MTFC32GAPALBH-AAT-auto_emmc_8-128gb_5_1.pdf

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e.MMC Memory

Features

Part Numbering Information

Device Marking

e.MMC Performance

e.MMC Current Consumption

Important Notes and Warnings

General Description

Signal Descriptions

100-Ball Signal Assignments

153-Ball Signal Assignments

Package Dimensions

Architecture

MMC Protocol Independent of NAND Flash Technology

Defect and Error Management

OCR Register

CID Register

CSD Register

ECSD Register

DC Electrical Specifications – Device Power

Product features

Revision History

Rev. H – 02/20

Rev. G – 10/18

Rev. F – 08/18

Rev. E – 06/18

Rev. D – 02/18

Rev. C – 10/17

Rev. B – 07/17

Rev. A – 06/17

Micron Confidential and Proprietary 8GB, 16GB, 32GB, 64GB, 128GB: e.MMC (Automotive) Features e.MMC Memory MTFC8GAM, MTFC16GAP, MTFC32GAP, MTFC64GAP, MTFC128GAP Options • Density – 8GB – 16GB – 32GB – 64GB – 128GB • NAND component – 64Gb – 128Gb • Controller • Packages – JEDEC-standard, RoHS-compliant – 100-ball TBGA – 153-ball TFBGA – 153-ball TFBGA • Operating temperature range – From –40°C to +85°C – From –40°C to +105°C Marking 8G 16G 32G 64G 128G AM AP AL NA BH NS AIT AAT Note: 1. The JEDEC specification is available at www.jedec.org/sites/default/files/docs/ JESD84-B51.pdf. Features MultiMediaCard (MMC) controller and NAND Flash • JEDEC/MMC standard version 5.1-compliant (JEDEC Standard No. JESD84-B51)1 • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.70–1.95V; 2.7–3.6V • Advanced 12-signal interface • ×1, ×4, and ×8 I/Os, selectable by host • e.MMC I/F boot frequency: 0 to 52 MHz • e.MMC I/F clock frequency: 0 to 200 MHz • HS200/HS400 mode • Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock card) • Command queue • BKOPS control • Temporary write protection • Boot operation (high-speed boot) • Sleep mode • Replay-protected memory block (RPMB) • Hardware reset signal • Multiple partitions with enhanced attribute • Permanent and power-on write protection • High-priority interrupt (HPI) • Data strobe pin • Field firmware update (FFU) • Device health report • Sleep notification • Background operation • Reliable write • Discard and sanitize • Power-off notification • Backward compatible with previous MMC • ECC and block management implemented • Automotive grade: – AEC-Q104 – PPAP • Retention AEC-Q100-005 compliant: – 10 years @55°C at 10% of PE – 5 years @55°C at maximum PE CCMTD-841846911-10434 auto_emmc_8-128gb_5_1.pdf - Rev. H 02/2020 EN Products and specifications discussed herein are subject to change by Micron without notice. 1 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2017 Micron Technology, Inc. All rights reserved.

Micron Confidential and Proprietary 8GB, 16GB, 32GB, 64GB, 128GB: e.MMC (Automotive) Features Part Numbering Information Micron® e.MMC memory devices are available in different configurations and densities. Figure 1: e.MMC Part Numbering MT FC xx xx xx xx - xx xxx xx Micron Technology Product Family FC = NAND Flash + controller NAND Density NAND Component Controller ID Table 1: Ordering Information Base Part Number MTFC8GAMALBH-AIT MTFC8GAMALBH-AAT MTFC8GAMALNA-AIT MTFC8GAMALNA-AAT MTFC16GAPALBH-AIT MTFC16GAPALBH-AAT MTFC16GAPALNA-AIT MTFC16GAPALNA-AAT MTFC32GAPALBH-AIT MTFC32GAPALBH-AAT MTFC32GAPALNA-AIT MTFC32GAPALNA-AAT MTFC64GAPALBH-AIT MTFC64GAPALBH-AAT MTFC64GAPALNA-AIT MTFC64GAPALNA-AAT MTFC128GAPALNS-AIT MTFC128GAPALNS-AAT MTFC128GAPALNA-AIT MTFC128GAPALNA-AAT Density 8GB 8GB 16GB 16GB 32GB 32GB 64GB 64GB 128GB 128GB Production Status Blank = Production ES = Engineering sample QS = Qualification sample Operating Temperature Range Special Options Package Codes All packages are Pb free Package 153-ball TFBGA 11.5mm × 13mm × 1.1mm 100-ball TBGA 14mm × 18mm × 1.2mm 153-ball TFBGA 11.5mm × 13mm × 1.1mm 100-ball TBGA 14mm × 18mm × 1.2mm 153-ball TFBGA 11.5mm × 13mm × 1.1mm 100-ball TBGA 14mm × 18mm × 1.2mm 153-ball TFBGA 11.5mm × 13mm × 1.1mm 100-ball TBGA 14mm × 18mm × 1.2mm 153-ball TFBGA 11.5mm × 13mm × 1.2mm 100-ball TBGA 14mm × 18mm × 1.2mm Shipping Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel CCMTD-841846911-10434 auto_emmc_8-128gb_5_1.pdf - Rev. H 02/2020 EN 2 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2017 Micron Technology, Inc. All rights reserved.

