
2.10 Rear-Panel I/O Board Requirements
2.10.1 3U Rear-Panel I/O Board Dimensions
2.10.2 6U Rear-Panel I/O Board Dimensions
Electrical Requirements 3
3.1 Signal Definitions
3.1.1 PCI Express Signals
3.1.1.1 PCI Express Transmit Signals
3.1.1.2 PCI Express Receive Signals
3.1.1.3 Interconnect Definition
3.1.1.4 Electrical Budgets
3.1.1.5 Jitter Budget Allocation
3.1.1.6 Reference Clock
3.1.2 ESD
3.1.3 5 Vaux
3.1.4 SMBus
3.1.4.1 SMBus “Back Powering” Considerations
3.1.4.2 Backplane Identification and Capability Using SMBus
3.1.5 PWRBTN# Signal
3.1.6 PS_ON# Signal
3.1.7 PWR_OK Signal
3.1.8 WAKE# Signal
3.1.8.1 Implementation Note
3.1.9 PERST# Signal
3.1.9.1 Initial Power-Up (G3 to L0)
3.1.9.2 Power Management States (S0 to S3/S4 to S0)
3.1.9.3 Power Down
3.1.10 SYSEN# Signal
3.1.11 Geographical Addressing
3.1.12 LINKCAP Signal
3.1.13 I/O Pins
3.1.14 Reserved Pins
3.2 Hot-Plug Support
3.2.1 Hot-Plug Sub-System Architecture
3.2.2 Power Enable
3.2.3 Wake#
3.2.4 Module Power Good
3.2.5 Present Detection
3.2.6 System Management Bus
3.2.7 System Management Bus Alert
3.2.8 Attention LED
3.2.9 Attention Switch
3.2.10 DC Specifications
3.3 Backplane Connector Pin Assignments
3.3.1 System Slot
3.3.1.1 4-Link Configuration
3.3.1.2 2-Link Combination Configuration
3.3.2 Peripheral Slot Type 1
3.3.3 Peripheral Slot Type 2
3.3.4 Hybrid Peripheral Slot
3.3.5 Legacy Slot
3.3.6 Switch Slot
3.3.6.1 3U Switch Slot
3.3.6.2 6U Switch Slot-x4 Link Width
3.3.6.3 6U Switch Slot-x8 Link Width
3.4 Power Supply Requirements
3.4.1 Current Available
3.4.2 Regulation and Ripple and Noise
3.4.3 Backplane Power Decoupling
3.4.4 Power Supply Timing
3.4.5 Additional Power Requirements for Boards Supporting Hot-Plug
Keying Requirements 4
4.1 Legacy Slots and Legacy Boards
4.2 eHM Keying
CompactPCI Express Advanced Differential Fabric Connector A
A.1 General Data
A.1.1 Objective of this Document
A.1.2 Scope
A.1.3 Intended Method of Mounting
A.1.4 Ratings and Characteristics
A.1.5 Normative References
A.1.6 Markings
A.1.7 Type Designation
A.1.8 Ordering Information
A.1.9 Special Connector Loadings
A.2 Technical Information
A.2.1 Contacts and Terminations
A.3 Dimensional Information
A.3.1 Isometric View and Common Features
A.3.2 Engagement Information
A.3.2.1 Electrical Engagement Length
A.3.2.2 First Contact Point
A.3.2.3 Perpendicular to Engagement Direction
A.3.2.4 Inclination
A.3.3 Backplane Connectors
A.3.3.1 Dimensions
A.3.3.2 Contacts
A.3.3.3 Contact Tip Geometry
A.3.3.4 Terminations
A.3.4 Front Board Connectors
A.3.4.1 Dimensions
A.3.4.2 Terminations
A.3.5 Mounting Information for Backplane Connectors
A.3.5.1 Hole Pattern on Backplanes
A.3.5.2 Backplane Contact Positional Requirements
A.3.5.3 True Position of Male Contacts
A.3.6 Mounting Information for Front Board Connectors
A.3.6.1 Hole Pattern on Printed Boards
A.4 Characteristics
A.4.1 Climatic Category
A.4.1.1 Climatic Category Test batch P: Initial Examination
A.4.1.2 Climatic Category Test Batch A: Mechanical Tests
A.4.1.3 Climatic Category Test Batch B: Harsh Environments
A.4.1.4 Climatic Category Test Batch C: Damp Heat
A.4.1.5 Climatic Category Test Batch D: Extended Environmental Tests
A.4.1.6 Climatic Category Test Batch E: Extended Environmental Tests
A.4.2 Electrical Characteristics
A.4.2.1 Impedance
A.4.2.2 Crosstalk
A.4.2.3 Propagation Delay
A.4.2.4 Differential Skew
A.4.2.5 Insertion Loss
Enriched Hard-Metric Connector B
B.1 General Data
B.1.1 Objective of this Document
B.1.2 Description of the Connector’s Approach
B.1.3 Descriptive Partitions Found Further This Document
