Rockchip RK1808 Datasheet V1.2 20190527.pdf

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Table of Content

Figure Index

Table Index

NOTICE

Chapter 1 Introduction

1.1 Overview

1.2 Features

1.2.1 Microprocessor

1.2.2 Neural Process Unit

1.2.3 On Chip Memory

1.2.4 External Memory or Storage device

1.2.5 System Component

1.2.6 Video CODEC

1.2.7 JPEG CODEC

1.2.8 Graphic Engine

1.2.9 Video input interface

1.2.10 Display interface

1.2.11 Video Output Processor LITE(VOP_LITE)

1.2.12 Video Output Processor RAW(VOP_RAW)

1.2.13 Audio Interface

1.2.14 Connectivity

1.2.15 Others

1.3 Block Diagram

Chapter 2 Package Information

2.1 Order Information

2.2 Top Marking

2.3 FCCSP 420L Dimension

2.4 Ball Map

2.5 Pin Number List

2.6 Power/Ground IO Description

2.7 Function IO Description

2.8 IO Pin Name Description

Chapter 3 Electrical Specification

3.1 Absolute Ratings

3.2 Recommended Operating Condition

3.3 DC Characteristics

3.4 Electrical Characteristics for General IO

3.5 Electrical Characteristics for PLL

3.6 Electrical Characteristics for USB 2.0 Interface

3.7 Electrical Characteristics for DDR IO

3.8 Electrical Characteristics for TSADC

3.9 Electrical Characteristics for SARADC

3.10 Electrical Characteristics for MIPI DPHY TX

3.11 Electrical Characteristics for MIPI DPHY RX

3.12 Electrical Characteristics for PCIe

Chapter 4 Thermal Management

4.1 Overview

4.2 Package Thermal Characteristics

RK1808 Datasheet Rev 1.2 Date Revision Revision History Description 2019-5-27 1.2 Update 2019-3-1 1.1 Update DDR3 capacity from 2GB to 4GB Update package thickness 2018-11-8 1.0 Initial released Copyright 2019 ©Fuzhou Rockchip Electronics Co., Ltd. 2

RK1808 Datasheet Rev 1.2 Table of Content Table of Content ...................................................................................................... 3 Figure Index ........................................................................................................... 4 Table Index ............................................................................................................. 5 NOTICE .................................................................................................................. 6 Chapter 1 Introduction ..................................................................................... 7 1.1 Overview ............................................................................................... 7 1.2 Features ................................................................................................ 7 1.3 Block Diagram ...................................................................................... 15 Chapter 2 Package Information......................................................................... 16 2.1 Order Information ................................................................................. 16 2.2 Top Marking ......................................................................................... 16 2.3 FCCSP 420L Dimension .......................................................................... 16 2.4 Ball Map .............................................................................................. 18 2.5 Pin Number List .................................................................................... 19 2.6 Power/Ground IO Description .................................................................. 23 2.7 Function IO Description .......................................................................... 25 2.8 IO Pin Name Description ........................................................................ 32 Chapter 3 Electrical Specification ...................................................................... 37 3.1 Absolute Ratings ................................................................................... 37 3.2 Recommended Operating Condition ......................................................... 37 3.3 DC Characteristics ................................................................................. 38 3.4 Electrical Characteristics for General IO .................................................... 38 3.5 Electrical Characteristics for PLL .............................................................. 39 3.6 Electrical Characteristics for USB 2.0 Interface .......................................... 39 3.7 Electrical Characteristics for DDR IO......................................................... 40 3.8 Electrical Characteristics for TSADC.......................................................... 40 3.9 Electrical Characteristics for SARADC ....................................................... 40 3.10 Electrical Characteristics for MIPI DPHY TX .............................................. 41 3.11 Electrical Characteristics for MIPI DPHY RX .............................................. 41 3.12 Electrical Characteristics for PCIe ........................................................... 42 Chapter 4 Thermal Management ....................................................................... 45 4.1 Overview ............................................................................................. 45 4.2 Package Thermal Characteristics ............................................................. 45 Copyright 2019 ©Fuzhou Rockchip Electronics Co., Ltd. 3

