INF-8077i.PDF

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SFF Committee

INF-8077i

10 Gigabit Small Form Factor Pluggable Module

Revision 3.1 April 2, 2003

SFF Committee information

Legal Disclaimer

Identification of defects

Publication History

Foreword

XFP Contributors

Acknowledgments

Table of Contents

Chapter 1: Scope of XFP specification 1

Chapter 2: XFP Electrical Interface 3

Chapter 3: High Speed Electrical Specification XFI 16

Chapter 4: XFP 2-Wire Interface Protocol 42

Chapter 5: Management interface 54

Chapter 6: Mechanical and Board definition 97

List of Figures

List of Tables

Chapter 1: Scope of XFP specification

1.1 Introduction

1.2 Requirements on Press announcements

Chapter 2: XFP Electrical Interface

2.1 Introduction

2.2 General Requirements

2.3 XFP Host Connector Definition

2.4 Low Speed Electrical Hardware Pins

2.4.1 Mod_NR

2.4.2 Mod_DeSel

2.4.3 Interrupt

2.4.4 TX_DIS

2.4.5 Mod_ABS

2.4.6 RX_LOS

2.4.7 P_Down/RST

2.4.7.1 Power Down Function

2.4.7.2 Reset Function

2.4.7.3 Module Behavior during Power Down and Reset

2.5 Low Speed Electrical Specifications

2.6 Timing Requirement of Control and Status I/O

2.7 XFP Power Requirement

2.7.1 Power Noise Output

2.7.2 Power Noise Susceptibility

2.7.3 Host Filtering

2.8 ESD

Chapter 3: High Speed Electrical Specification XFI

3.1 Introduction

3.2 XFI Applications Definition

3.3 XFI Termination and DC Blocking

3.4 XFI Compliance Channel

3.5 XFI ASIC/SerDes Specification

3.5.1 XFI ASIC/SerDes Transmitter Output Specifications at A (Informative)

3.5.2 XFI ASIC/SerDes Receiver Input Specifications at D (Informative)

3.6 XFI Host System Specification

3.6.1 XFI Host Transmitter Output Specifications at B

3.6.2 XFI Host Receiver Input Specifications at C

3.7 XFI Module Specifications

3.7.1 XFI Module Transmitter Input Specifications at B’

3.7.2 XFI Module Receiver Output Specifications at C’

3.8 Signal Conditioner

3.8.1 Telecom Module

3.8.2 Datacom Module

3.9 Reference Clock Specifications

3.9.1 Optional Synchronous CMU Clock

Chapter 4: XFP 2-Wire Interface Protocol

4.1 Introduction

4.2 XFP 2-Wire Timing Diagram

4.3 Memory Transaction Timing

4.4 Device Addressing and Operation

4.5 Read/Write Functionality

4.5.1 Packet Error Checking

4.5.2 XFP Memory Address Counter (Read and Write Operations)

4.5.3 Read Operations (Current Address Read)

4.5.4 Read Operations (Random Read)

4.5.5 Read Operations (Sequential Read)

4.5.6 Read Operation Packet Error Checking

4.5.7 Write Operations (Byte Write)

4.5.8 Write Operations (Sequential Write)

4.5.9 Write Operation Packet Error Checking

4.5.10 Write Operations (Acknowledge Polling)

Chapter 5: Management interface

5.0.1 Applicable Documents

5.1 Description of Lower Memory Map: Control Functions, Diagnostics, Table Access

5.2 Identifier

5.3 Signal Conditioner Control

5.4 2-Wire Serial Interface Checksum

5.5 Table Selection and Password Entry (Table 44)

5.6 Basic Monitoring Functions

5.7 Optional Variable Power Supply (VPS) Control

5.8 System BER Reporting

5.9 Wavelength Control

5.10 FEC Control

5.11 Interrupt System Logic

5.11.1 General Control and Status Bits

5.12 Timing for Soft Control and Status Functions

5.13 Description of Upper Memory Map Table 00h – Future Diagnostics Functions

5.14 Description of Upper Memory Map Table 01h – Serial ID Memory Map

5.15 Identifier

5.16 Extended Identifier

5.17 Connector

5.18 Interface Specification

5.19 Encoding

5.20 BR, Minimum

5.21 BR, maximum

5.22 Length (Standard single mode fiber)-km

5.23 Length (Extended Bandwidth 50 mm Multimode Fiber)

