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EPSON NS 6040 Manual---- IC Handler.pdf
NS-6000 series HIGH SPEED IC HANDLER User’s Manual
PREFACE
FOREWORD
WARRANTY
NOTICE
TRADEMARKS
Manual List
TABLE OF CONTENTS
1. Before Operating the Handler
2. Functions and Specifications
3. Installation
4. Procedures after Changing Devices
5. Tester Interface
6. Scanner Setup
7. Monitoring the Operation Status of the Handler via Web Access
8. I/O Map
Chapter 1 Before Operating the Handler
1.1 Marks in the Contents
1.2 For Safety
1.2.1 For Operations
Before Operations
During Operations
Range of Allowed Operation and Password
Operation Panels
1.2.2 Safety Functions
Covers, Doors and Safety Switches
Emergency Stop Switches
Confirmation of Safety Functions
1.2.3 Installation
Transportation and Installation
Connection to the Tester
Environment
Piping and Wiring
Setting Up
Connecting Cable or Connectors
1.2.4 Operating the Handler
Automatic Operations
Replacing the Change Kit Jigs
Adjustment Operations
Solving Jamming
1.2.5 Maintenance
Maintenance
Teaching
Adjustment Operations
Replacement of the Electrical Unit
1.2.6 Others
1.3 Stickers on the Handler
Chapter 2 Functions and Specifications
2.1 Part Names
2.1.1 Front View (Loader/Unloader side)
2.1.2 Inside the Hinged Doors
2.1.3 Lateral View
2.1.4 Back View (Tester side)
2.2 Unit Layout
2.3 Functions and the Outline of Specifications
1. Tray Loader
2. Loading Robot: Input Arm
3. Tray transporting Robot: Empty Tray Arm
4. Hot Plates
5. Shuttle 1 and 2
6. Index Unit: Test Arm 1 and 2
7. Unloading Robot: Output Arm
8. Tray Unloader
9. Contact Test Sockets
10. Fixed Tray(s)
11. Main Frame, Cover and Door
12. IC Lead Scanner (option)
13. Empty Tray Unloader (option)
14. Empty Tray Loader (option)
2.4 Names and Specifications of the Operation Panels
2.4.1 Names of the Operation Panels
2.4.2 Specifications of the Operation Panels
Chapter 3 Installation
3.1 Transportation
3.2 Moving the Handler
3.3 Connection of the Air Source
3.4 Connection to the Tester
3.5 Connection to the Power Supply
3.6 Power Supply Connection of Controller and Monitor
Reference: To Quit Software
3.7 Static Electricity
3.7.1 Reducing Static Electricity by the Attaching Ionizer (Option)
3.7.2 Dissipative Process and Change Kit Jigs with Dissipative Materials (Option)
Chapter 4 Procedures after Changing Devices
4.10 Temperature Calibration Procedures
4.10.1 Preparation
When setting the offset values manually (as conventionally done)
When automatically calibrating using the data-logger
4.10.2 Manual Calibration Procedure
4.10.3 Automatic Calibration Procedure
4.11 Adjusting the Device Unloading Position
4.11.1 The Procedures for Adjusting the Device Unloading Position
Summary of Procedure
4.11.2 Pausing the Handler
4.11.3 Basic Data Settings
(1) The [Tray Form] Dialog
(2) The [Hot Plate Form] Dialog
(3) The [Input Arm Condition] Dialog
(4) The [Index Arm Condition] Dialog
(5) The [Output Arm Condition] Dialog
A : Release & Drop Positions of the Device on the Loading Side
A-1 : Release & Drop Position from the Loading Tray to the Shuttle(s) on the Loading
Side (in the Ambient mode)
Check Point
Preparation
Procedure
A-2 ：Release & Drop Position from the Loading Tray to the Hot Plate
(in the High-Temperature mode)
Check Points
Preparation
Procedure
A-3 ：Release & Drop position from the Hot Plate to the Shuttle(s) on the Loading Side
(in High-Temperature Mode)
Check Points
Preparation
Procedure
B : Release & Drop Positions of the Device on the Unloading Side
(in Ambient and High Temperature Modes)
B-1 : Release & Drop Position from the Shuttle to the Unloader 1 Tray
(in Ambient and High Temperature Modes)
Check Points
Preparation
Procedure
C : Pickup/Release Level Position of the Device (Height)
C-1 : Pickup Level Position (Height) from the Loading Tray
(in Ambient & High Temperature Modes)
To Start the Suction at a Higher Level than Currently Set:
To Start the Suction at a Lower level than Currently Set:
C-2 : Release & Drop Level Position (Height) into the Shuttle on the Loading Side
(in the Ambient & High-Temperature Modes)
To Release & Drop the Device at a Higher Level Position than the
Currently Set:
To Release & Drop the Device at a Lower Level Position than
Currently Set:
C-3 : Pickup Level Position (height) from the Shuttle on the Unloading Side
(in Ambient & High-Temperature Modes).
