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DS3231中文数据手册.pdf

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    19-5170; Rev 8; 7/10 高精度、I2C接口、集成RTC/TCXO/晶体 ____________________________________概述 DS3231 I2C (RTC) (TCXO) DS3231 16 300mil SO RTC 31 24 AM/PM 12 I2C VCC RST μP _________________________________ 应用 GPS ____________________________________特性 ♦ 0°C 至 +40°C 范围内时钟精度为 ±2ppm ♦ -40°C 至 +85°C 范围内时钟精度为 ±3.5ppm ♦ 为连续计时提供备用电池输入 ♦ 工作温度范围 商用级：0°C 至 +70°C 工业级：-40°C 至 +85°C ♦ 低功耗 ♦ 实时时钟提供秒、分、时、星期、日期、月、 年信息，并提供有效期到 2100 年的闰年补偿 ♦ 两个日历闹钟 ♦ 可编程方波输出 ♦ 快速(400kHz) I2C 接口 ♦ 3.3V 工作电压 ♦ 数字温度传感器输出：精度为 ±3°C ♦ 老化修正寄存器 ♦ RST 输出/手动复位去抖输入 ♦ 通过保险商试验机构(UL)认证 ________________________________定购信息 PART DS3231S# DS3231SN# TEMP RANGE 0°C to +70°C -40°C to +85°C PIN-PACKAGE 16 SO 16 SO #RoHSRoHS JESD97 e3 #RoHS 引脚配置在数据资料的最后给出。 ________________________________________________________________________典型工作电路 VCC SCL SDA RST μP VCC RPU = tR/CB RPU RPU PUSHBUTTON RESET VCC VCC DS3231 GND INT/SQW 32kHz VBAT N.C. N.C. N.C. N.C. SCL SDA RST N.C. N.C. N.C. N.C. AVAILABLE本文是英文数据资料的译文，文中可能存在翻译上的不准确或错误。如需进一步确认，请在您的设计中参考英文资料。有关价格、供货及订购信息，请联络Maxim亚洲销售中心：10800 852 1249 (北中国区)，10800 152 1249 (南中国区)，或访问Maxim的中文网站：china.maximintegrated.com。DS3231
    高精度、I2C接口、集成RTC/TCXO/晶体 ABSOLUTE MAXIMUM RATINGS Voltage Range on VCC, VBAT, 32kHz, SCL, SDA, RST, INT/SQW Relative to Ground.............................-0.3V to +6.0V Junction-to-Ambient Thermal Resistance (θJA) (Note 1)....73°C/W Junction-to-Case Thermal Resistance (θJC) (Note 1) ......23°C/W Operating Temperature Range Storage Temperature Range ...............................-40°C to +85°C Lead Temperature (soldering, 10s) .................................+260°C Soldering Temperature (reflow, 2 times max) Lead(Pb)-free...............................................................+260°C Containing lead(Pb).....................................................+240°C (See the Handling, PC Board Layout, and Assembly section.) (noncondensing) .............................................-40°C to +85°C Junction Temperature......................................................+125°C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to china.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS (TA = TMIN to TMAX, unless otherwise noted.) (Notes 2, 3) PARAMETER SYMBOL CONDITIONS Supply Voltage Logic 1 Input SDA, SCL Logic 0 Input SDA, SCL VCC VBAT VIH VIL TYP 3.3 3.0 MIN 2.3 2.3 0.7 x VCC -0.3 MAX 5.5 5.5 VCC + 0.3 0.3 x VCC UNITS V V V V ELECTRICAL CHARACTERISTICS (VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC = 3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 2, 3) PARAMETER SYMBOL CONDITIONS MIN TYP Active Supply Current ICCA (Notes 4, 5) Standby Supply Current ICCS Temperature Conversion Current ICCSCONV Power-Fail Voltage Logic 0 Output, 32kHz, INT/SQW, SDA Logic 0 Output, RST Output Leakage Current 32kHz, INT/SQW, SDA Input Leakage SCL RST Pin I/O Leakage VBAT Leakage Current (VCC Active) VPF VOL VOL ILO ILI IOL IBATLKG VCC = 3.63V VCC = 5.5V VCC = 3.63V VCC = 5.5V I2C bus inactive, 32kHz output on, SQW output off (Note 5) I2C bus inactive, 32kHz VCC = 3.63V output on, SQW output off VCC = 5.5V IOL = 3mA IOL = 1mA Output high impedance RST high impedance (Note 6) 2.45 2.575 -1 -1 -200 0 25 MAX 200 300 110 170 575 650 2.70 0.4 0.4 +1 +1 +10 100 UNITS μA μA μA V V V μA μA μA nA DS32312Maxim Integrated
