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深入浅出Cortex-M7——i.MX RT1050(20180122).pdf
第1章 i.MX RT1050系列芯片简介
1.1 i.MX RT1050跨界处理器
1.1.1 概述
1． i.MX RT跨界处理器
2． 高性能、实时处理
1.1.2 特性
1.2 芯片特色外设
1.2.1 2D图像处理引擎
1.2.2 CSI接口
1.2.3 SAI接口
1.3 应用领域
1.4 封装信息
1.5 引脚说明
第2章 EasyARM-RT1052开发套件
2.1 开发板介绍
2.1.1 产品特性
2.1.2 资源参数
2.1.3 电气参数
2.1.4 接口说明
1． 指示灯及蜂鸣器
2． 配置说明
3． 接口说明
4． J13接口管脚说明
5． J14接口管脚说明
6． SWD及UART1接口说明
第3章 硬件设计
3.1 最小系统
3.1.1 电源电路
1． 上电时序
2． 掉电时序
3． 电源使用
4． 电源电路
3.1.2 时钟电路
3.1.3 复位与调试
3.1.4 系统BOOT
3.1.5 存储器电路
1． SDRAM
2． QSPI NOR Flash
3.2 板载外设
3.2.1 以太网
3.2.2 USB
3.2.3 SD卡
3.2.4 LCD
3.2.5 LED及蜂鸣器
3.2.6 CSI
3.2.7 Wi-Fi
3.2.8 AWorks接口
3.2.9 机械尺寸
第4章 软件设计
4.1 外设简介
4.2 通用I/O（GPIO）
4.2.1 概述
4.2.2 特性
4.2.3 配置步骤
1． 输出模式
2． 输入模式
3． 中断检测
4.2.4 例程介绍
4.2.5 实验现象
4.3 LPUART控制器
4.3.1 概述
4.3.2 特性
4.3.3 配置步骤
4.3.4 例程介绍
4.3.5 实验现象
4.4 LPSPI控制器
4.4.1 概述
4.4.2 特性
4.4.3 配置步骤
4.4.4 例程介绍
4.4.5 实验现象
4.5 LPI2C控制器
4.5.1 概述
4.5.2 特性
4.5.3 配置步骤
4.5.4 例程介绍
4.5.5 实验现象
4.6 FlexSPI控制器（FlexSPI）
4.6.1 概述
4.6.2 特性
4.6.3 配置步骤
4.6.4 例程介绍
4.6.5 实验现象
4.7 CAN控制器（FlexCAN）
4.7.1 概述
4.7.2 特性
4.7.3 配置步骤
4.7.4 例程介绍
4.7.5 实验现象
4.8 FlexI/O接口（FlexI/O）
4.8.1 概述
4.8.2 特性
4.8.3 配置步骤
4.8.4 例程介绍
4.8.5 实验现象
4.9 矩阵键盘端口（KPP）
4.9.1 概述
4.9.2 特性
4.9.3 配置步骤
4.9.4 例程介绍
4.9.5 实验现象
4.10 同步音频接口（SAI）
4.10.1 概述
4.10.2 特性
4.10.3 配置步骤
4.10.4 例程介绍
4.10.5 实验现象
4.11 数字音频接口（SPDIF）
4.11.1 概述
4.11.2 特性
4.11.3 配置步骤
4.11.4 例程介绍
4.11.5 实验现象
4.12 模数转换（ADC）
4.12.1 概述
4.12.2 特性
4.12.3 配置步骤
4.12.4 例程介绍
4.12.5 实验现象
4.13 模拟比较器（ACMP）
4.13.1 概述
4.13.2 特性
4.13.3 配置步骤
4.13.4 例程介绍
4.13.5 实验现象
4.14 增强型直接内存存取（eDMA）
4.14.1 概述
4.14.2 特性
4.14.3 配置步骤
4.14.4 例程介绍
4.14.5 实验现象
4.15 通用定时器（GPT）
4.15.1 概述
4.15.2 特性
4.15.3 配置步骤
4.15.4 例程介绍
4.15.5 实验现象
4.16 周期中断定时器（PIT）
4.16.1 概述
4.16.2 特性
4.16.3 配置步骤
4.16.4 例程介绍
4.16.5 实验现象
4.17 正交解码器（ENC）
4.17.1 概述
4.17.2 特性
4.17.3 配置步骤
4.17.4 例程介绍
4.17.5 实验现象
4.18 看门狗定时器（WDOG）
4.18.1 概述
4.18.2 特性
4.18.3 配置步骤
4.18.4 例程介绍
4.18.5 实验现象
4.19 外部看门狗监视器（EWM）
4.19.1 概述
4.19.2 特性
4.19.3 配置步骤
4.19.4 例程介绍
4.19.5 实验现象
4.20 外部存储控制器（SEMC）
4.20.1 概述
4.20.2 特性
4.20.3 配置步骤
4.20.4 例程介绍
4.20.5 实验现象
4.21 温度检测模块（TEMPMON）
4.21.1 概述
4.21.2 特性
4.21.3 配置步骤
4.21.4 例程介绍
4.21.5 实验现象
4.22 LCD控制器（eLCDIF）
4.22.1 概述
4.22.2 特性
4.22.3 配置步骤
4.22.4 例程介绍
4.22.5 实验现象
4.23 2D图形处理（PXP）
4.23.1 概述
4.23.2 特性
4.23.3 配置步骤
4.23.4 例程介绍
4.23.5 实验现象
4.24 触屏控制器（TSC）
4.24.1 概述
4.24.2 特性
4.24.3 配置步骤
4.24.4 例程介绍
4.24.5 实验现象
4.25 SD卡接口（uSDHC）
4.25.1 概述
4.25.2 特性
4.25.3 配置步骤
4.25.4 例程介绍
4.25.5 实验现象
4.26 USB接口
4.26.1 概述
4.26.2 特性
4.26.3 配置步骤
4.26.4 例程介绍
4.26.5 实验现象
4.27 以太网接口（ENET）
4.27.1 概述
4.27.2 特性
4.27.3 配置步骤
4.27.4 例程介绍
4.27.5 实验现象
4.28 可配置OCRAM（FlexRAM）
4.28.1 概述
4.28.2 特性
4.28.3 配置步骤
4.28.4 例程介绍
4.28.5 实验现象
4.29 电源管理
4.29.1 概述
4.29.2 特性
4.29.3 功耗模式
4.29.4 配置步骤
4.29.5 例程介绍
4.29.6 实验现象
4.30 安全非易失存储（SNVS）
4.30.1 概述
4.30.2 特性
4.30.3 配置步骤
4.30.4 例程介绍
4.30.5 实验现象
第5章 开发工具
5.1 IDE工具
5.1.1 KEIL
1． 获取MDK-ARM
2． 安装MDK-ARM
3． SDK包工程导入
4． 编译SDK包工程
5.1.2 IAR
1． IAR软件获取
2． IAR软件的安装
3． SDK软件包导入
4． 编译SDK包示例工程
5.1.3 MCUXpresso
1． MCUXpresso IDE软件获取
2． MCUXpresso IDE软件安装
3． SDK软件包构建与下载
4． SDK包工程导入
5.2 调试工具
5.2.1 CMSIS-DAP
1． 认识CMSIS-DAP
2． KEIL编译环境下的调试
3． IAR编译环境下的调试
5.3 量产工具
5.3.1 P800isp简介
5.3.2 硬件特点
5.3.3 烧写速度
附录A PIMXRT1052CVL5A管脚分配表
目 录
1.1
1.2
1.3
1.4
1.5
2.1
1.2.1
1.2.2
1.2.3
第 1 章 i.MX RT1050 系列芯片简介 ····························································· 1
i.MX RT1050 跨界处理器 ········································································ 1
1.1.1 概述 ····························································································· 1
1.1.2 特性 ····························································································· 2
芯片特色外设 ······················································································ 3
2D 图像处理引擎 ············································································ 3
CSI 接口 ······················································································· 4
SAI 接口 ······················································································· 4
应用领域····························································································· 5
封装信息····························································································· 5
引脚说明····························································································· 6
第 2 章 EasyARM-RT1052 开发套件 ··························································· 12
开发板介绍 ························································································ 12
2.1.1 产品特性······················································································ 13
2.1.2 资源参数······················································································ 13
2.1.3 电气参数······················································································ 14
2.1.4 接口说明······················································································ 15
第 3 章 硬件设计 ···················································································· 18
最小系统···························································································· 18
3.1.1 电源电路······················································································ 18
3.1.2 时钟电路······················································································ 21
3.1.3 复位与调试 ·················································································· 22
