imx255 规格书.pdf

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Description

Features

Device Structure

Absolute Maximum Ratings

Recommended Operating Conditions

USE RESTRICTION NOTICE

Chip Center and Optical Center

Pixel Arrangement

Block Diagram and Pin Configuration

Pin Description

Electrical Characteristics

DC Characteristics

Power Consumption

AC Characteristics

Master Clock (INCK) Waveform Diagram

XVS / XHS Input Characteristics in Slave Mode (XMASTER = High)

XTRIG Input Characteristics in Slave Mode (XMASTER = High) only

Serial Communication

DLCKPy / DLCKMy, DLOPxy / DLOMxy

I/O Equivalent Circuit Diagram

Spectral Sensitivity Characteristics

Image Sensor Characteristics

Zone Definition of Video Signal Shading

Image Sensor Characteristics Measurement Method

Measurement Conditions

Definition of standard imaging conditions

Measurement Method

Setting Registers Using Serial Communication

Description of Setting Registers (4-wire)

Description of Setting Registers (I2C)

I2C Communication Protocol

I2C Serial Communication Read/Write Operation

Single Read from Random Location

Single Read from Current Location

Sequential Read Starting from Random Location

Sequential Read Starting from Current Location

Chip ID = 02 (Write: Chip ID = 02h, Read: Chip ID = 82h, I2C: 30**h)

Chip ID = 03 (Write: Chip ID = 03h, Read: Chip ID = 83h, I2C: 31**h)

Chip ID = 04 (Write: Chip ID = 04h, Read: Chip ID = 84h, I2C: 32**h)

Chip ID = 05 (Write: Chip ID = 05h, Read: Chip ID = 85h, I2C: 33**h)

Chip ID = 06 (Write: Chip ID = 06h, Read: Chip ID = 86h, I2C: 34**h)

Chip ID = 07 (Write: Chip ID = 07h, Read: Chip ID = 87h, I2C: 35**h)

Chip ID = 08 (Write: Chip ID = 08h, Read: Chip ID = 88h, I2C: 36**h)

Chip ID = 09 (Write: Chip ID = 09h, Read: Chip ID = 89h, I2C: 37**h)

Chip ID = 0A (Write: Chip ID = 0Ah, Read: Chip ID = 8Ah, I2C: 38**h)

Chip ID = 0B (Write: Chip ID = 0Bh, Read: Chip ID = 8Bh, I2C: 39**h)

Chip ID = 0C (Write: Chip ID = 0Ch, Read: Chip ID = 8Ch, I2C: 3A**h)

Chip ID = 0D (Write: Chip ID = 0Dh, Read: Chip ID = 8Dh, I2C: 3B**h)

Chip ID = 0E (Write: Chip ID = 0Eh, Read: Chip ID = 8Eh, I2C: 3C**h)

Chip ID = 0F (Write: Chip ID = 0Fh, Read: Chip ID = 8Fh, I2C: 3D**h)

Chip ID = 10 (Write: Chip ID = 10h, Read: Chip ID = 90h, I2C: 3E**h)

Chip ID = 11 (Write: Chip ID = 11h, Read: Chip ID = 91h, I2C: 3F**h)

Chip ID = 12 (Write: Chip ID = 12h, Read: Chip ID = 92h, I2C: 40**h)