    高精度、I2C接口、集成RTC/TCXO/晶体 ELECTRICAL CHARACTERISTICS (continued) (VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC = 3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 2, 3) PARAMETER SYMBOL CONDITIONS MIN Output Frequency fOUT VCC = 3.3V or VBAT = 3.3V Frequency Stability vs. Temperature (Commercial) Frequency Stability vs. Temperature (Industrial) f/fOUT f/fOUT VCC = 3.3V or VBAT = 3.3V, aging offset = 00h VCC = 3.3V or VBAT = 3.3V, aging offset = 00h 0°C to +40°C >40°C to +70°C -40°C to <0°C 0°C to +40°C >40°C to +85°C Frequency Stability vs. Voltage f/V Trim Register Frequency Sensitivity per LSB f/LSB Specified at: -40°C +25°C +70°C +85°C Temperature Accuracy Crystal Aging Temp f/fO VCC = 3.3V or VBAT = 3.3V After reflow, not production tested First year 0–10 years -3 TYP 32.768 1 0.7 0.1 0.4 0.8 UNITS kHz ppm ppm ppm/V ppm MAX ±2 ±3.5 ±3.5 ±2 ±3.5 +3 °C ±1.0 ±5.0 ppm ELECTRICAL CHARACTERISTICS (VCC = 0V, VBAT = 2.3V to 5.5V, TA = TMIN to TMAX, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP Active Battery Current IBATA EOSC = 0, BBSQW = 0, SCL = 400kHz (Note 5) VBAT = 3.63V VBAT = 5.5V MAX 70 150 Timekeeping Battery Current IBATT Temperature Conversion Current IBATTC Data-Retention Current IBATTDR EOSC = 0, BBSQW = 0, EN32kHz = 1, SCL = SDA = 0V or SCL = SDA = VBAT (Note 5) VBAT = 5.5V VBAT = 3.63V EOSC = 0, BBSQW = 0, SCL = SDA = 0V or SCL = SDA = VBAT EOSC = 1, SCL = SDA = 0V, +25°C VBAT = 3.63V VBAT = 5.5V 0.84 3.0 1.0 3.5 575 650 100 UNITS μA μA μA nA DS32313Maxim Integrated3
    高精度、I2C接口、集成RTC/TCXO/晶体 AC ELECTRICAL CHARACTERISTICS (VCC = VCC(MIN) to VCC(MAX) or VBAT = VBAT(MIN) to VBAT(MAX), VBAT > VCC, TA = TMIN to TMAX, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS SCL Clock Frequency Bus Free Time Between STOP and START Conditions Hold Time (Repeated) START Condition (Note 7) Low Period of SCL Clock High Period of SCL Clock Data Hold Time (Notes 8, 9) Data Setup Time (Note 10) START Setup Time Rise Time of Both SDA and SCL Signals (Note 11) Fall Time of Both SDA and SCL Signals (Note 11) fSCL tBUF tHD:STA tLOW tHIGH tHD:DAT tSU:DAT tSU:STA tR tF Setup Time for STOP Condition tSU:STO Capacitive Load for Each Bus Line Capacitance for SDA, SCL Pulse Width of Spikes That Must Be Suppressed by the Input Filter Pushbutton Debounce Reset Active Time Oscillator Stop Flag (OSF) Delay Temperature Conversion Time CB CI/O tSP PBDB tRST tOSF tCONV Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode Fast mode Standard mode (Note 11) (Note 12) POWER-SWITCH CHARACTERISTICS (TA = TMIN to TMAX) MIN 100 0 1.3 4.7 0.6 4.0 1.3 4.7 0.6 4.0 0 0 100 250 0.6 4.7 20 + 0.1CB 20 + 0.1CB 0.6 4.7 TYP 10 30 250 250 100 125 MAX 400 100 UNITS kHz 0.9 0.9 300 1000 300 300 400 200 μs μs μs μs μs ns μs ns ns μs pF pF ns ms ms ms ms PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS VCC Fall Time; VPF(MAX) to VPF(MIN) VCC Rise Time; VPF(MIN) to VPF(MAX) Recovery at Power-Up tVCCF tVCCR tREC (Note 13) 300 0 250 300 μs μs ms DS32314Maxim Integrated
    高精度、I2C接口、集成RTC/TCXO/晶体 ___________________________________________________________________ 按钮复位时序 RST PBDB tRST ___________________________________________________________________ 电源开关时序 VCC VPF(MAX) VPF(MIN) RST tVCCF VPF VPF tVCCR tREC DS32315Maxim Integrated5
