UIS8910DM Device Specification 
 
 
 
 
 
 
 
 
 
 
 
 
 
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UIS8910DM Device Specification 
 
IMPORTANT NOTICE 
 
Spreadtrum  Communications  (Shanghai)  Co.,  Ltd.,  its  parent  company,  subsidiaries,  and  its 
affiliates are collectively referred to UNISOC (hereafter “UNISOC”). 
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(Shanghai)  Co.,  Ltd.,  its  parent  company,  its  subsidiaries,  and  its  affiliates  are  confidential 
information (hereafter collectively “UNISOC Confidential Information”). 
 
 
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and their products use trademarks owned by the respective companies and are for reference purpose 
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UIS8910DM Device Specification 
 
Revision History 
Version 
Data 
Owner 
7/26/2018 
JM Gao 
0.1 
0.2 
 
 
 
 
 
 
 
 
 
 
 
 
Note 
First draft. 
12/07/2018 
Jackie Li 
Update for UIS8910DM. 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
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UIS8910DM Device Specification 
Contents 
Revision History ..................................................................................................................................... 3 
Contents .................................................................................................................................................. 4 
List of Figures ......................................................................................................................................... 5 
List of Tables .......................................................................................................................................... 6 
1 
2 
3 
4 
 
 
 
System Overview .......................................................................................................................... 7 
General Description ........................................................................................................... 7 
1.1 
Features ............................................................................................................................ 7 
1.2 
Platform Features............................................................................................... 7 
1.2.1 
1.2.2 
Modem Features ................................................................................................ 8 
1.2.3 
Multi-media Features ......................................................................................... 8 
Chip Architecture ............................................................................................................... 9 
1.3 
Package Information ..................................................................................................................10 
Top Marketing Definition .................................................................................................10 
2.1 
BGA Pinout ......................................................................................................................10 
2.2 
2.3 
Mechanical Dimensions ..................................................................................................11 
Reflow Profile ..................................................................................................................11 
2.4 
Pin Information ...........................................................................................................................12 
3.1 
Pin Symbol Descriptions .................................................................................................12 
Pin List .............................................................................................................................13 
3.2 
SDMMC INTERFACE ......................................................................................13 
3.2.1 
LCD INTERFACE.............................................................................................13 
3.2.2 
3.2.3 
CAMERA INTERFACE ....................................................................................14 
GPIO INTERFACE ...........................................................................................15 
3.2.4 
KEYPAD INTERFACE .....................................................................................17 
3.2.5 
3.2.6 
SIM INTERFACE .............................................................................................17 
DEBUGHOST INTERFACE .............................................................................18 
3.2.7 
PMIC INTERFACE ...........................................................................................18 
3.2.8 
3.2.9 
USB INTERFACE ............................................................................................18 
3.2.10  RF INTERFACE ...............................................................................................18 
Electrical Specification ..............................................................................................................20 
Recommended Operating Conditions .............................................................................20 
4.1 
4.2 
Thermal Characteristics ..................................................................................................21 
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UIS8910DM Device Specification 
List of Figures 
Chip Architecture ............................................................................................................... 9 
Figure 1-1 
Top Marketing Definition .................................................................................................10 
Figure 2-1 
Figure 2-2 
BGA Pinout ......................................................................................................................10 
Figure 2-3  Mechanical Dimensions ..................................................................................................11 
Recommended reflow profile ...........................................................................................11 
Figure 2-4 
 
 
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UIS8910DM Device Specification 
List of Tables 
Table 3-1 
Table 4-1 
Table 4-2 
Table 4-3 
Table 4-4 
Pin Symbol ......................................................................................................................12 
Recommended Operating Power Range ........................................................................20 
DC Parameters (1.8V Digital IO) .....................................................................................20 
DC Parameters (3.3V Digital IO) .....................................................................................21 
Thermal Characteristics ..................................................................................................21 
 
 
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UIS8910DM Device Specification 
1 
System Overview 
1.1 
General Description 
UIS8910DM  is  an  advanced  system-on-chip  solution  integrated  CAT1bis/GSM/GPRS  modems. 
Building on the success of UNISOC’s current solutions, the UIS8910DM integrates RF transceiver and 
Bluetooth RF for low cost. 
UIS8910DM supports plenty of peripherals such as SDIO, UART, I2C, SPI, I2S, MIPI CSI, and GPIOs. 
Full custom power management chip provides power to SOC and all peripherals. 
To  meet  the  increasing  popular  power-saving  requirements  without  the  use  of  additional  hardware, 
UIS8910DM  has  an  ultra-low  power  standby  solution  that  an  embedded  power-FSM  can  perform 
standby events and wake up the system as required. 
UIS8910DM 8.9X8.9mm TFBGA package and 301 balls. 
1.2 
Features 
1.2.1 
Platform Features 
Microcontroller Subsystem 
 
 
500MHz Cortex A5 Application processor with 32KB ICache and 32KB DCache,NEON/FPU 
Three(3) Boot modes 
  Normal : Boot from Nor-flash 
 
 
Boot from SD card 
Force download(UART2 or USB) 
 
Twelve general DMA channels for peripherals and one dedicated channel for debug host 
  Multiple SoC low power modes with rich wakeup sources 
Memory 
 
 
Integrated SPI Nor Flash(64Mb) and PSRAM(128Mb) 
4K-bit E-fuse 
WCN Subsystem 
  Support Bluetooth 4.2 true dual mode(BR/EDR and BLE) 
  Support WIFI  802.11b Rx only(RSSI and MAC Address for Location) 
  Support FM 
 
Integrated balun for RF 
User Interface 
 
1 Pulse Width Modulator 
  Up to 32 GPIOs with interrupt function 
 
 
 
 
 
 
3 UART interface 
2 SDIO interface 
3 I2C interface 
2 I2S(slave) interface 
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UIS8910DM Device Specification 
 
2 SPI(master) interface 
  Up to 6 column x 6 row keypad 
  GPIO0-5 can be used to extend external flash 
  USB2.0 
Power Management 
  External DC-DC and LDOs solution(PMIC UIP8910M) deriving from VBAT 
 
Flexible I/O voltage 
  External pin reset 
Clock Source 
 
 
26MHz VC-TCXO or TSX 
32KHz crystal oscillator or 32K-less 
1.2.2 
Modem Features 
CAT1bis Communication 
 
3GPP Release 13 
  Supports FDD, TDD 
  Supports 1.4/3/5/10/15/20MHz bandwidth in downlink and uplink 
  Up to UL/DL 5Mbps/10Mbps respectively  
  Support VoLTE 
GSM/GPRS 
  Dual differential LNAs support quad band receiver 
 
Fully integrated channel filter 
  High dynamic range ADC 
 
Transmitter support quad band 
  Programmable fractional-N synthesizer 
  On die wide range VCO and integrated loop filter 
 
 
Fast settling time suitable for multi-slot GPRS applications 
Low power mode support 32KHz crystal removal 
  GPRS Class 12 
  Support HR/FR/EFR voice codec 
1.2.3 
Multi-media Features 
Audio Processor 
 
 
ZSP900m processor 
L1 cache(32KB ICache and 32KB DCache) 
Audio Interface 
  Support AUD interface  
  Support I2S(slave) interface 
 
 
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