Readout Drive Modes

Sync code

List of Sync Code

Sync Code Output Timing

Image Data Output Format

All-pixel scan

ROI mode

ROI Overlap mode

Vertical / Horizontal 1/2 Subsampling mode

Vertical 2-pixel FD Binning mode

2x2 Vertical FD binning mode

Description of Various Function

Standby mode

Slave Mode and Master Mode

Gain Adjustment Function

Black Level Adjustment Function

Horizontal / Vertical Normal Operation and Inverted Operation

Shutter and Integration Time Settings

Global Shutter (Normal Mode) Operation

Global Shutter (Sequential Trigger Mode) Operation

Global Shutter (Fast Trigger Mode) Operation

Mode Transitions of Global Shutter Operation

Pulse Output Function

Signal Output

Output Pin Settings

Output Pin Bit Width Selection

Output Signal Range

Mode Transition

Other Function

Power-on and Power-off Sequence

Power-on sequence

Power-off Sequence

Sensor Setting Flow

Setting Flow in Sensor Slave Mode

Sensor Flow in Sensor Master Mode

Peripheral Circuit

Analog Power Pins

Digital Power Pins

Analog Other Pins

Digital I/O Pins

Output pins

Spot Pixel Specifications

Sport Pixel Zone Definition

Notice on White Pixels Specifications

Measurement Method for Spot Pixels

Spot Pixel Pattern Specification

Marking

Notes On Handling

Package Outline

List of Trademark Logos and Definition Statements

Revision History

Diagonal 16.1 mm (Type 1) CMOS solid-state Image Sensor with Square Pixel for Monochrome Cameras Preliminary Description IMX255LLR-C The IMX255LLR-C is a diagonal 16.1mm (Type 1) CMOS active pixel type solid-state image sensor with a square pixel array and 8.95 M effective pixels. This chip features a global shutter with variable charge-integration time. This chip operates with analog 3.3 V, digital 1.2 V, and interface 1.8 V triple power supply, and has low power consumption. High sensitivity, low dark current and low PLS characteristics are achieved. (Applications: FA cameras, ITS cameras) Features ◆ CMOS active pixel type dots ◆ Built-in timing adjustment circuit, H/V driver and serial communication circuit ◆ Global shutter function ◆ Input frequency 37.125 MHz / 74.25 MHz / 54 MHz ◆ Number of recommended recording pixels: 4096 (H) × 2160 (V) approx. 8.85 M pixels Readout mode All-pixel scan mode Vertical / Horizontal 1 / 2 Subsampling mode Vertical 2-pixel FD Binning mode 2x2 Vertical FD binning mode ROI mode Vertical / Horizontal‐Normal / Inverted readout mode ◆ Readout rate Maximum frame rate in All-pixel scan mode: 8 bit 93.7 frame/s, 10 bit: 88.7 frame/s, 12 bit: 63.7 frame/s ◆ Variable-speed shutter function (resolution 1 H units) ◆ 8-bit / 10-bit / 12-bit A/D converter ◆ CDS / PGA function 0 dB to 24 dB: Analog Gain (0.1 dB step) 24.1 dB to 48 dB: Analog Gain: 24 dB + Digital Gain: 0.1 dB to 24 dB (0.1 dB step) ◆ I/O interface Low voltage LVDS (150 mVp-p) serial (4 ch / 8 ch / 16 ch switching) DDR output ◆ Recommended lens F number: 2.8 or more (Close side) ◆ Recommended exit pupil distance: –100 mm to –∞ *There is a possible to change the registers on this document. 1 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

Device Structure ◆ CMOS image sensor ◆ Image size IMX255LLR-C Diagonal 16.1 mm (Type 1) Approx. 8.95 M pixels All-pixel ◆ Total number of pixels 4112 (H) × 2186 (V) ◆ Number of effective pixels Approx. 8.99 M pixels 4112 (H) × 2176 (V) Approx. 8.95 M pixels ◆ Number of active pixels 4112 (H) × 2176 (V) Approx. 8.95 M pixels ◆ Number of recommended recording pixels 4096 (H) × 2160 (V) Approx. 8.85 M pixels All-pixel ◆ Unit cell size 3.45 µm (H) × 3.45 µm (V) ◆ Optical black Horizontal (H) direction: Front 0 pixels, rear 0 pixels Vertical (V) direction: Front 10 pixels, rear 0 pixels ◆ Substrate material Silicon 2