To Start the Suction at a Higher Level than Currently Set:
To Start the Suction at a Lower Level than Currently Set:
C-4 : Release & Drop Level Position (height) onto the Hot Plate
(only in the High Temperature Mode)
To Release & Drop the Device at a Higher Level Position than
Currently Set:
To Release & Drop the Device at a Lower Level Position than
Currently Set:
C-5 : Pickup Level Position (height) from the Hot Plate (only High-Temperature Mode)
To Start the Suction at a Higher Level of Currently Set:
To Start the Suction at a Lower Level than Currently Set:
C-6 : Release & Drop Level Position (height) onto the Unloading Tray
(in the Ambient & High-Temperature Modes)
To Release & Drop the Device at a Higher Position than
Currently Set:
To Release & Drop the Device at a Lower Position than Currently
Set:
Saving the Z Offset Data Settings
4.1 Replacement of the Change Kit Jigs
Set of Change Kit Jigs
4.1.1 Replacement of the Input Arm Hand Jigs
4.1.2 Replacement of the Hot Plate Jigs
4.1.3 Replacement of the Shuttle Jigs
4.1.4 Replacement of the Test Hand Jigs
4.1.5 Replacement of the Output Arm Jigs
4.1.6 Replacement of the Socket Guide Jigs
4.1.7 Replacement of the Hand Pitch Jigs
4.2 Setup File
4.3 Editing the Tray Form Settings
4.4 Editing the Hot Plate Form Settings
4.5 Socket Contact Pressure and Contact Level Position
4.5.1 Showing the [Contact Parameter] Dialog
4.5.2 Changing the Handler Mode
4.5.3 Setting the Contact Pressure
A: Operating the Regulator by Hand
Regulator for Air Pressure Adjustment
B: Using an Optional Electropnuematic Regulator
4.5.4 Starting the Handler
When “Height Calibration” mode is selected:
When “Height Adjustment (Contact test)” mode is selected:
When “Manual Calibration” is selected:
Reference: Operation Sequence
Height Calibration
Height Adjustment (Contact test)
4.5.5 Loading the Contact Level Position (Height) Data
Reference: Torque Control Mode
4.5.6 Adjusting the Contact Level Position (Height) Data
4.6 Changing the Hand Pitches
4.7 Device Pickup/Release Level Position (Height)
4.7.1 Shuttle Position on the Loading Side
4.7.2 Shuttle Position on the Unloading Side
4.7.3 Input the Values
4.8 Vacuum Check Wait Time and Counter-Air-On Time
4.8.1 Adjusting the Input Arm
4.8.2 Adjusting the Index Arm
4.8.3 Adjusting the Output Arm
4.9 I/F Unit
Chapter 5 Tester Interface
5.1 IFUNT100
Appearance
5.2 Digital I/O Interface
5.2.1 [DIO Interface Configuration] Dialog
Start Signal
DUT Signal
End Signal
Multiple
Tester Calibration (RS-232C)
Category Signal
[Name]
5.2.2 Signals
START Signal
END Signal
DUT Signal
Category Data Signal
5.2.3 Type and Outline of I/F Unit Communication
Terms
5.2.4 Basic Timing Chart and Features of Signals
“5Bit Bit”, “5Bit Binary” or “10Bit”