B.1.4 Normative References
B.1.4.1 Primary References Describing the Generic Part of the Connector
B.1.4.2 Additional References
B.1.5 Intended Method of Mounting
B.1.6 Markings
B.1.7 Type Designation (General)
B.2 Technical Information
B.2.1 Definitions
B.2.2 Contacts
B.2.3 Contact Performance Level
B.2.4 Keying
B.2.4.1 Mating Rules
B.2.4.2 Examples for Mating and Nonmating Configurations
B.2.5 Type Designation
B.2.6 Applicational Information
B.2.6.1 Alignment and Gathering
B.2.6.2 Polarization
B.3 Dimensional Information
B.3.1 General
B.3.2 View and Common Features
B.3.3 Remarks on Mating Properties of eHM Connector
B.3.4 Fixed Board Connector
B.3.4.1 Dimensions
B.3.4.2 Terminations
B.3.4.3 Mounting Information for Fixed Board Connectors
B.3.4.4 Hole Pattern on Fixed Board
B.3.4.5 Position of Connectors on Fixed Board
B.3.5 Free Board Connectors
B.3.5.1 Dimensions
B.3.5.2 Terminations
B.3.5.3 Mounting Information for Free Board Connectors
B.3.5.4 Hole Pattern on Free Board
B.3.5.5 Position of Connectors on Front Board
B.4 Characteristics
B.4.1 Climatic Category
B.4.2 Electrical Characteristics
B.4.2.1 Creepage and Clearance Distances
B.4.2.2 Voltage Proof
B.4.2.3 Current-Carrying Capacity
B.4.2.4 Contact Resistance
B.4.2.5 Insulation Resistance
B.4.3 Mechanical
B.4.3.1 Mechanical Operation
B.4.3.2 Engaging and Separating Forces
B.4.3.3 Contact Retention in Insert
B.4.3.4 Static Load, Transverse
B.4.3.5 Gauge Retention Force
B.4.3.6 Vibration (Sinusoidal)
B.4.3.7 Shock
B.4.3.8 Polarization Method
B.4.3.9 Robustness and Effectiveness of Coding Device
B.5 Test Schedule
B.6 Quality Assessment Procedures
Universal Power Connector (UPM) C
C.1 General Data
C.1.1 Objective of this Document
C.2 Dimensions
C.3 Perpendicular to Engagement Direction
C.4 Inclination
C.5 Mounting Information
C.6 Climatic Category
CompactPCI Express
®
PICMG EXP.0 R1.0 Specification
Release Candidate 1
Draft
May 27, 2005
DRAFT SPECIFICATION FOR REVIEW ONLY
DO NOT DESIGN TO/DO NOT CLAIM COMPLIANCE TO/DO NOT
DISTRIBUTE THIS SPECIFICATION
©Copyright 2005, PCI Industrial Computer Manufacturers Group.
The attention of adopters is directed to the possibility that compliance with or adoption of PICMG® specifications may require use of an invention
covered by patent rights. PICMG® shall not be responsible for identifying patents for which a license may be required by any PICMG® specification or
for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG® specifications are prospective
and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.
NOTICE:
The information contained in this document is subject to change without notice. The material in this document details a PICMG® specification in
accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this
specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG® MAKES NO WARRANTY OF ANY KIND,
EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP,
IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.
In no event shall PICMG® be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including
loss of profits, revenue, data or use, incurred by any user or any third party.
Compliance with this specification does not absolve manufacturers of CompactPCI® Express equipment from the requirements of safety and
regulatory agencies (UL, CSA, FCC, IEC, etc.).
The PICMG® and CompactPCI® names and the PICMG®, CompactPCI®, and CompactPCI® Express logos are registered trademarks of the PCI
Industrial Computer Manufacturers Group.
All other brand or product names may be trademarks or registered trademarks of their respective holders.
