Rockchip RK3568 Datasheet V1.0-20201210.pdf

发布时间：2022-05-30 发布人：admin 分类：说明书资料大小：5.87M 资料格式：pdf 举报版权申诉

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Table of Content

Figure Index

Table Index

Warranty Disclaimer

Chapter 1 Introduction

1.1 Overview

1.2 Features

1.2.1 Microprocessor

1.2.2 Neural Process Unit

1.2.3 Memory Organization

1.2.4 Internal Memory

1.2.5 External Memory or Storage device

1.2.6 System Component

1.2.7 Video CODEC

1.2.8 JPEG CODEC

1.2.9 Image Enhancement (IEP module)

1.2.10 Graphics Engine

1.2.11 Video input interface

1.2.12 Display interface

1.2.13 Video Output Processor

1.2.14 Audio Interface

1.2.15 Connectivity

1.2.16 Others

1.3 Block Diagram

Chapter 2 Package Information

2.1 Order Information

2.2 Top Marking

2.3 FCBGA636L Dimension

2.4 Ball Map

2.5 Pin Number List

2.6 Power/Ground IO Description

2.7 Function IO Description

2.8 IO Pin Name Description

Chapter 3 Electrical Specification

3.1 Absolute Ratings

3.2 Recommended Operating Condition

3.3 DC Characteristics

3.4 Electrical Characteristics for General IO

3.5 Electrical Characteristics for PLL

3.6 Electrical Characteristics for USB 2.0 Interface

3.7 Electrical Characteristics for DDR IO

3.8 Electrical Characteristics for TSADC

3.9 Electrical Characteristics for MIPI DSI

3.10 Electrical Characteristics for MIPI CSI

3.11 Electrical Characteristics for HDMI

3.12 Electrical Characteristics for multi-PHY

Chapter 4 Thermal Management

4.1 Overview

4.2 Package Thermal Characteristics

RK3568 Datasheet Rev 1.0 Table of Content Table of Content ...................................................................................................... 3 Figure Index ........................................................................................................... 4 Table Index ............................................................................................................. 5 Warranty Disclaimer ................................................................................................. 6 Chapter 1 Introduction ..................................................................................... 7 1.1 Overview ............................................................................................... 7 1.2 Features ................................................................................................ 7 1.3 Block Diagram ...................................................................................... 19 Chapter 2 Package Information......................................................................... 20 2.1 Order Information ................................................................................. 20 2.2 Top Marking ......................................................................................... 20 2.3 FCBGA636L Dimension ........................................................................... 20 2.4 Ball Map .............................................................................................. 23 2.5 Pin Number List .................................................................................... 23 2.6 Power/Ground IO Description .................................................................. 30 2.7 Function IO Description .......................................................................... 33 2.8 IO Pin Name Description ........................................................................ 42 Chapter 3 Electrical Specification ...................................................................... 54 3.1 Absolute Ratings ................................................................................... 54 3.2 Recommended Operating Condition ......................................................... 55 3.3 DC Characteristics ................................................................................. 56 3.4 Electrical Characteristics for General IO .................................................... 57 3.5 Electrical Characteristics for PLL .............................................................. 58 3.6 Electrical Characteristics for USB 2.0 Interface .......................................... 58 3.7 Electrical Characteristics for DDR IO......................................................... 59 3.8 Electrical Characteristics for TSADC.......................................................... 60 3.9 Electrical Characteristics for MIPI DSI ....................................................... 60 3.10 Electrical Characteristics for MIPI CSI ..................................................... 60 3.11 Electrical Characteristics for HDMI .......................................................... 60 3.12 Electrical Characteristics for multi-PHY .................................................... 61 Chapter 4 Thermal Management ....................................................................... 62 4.1 Overview ............................................................................................. 62 4.2 Package Thermal Characteristics ............................................................. 62 Copyright 2020 © Rockchip Electronics Co., Ltd. 3

RK3568 Datasheet Rev 1.0 Figure Index Fig.1-1 Block Diagram ....................................................................................... 19 Fig.2-1 Package definition .................................................................................. 20 Fig.2-2 Package Top View .................................................................................. 20 Fig.2-3 Package bottom view .............................................................................. 21 Fig.2-4 Package side view .................................................................................. 21 Fig.2-5 Package dimension ................................................................................. 22 Fig.2-6 Ball Map ............................................................................................... 23 Copyright 2020 © Rockchip Electronics Co., Ltd. 4