RK1808 Datasheet Rev 1.2 Figure Index Fig.1-1 Block Diagram .............................................................................................. 15 Fig.2-1 Package definition .................................................................................... 16 Fig.2-2 Package Top And Side View ....................................................................... 16 Fig.2-3 Package Bottom View ............................................................................... 17 Fig.2-4 Ball Map ................................................................................................. 18 Copyright 2019 ©Fuzhou Rockchip Electronics Co., Ltd. 4

RK1808 Datasheet Rev 1.2 Table Index Table 2-1 Pin Number Order Information .................................................................. 19 Table 2-2 Power/Ground IO information ................................................................... 23 Table 2-3 Function IO description ............................................................................ 25 Table 2-4 IO function description list ....................................................................... 32 Table 3-1 Absolute ratings...................................................................................... 37 Table 3-2 Recommended operating condition ............................................................ 37 Table 3-3 DC Characteristics ................................................................................... 38 Table 3-4 Electrical Characteristics for Digital General IO ............................................ 38 Table 3-5 Electrical Characteristics for PLL ................................................................ 39 Table 3-6 Electrical Characteristics for USB 2.0 Interface ............................................ 39 Table 3-7 Electrical Characteristics for DDR IO .......................................................... 40 Table 3-8 Electrical Characteristics for TSADC ........................................................... 40 Table 3-9 Electrical Characteristics for SARADC ......................................................... 40 Table 3-10 Electrical Characteristics for MIPI DPHY TX ................................................ 41 Table 3-11 Electrical Characteristics for MIPI DPHY RX ............................................... 42 Table 3-12 Electrical Characteristics for PCIe Transmitter ............................................ 42 Table 3-13 Electrical Characteristics for PCIe Receiver ................................................ 43 Table 3-14 External Reference Clock Specification for PCIe ......................................... 43 Table 4-1 Thermal Resistance Characteristics ............................................................ 45 Copyright 2019 ©Fuzhou Rockchip Electronics Co., Ltd. 5

RK1808 Datasheet Rev 1.2 NOTICE Copyright © 2019, Fuzhou Rockchip Electronics Co., Ltd. All rights reserved. 1. By using this document, you hereby unequivocally acknowledge that you have read and agreed to be bound by the contents of this notice. 2. Fuzhou Rockchip Electronics Co., Ltd. (“Rockchip”) may make changes to any information in this document at any time without any prior notice. The information herein is subject to change without notice. Do not finalize a design with this information. 3. Information in this document is provided in connection with Rockchip products. 4. THIS DOCUMENT IS PROVIDED “AS IS” WITHOUT ANY WARRANTY OR CONDITION OF ANY KIND, EITHER EXPRESS, IMPLIED OR STATUTORY, INCLUDING, WITHOUT LIMITATION, ANY WARRANTY OR CONDITION WITH RESPECT TO MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, OR NON-INFRINGEMENT.ROCKCHIP DOES NOT ASSUME ANY RESPONSIBILITY AND LIABILITY FOR ITS USE NOR FOR ANY INFRINGEMENT OF PATENTS OR OTHER RIGHTS OF THE THIRD PARTIES WHICH MAY RESULT FROM ITS USE. 5. Rockchip products described in this document are not designed, intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility application. 6. Rockchip and Rockchip logo are trademarks or registered trademarks of Rockchip in China and other countries. All referenced brands, product names, service names and trademarks in this document are the property by their respective owners. Copyright 2019 ©Fuzhou Rockchip Electronics Co., Ltd. 6

