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SanDisk iNAND 7250 e.MMC 5.1 Data Sheet.pdf
Data Sheet - Confidential
DOC-56-34-01460• Rev 1.4 • August 2017
Industrial iNAND® 7250
e.MMC 5.1 with HS400 Interface
Confidential, subject to all applicable non-disclosure agreements
www.SanDisk.com
Confidential
SanDisk® iNAND 7250 e.MMC 5.1+ HS400 I/F data sheet
REVISION HISTORY
Doc. No
Revision
Date
Description
DOC-56-34-01460
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0.1
0.2
1.0
1.1
1.2
1.3
1.4
October-2016
Preliminary version
January-2017
Updated tables 2, 5 and 6
March-2017
Released version
May-2017
Updated SKU names
June-2017
Updated performance targets, SKU ID in ext_CSD
July-2017
Updated ext_CSD MAX_ENH_SIZE_MULT
August-2017
Updated drawing marking
SanDisk® general policy does not recommend the use of its products in life support applications where in a failure or
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products in life support applications assumes all risk of such use and indemnifies SanDisk against all damages. See “Disclaimer
of Liability.”
This document is for information use only and is subject to change without prior notice. SanDisk assumes no responsibility for
any errors that may appear in this document, nor for incidental or consequential damages resulting from the furnishing,
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SanDisk provides this information, and any related samples, products, and documentation (collectively the “Materials”) solely
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or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under, or in connection
with, the Materials (including your use of the Materials), including for any direct, indirect, special, incidental, or consequential
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All parts of the SanDisk documentation are protected by copyright law and all rights are reserved. SanDisk and the SanDisk logo
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©2017 Western Digital Corporation or its affiliates. All rights reserved. SanDisk is a trademark of Western Digital Corporation or
its affiliates, registered in the United States and other countries. All other trademarks are the property of their respective
holder(s).
© 2017 SanDisk – a Western Digital brand
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DOC-56-34-01460
Confidential
TABLE OF CONTENTS
SanDisk® iNAND 7250 e.MMC 5.1+ HS400 I/F data sheet
1.
Introduction ......................................................................................................................... 5
1.1. General Description ...................................................................................................... 5
1.2. Plug-and-Play Integration ................................................................................................. 6
1.3. Feature Overview ......................................................................................................... 7
1.4. MMC bus and Power Lines ........................................................................................... 8
1.4.1. Bus operating conditions ................................................................................................. 8
2. e.MMC Selected Features Overview ................................................................................ 10
2.1. HS400 Interface .......................................................................................................... 11
2.2. Enhanced User Data Area (EUDA) ............................................................................. 11
2.3. Extended Partitions Attribute (eGPP) .......................................................................... 11
2.4. Field Firmware Upgrade (FFU) ................................................................................... 11
2.5. Cache ......................................................................................................................... 12
2.6. Discard ....................................................................................................................... 12
2.7. Power off Notifications ................................................................................................ 12
2.8. Packed Commands .................................................................................................... 12
2.9. Boot Partition .............................................................................................................. 12
2.10. RPMB Partition ........................................................................................................... 12
2.11. Automatic Sleep Mode ................................................................................................ 12
2.12. Sleep (CMD5) ............................................................................................................. 13
2.13. Enhanced Reliable Write ............................................................................................ 13
2.14. Sanitize ...................................................................................................................... 13
2.15. Secure Erase .............................................................................................................. 13
2.16. Secure Trim ................................................................................................................ 14
2.17. Partition Management................................................................................................. 14
2.18. Device Health ............................................................................................................. 14
2.19. EOL Status ................................................................................................................. 14
2.20. Enhanced Write Protection ......................................................................................... 14
2.21. High Priority Interrupt (HPI)......................................................................................... 15
2.22. H/W Reset .................................................................................................................. 15
2.23. Host-Device Synchronization Flow (Enhanced STROBE) ........................................... 15
2.24. Command-Queue ....................................................................................................... 15
3. Product Specifications ..................................................................................................... 16
3.1. Typical Power Requirements ...................................................................................... 16
© 2017 SanDisk – a Western Digital brand
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Confidential
SanDisk® iNAND 7250 e.MMC 5.1+ HS400 I/F data sheet
3.2. Operating Conditions .................................................................................................. 17
3.2.1. Operating and Storage Temperature Specifications ..................................................... 17
3.2.2. Moisture Sensitivity ........................................................................................................ 17
3.3. Reliability .................................................................................................................... 18
3.5. Typical System Performance ...................................................................................... 19
4. Physical Specifications .................................................................................................... 20
5.