PICMG EXP.O CompactPCI Express Specification, Draft R1.0 RC1, May 27, 2005
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
1
2
1.6
1.7
1.8
1.9
Introduction ..........................................................................................................13
Statement of Compliance ............................................................................13
1.1
Terminology.................................................................................................13
1.2
1.3
Applicable Documents.................................................................................18
Objectives....................................................................................................19
1.4
Name and Logo Usage ...............................................................................20
1.5
1.5.1
Logo Use ........................................................................................20
1.5.2
Trademark Policy ...........................................................................20
Intellectual Property.....................................................................................21
Special Word Usage....................................................................................22
Connectors ..................................................................................................22
1.8.1
Legacy CompactPCI Connectors ...................................................22
1.8.2 High-Speed Advanced Differential Fabric Connectors...................23
1.8.3 UPM Power Connectors.................................................................25
System Slot/Board and Type 1 Peripheral Slot/Board....25
1.8.3.1
Switch Slot/Board ...........................................................26
1.8.3.2
1.8.4
eHM Connector ..............................................................................27
1.8.5 CompactPCI Pluggable Power Supply Connector .........................27
Slot and Board Descriptions........................................................................28
1.9.1 Connector Reference Designators .................................................31
System Slot and Board...................................................................31
1.9.2
Type 1 Peripheral Slot and Board ..................................................32
1.9.3
1.9.4
Type 2 Peripheral Slot and Board ..................................................33
1.9.5 Hybrid Peripheral Slot ....................................................................35
1.9.6
Legacy Slot.....................................................................................36
Switch Slot and Board ....................................................................36
1.9.7
3U Switch Slot and Board...............................................36
1.9.7.1
1.9.7.2
6U Switch Slot and Board...............................................37
1.10 Example Configurations ..............................................................................40
Mechanical Requirements ..................................................................................45
2.1 Mechanical Overview ..................................................................................45
2.2
Drawing Standard........................................................................................45
Units ............................................................................................................45
2.3
Keepout Zones ............................................................................................45
2.4
Connector Requirements ............................................................................45
2.5
2.5.1
ADF Connectors.............................................................................45
Board Connectors...........................................................45
2.5.1.1
Backplane Connectors without Hot-Plug Support ..........46
2.5.1.2
2.5.1.3
Backplane Connectors with Hot-Plug Support ...............46
eHM Connectors ............................................................................46
2.5.2.1
Board Connector Type Designation ...............................46
Backplane Connectors without Hot-Plug Support ..........46
2.5.2.2
2.5.2.3
Backplane Connectors with Hot-Plug Support ...............46
2.5.3 UPM Connectors ............................................................................46
Backplane Connectors ...................................................46
Board Connectors without Hot-Plug Support..................47
2.5.3.1
2.5.3.2
2.5.2
PICMG EXP.O CompactPCI Express Specification, Draft R1.0 RC1, May 27, 2005
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
3
2.9.2
3
2.6
2.7
2.8
2.9
2.5.3.3
Board Connectors with Hot-Plug Support....................... 47
2.5.4 HM Connectors .............................................................................. 47
2.5.5
47-Position Pluggable Power Supply Connector............................ 47
Chassis Subrack Requirements.................................................................. 47
Backplane Requirements ............................................................................ 47
3U Backplane Dimensions and Connector Locations ....................47
2.7.1
2.7.2
6U Backplane Dimensions and Connector Locations ....................49
Slot Numbering and Glyphs ........................................................................ 51
Board Requirements ................................................................................... 51
2.9.1
3U System/Type 1/Type 2 Board Dimensions and Connector
Locations........................................................................................ 51
6U System/Type 1/Type 2 Board Dimensions and Connector
Locations........................................................................................ 53
3U Switch Board Dimensions and Connector Locations................ 54
2.9.3
6U Switch Board Dimensions and Connector Locations................ 55
2.9.4
Board PCB Thickness .................................................................... 56
2.9.5
ESD Discharge Strip ...................................................................... 56
2.9.6
ESD Clip......................................................................................... 56
2.9.7
2.9.8
Front Panels................................................................................... 56
2.9.9 CompactPCI Express Logo ............................................................ 57
2.9.10 PMC/XMC Support......................................................................... 57
2.9.11 Cross Sectional View ..................................................................... 58
2.9.12 Component Outline and Warpage.................................................. 58
2.9.13 Solder Side Cover (Optional) ......................................................... 58
2.9.14 Component Heights........................................................................ 59