    高精度、I2C接口、集成RTC/TCXO/晶体 ______________________________________________________ I 2C串行总线上的数据传输 SDA SCL tBUF tLOW tHD:STA tR STOP START NOTE: TIMING IS REFERENCED TO VIL(MAX) AND VIH(MIN). tF tHIGH tHD:DAT tSU:DAT tHD:STA tSP tSU:STA REPEATED START tSU:STO WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data. Note 2: Limits at -40°C are guaranteed by design and not production tested. Note 3: All voltages are referenced to ground. Note 4: Note 5: Current is the averaged input current, which includes the temperature conversion current. Note 6: The RST pin has an internal 50kΩ (nominal) pullup resistor to VCC. Note 7: After this period, the first clock pulse is generated. Note 8: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIH(MIN) of the SCL signal) ICCA—SCL clocking at max frequency = 400kHz. to bridge the undefined region of the falling edge of SCL. Note 9: The maximum tHD:DAT needs only to be met if the device does not stretch the low period (tLOW) of the SCL signal. Note 10: A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT ≥ 250ns must then be met. This is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line tR(MAX) + tSU:DAT = 1000 + 250 = 1250ns before the SCL line is released. Note 11: CB—total capacitance of one bus line in pF. Note 12: The parameter tOSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of 0.0V ≤ VCC ≤ VCC(MAX) and 2.3V ≤ VBAT ≤ 3.4V. Note 13: This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, tREC is bypassed and RST immedi- ately goes high. The state of RST does not affect the I2C interface, RTC, or TCXO. DS32316Maxim Integrated
    高精度、I2C接口、集成RTC/TCXO/晶体 ____________________________________________________________________ 典型工作特性 (VCC = +3.3V, TA = +25°C, unless otherwise noted.) ) A μ ( S C C I ) A μ ( T A B I 150 125 100 75 50 25 0 1.0 0.9 0.8 0.7 0.6 STANDBY SUPPLY CURRENT vs. SUPPLY VOLTAGE BSY = 0, SCL = SDA = VCC RST ACTIVE 1 0 c o t 1 3 2 3 S D 2.0 2.5 3.0 4.0 3.5 VCC (V) 4.5 5.0 5.5 SUPPLY CURRENT vs. TEMPERATURE VCC = 0, EN32kHz = 1, BSY = 0, SDA = SCL = VBAT OR GND 3 0 c o t 1 3 2 3 S D -40 -15 10 35 60 85 TEMPERATURE (°C) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 60 50 40 30 20 10 0 -10 -20 -30 -40 SUPPLY CURRENT vs. SUPPLY VOLTAGE VCC = 0V, BSY = 0, SDA = SCL = VBAT OR VCC 2 0 c o t 1 3 2 3 S D EN32kHz = 1 EN32kHz = 0 2.3 3.3 4.3 5.3 VBAT (V) FREQUENCY DEVIATION vs. TEMPERATURE vs. AGING VALUE 4 0 c o t 1 3 2 3 S D 8 -33 0 32 127 -40 -15 10 35 60 85 TEMPERATURE (°C) ) A μ ( T A B I ) m p p ( I I N O T A V E D Y C N E U Q E R F ) m p p ( Y C N E U Q E R F A T L E D 20 0 -20 -40 -60 -80 -100 -120 -140 -160 -180 -200 DELTA TIME AND FREQUENCY vs. TEMPERATURE DS3231 toc05 CRYSTAL +20ppm TYPICAL CRYSTAL, UNCOMPENSATED CRYSTAL -20ppm DS3231 ACCURACY BAND -40 -30 -20 -10 0 10 20 30 40 TEMPERATURE (°C) 50 60 70 80 ) R A E Y / I N M ( E M I T A T L E D 0 -20 -40 -60 -80 -100 DS32317Maxim Integrated7
    高精度、I2C接口、集成RTC/TCXO/晶体 ___________________________________________________________________________ 方框图 OSCILLATOR AND CAPACITOR ARRAY X1 X2 CONTROL LOGIC/ DIVIDER SQUARE-WAVE BUFFER; INT/SQW CONTROL 1Hz VCC VBAT GND SCL SDA POWER CONTROL TEMPERATURE SENSOR ALARM, STATUS, AND CONTROL REGISTERS I2C INTERFACE AND ADDRESS REGISTER DECODE DS3231 1Hz CLOCK AND CALENDAR REGISTERS USER BUFFER (7 BYTES) VOLTAGE REFERENCE; DEBOUNCE CIRCUIT; PUSHBUTTON RESET 32kHz INT/SQW RST N N VCC N DS32318Maxim Integrated
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