Interface Description ......................................................................................................... 22
5.1. MMC I/F Ball Array ..................................................................................................... 22
5.2. Pins and Signal Description ........................................................................................ 23
5.3. Registers value ........................................................................................................... 24
5.3.1. OCR Register................................................................................................................. 24
5.3.2. CID Register .................................................................................................................. 24
5.3.3. DSR Register ................................................................................................................. 24
5.3.4. CSD Register ................................................................................................................. 25
5.3.5. EXT_CSD Register ........................................................................................................ 26
5.4. User Density ............................................................................................................... 31
6. HW Application Guidelines ............................................................................................... 32
6.1. Design Guidelines ...................................................................................................... 32
6.2. Capacitor Selection & Layout Guidelines .................................................................... 33
6.3. Reference Schematics ................................................................................................ 35
7. Propriety iNAND 7250 feature overview .......................................................................... 36
7.1. Smart Partitioning ....................................................................................................... 36
7.2. Manual Refresh .......................................................................................................... 36
7.3. Boot & RPMB resize ................................................................................................... 36
7.4. One Time Programmable Register for Custom ID ....................................................... 37
7.5. Device Report & Advanced Health Status................................................................... 37
7.5.1. Device Report fields ....................................................................................................... 37
7.5.2. Advanced Health Status Fields...................................................................................... 38
7.6. Power-Loss indications ............................................................................................... 39
7.6.1. Unstable Power-Supply indications ............................................................................... 39
8. Marking .............................................................................................................................. 44
9. Ordering Information ........................................................................................................ 45
How to Contact Us .................................................................................................................. 46
© 2017 SanDisk – a Western Digital brand
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DOC-56-34-01460
1. INTRODUCTION
SanDisk iNAND 7250 e.MMC 5.1 HS400 I/F data sheet
1.1. General Description
Overview The SanDisk® Industrial iNAND 7250 is an Embedded Flash Drive (EFD) designed for
connected devices in Industrial, Industrial IoT, and other IoT applications. This includes
applications such as security cameras, commercial drones, networking equipment, IoT
gateways, system on modules (SOM), and others. The Industrial iNAND 7250 enables
manufacturers to bring the benefits of flash rapid boot-up, high reliability, robustness,
consistent performance as well as many proprietary features to these new applications. The
Industrial iNAND 7250 utilizes an LDPC ECC engine and MLC memory to provide a robust, high
performance, high quality and high endurance product. The LDPC engine significantly improves
error correction capabilities enabling longer device lifetime and an increased ability to handle
operations at high temperature. The MLC memory is optimized versus standard MLC memory
to offer better endurance over the life of the memory, providing more design margin, and also
leading to a lower uncorrectable bit-error rate (UBER) at any given point over the life of the
device.
The SanDisk Industrial iNAND 7250 was designed with a specific focus on the Industrial market.
All SanDisk Industrial grade products go through extensive testing, and are part of a long-term,
stable roadmap, reducing the complexity and number of qualification cycles that a
manufacturer may need to perform. The Industrial iNAND 7250 is qualified to temperature
ranges from -40oC up to 85oC ambient.
The Industrial iNAND 7250 is available from 8GB to 64GB of capacity and supports the e.MMC
5.1 interface. Highlighted features include extended operating temperature support, advanced
health status, automatic and manual data refresh, RPMB and Boot partition resize, flexible
EUDA and fast boot mode. Data reliability and product life is improved significantly by the
internal refresh feature combined with MLC memory and LDPC ECC engine. Industrial iNAND
7250 also provides 3.3V IO support for legacy designs and hence is suitable for upgrading old
systems.
Architecture The Industrial iNAND 7250 combines an embedded flash controller with Multi-
level Cell NAND flash technology enhanced by SanDisk’s embedded flash management software
running as firmware on the flash controller. Industrial iNAND 7250 employs an industry-
standard e.MMC 5.1 interface featuring Command-Queue, HS400 interface, FFU, as well as
legacy e.MMC 4.51 features such as power off notifications, packed commands, Cache, boot /
RPMB partitions, HPI, and HW reset, making it an optimal device for both reliable code and data
storage.
Like other SanDisk iNAND products, the Industrial iNAND 7250 offers plug-and-play integration
and support for multiple NAND technology transitions.
The Industrial iNAND 7250 architecture and embedded firmware fully emulates a hard disk to
the host processor, enabling read/write operations that are identical to a standard, sector-
based hard drive. In addition, SanDisk firmware employs patented methods, such as virtual
© 2017 SanDisk – a Western Digital brand
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mapping, dynamic and static wear-leveling, and automatic block management to ensure high
data reliability and maximizing flash life expectancy.