Micron Confidential and Proprietary 8GB, 16GB, 32GB, 64GB, 128GB: e.MMC (Automotive) Features Device Marking Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead, an abbreviated device mark consisting of a 5-digit alphanumeric code is used. The abbreviated device marks are cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: www.micron.com/decoder. e.MMC Performance Performance in the following tables are retrieved with these conditions: Bus in x8 I/O; Temperature 25°C; Sequen- tial access of 512KB chunk; Cache ON (write), Command queueing enabled with queue depth 8 commands in HS400. Additional performance data, such as system performance on a specific application board, is provided in a sepa- rate document upon customer request. Table 2: HS400 Performance Condition Sequential write Sequential read Table 3: HS200 Performance Condition Sequential write Sequential read 8GB 40 280 8GB 40 180 Typical Values 16GB 60 320 Typical Values 16GB 60 180 32/64/128GB 120 320 32/64/128GB 100 180 Unit MB/s MB/s Unit MB/s MB/s e.MMC Current Consumption Current consumption in the following tables are retrieved with these conditions: Bus in x8 I/O; VCC = 3.6V and VCCQ = 1.95V; Temperature 25°C; Measurements done as average RMS current consumption; ICCQ in READ opera- tion measurements with tester load disconnected. Table 4: HS400 Current Consumption Condition Write1 Read1 Sleep Auto standby Typical Values (ICC/ICCQ) 8GB 60/90 100/140 0/100 60/110 16GB 60/90 120/140 0/100 80/110 32GB 110/90 120/140 0/100 80/110 64GB 110/90 120/140 0/100 120/110 128GB 110/90 150/140 0/100 250/110 Unit mA mA µA µA Note: 1. Command queueing enabled with queue depth 8 commands. CCMTD-841846911-10434 auto_emmc_8-128gb_5_1.pdf - Rev. H 02/2020 EN 3 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2017 Micron Technology, Inc. All rights reserved.

Micron Confidential and Proprietary 8GB, 16GB, 32GB, 64GB, 128GB: e.MMC (Automotive) Features Table 5: HS200 Current Consumption Condition Write Read Sleep Auto standby Typical Values (ICC/ICCQ) 8GB 50/80 70/110 0/100 60/110 16GB 50/80 80/110 0/100 80/110 32GB 100/80 80/110 0/100 80/110 64GB 100/80 80/110 0/100 120/110 128GB 100/80 90/110 0/100 250/110 Unit mA mA µA µA CCMTD-841846911-10434 auto_emmc_8-128gb_5_1.pdf - Rev. H 02/2020 EN 4 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2017 Micron Technology, Inc. All rights reserved.

Micron Confidential and Proprietary 8GB, 16GB, 32GB, 64GB, 128GB: e.MMC (Automotive) Important Notes and Warnings Important Notes and Warnings Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions. This document supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any information set forth in this docu- ment if you obtain the product described herein from any unauthorized distributor or other source not authorized by Micron. Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi- cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib- utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non- automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con- ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in- demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting from any use of non-automotive-grade products in automotive applications. Critical Applications. Products are not authorized for use in applications in which failure of the Micron compo- nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ- mental damage by incorporating safety design measures into customer's applications to ensure that failure of the Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron component for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi- cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron product. Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems, applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL- URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en- vironmental damages will result from failure of any semiconductor component. Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly authorized representative. CCMTD-841846911-10434 auto_emmc_8-128gb_5_1.pdf - Rev. H 02/2020 EN 5 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2017 Micron Technology, Inc. All rights reserved.

Micron Confidential and Proprietary 8GB, 16GB, 32GB, 64GB, 128GB: e.MMC (Automotive) General Description General Description Micron e.MMC is a communication and mass data storage device that includes a Multi- MediaCard (MMC) interface, a NAND Flash component, and a controller on an ad- vanced 12-signal bus, which is compliant with the MMC system specification. Its cost per bit, small package sizes, and high reliability make it an ideal choice for automotive applications, including information and entertainment, navigation tools, advanced driving assistance systems, and a variety of other industrial and portable products. The nonvolatile e.MMC draws no power to maintain stored data, delivers high perform- ance across a wide range of operating temperatures, and resists shock and vibration dis- ruption. CCMTD-841846911-10434 auto_emmc_8-128gb_5_1.pdf - Rev. H 02/2020 EN 6 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2017 Micron Technology, Inc. All rights reserved.