Absolute Maximum Ratings IMX255LLR-C Item Symbol Rating Unit Remarks Not exceed 3.3 V Not exceed 3.3 V Max. 3.45 1.90 1.30 Unit V V V Supply voltage (Analog 3.3 V) AVDD –0.3 Supply voltage (Interface 1.8 V) OVDD –0.3 Supply voltage (Digital 1.2 V) DVDD –0.3 to to to +4.0 +3.3 +2.0 Input voltage Output voltage Operating temperature Storage temperature VI VO Topr Tstg Performance guarantee temperature Tspec Recommended Operating Conditions –0.3 to OVDD +0.3 –0.3 to OVDD +0.3 -30 -40 -10 to to to +75 +85 +60 V V V V V ˚C ˚C ˚C Item Supply voltage (Analog 3.3 V) Supply voltage (Interface 1.8 V) Supply voltage (Digital 1.2 V) Symbol AVDD OVDD DVDD Min. 3.15 1.70 1.10 Typ. 3.30 1.80 1.20 3

USE RESTRICTION NOTICE IMX255LLR-C 4 This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the image sensor products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may, at any time, modify this Notice which will be available to you in the latest specifications book for the Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or distributor of Sony on such a use restriction notice when you consider using the Products. Use Restrictions  The Products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by Sony from time to time.  You should not use the Products for critical applications which may pose a life- or injury-threatening risk or are highly likely to cause significant property damage in the event of failure of the Products. You should consult your sales representative beforehand when you consider using the Products for such critical applications. In addition, you should not use the Products in weapon or military equipment.  Sony disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the Products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. Design for Safety  Sony is making continuous efforts to further improve the quality and reliability of the Products; however, failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social damage as a result of such failure. Export Control  If the Products are controlled items under the export control laws or regulations of various countries, approval may be required for the export of the Products under the said laws or regulations. You should be responsible for compliance with the said laws or regulations. No License Implied  The technical information shown in this specifications book is for your reference purposes only. The availability of this specifications book shall not be construed as giving any indication that Sony and its licensors will license any intellectual property rights in such information by any implication or otherwise. Sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third-party rights due to the same. It is therefore your sole legal and financial responsibility to resolve any such problems and infringement. Governing Law  This Notice shall be governed by and construed in accordance with the laws of Japan, without reference to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the court of first instance. Other Applicable Terms and Conditions  The terms and conditions in the Sony additional specifications, which will be made available to you when you order the Products, shall also be applicable to your use of the Products as well as to this specifications book. You should review those terms and conditions when you consider purchasing and/or using the Products. General-0.0.8