The Industrial iNAND 7250 also includes an intelligent controller, which manages interface
protocols, data storage and retrieval, error correction code (ECC) algorithms, defect handling
and diagnostics, power management and clock control.
Combining high performance with features for easy integration and exceptional reliability, the
Industrial iNAND 7250 is an EFD designed to exceed the demands of both manufacturers and
their customers.
1.2. Plug-and-Play Integration
iNAND’s optimized architecture eliminates the need for complicated software integration and
testing processes thereby enabling plug-and-play integration into the host system. The
replacement of one iNAND device with another of a newer generation requires virtually no
changes to the host. This allows manufacturers to adopt advanced NAND Flash technologies
and update product lines with minimal integration or qualification efforts.
The Industrial iNAND 7250 features a MMC interface that allows for easy integration regardless
of the host (chipset) type used. All device and interface configuration data (such as maximum
frequency and device identification) are stored on the device.
With JEDEC compatible form factors measuring 11.5x13mm (153 balls) for all capacities, the
Industrial iNAND 7250 is ideally suited for a wide variety of Industrial subsystems where PCB
space may be limited.
Figure 1 shows a block diagram of the SanDisk Industrial iNAND 7250 with MMC Interface.
MMC Bus
Interface
SanDisk iNAND
Single Chip
controller
Data In/Out
Flash
Memory
Control
Figure 1 - SanDisk Industrial iNAND 7250 with MMC Interface Block Diagram
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1.3. Feature Overview
SanDisk Industrial iNAND 7250, with MMC interface, includes the following features:
Memory controller and NAND flash
Mechanical design that complies with JEDEC Specifications with specific optimizations for
industrial applications
Offered in three TFBGA packages of e.MMC 5.1
o 11.5mm x 13mm x 0.8mm (8GB-16GB)
o 11.5mm x 13mm x 1.0mm (32GB)
o 11.5mm x 13mm x 1.2mm (64GB)
Operating temperature range: –25°C to +85°C and –40°C to +85°C ambient
Dual power system
Core voltage (VCC) 2.7-3.6 V
I/O (VCCQ) voltage, either: 1.7-1.95V or 2.7-3.6V
8GB - 64GB of data storage
Supports three data bus widths: 1bit (default), 4bit, 8bit
Complies with e.MMC Specification Ver. 5.1 HS400
Variable clock frequencies of 0-20 MHz, 0-26 MHz (default), 0-52 MHz (high-speed), 0-200
MHz SDR (HS200), 0-200 MHz DDR (HS400)
Up to 400 MB/sec bus transfer rate, using 8 parallel data lines at 200 MHz, HS400 Mode
High data integrity with MLC memory, advanced LDPC ECC engine, automatic and manual
refresh
Advanced health status, fast boot, flexible EUDA, smart partitioning
Up to 3K P/E cycles on MLC and 30K P/E cycles on SLC with 1 year data retention @ 55°C
and at least 10 year data retention @ 55°C for fresh devices
© 2017 SanDisk – a Western Digital brand
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1.4. MMC bus and Power Lines
SanDisk iNAND 7250 supports the MMC interface protocol. For more details regarding these
buses refer to JEDEC standard No. JESD84-B51.
The iNAND bus has the following communication and power lines:
CMD: Command is a bidirectional signal. The host and iNAND operate in two modes, open
drain and push-pull.
DAT0-7: Data lines are bidirectional signals. Host and iNAND operate in push-pull mode.
CLK: Clock input.
RST_n: Hardware Reset Input.
VCCQ: Power supply line for host interface.
VCC: Power supply line for internal flash memory.
VDDi: iNAND’s internal power node, not the power supply. Connect 0.1uF capacitor from
VDDi to ground.
VSS, VSSQ: Ground lines.
RCLK: Data strobe.
VSF: Vendor specific functions used for debugging purposes.
1.4.1. Bus operating conditions
Table 1 - Bus operating conditions
Parameter
Peak voltage on all lines
Input Leakage Current (before initializing
and/or connecting the internal pull-up
resistors)
Input Leakage Current (after changing the
bus width and disconnecting the internal
pull-up resistors)
Output Leakage Current (before initializing
and/or connecting the internal pull-up
resistors)
Output Leakage Current (after changing
the bus width and disconnecting the
internal pull-up resistors)
Min
-0.5
-100
Max
VCCQ+0.5
100
-2
2
-100
100
-2
2
Unit
V
µA
µA
µA
µA
© 2017 SanDisk – a Western Digital brand
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