RK3568 Datasheet Rev 1.0 Table Index Table 2-1 Pin Number List Information ................................................................... 23 Table 2-2 Power/Ground IO information ................................................................. 30 Table 2-3 Function IO description .......................................................................... 33 Table 2-4 IO function description list ..................................................................... 42 Table 3-1 Absolute ratings.................................................................................... 54 Table 3-2 Recommended operating condition .......................................................... 55 Table 3-3 DC Characteristics ................................................................................. 56 Table 3-4 Electrical Characteristics for Digital General IO .......................................... 57 Table 3-5 Electrical Characteristics for Frac PLL ....................................................... 58 Table 3-6 Electrical Characteristics for Int-PLL ......................................................... 58 Table 3-7 Electrical Characteristics for USB 2.0 Interface .......................................... 58 Table 3-8 Electrical Characteristics for DDR IO ........................................................ 59 Table 3-9 Electrical Characteristics for TSADC ......................................................... 60 Table 3-10 Electrical Characteristics for MIPI DSI .................................................... 60 Table 3-11 Electrical Characteristics for MIPI CSI ..................................................... 60 Table 3-12 Electrical Characteristics for HDMI ......................................................... 60 Table 3-13 Electrical Characteristics for PCIe PHY .................................................... 61 Table 4-1 Thermal Resistance Characteristics .......................................................... 62 Copyright 2020 © Rockchip Electronics Co., Ltd. 5

RK3568 Datasheet Rev 1.0 Warranty Disclaimer Rockchip Electronics Co., Ltd makes no warranty, representation or guarantee (expressed, implied, statutory, or otherwise) by or with respect to anything in this document, and shall not be liable for any implied warranties of non-infringement, merchantability or fitness for a particular purpose or for any indirect, special or consequential damages. Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co., Ltd assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. Rockchip Electronics Co., Ltd’s products are not designed, intended, or authorized for using as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Rockchip Electronics Co., Ltd’s product could create a situation where personal injury or death may occur, should buyer purchase or use Rockchip Electronics Co., Ltd’s products for any such unintended or unauthorized application, buyers shall indemnify and hold Rockchip Electronics Co., Ltd and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees arising out of, either directly or indirectly, any claim of personal injury or death that may be associated with such unintended or unauthorized use, even if such claim alleges that Rockchip Electronics Co., Ltd was negligent regarding the design or manufacture of the part. Copyright and Patent Right Information in this document is provided solely to enable system and software implementers to use Rockchip Electronics Co., Ltd ’s products. There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Rockchip Electronics Co., Ltd does not convey any license under its patent rights nor the rights of others. All copyright and patent rights referenced in this document belong to their respective owners and shall be subject to corresponding copyright and patent licensing requirements. Trademarks Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltd’s products are trademarks of Rockchip Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to other companies and their products use trademarks owned by the respective companies and are for reference purpose only. Confidentiality The information contained herein (including any attachments) is confidential. The recipient hereby acknowledges the confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party. Reverse engineering or disassembly is prohibited. ROCKCHIP ELECTRONICS CO.,LTD. RESERVES THE RIGHT TO MAKE CHANGES IN ITS PRODUCTS OR PRODUCT SPECIFICATIONS WITH THE INTENT TO IMPROVE FUNCTION OR DESIGN AT ANY TIME AND WITHOUT NOTICE AND IS NOT REQUIRED TO UNDATE THIS DOCUMENTATION TO REFLECT SUCH CHANGES. Copyright © 2020 Rockchip Electronics Co., Ltd. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Rockchip Electronics Co., Ltd. Copyright 2020 © Rockchip Electronics Co., Ltd. 6