3.1.4 系统 BOOT ··················································································· 22
3.1.5 存储器电路 ·················································································· 24
板载外设···························································································· 25
3.2.1 以太网························································································· 25
USB ···························································································· 27
3.2.2
SD 卡 ·························································································· 28
3.2.3
LCD ···························································································· 29
3.2.4
LED 及蜂鸣器 ··············································································· 29
3.2.5
3.2.6
CSI ····························································································· 30
3.2.7 Wi-Fi ·························································································· 30
AWorks 接口 ················································································· 32
3.2.8
3.2.9 机械尺寸······················································································ 34
第 4 章 软件设计 ···················································································· 35
外设简介···························································································· 35
通用 I/O（GPIO） ················································································ 35
4.2.1 概述 ···························································································· 35
4.2.2 特性 ···························································································· 35
4.2.3 配置步骤······················································································ 35
4.2.4 例程介绍······················································································ 36
4.2.5 实验现象······················································································ 36
4.1
4.2
3.1
3.2
i
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
LPUART 控制器 ·················································································· 37
4.3.1 概述 ···························································································· 37
4.3.2 特性 ···························································································· 37
4.3.3 配置步骤······················································································ 37
4.3.4 例程介绍······················································································ 37
4.3.5 实验现象······················································································ 39
LPSPI 控制器 ······················································································ 39
4.4.1 概述 ···························································································· 39
4.4.2 特性 ···························································································· 39
4.4.3 配置步骤······················································································ 39
4.4.4 例程介绍······················································································ 39
4.4.5 实验现象······················································································ 42
LPI2C 控制器 ······················································································ 42
4.5.1 概述 ···························································································· 42
4.5.2 特性 ···························································································· 42
4.5.3 配置步骤······················································································ 43
4.5.4 例程介绍······················································································ 43
4.5.5 实验现象······················································································ 48
FlexSPI 控制器（FlexSPI） ···································································· 48
4.6.1 概述 ···························································································· 48
4.6.2 特性 ···························································································· 48
4.6.3 配置步骤······················································································ 49
4.6.4 例程介绍······················································································ 50
4.6.5 实验现象······················································································ 52
CAN 控制器（FlexCAN） ······································································ 52
4.7.1 概述 ···························································································· 52
4.7.2 特性 ···························································································· 52
4.7.3 配置步骤······················································································ 53
4.7.4 例程介绍······················································································ 54
4.7.5 实验现象······················································································ 56
FlexI/O 接口（FlexI/O） ········································································ 56
4.8.1 概述 ···························································································· 56