RK1808 Datasheet Rev 1.2 Chapter 1 Introduction 1.1 Overview RK1808 is a high-performance, low power processor for neural network inference. Especially, it is one of current leading solution for mobile device by providing complementary neural network hardware accelerator. Equipped with one powerful neural network process unit(NPU), it makes RK1808 easy programming and compatible with mainstream platforms in the market, such as caffe, tensor flow, and so on. 1.2 Features The features listed below which may or may not be present in actual product, may be subject to the third party licensing requirements. Please contact Rockchip for actual product feature configurations and licensing requirements. 1.2.1 Microprocessor  Dual-core ARM Cortex-A35 CPU  ARM Neon Advanced SIMD (single instruction, multiple data) support for accelerated media and signal processing computation Include VFP v4 hardware to support single and double-precision operations   128KB unified system L2 cache   One isolated voltage domain include  Separate power domains for CPU core system to support internal power switch Integrated 32KB L1 instruction cache, 32KB L1 data cache with 4-way set associative  PD_CPU0: 1st Cortex-A35 + Neon + FPU + L1 I/D Cache  PD_CPU1: 2nd Cortex-A35 + Neon + FPU + L1 I/D Cache  One isolated voltage domain includes Dual Core CPU, L2 cache and other logics to support DVFS and can externally turn on/off based on different application scenario. 1.2.2 Neural Process Unit  Support max1920 Int8 MAC operations per cycle  Support max 64 FP16 MAC operations per cycle  Support max192 Int16 MAC operations per cycle  512KB internal buffer  One isolated voltage domain to support DVFS 1.2.3 On Chip Memory  Internal BootRom  Used for storing boot code and support system boot from the following interface:  SFC interface The Serial Flash Controller (SFC) is used to control the data transfer between the SoC system and the serial NOR/NAND flash device.  eMMC interface  SDMMC interface  SYSTEM_SRAM  Size: 2MB  PMU_SRAM  Size: 8KB 1.2.4 External Memory or Storage device  Dynamic Memory Interface (DDR3/DDR3L/LPDDR2/LPDDR3/DDR4)①  Compatible with JEDEC standards  Compatible with DDR3-1600/DDR3L-1600/ LPDDR2-1066 /LPDDR3-1600/DDR4- 2133 Copyright 2019 ©Fuzhou Rockchip Electronics Co., Ltd. 7

RK1808 Datasheet Rev 1.2  Support 32-bit data width, 2 ranks (chip selects), max 4GB addressing space per rank, total addressing space is 4GB(max)  eMMC interface  Compatible with eMMC specification 4.41, 4.51  Support data bus width: 1-bit, 4-bit or 8-bit  Support up to max 150MB/s data transfer rates  SD/MMC interface  Compatible with SD3.0, MMC ver4.51  Data bus width is 4bits  Serial FLASH interface  Support x1,x2,x4 data bits mode  Support 1 chip select 1.2.5 System Component  CRU (clock & reset unit)  One oscillator with 24MHz clock input  Provide clock gating control for individual components  Support global soft-reset control for whole chip, also individual soft-reset for each component.  PMU(Power Management Unit)  Manage on operating on 4 separate voltage domains for the digital logic circuit: VD_CORE/VD_LOGIC/VD_NPU/VD_PMU  Provide powering up/down function for 7 power domains, which are included in the 4 voltage domains independently, to save power.  PD_CPU0 and PD_CPU1 in VD_CORE  PD_VIO, PD_PCIe, PD_VPU and PD_DDR in VD_LOGIC  Timer  Support 6 64-bit timers for non-secure application  Support 2 64-bit timers for secure application  Support two operation modes: free-running and user-defined count  PWM  Support 11 on-chip PWMs(PWM0~PWM3,PWM5~PWM11)  Embedded 32-bit timer/counter facility  Support capture mode  Support continuous mode or one-shot mode  Optimized for IR receiving application for PWM3, PWM7 and PWM11  Watchdog  One Watchdog for non-secure application  One Watchdog for secure application  32-bit watchdog counter  Counter counts down from a preset value to 0 to indicate the occurrence of a timeout  WDT can perform two types of operations when timeout occurs:  Generate a system reset  First generate an interrupt and if this is not cleared by the service routine by the time a second timeout occurs then generate a system reset  Totally 16 defined-ranges of main timeout period  Interrupt Controller  Support 256 SPI (Shared Peripheral Interrupts) interrupt sources input from different components  Support 16 software-triggered interrupts  Two interrupt outputs (nFIQ and nIRQ) separately for each Cortex-A35, both are low-level sensitive Copyright 2019 ©Fuzhou Rockchip Electronics Co., Ltd. 8

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