CONTENTS IMX255LLR-C Description ......................................................................................................................................................................1 Features ..........................................................................................................................................................................1 Device Structure ..............................................................................................................................................................2 Absolute Maximum Ratings ..............................................................................................................................................3 Recommended Operating Conditions ...............................................................................................................................3 USE RESTRICTION NOTICE ..........................................................................................................................................4 Chip Center and Optical Center ........................................................................................................................................7 Pixel Arrangement ...........................................................................................................................................................8 Block Diagram and Pin Configuration ...............................................................................................................................9 Pin Description .............................................................................................................................................................. 11 Electrical Characteristics ................................................................................................................................................ 15 DC Characteristics ..................................................................................................................................................... 15 Power Consumption ................................................................................................................................................... 15 AC Characteristics...................................................................................................................................................... 16 Master Clock (INCK) Waveform Diagram ................................................................................................................. 16 XVS / XHS Input Characteristics in Slave Mode (XMASTER = High) ......................................................................... 17 XTRIG Input Characteristics in Slave Mode (XMASTER = High) only ........................................................................ 17 Serial Communication ............................................................................................................................................. 18 DLCKPy / DLCKMy, DLOPxy / DLOMxy .................................................................................................................. 20 I/O Equivalent Circuit Diagram ....................................................................................................................................... 21 Spectral Sensitivity Characteristics ................................................................................................................................. 22 Image Sensor Characteristics ........................................................................................................................................ 23 Zone Definition of Video Signal Shading...................................................................................................................... 23 Image Sensor Characteristics Measurement Method ...................................................................................................... 24 Measurement Conditions ............................................................................................................................................ 24 Definition of standard imaging conditions .................................................................................................................... 24 Measurement Method................................................................................................................................................. 25 Setting Registers Using Serial Communication ............................................................................................................... 26 Description of Setting Registers (4-wire) ..................................................................................................................... 26 Register Communication Timing (4-wire) ..................................................................................................................... 27 Register Write and Read (4-wire) ................................................................................................................................ 28 Description of Setting Registers (I2C) .......................................................................................................................... 29 Register Communication Timing (I2C).......................................................................................................................... 30 I2C Communication Protocol ....................................................................................................................................... 31 I2C Serial Communication Read/Write Operation ......................................................................................................... 32 Single Read from Random Location ........................................................................................................................ 32 Single Read from Current Location .......................................................................................................................... 32 Sequential Read Starting from Random Location ..................................................................................................... 33 Sequential Read Starting from Current Location ....................................................................................................... 33 Register Map (There is a possible to change the registers on this document.) .................................................................. 34 Chip ID = 02 (Write: Chip ID = 02h, Read: Chip ID = 82h, I2C: 30**h) ........................................................................ 35 Chip ID = 03 (Write: Chip ID = 03h, Read: Chip ID = 83h, I2C: 31**h) ........................................................................ 41 Chip ID = 04 (Write: Chip ID = 04h, Read: Chip ID = 84h, I2C: 32**h) ........................................................................ 42 Chip ID = 05 (Write: Chip ID = 05h, Read: Chip ID = 85h, I2C: 33**h) ........................................................................ 44 Chip ID = 06 (Write: Chip ID = 06h, Read: Chip ID = 86h, I2C: 34**h) ........................................................................ 47 Chip ID = 07 (Write: Chip ID = 07h, Read: Chip ID = 87h, I2C: 35**h) ........................................................................ 47 Chip ID = 08 (Write: Chip ID = 08h, Read: Chip ID = 88h, I2C: 36**h) ........................................................................ 47 Chip ID = 09 (Write: Chip ID = 09h, Read: Chip ID = 89h, I2C: 37**h) ........................................................................ 47 Chip ID = 0A (Write: Chip ID = 0Ah, Read: Chip ID = 8Ah, I2C: 38**h) ....................................................................... 47 Chip ID = 0B (Write: Chip ID = 0Bh, Read: Chip ID = 8Bh, I2C: 39**h) ....................................................................... 47 Chip ID = 0C (Write: Chip ID = 0Ch, Read: Chip ID = 8Ch, I2C: 3A**h) ...................................................................... 47 Chip ID = 0D (Write: Chip ID = 0Dh, Read: Chip ID = 8Dh, I2C: 3B**h) ...................................................................... 47 Chip ID = 0E (Write: Chip ID = 0Eh, Read: Chip ID = 8Eh, I2C: 3C**h) ...................................................................... 47 Chip ID = 0F (Write: Chip ID = 0Fh, Read: Chip ID = 8Fh, I2C: 3D**h) ....................................................................... 47 Chip ID = 10 (Write: Chip ID = 10h, Read: Chip ID = 90h, I2C: 3E**h) ....................................................................... 47 Chip ID = 11 (Write: Chip ID = 11h, Read: Chip ID = 91h, I2C: 3F**h) ........................................................................ 47 Chip ID = 12 (Write: Chip ID = 12h, Read: Chip ID = 92h, I2C: 40**h) ........................................................................ 47 Readout Drive Modes .................................................................................................................................................... 48 5