2.9.15 System Slot Identification............................................................... 59
2.10 Rear-Panel I/O Board Requirements .......................................................... 59
2.10.1 3U Rear-Panel I/O Board Dimensions ........................................... 59
2.10.2 6U Rear-Panel I/O Board Dimensions ........................................... 60
Electrical Requirements ...................................................................................... 62
Signal Definitions......................................................................................... 62
3.1
3.1.1
PCI Express Signals....................................................................... 62
PCI Express Transmit Signals........................................ 62
3.1.1.1
PCI Express Receive Signals......................................... 62
3.1.1.2
Interconnect Definition.................................................... 63
3.1.1.3
3.1.1.3.1
Link Definition .............................................. 63
3.1.1.3.2
Link Grouping .............................................. 63
Electrical Budgets........................................................... 64
3.1.1.4.1 AC Coupling.................................................65
3.1.1.4.2
Insertion Loss .............................................. 65
3.1.1.4.3 Crosstalk...................................................... 66
3.1.1.4.4
Lane-to-Lane Skew...................................... 67
3.1.1.4.5 Equalization .................................................67
3.1.1.4.6 Skew within the Differential Pair (Intra-Pair
3.1.1.4
3.1.1.5
Skew)........................................................... 67
Jitter Budget Allocation................................................... 68
3.1.1.5.1 Random Jitter (Rj)........................................ 68
3.1.1.5.2 System Level Jitter Distribution ................... 69
3.1.1.5.3
Interconnect Jitter Budget............................ 69
3.1.1.5.4 Eye Patterns ................................................ 70
Type 2 Peripheral Transmitter Eye .............. 71
3.1.1.5.5
4
PICMG EXP.O CompactPCI Express Specification, Draft R1.0 RC1, May 27, 2005
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
3.1.9
3.1.2
3.1.3
3.1.4
3.1.1.5.6 Controller Transmitter Eye...........................72
3.1.1.5.7
Type 2 Peripheral Receiver Eye ..................73
3.1.1.5.8 Controller Receiver Eye...............................74
3.1.1.5.9 Backplane Compliance Testing ...................75
3.1.1.5.10 Alternative Controller TX Measurement.......77
3.1.1.6 Reference Clock .............................................................78
3.1.1.6.1 Hot-Plug.......................................................78
3.1.1.6.2 Clock Fan-Out..............................................79
3.1.1.6.3 Clocking Dependencies ...............................79
3.1.1.6.4 AC-Coupling and Biasing.............................79
3.1.1.6.5 Routing Length.............................................80
3.1.1.6.6 Reference Clock Specification.....................81
3.1.1.6.7 REFCLK Phase Jitter Specification .............84
ESD ................................................................................................85
5 Vaux ............................................................................................85
SMBus............................................................................................85
3.1.4.1
SMBus “Back Powering” Considerations........................88
3.1.4.2
Backplane Identification and Capability Using SMBus ...88
PWRBTN# Signal...........................................................................94
3.1.5
PS_ON# Signal ..............................................................................94
3.1.6
PWR_OK Signal.............................................................................95
3.1.7
3.1.8 WAKE# Signal................................................................................96
3.1.8.1
Implementation Note ......................................................98
PERST# Signal ..............................................................................99
3.1.9.1
Initial Power-Up (G3 to L0) ...........................................100
Power Management States (S0 to S3/S4 to S0) ..........101
3.1.9.2
3.1.9.3
Power Down .................................................................102
3.1.10 SYSEN# Signal ............................................................................103
3.1.11 Geographical Addressing .............................................................103
3.1.12 LINKCAP Signal ...........................................................................104
3.1.13 I/O Pins.........................................................................................104
3.1.14 Reserved Pins ..............................................................................104
Hot-Plug Support.......................................................................................104
3.2.1 Hot-Plug Sub-System Architecture...............................................104
3.2.2
Power Enable ...............................................................................107
3.2.3 Wake# ..........................................................................................108
3.2.4 Module Power Good.....................................................................108
3.2.5
Present Detection.........................................................................108
System Management Bus ............................................................108
3.2.6
System Management Bus Alert....................................................108
3.2.7
Attention LED ...............................................................................109
3.2.8
3.2.9
Attention Switch............................................................................109
3.2.10 DC Specifications .........................................................................109
Backplane Connector Pin Assignments ....................................................109
System Slot ..................................................................................109
3.3.1
3.3.1.1
4-Link Configuration .....................................................110
3.3.1.2
2-Link Combination Configuration ................................111
Peripheral Slot Type 1..................................................................113
3.3.2
3.3.3
Peripheral Slot Type 2..................................................................115
3.3.4 Hybrid Peripheral Slot ..................................................................115
3.3.5
Legacy Slot...................................................................................117
3.2
3.3
PICMG EXP.O CompactPCI Express Specification, Draft R1.0 RC1, May 27, 2005
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
5
4
A
3.4