RK3568 Datasheet Rev 1.0 Chapter 1 Introduction 1.1 Overview RK3568 is a high-performance and low power quad-core application processor designed for personal mobile internet device and AIoT equipments. Many embedded powerful hardware engines are provided to optimize performance for high- end application. RK3568 supports almost full-format H.264 decoder by 4K@60fps, H.265 decoder by 4K@60fps, also support H.264/H.265 encoder by 1080p@60fps, high-quality JPEG encoder/decoder. Embedded 3D GPU makes RK3568 completely compatible with OpenGL ES 1.1/2.0/3.2, OpenCL 2.0 and Vulkan 1.1. Special 2D hardware engine will maximize display performance and provide very smoothly operation. The build-in NPU supports INT8/INT16 hybrid operation. In addition, with its strong compatibility, network models based on a series of frameworks such as TensorFlow/MXNet/PyTorch/Caffe can be easily converted. RK3568 has high-performance external memory interface(DDR3/DDR3L/DDR4 /LPDDR3/LPDDR4/LPDDR4X) capable of sustaining demanding memory bandwidths. 1.2 Features The features listed below which may or may not be present in actual product, may be subject to the third party licensing requirements. Please contact Rockchip for actual product feature configurations and licensing requirements. 1.2.1 Microprocessor  Quad-core ARM Cortex-A55 CPU  ARM Neon Advanced SIMD (single instruction, multiple data) support for accelerated media and signal processing computation Include VFP hardware to support single and double-precision operations Integrated 32KB L1 instruction cache, 32KB L1 data cache with ECC   ARMv8 Cryptography Extensions   512KB unified system L3 cache with ECC  TrustZone technology support  Separate power domains for CPU core system to support internal power switch and externally turn on/off based on different application scenario  PD_A55_0: 1st Cortex-A55 + Neon + FPU + L1 I/D Cache  PD_A55_1: 2nd Cortex-A55 + Neon + FPU + L1 I/D Cache  PD_A55_2: 3rd Cortex-A55 + Neon + FPU + L1 I/D Cache  PD_A55_3: 4th Cortex-A55 + Neon + FPU + L1 I/D Cache  One isolated voltage domain 1.2.2 Neural Process Unit  Neural network acceleration engine with processing performance up to 0.8 TOPS  Support integer 8, integer 16 convolution operation  Support deep-learning frameworks: TensorFlow, TF-lite, Pytorch, Caffe, ONNX, MXNet, Keras, Darknet  One isolated voltage domain 1.2.3 Memory Organization  Internal on-chip memory  BootROM  SYSTEM_SRAM in the voltage domain of VD_LOGIC  PMU_SRAM in the voltage domain of VD_PMU for low power application Copyright 2020 © Rockchip Electronics Co., Ltd. 7

RK3568 Datasheet Rev 1.0  External off-chip memory  DDR3/DDR3L/DDR4/LPDDR3/LPDDR4/LPDDR4X①  SPI Nor/Nand Flash  eMMC  SD_Card  8bits Async Nand Flash  8bits toggle Nand Flash  8bits ONFI Nand Flash 1.2.4 Internal Memory  Internal BootRom  Support system boot from the following device:  SPI Flash interface  Nand Flash  eMMC interface  SDMMC interface  Support system code download by the following interface:  USB OTG interface (Device mode)  SYSTEM_SRAM  Size: 64KB  PMU_SRAM  Size: 8KB 1.2.5 External Memory or Storage device  Dynamic Memory Interface (DDR3/DDR3L/DDR4/LPDDR2/LPDDR3/LPDDR4/LPDDR4X)  Compatible with JEDEC standards  Compatible with DDR3-2133/DDR3L-2133/LPDDR3-2133/DDR4-3200/LPDDR4- 3200/LPDDR4X-3200  Support 32bits data width, 2 ranks (chip selects), total addressing space is 8GB(max) for DDR3/DDR3L/DDR4  Support 32bits data width, 4 ranks (chip selects), total addressing space is 8GB(max) for LPDDR3/LPDDR4/LPDDR4X  Low power modes, such as power-down and self-refresh for SDRAM  Compensation for board delays and variable latencies through programmable pipelines  Support 8bits ECC for DDR3/DDR3L/DDR4  Programmable output and ODT impedance with dynamic PVT compensation  eMMC Interface  Compatible with standard iNAND interface  Compatible with eMMC specification 4.41, 4.51, 5.0 and 5.1  Support three data bus width: 1bit, 4bits or 8bits  Support HS200;  Support CMD Queue  SD/MMC Interface  Compatible with SD3.0, MMC ver4.51  Data bus width is 4bits  Nand Flash Interface  Support async nand flash, each channel 8bits, up to 4 banks  Support ONFI Synchronous Flash Interface, each channel 8bits, up to 4 banks  Support Toggle Flash Interface, each channel 8bits, up to 4 banks  Support sync DDR nand flash, each channel 8bits, up to 4 banks Copyright 2020 © Rockchip Electronics Co., Ltd. 8

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