5.24 Length (50 um Multimode Fiber)

5.25 Length (62.5 um Multimode Fiber)

5.26 Length (Copper)

5.27 Device Technology

5.28 Vendor name

5.29 CDR Support

5.30 Vendor OUI

5.31 Vendor PN

5.32 Vendor Rev

5.33 Laser Wavelength

5.34 Laser Wavelength Tolerance

5.35 Maximum Case Temperature

5.36 CC_BASE

5.37 Power supply requirements

5.38 Vendor SN

5.39 Date Code

5.40 Diagnostic Monitoring Type

5.41 Enhanced Options

5.42 Auxiliary Monitoring

5.43 CC_EXT

5.44 Vendor Specific ID Field

5.45 Description of Upper Memory Map Table 02h – User EEPROM Data

5.46 Description of Upper Memory Map Tables 03h – 7Fh – Vendor Specific Functions

5.47 Description of Upper Memory Map Tables 80h – FFh – Reserved

Chapter 6: Mechanical and Board definition

6.1 Introduction

6.2 XFP Datums and Component Alignment

6.3 XFP Transceiver Package Dimensions

6.4 Mating of XFP Transceiver PCB to XFP Electrical Connector

6.5 Host Board Layout

6.6 Insertion, Extraction and Retention Forces for XFP Transceivers

6.7 Color Coding and Labeling of XFP Transceivers

6.8 Bezel and EMI Gasket Design for Systems Using XFP Transceivers

6.9 XFP Connector Mechanical Specifications

6.10 XFP Cage Assembly Dimensions

6.10.1 XFP Cage Housing

6.10.2 XFP Cage Rear EMI Gaskets

6.10.2.1 XFP Upper Rear EMI Gasket

6.10.2.2 Lower Rear EMI Gasket

6.10.2.3 XFP Intermediate Rear Cage EMI Gasket (Finger Stock)

6.10.3 XFP Cage Front Cage EMI Gasket (Finger Stock)

6.10.4 XFP Front Flange

6.11 XFP Heat Sink Clip Dimensions

6.12 An Example XFP Heat Sink

6.13 Environmental and Thermal

6.14 Dust/EMI Cover

Appendix A: Application Reference Model

A.1 ASIC/SerDes Compliance Testing

A.2 Host System Compliance Testing

A.3 XFP Module Compliance Testing

A.4 HOST SYSTEM COMPLIANCE TEST BOARD

A.4.1 Host System Compliance Board Material and Layer Stack-up

A.4.2 Host System Compliance Test Board Partlist

A.4.3 Schematic of Host System Compliance Test Board

A.4.4 Gerber file and S parameter measurements

A.5 XFP MODULE COMPLIANCE TEST BOARD

A.5.1 XFP Module Board Material and Layer Stack-up

A.5.2 XFP Module Compliance Board Partlist

A.5.3 Schematic of the XFP Compliance Test Board

A.5.4 Gerber files and Measured S-Parameters

Appendix B: XFI Channel Measurements and Modeling

B.1 System Overview

B.2 Design Guideline

B.3 Using System Simulation for Channel Modeling

Appendix C: Differential S-Parameters and TDR

C.1 Choosing S-Parameters vs TDR

C.2 Differential Impedance

C.3 4 Port Single-Ended S-Parameter Definition

C.4 2 Port Mixed Mode Differential S-Parameter Definition

Appendix D: Optimum Via Design

D.1 Vias

D.2 Single-ended Vias

D.3 Differential Vias

D.4 GSSG Differential Vias

Appendix E: Jitter Methodology and Measurement

E.1 Eye Mask Compliance

E.2 Non-DDJ Eye Mask

E.3 Stress Eye Test for RX Tolerance Testing

E.4 Jitter Peaking Specifications and Measurements

E.5 AC Common Mode Test

E.6 Termination Mismatch

E.7 Power supply noise testing methodology

E.7.1 Power Supply Noise compliance

E.7.2 Power Supply Noise Methodology

E.7.3 Power Supply Noise Methodology

Appendix F: Module Thermal Testing

F.1 Module Thermal Power Classes

F.2 Thermal Test Recommendation

F.3 Thermal Test Configuration