3.3.6
Switch Slot....................................................................................117
3U Switch Slot ..............................................................117
3.3.6.1
6U Switch Slot—x4 Link Width.....................................118
3.3.6.2
3.3.6.3
6U Switch Slot—x8 Link Width.....................................121
Power Supply Requirements.....................................................................123
3.4.1 Current Available..........................................................................123
3.4.2 Regulation and Ripple and Noise.................................................124
3.4.3
Backplane Power Decoupling ......................................................124
Power Supply Timing ...................................................................124
3.4.4
Additional Power Requirements for Boards Supporting
3.4.5
Hot-Plug .......................................................................................125
Keying Requirements ........................................................................................126
Legacy Slots and Legacy Boards..............................................................126
4.1
4.2
eHM Keying...............................................................................................126
CompactPCI Express Advanced Differential Fabric Connector ....................129
A.1 General Data.............................................................................................129
A.1.1 Objective of this Document .........................................................129
A.1.2 Scope ...........................................................................................129
A.1.3
Intended Method of Mounting.......................................................129
A.1.4 Ratings and Characteristics .........................................................130
A.1.5 Normative References..................................................................130
A.1.6 Markings.......................................................................................131
A.1.7
Type Designation .........................................................................131
A.1.8 Ordering Information ....................................................................132
A.1.9 Special Connector Loadings ........................................................132
Technical Information................................................................................133
A.2.1 Contacts and Terminations ..........................................................133
Dimensional Information............................................................................134
A.3.1
Isometric View and Common Features ........................................134
A.3.2 Engagement Information ..............................................................134
A.3.2.1 Electrical Engagement Length......................................134
A.3.2.2
First Contact Point........................................................135
A.3.2.3 Perpendicular to Engagement Direction.......................135
A.3.2.4
Inclination .....................................................................135
A.3.3 Backplane Connectors .................................................................136
A.3.3.1 Dimensions...................................................................136
A.3.3.2 Contacts .......................................................................136
A.3.3.3 Contact Tip Geometry ..................................................137
A.3.3.4
Terminations.................................................................137
Front Board Connectors ...............................................................138
A.3.4.1 Dimensions...................................................................138
A.3.4.2
Terminations.................................................................138
A.3.5 Mounting Information for Backplane Connectors .........................138
A.3.5.1 Hole Pattern on Backplanes.........................................139
A.3.5.2 Backplane Contact Positional Requirements ...............139
A.3.5.3
True Position of Male Contacts ....................................139
A.3.6 Mounting Information for Front Board Connectors .......................140
A.3.6.1 Hole Pattern on Printed Boards....................................140
Characteristics...........................................................................................141
A.3.4
A.2
A.3
A.4
6
PICMG EXP.O CompactPCI Express Specification, Draft R1.0 RC1, May 27, 2005
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
A.4.1 Climatic Category .........................................................................141
A.4.1.1 Climatic Category Test batch P: Initial Examination.....141
A.4.1.2 Climatic Category Test Batch A: Mechanical Tests......141
A.4.1.3 Climatic Category Test Batch B: Harsh Environments .144
A.4.1.4 Climatic Category Test Batch C: Damp Heat ...............146
A.4.1.5 Climatic Category Test Batch D: Extended
Environmental Tests.....................................................147
A.4.1.6 Climatic Category Test Batch E: Extended
Environmental Tests.....................................................148
A.4.2 Electrical Characteristics ..............................................................148
A.4.2.1
Impedance....................................................................148
A.4.2.2 Crosstalk.......................................................................149
A.4.2.3 Propagation Delay ........................................................149
A.4.2.4 Differential Skew...........................................................149
A.4.2.5
Insertion Loss ...............................................................149
Enriched Hard-Metric Connector......................................................................150
B.1 General Data .............................................................................................150
B.1.1 Objective of this Document ..........................................................150
B.1.2 Description of the Connector’s Approach.....................................150
B.1.3 Descriptive Partitions Found Further This Document...................150
B.1.4 Normative References..................................................................151
B
B.2
B.3
B.1.4.1 Primary References Describing the Generic Part of
the Connector ...............................................................151
B.1.4.2 Additional References ..................................................151
B.1.5
Intended Method of Mounting.......................................................151
B.1.6 Markings.......................................................................................152
B.1.7
Type Designation (General) .........................................................152