“5Bit Bit with L_Dut” or “5Bit Binary with L_Dut”
“5Bit Bit with H_Dut” or “5Bit Binary with H_Dut”
“5Bit Bit 1 Start with L_Dut” or “5Bit Binary 1 Start with L_Dut”
“5Bit Bit 1 Start with H_Dut” or “5Bit Binary 1 Start with H_Dut”
“5Bit Bit with L_Dut & Reset”
“5Bit Bit with H_Dut &Reset”
Signals and Timing of Parameter
5.3 Testing for Signal Level
5.4 Testing for Signal Timing
5.5 RS-232C Interface
5.6 GP-IB Interface
5.6.1 Outline of GP-IB Interface
5.6.2 Signal Assignment
5.6.3 Command Format
5.6.4 Commands
1. Tester →Handler
2. Handler →Tester
Operation Sequence
5.7 Method of Starting the Tester Interface from SPEL 95
5.8 I/F Unit Signal Assignment
5.8.1 I/F Unit Signal Assignment
5.8.2 Signal Assignment in Normal Setting “5bit bit ” (DUT Signal is Unused.)
5.8.3 Signal Assignment in Normal Setting “10bit bit ”
5.9 Tester Calibration
5.9.1 Setup Procedure
Hardware Setting
Setting the Tester Program
The Handler Settings
5.9.2 RS-232C Specifications
The RS ‐232C Commands
Operation Sequence
Chapter 6 Scanner Setup
6.1 The Device ID
6.2 Setting up the Scanner
6.2.1 Turning ON the Scanner Power
6.2.2 Creating the Device File (Scanner)
6.2.3 Editing the “Idcode.def ” File (Handler)
6.2.4 Selecting the Scanner in the Setup File (Handler)
6.2.5 Confirming/Changing the Teaching Point
6.2.6 Editing the Offset Data
Chapter 7 Monitoring the Operation Status of the Handler via Web Access
7.1 Network Connection
7.1.1 Network Configurations
Peer-to-peer Connection
Hub Connection
7.1.2 Assignment of Connector Pins
7.1.3 Configuration of Pins on the Cable
7.1.4 Connection of the Cable
7.2 Setting up the Software
7.3 Web Access
Activating the WWW Server
Deactivating the WWW Server
7.3.1 A Case of Monitoring the Operation Status of the Handler via Internet Explorer
Setting of the IP Addresses
Activating the WWW Browser
7.3.2 Monitoring the Status of Connection
Setup of the WWW Dialog
WWW Dialog
7.3.3 Settings for Monitoring the Status of Connection
Setting up the [Server Configuration] Dialog
Exiting the [Server Configuration] Dialog
Server Configuration Dialog
[Server] Panel
[HTML] Panel
[Logging] Panel
[Status] Panel
[Alerts] Panel
Chapter 8 I/O Map
DU2 I/O INPUT
DU2 I/O OUTPUT
I/O-1 INPUT
I/O-1 OUTPUT
I/O-2 INPUT
I/O-2 OUTPUT
Remote I/O INPUT
Remote I/O OUTPUT
Remote I/O INPUT
Remote I/O OUTPUT
PC INPUT
PC I/O INPUT
INPUT
OUTPUT
Please direct any inquiries about the use of this manual to SEIKO EPSON CORPORATION
NS-6000 series
HIGH SPEED IC HANDLER
User’s Manual
Rev.2.0
EM013A854F
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NS-6000 series HIGH SPEED IC HANDLER
User’s Manual
Rev.2.0
Copyright 1999-2001 SEIKO EPSON CORPORATION. All rights reserved.
i
FOREWORD
The following manuals are attached with NS-6000 series high speed IC handler.