IMX255LLR-C Sync code .................................................................................................................................................................. 51 List of Sync Code .................................................................................................................................................... 51 Sync Code Output Timing ....................................................................................................................................... 51 Image Data Output Format ......................................................................................................................................... 52 All-pixel scan .......................................................................................................................................................... 52 ROI mode ............................................................................................................................................................... 55 ROI Overlap mode .................................................................................................................................................. 61 Vertical / Horizontal 1/2 Subsampling mode ............................................................................................................. 63 Vertical 2-pixel FD Binning mode ............................................................................................................................. 64 2x2 Vertical FD binning mode .................................................................................................................................. 65 Description of Various Function ...................................................................................................................................... 66 Standby mode ............................................................................................................................................................ 66 Slave Mode and Master Mode .................................................................................................................................... 67 Gain Adjustment Function ........................................................................................................................................... 68 Black Level Adjustment Function ................................................................................................................................ 69 Horizontal / Vertical Normal Operation and Inverted Operation ..................................................................................... 70 Shutter and Integration Time Settings ......................................................................................................................... 71 Global Shutter (Normal Mode) Operation ................................................................................................................. 72 Global Shutter (Sequential Trigger Mode) Operation ................................................................................................ 74 Global Shutter (Fast Trigger Mode) Operation .......................................................................................................... 76 Mode Transitions of Global Shutter Operation .......................................................................................................... 78 Pulse Output Function ............................................................................................................................................. 79 Signal Output ............................................................................................................................................................. 81 Output Pin Settings ................................................................................................................................................. 81 Output Pin Bit Width Selection ................................................................................................................................. 83 Output Signal Range ............................................................................................................................................... 84 Register Hold Setting.................................................................................................................................................. 85 Mode Transition ......................................................................................................................................................... 86 Other Function ........................................................................................................................................................... 87 Power-on and Power-off Sequence ................................................................................................................................ 88 Power-on sequence ................................................................................................................................................... 88 Power-off Sequence ................................................................................................................................................... 89 Sensor Setting Flow ....................................................................................................................................................... 90 Setting Flow in Sensor Slave Mode ............................................................................................................................. 90 Sensor Flow in Sensor Master Mode ........................................................................................................................... 91 Peripheral Circuit ........................................................................................................................................................... 92 Analog Power Pins ..................................................................................................................................................... 92 Digital Power Pins ...................................................................................................................................................... 93 Analog Other Pins ...................................................................................................................................................... 94 Digital I/O Pins ........................................................................................................................................................... 95 Output pins ................................................................................................................................................................ 96 Spot Pixel Specifications ................................................................................................................................................ 97 Sport Pixel Zone Definition ......................................................................................................................................... 97 Notice on White Pixels Specifications ............................................................................................................................. 98 Measurement Method for Spot Pixels ............................................................................................................................. 99 Spot Pixel Pattern Specification .................................................................................................................................... 100 Marking ....................................................................................................................................................................... 101 Notes On Handling ...................................................................................................................................................... 102 Package Outline .......................................................................................................................................................... 104 List of Trademark Logos and Definition Statements ....................................................................................................... 105 Revision History........................................................................................................................................................... 106 6

Chip Center and Optical Center IMX255LLR-C Optical Center 7 Sensorscanning Vdirection (normal)Sensorscanning Hdirection (normal)Packageoutline Vdirection10.00 ± TBD mm11.50 ± TBD mmTop ViewPackage centerOptical centerA1-PinU1-PinA16-PinU16-PinPackageoutline HdirectionPackage reference (H, V)23.00 ± TBD mm20.00 ± TBD mm

Pixel Arrangement IMX255LLR-C Pixel Arrangement 8 GGBRGGBRGGBRGGBRU1 pinA1 pinU16 pinA16 pinTop ViewReference pinOB side ignored areaEffective margin for color processingEffective margin for color processingEffective margin forcolor processing8846409688Horizontal scan direction (Normal)Vertical scan direction (Normal)Vertical (V) direction effective OBRecording pixel areaEffective margin forcolor processingTotal number of pixels: 4112 (H) × 2186 (V) = 8.99 M pixel　Number of effective pixels:4112 (H) × 2176 (V) = 8.95 M pixel Number of active pixels:4112 (H) × 2176 (V) = 8.95 M pixel Number of recommended recording pixels:4096 (H) × 2160 (V) = 8.85 M pixel (All pixels)2160

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