4.8.2 特性 ···························································································· 56
4.8.3 配置步骤······················································································ 57
4.8.4 例程介绍······················································································ 57
4.8.5 实验现象······················································································ 58
矩阵键盘端口（KPP） ·········································································· 59
4.9.1 概述 ···························································································· 59
4.9.2 特性 ···························································································· 59
4.9.3 配置步骤······················································································ 59
4.9.4 例程介绍······················································································ 59
4.9.5 实验现象······················································································ 61
同步音频接口（SAI） ··········································································· 61
4.10.1 概述 ···························································································· 61
ii
4.10.2 特性 ···························································································· 61
4.10.3 配置步骤······················································································ 61
4.10.4 例程介绍······················································································ 62
4.10.5 实验现象······················································································ 64
数字音频接口（SPDIF） ······································································· 64
4.11.1 概述 ···························································································· 64
4.11.2 特性 ···························································································· 64
4.11.3 配置步骤······················································································ 64
4.11.4 例程介绍······················································································ 65
4.11.5 实验现象······················································································ 67
模数转换（ADC） ··············································································· 67
4.12.1 概述 ···························································································· 67
4.12.2 特性 ···························································································· 67
4.12.3 配置步骤······················································································ 67
4.12.4 例程介绍······················································································ 67
4.12.5 实验现象······················································································ 69
模拟比较器（ACMP） ·········································································· 69
4.13.1 概述 ···························································································· 69
4.13.2 特性 ···························································································· 69
4.13.3 配置步骤······················································································ 70
4.13.4 例程介绍······················································································ 70
4.13.5 实验现象······················································································ 71
增强型直接内存存取（eDMA） ······························································ 71
4.14.1 概述 ···························································································· 71
4.14.2 特性 ···························································································· 71
4.14.3 配置步骤······················································································ 72
4.14.4 例程介绍······················································································ 72
4.14.5 实验现象······················································································ 74
通用定时器（GPT） ············································································· 74
4.15.1 概述 ···························································································· 74
4.15.2 特性 ···························································································· 74
4.15.3 配置步骤······················································································ 75
4.15.4 例程介绍······················································································ 75
4.15.5 实验现象······················································································ 76
周期中断定时器（PIT） ········································································ 76
4.16.1 概述 ···························································································· 76
4.16.2 特性 ···························································································· 77
4.16.3 配置步骤······················································································ 77
4.16.4 例程介绍······················································································ 77
4.16.5 实验现象······················································································ 78
正交解码器（ENC） ············································································ 78