This is the User’s Manual for high speed IC handler NS-6000 series. Please thoroughly read this
and other related manuals before using the equipment.
Chapter 1 describes the safety requirements that user must follow when using the handler.
Read this chapter before doing any operations.
Chapter 2 describes the names and functions of parts of the handler. It also describes the
specification.
Chapter 3 describes how to transfer and install the handler. It also explains the connection to
air, power and Tester.
Chapter 4 describes things to do when the device is changed. The procedure for the following
items is described.
- Replacement of change kit jigs
- Setup Files
- Change of the parameters of “Tray Form”
- Change of the parameters of “Hot Plate Form”
- Adjustment of contact pressure and height for socket unit
- Change of the parameters of “Hand Pitch”
- How to adjust the contact height of the shuttle
- Adjustment of vacuum pressure in each robot hand
- Adjustment of I/F Unit
- Temperature calibration procedure
- Correction of device position
Chapter 5 describes the procedures of the connection to I/F Unit.
Chapter 6 describes the procedures to set up a scanner.
Chapter 7 describes the procedures to monitor the operation status of the handler via Web ac-
cess.
Chapter 8 describes the assignment of I/O.
ii
WARRANTY
The handler and its options are shipped to our customers only after being subjected to the
strictest quality controls, tests and inspections to certify its compliance with our high per-
formance standards.
Products malfunction(s) resulting from normal handling or operation will be repaired free
of charge up to 12 months after delivery.
However, customers will be charged for repairs in the following cases:
1. Damage or malfunction caused by improper use which is not described in the manual,
or careless use.
2. Malfunctions caused by customers’ unauthorized disassembly.
3. Damage due to improper adjustments or unauthorized repair attempts.
4. Damage caused by natural disasters such as earthquake, flood, etc.
Note with caution that Seiko Epson does not guarantee the basic performance characteris-
tics of this handler if it is used in a manner that exceeds the specifications.
Note also that Seiko Epson is not responsible for any injury, damage, or faults that may
occur due to lack of compliance with requirements described in the “Warning” and “Cau-
tion” sections of this manual.
Seiko Epson recognizes that not all conditions that may give rise to safety hazards or op-
erational problems can be foreseen. Accordingly, note that the items described in the
“Warning” and “Caution” sections of this manual are only those items that are within the
company’s limited range of predictability.
No part of this manual may be copied or reproduced without authorization.
The content of this manual is subject to change without notice.
Seiko Epson asks that you please notify us if you should find any errors in this manual
or if you have any comments regarding its content.
NOTICE
TRADEMARKS
Microsoft is a registered trademark and Windows and Windows logo are registered
trademarks of the Microsoft Corporation. Other brand and product names are trademarks
or registered trademarks of the respective holders.
iii
Manual List
1． User’s Manual
This manual is User’s Manual. Please carefully read this manual and understand the
caution points for safety before operating or maintaining the handler.
2． Maintenance Manual
The following items are described in the Maintenance Manual. Please carefully read
the manual before performing maintenance.
- The daily maintenance schedule and points
- The replacement of parts (Motor, Heaters, Thermo Unit Board, Control Unit and
Drive Unit)
- The setting procedures after the replacement
- Maintenance parts list
3． MMI Operation Manual
The windows to input the data necessary for the handler operation are described in
this manual.
MMI Operation Manual describes only about the windows, and the settings of the
data are described in the User’s Manual.
4． Teaching Manual
The procedures of the pose (point) data teaching are described in this manual. (After
replacing the motor or sensor, the position of teaching point may be slipped off.
Therefore, teach the pose (point) data again.)
5． Alarm and Countermeasures
The alarm messages and their countermeasures shown when an alarm such as Jam or
Warning occurs during the handler operation are described in this manual.
