Revision History
Declaration
Contents
Figures
Tables
About This Documentation
1. Overview
2. Features
2.1. CPU Architecture
2.2. GPU Architecture
2.3. Memory Subsystem
Boot ROM
SDRAM
NAND Flash
SMHC
2.4. System Peripheral
Timer
High Speed Timer
RTC
GIC
DMA
CCU
PWM
Thermal Sensor
Crypto Engine
Security ID
2.5. Video Engine
Video Decoder
Video Encoder
2.6. Display Subsystem
DE2.0
Video Output
2.7. Image In
2.8. Audio Subsystem
Audio Codec
I2S/PCM
One Wire Audio(OWA)
AC97
2.9. External Peripherals
USB
EMAC
GMAC
Transport Stream Controller
TWI
Smart Card Reader
SPI
UART
PS2
CIR
SATA
Keypad
KEYADC
RTP
2.10. Package
3. Block Diagram
4. Pin Description
4.1. Pin Characteristics
4.2. Signal Descriptions
5. Electrical Characteristics
5.1. Absolute Maximum Ratings
5.2. Recommended Operating Conditions
5.3. DC Electrical Characteristics
5.4. PLL Electrical Characteristics
5.4.1. CPU PLL Electrical Parameters
5.4.2. Audio PLL Electrical Parameters
5.4.3. GPU PLL Electrical Parameters
5.4.4. Peripheral0/1 PLL Electrical Parameters
5.4.5. MIPI PLL Electrical Parameters
5.4.6. DDR0/1 PLL Electrical Parameters
5.4.7. Video0/1 PLL Electrical Parameters
5.4.8. VE PLL Electrical Parameters
5.4.9. DE PLL Electrical Parameters
5.4.10. SATA PLL Electrical Parameters
5.5. KEYADC Electrical Characteristics
5.6. Oscillator Electrical Characteristics
5.7. Maximum Current Consumption
5.8. External Memory Electrical Characteristics
5.8.1. Nand AC Electrical Characteristics
5.8.2. SMHC AC Electrical Characteristics
5.9. External Peripherals Electrical Characteristics
5.9.1. LCD AC Electrical Characteristics
5.9.2. CSI AC Electrical Characteristics
5.9.3. EMAC AC Electrical Characteristics
5.9.4. PS2 AC Electrical Characteristics
5.9.5. CIR AC Electrical Characteristics
5.9.6. SPI AC Electrical Characteristics
5.9.7. UART AC Electrical Characteristics
5.9.8. TWI AC Electrical Characteristics
5.9.9. TSC AC Electrical Characteristics
5.9.10. AC97 AC Electrical Characteristics
5.9.11. SCR AC Electrical Characteristics
5.10. Power-up and Power-down Sequence
6. Package Thermal Characteristics
7. Pin Assignment
7.1. Pin Map
7.2. Package Dimension