4.17.1 概述 ···························································································· 78
4.17.2 特性 ···························································································· 79
4.17.3 配置步骤······················································································ 79
4.11
4.12
4.13
4.14
4.15
4.16
4.17
iii
4.18
4.19
4.20
4.21
4.22
4.23
4.24
4.17.4 例程介绍······················································································ 79
4.17.5 实验现象······················································································ 80
看门狗定时器（WDOG） ······································································ 81
4.18.1 概述 ···························································································· 81
4.18.2 特性 ···························································································· 81
4.18.3 配置步骤······················································································ 81
4.18.4 例程介绍······················································································ 81
4.18.5 实验现象······················································································ 82
外部看门狗监视器（EWM） ·································································· 83
4.19.1 概述 ···························································································· 83
4.19.2 特性 ···························································································· 83
4.19.3 配置步骤······················································································ 83
4.19.4 例程介绍······················································································ 83
4.19.5 实验现象······················································································ 85
外部存储控制器（SEMC） ···································································· 85
4.20.1 概述 ···························································································· 85
4.20.2 特性 ···························································································· 85
4.20.3 配置步骤······················································································ 86
4.20.4 例程介绍······················································································ 86
4.20.5 实验现象······················································································ 87
温度检测模块（TEMPMON） ································································ 87
4.21.1 概述 ···························································································· 87
4.21.2 特性 ···························································································· 87
4.21.3 配置步骤······················································································ 88
4.21.4 例程介绍······················································································ 88
4.21.5 实验现象······················································································ 88
LCD 控制器（eLCDIF） ········································································ 88
4.22.1 概述 ···························································································· 88
4.22.2 特性 ···························································································· 88
4.22.3 配置步骤······················································································ 88
4.22.4 例程介绍······················································································ 89
4.22.5 实验现象······················································································ 90
2D 图形处理（PXP）············································································ 90
4.23.1 概述 ···························································································· 90
4.23.2 特性 ···························································································· 90
4.23.3 配置步骤······················································································ 90
4.23.4 例程介绍······················································································ 91
4.23.5 实验现象······················································································ 91
触屏控制器（TSC） ············································································· 91
4.24.1 概述 ···························································································· 91
4.24.2 特性 ···························································································· 92
4.24.3 配置步骤······················································································ 92
4.24.4 例程介绍······················································································ 92
4.24.5 实验现象······················································································ 92
iv
4.25
4.26
4.27
4.28
SD 卡接口（uSDHC） ·········································································· 92
4.25.1 概述 ···························································································· 92
4.25.2 特性 ···························································································· 92
4.25.3 配置步骤······················································································ 93
4.25.4 例程介绍······················································································ 94