Micron Confidential and Proprietary 8GB, 16GB, 32GB, 64GB, 128GB: e.MMC (Automotive) Signal Descriptions Signal Descriptions Table 6: Signal Descriptions Symbol CLK Type Input RST_n Input CMD I/O DAT[7:0] I/O Description Clock: Each cycle of the clock directs a transfer on the command line and on the data line(s). The frequency can vary between the minimum and the maximum clock frequency. Reset: The RST_n signal is used by the host for resetting the device, moving the device to the pre- idle state. By default, the RST_n signal is temporarily disabled in the device. The host must set ECSD register byte 162, bits[1:0] to 0x1 to enable this functionality before the host can use it. Command: This signal is a bidirectional command channel used for command and response trans- fers. The CMD signal has two bus modes: open-drain mode and push-pull mode (see Operating Modes). Commands are sent from the MMC host to the device, and responses are sent from the device to the host. Data I/O: These are bidirectional data signals. The DAT signals operate in push-pull mode. By de- fault, after power-on or assertion of the RST_n signal, only DAT0 is used for data transfer. The MMC controller can configure a wider data bus for data transfer either using DAT[3:0] (4-bit mode) or DAT[7:0] (8-bit mode). e·MMC includes internal pull-up resistors for data lines DAT[7:1]. Immedi- ately after entering the 4-bit mode, the device disconnects the internal pull-up resistors on the DAT[3:1] lines. Upon entering the 8-bit mode, the device disconnects the internal pull-ups on the DAT[7:1] lines. Output Data strobe: Generated by the device and used for data output and CRC status response output in HS400 mode. The frequency of this signal follows the frequency of CLK. For data output, each cycle of this signal directs two bits transfer (2x) on the data, one bit for the positive edge and the other bit for the negative edge. For CRC status response output, the CRC status is latched on the positive edge only, and is "Don't Care" on the negative edge. Vendor specific function: VSF1, VSF2, VSF3, VSF4, VSF5, VSF6, and VSF7 are internally connected. VCC: NAND interface (I/F) I/O and NAND Flash power supply. VCCQ: e·MMC controller core and e·MMC I/F I/O power supply. VSS: NAND I/F I/O and NAND Flash ground connection. VSSQ: e·MMC controller core and e·MMC I/F ground connection. Internal voltage node: At least a 0.1μF capacitor is required to connect VDDIM to ground. A 1μF ca- pacitor is recommended. Do not tie to supply voltage or ground. No connect: No internal connection is present. Reserved for future use: No internal connection is present. Leave it floating externally. Note: 1. VSS and VSSQ are connected internally. DS VSF[7:1] VCC VCCQ 1 VSS 1 VSSQ VDDIM NC RFU Input/ output Supply Supply Supply Supply – – CCMTD-841846911-10434 auto_emmc_8-128gb_5_1.pdf - Rev. H 02/2020 EN 7 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2017 Micron Technology, Inc. All rights reserved.

Micron Confidential and Proprietary 8GB, 16GB, 32GB, 64GB, 128GB: e.MMC (Automotive) 100-Ball Signal Assignments 100-Ball Signal Assignments Figure 2: 100 Ball (Top View, Ball Down) 3 4 5 6 7 8 2 NC 1 NC NC 9 NC 10 NC NC VSF1 VSF2 VSF3 VSF4 VSF5 VSF6 VSF7 VSF8 RFU RFU VDDIM RFU RFU RFU RFU RFU VCC VCC VCC VCC VCC VCC VCC VCC VSS VSS VSS VSS VSS VSS VSS VSS VSSQ VCCQ RFU RFU RFU RFU VCCQ VSSQ RFU RFU RFU VSS RFU RFU RFU RFU DAT0 DAT2 RFU DS RFU RFU DAT5 DAT7 VCCQ VSSQ VCCQ RFU RFU VCCQ VSSQ VCCQ RFU RFU VSSQ RST_n RFU VSSQ RFU RFU DAT1 DAT3 RFU RFU RFU RFU DAT4 DAT6 VSSQ VCCQ RFU CMD CLK RFU VCCQ VSSQ NC NC NC NC NC NC A B D E F G H J K L M N P T U A B D E F G H J K L M N P T U Notes: 1. Connect a 1μF decoupling capacitor from VDDIM to ground. 2. Some previous versions of the JEDEC product or mechanical specification had defined reserved for future use (RFU) balls as no connect (NC) balls. NC balls assigned in the pre- vious specifications could have been connected to ground on the system board. To ena- ble new feature introduction, some of these balls are assigned as RFU in the v4.4 me- chanical specification. Any new PCB footprint implementations should use the new ball assignments and leave the RFU balls floating on the system board. 3. VCC, VCCQ, VSS, and VSSQ balls must all be connected on the system board. CCMTD-841846911-10434 auto_emmc_8-128gb_5_1.pdf - Rev. H 02/2020 EN 8 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2017 Micron Technology, Inc. All rights reserved.

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