6． Wiring Diagrams
The wiring diagrams are drawn in this manual.
iv
TABLE OF CONTENTS
1. Before Operating the Handler
1
1.1 Marks in the Contents ................................................................................2
1.2 For Safety ...................................................................................................3
1.2.1 For Operations ................................................................................3
1.2.2 Safety Functions .............................................................................5
1.2.3 Installation .......................................................................................6
1.2.4 Operating the Handler.....................................................................8
1.2.5 Maintenance....................................................................................9
1.2.6 Others............................................................................................11
1.3 Stickers on the Handler............................................................................12
2. Functions and Specifications
15
2.1 Part Names............................................................................................... 16
2.2 Unit Layout................................................................................................ 19
2.3 Functions and the Outline of Specifications............................................. 20
2.4 Names and Specifications of the Operation Panels ................................ 24
3. Installation
29
3.1 Transportation .......................................................................................... 30
3.2 Moving the Handler .................................................................................. 31
3.3 Connection of the Air Source ................................................................... 32
3.4 Connection to the Tester.......................................................................... 33
3.5 Connection to the Power Supply.............................................................. 34
3.6 Power Supply Connection of Controller and Monitor............................... 36
3.7 Static Electricity ........................................................................................ 37
4. Procedures after Changing Devices
39
4.1 Replacement of the Change Kit Jigs........................................................ 41
4.2 Setup File.................................................................................................. 49
4.3 Editing the Tray Form Settings................................................................. 50
4.4 Editing the Hot Plate Form Settings......................................................... 51
4.5 Socket Contact Pressure and Contact Level Position............................. 52
4.6 Changing the Hand Pitches ..................................................................... 64
4.7 Device Pickup/Release Level Position (Height) ...................................... 66
4.8 Vacuum Check Wait Time and Counter-Air-On Time ............................. 70
v
TABLE OF CONTENTS
4.9 I/F Unit ...................................................................................................... 74
4.10 Temperature Calibration Procedures .................................................... 75
4.11 Adjusting the Device Unloading Position............................................... 84
4.11.1 The Procedures for Adjusting the Device Unloading Position... 84
4.11.2 Pausing the Handler ................................................................... 85
4.11.3 Basic Data Settings .................................................................... 85
A: Release & Drop Positions of the Device on the Loading Side............ 91
B: Release & Drop Positions of the Device on the Unloading Side ...... 108
C: Pickup/Release Level Position of the Device (Height)...................... 114
Saving the Z Offset Data Settings.......................................................... 120
5. Tester Interface
121
5.1 IFUNT100............................................................................................... 122
5.2 Digital I/O Interface................................................................................. 123
5.3 Testing for Signal Level.......................................................................... 136
5.4 Testing for Signal Timing ....................................................................... 138
5.5 RS-232C Interface ................................................................................. 140
5.6 GP-IB Interface....................................................................................... 142
5.7 Method of Starting the Tester Interface from SPEL 95 ......................... 147
5.8 I/F Unit Signal Assignment..................................................................... 148
5.9 Tester Calibration................................................................................... 151
5.9.1 Setup Procedure......................................................................... 151
5.9.2 RS-232C Specifications.............................................................. 154
157
6.1 The Device ID......................................................................................... 158
6.2 Setting up the Scanner........................................................................... 158
6.2.1 Turning ON the Scanner Power ................................................. 158
6.2.2 Creating the Device File (Scanner) ............................................ 158
6.2.3 Editing the “Idcode.def” File (Handler) ....................................... 158
6.2.4 Selecting the Scanner in the Setup File (Handler)..................... 159
6.2.5 Confirming/Changing the Teaching Point .................................. 160
6.2.6 Editing the Offset Data................................................................ 162
6. Scanner Setup
7. Monitoring the Operation Status of the Handler via Web Access
163
7.1 Network Connection............................................................................... 164
7.1.1 Network Configurations .............................................................. 164
vi
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