4.25.5 实验现象······················································································ 96
USB 接口 ··························································································· 97
4.26.1 概述 ···························································································· 97
4.26.2 特性 ···························································································· 97
4.26.3 配置步骤······················································································ 97
4.26.4 例程介绍······················································································ 98
4.26.5 实验现象······················································································ 98
以太网接口（ENET） ··········································································· 99
4.27.1 概述 ···························································································· 99
4.27.2 特性 ···························································································· 99
4.27.3 配置步骤···················································································· 100
4.27.4 例程介绍···················································································· 100
4.27.5 实验现象···················································································· 103
可配置 OCRAM（FlexRAM） ······························································ 104
4.28.1 概述 ·························································································· 104
4.28.2 特性 ·························································································· 104
4.28.3 配置步骤···················································································· 104
4.28.4 例程介绍···················································································· 104
4.28.5 实验现象···················································································· 105
电源管理·························································································· 106
4.29.1 概述 ·························································································· 106
4.29.2 特性 ·························································································· 106
4.29.3 功耗模式···················································································· 107
4.29.4 配置步骤···················································································· 107
4.29.5 例程介绍···················································································· 107
4.29.6 实验现象···················································································· 110
安全非易失存储（SNVS） ··································································· 110
4.30.1 概述 ·························································································· 110
4.30.2 特性 ·························································································· 111
4.30.3 配置步骤···················································································· 111
4.30.4 例程介绍···················································································· 111
4.30.5 实验现象···················································································· 113
第 5 章 开发工具 ·················································································· 115
IDE 工具 ·························································································· 115
KEIL ························································································· 115
5.1.1
5.1.2
IAR ·························································································· 120
5.1.3 MCUXpresso ··············································································· 125
调试工具·························································································· 130
CMSIS-DAP ··············································································· 130
5.2.1
5.1
5.2
4.29
v
4.30
5.3
量产工具·························································································· 135
P800isp 简介 ··············································································· 135
5.3.1
5.3.2 硬件特点···················································································· 135
5.3.3 烧写速度···················································································· 136
附录 A PIMXRT1052CVL5A 管脚分配表 ······················································· 1
vi
第1章 i.MX RT1050 系列芯片简介
1.1
i.MX RT1050 跨界处理器
作为成千上万的智能物联网产品的核心，嵌入式处理器的独特之处在于其对功能和性能的
精确定制。传统嵌入式处理器与千变万化的物联网需求之间存在的差距正在不断增大，人们需
要处理器提供更低功耗、更经济的可扩展性，更强的计算性能、更高的安全性，以及更好的用
户体验。为满足这一需求，恩智浦打破应用处理器和 MCU 之间的界限，打造一类新的“跨界”
嵌入式处理器。这种新型应用处理器采用了 MCU 内核，但基于应用处理器的架构方式，既能
实现应用处理器的高性能和丰富功能，同时又兼具传统 MCU 的易用性和实时低功耗运行特性，
填补高性能与易用性之间的空白。
1.1.1 概述
1． i.MX RT 跨界处理器
凭借数十年来为消费者、工业和物联网市场提供 MCU 和应用处理器的领导经验，恩智浦
开发出了全新嵌入式处理器系列—i.MX RT 跨界系列处理器。新型的 i.MX RT 跨界系列处理器
基于 ARM® Cortex®-M7 内核，采用了 i.MX 6ULL 应用处理器架构，囊括了上文提到的跨界处
理器的所有特性，提供了市场上首款真正能够填补 MCU 和应用处理器之间空白的解决方案。
它把应用处理器级别的性能带到了 MCU 领域，能够支持实时、高性能处理功能，例如摄像头
和显示功能。
2． 高性能、实时处理
i.MX RT 系列的内核运行速度可达 600 MHz（相比之下，现有 MCU 的最高速度只有
400MHz）。这是目前具有最高性能水平的 Cortex-M7 解决方案，可提供 3015 CoreMark®/1284
DMIPS (> 2 DMIPS/MHz)。得益于高密度的 512KB TCM SRAM， i.MX RT 系列还能够实现超
快的实时响应。其中断延迟低至 20 纳秒，在全世界所有基于 ARM Cortex 的产品中，这是最短
的中断延迟，这都归功于高性能和 Cortex-M7 内核的强强组合。总而言之， i.MX RT 跨界处理
器的性能可达竞争产品的 2 倍。
1
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