Technical Information ................................................................................152
B.2.1 Definitions.....................................................................................152
B.2.2 Contacts .......................................................................................152
B.2.3 Contact Performance Level..........................................................154
B.2.4 Keying ..........................................................................................154
B.2.4.1 Mating Rules.................................................................155
B.2.4.2 Examples for Mating and Nonmating Configurations ...156
B.2.5
Type Designation .........................................................................156
B.2.6 Applicational Information ..............................................................157
B.2.6.1 Alignment and Gathering..............................................157
B.2.6.2 Polarization...................................................................158
Dimensional Information............................................................................158
B.3.1 General.........................................................................................158
B.3.2 View and Common Features........................................................158
B.3.3 Remarks on Mating Properties of eHM Connector.......................159
Fixed Board Connector ................................................................160
B.3.4
B.3.4.1 Dimensions...................................................................160
B.3.4.2
Terminations.................................................................161
B.3.4.3 Mounting Information for Fixed Board Connectors.......161
B.3.4.4 Hole Pattern on Fixed Board ........................................161
B.3.4.5 Position of Connectors on Fixed Board ........................161
Free Board Connectors ................................................................162
B.3.5.1 Dimensions...................................................................162
Terminations.................................................................163
B.3.5.2
B.3.5
PICMG EXP.O CompactPCI Express Specification, Draft R1.0 RC1, May 27, 2005
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
7
B.4
B.3.5.3 Mounting Information for Free Board Connectors ........163
B.3.5.4 Hole Pattern on Free Board..........................................163
B.3.5.5 Position of Connectors on Front Board ........................163
Characteristics...........................................................................................163
B.4.1 Climatic Category.........................................................................163
B.4.2 Electrical Characteristics ..............................................................163
B.4.2.1 Creepage and Clearance Distances.............................163
B.4.2.2 Voltage Proof................................................................164
B.4.2.3 Current-Carrying Capacity............................................164
B.4.2.4 Contact Resistance ......................................................164
B.4.2.5
Insulation Resistance ...................................................164
B.4.3 Mechanical ...................................................................................164
B.4.3.1 Mechanical Operation...................................................164
B.4.3.2 Engaging and Separating Forces.................................164
B.4.3.3 Contact Retention in Insert...........................................164
B.4.3.4 Static Load, Transverse................................................164
B.4.3.5 Gauge Retention Force ................................................164
B.4.3.6 Vibration (Sinusoidal) ...................................................164
B.4.3.7 Shock............................................................................164
B.4.3.8 Polarization Method......................................................165
B.4.3.9 Robustness and Effectiveness of Coding Device.........165
B.4.3.9.1 Conditions According to IEC60512-7,
C
Test 13e.....................................................165
B.5
Test Schedule ...........................................................................................165
B.6 Quality Assessment Procedures ...............................................................165
Universal Power Connector (UPM)...................................................................166
C.1 General Data.............................................................................................166
C.1.1 Objective of this Document ..........................................................166
Dimensions................................................................................................167
C.2
Perpendicular to Engagement Direction....................................................169
C.3
C.4
Inclination ..................................................................................................169
C.5 Mounting Information.................................................................................169
C.6
Climatic Category......................................................................................171
Figures
1-1 HM Connectors ................................................................................................ 23
1-2
Advanced Differential Fabric (ADF) Connector ................................................ 24
1-3 UPM Power Connector for System and Type 1 Peripheral Slots/Boards......... 25
Power Connector for Switch Slots/Boards ....................................................... 26
1-4
1-5
eHM Connector ................................................................................................ 27
1-6
47-Position CompactPCI Pluggable Power Supply Connector ........................ 28
1-7 CompactPCI Express 3U Slot Examples ......................................................... 29
1-8 CompactPCI Express 6U Slot Examples ......................................................... 30
1-9
System Board................................................................................................... 31
1-10 System Slot ...................................................................................................... 32
1-11 Type 1 Peripheral Board .................................................................................. 32
1-12 Type 1 Peripheral Slot...................................................................................... 33
1-13 Type 2 Peripheral Board .................................................................................. 34
1-14 Type 2 Peripheral Slot...................................................................................... 34
8
PICMG EXP.O CompactPCI Express Specification, Draft R1.0 RC1, May 27, 2005
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
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