Information Speciﬁcation INF-8077i, Revision 3.1 SFF Committee documentation may be purchased in hard copy or electronic form. SFF speciﬁcations are available at ftp://ftp.seagate.com/sff SFF Committee INF-8077i 10 Gigabit Small Form Factor Pluggable Module Revision 3.1 April 2, 2003 Secretariat: SFF Committee Abstract: This speciﬁcation deﬁnes the electrical, management, and mechanical interfaces of the XFP module. The module is a hot pluggable small footprint serial-to-serial data-agnostic multirate optical transceiver, intended to support Telecom (SONET OC-192 and G.709 “OTU-2”) and Datacom applications (10 Gb/s Ethernet and 10 Gb/s Fibre Channel). Nominal data rates range from 9.95 Gb/s, 10.31 Gb/s, 10.52 Gb/s, 10.70 Gb/s, and the emerging 11.09 Gb/s. The modules support all data encodings for these technologies. The modules may be used to imple- ment single mode or multi-mode serial optical interfaces at 850 nm, 1310 nm, or 1550 nm. The XFP module design may use one of several different optical connectors. An adaptable heatsink option allows a single module design to be compatible with a variety of hosts. Support: This document was adopted by the XFP MSA and is provided to the SFF for distribution and as a source document for related SFF projects. Documentation: This document has been prepared according to the guidelines and agreements of the XFP MSA. The XFP MSA has the stated intention of encouraging broad and rapid industry adoption of the speciﬁcation. The XFP speciﬁcation and the technologies it uses may be offered to formal standards bodies to further support the adoption of the speciﬁcation. POINTS OF CONTACT: Technical Editor: Ali Ghiasi Broadcom Corporation 3151 Zanker Road San Jose, CA 95134 Voice: (408) 922-7423 EMail: aghiasi@broadcom.com SFF Chair I. Dal Allan 14426 Black Walnut Court Saratoga, CA 95070 Voice: (408) 867-6630 Fax: (408) 867-2115 Email: endlcom@acm.org XFP Chair: Robert Snively Brocade Communication Systems, Inc. 1745 Technology Drive San Jose, CA 95110 Voice: (408) 487-8135 EMail: rsnively@brocade.com XFP (10 Gbit pluggable module SFF Page i

Information Specification INF-8077i, Revision 3.0 EXPRESSION OF SUPPORT BY MANUFACTURERS The following member companies of the SFF Committee voted in favor of this industry specification. ENDL Hewlett Packard Sun Microsystems TriQuint Tyco AMP The following member companies of the SFF Committee voted to abstain onthis industry specification. Amphenol FCI/Berg Fujitsu CPA Hitachi Cable Madison Cable Molex Seagate Xyratex The user's attention is called to the statements of intellectual property rights and copyright in the XFP specification, page ii. By distribution of this Specification, no position is taken with respect to the validity of these statements or of any patent rights in connection therewith. The XFP adopter’s agreement, available from XFP Promoters, contains agreements with respect to intellectual property rights and other rights and responsibilities. XFP (10 Gigabit Small Form Factor Pluggable Module) SFF Page ii

Information Speciﬁcation INF-8077i, Revision 3.1 SFF Committee information If you are not a member of the SFF Committee, but you are interested in participating, the following principles have been reprinted here for your information. PRINCIPLES OF THE SFF COMMITTEE The SFF Committee is an ad hoc group formed to address storage industry needs in a prompt manner. When formed in 1990, the original goals were limited to deﬁning de facto mechanical envelopes within which disk drives can be developed to ﬁt compact computer and other small products. In November 1992, the SFF Committee objectives were broadened to encompass other areas which needed simi- lar attention, such as pinouts for interface applications, and form factor issues on larger disk drives. SFF is a forum for resolving industry issues that are either not addressed by the standards process or need an immediate solution. Documents created by the SFF Committee are expected to be submitted to bodies such as EIA (Electronic Indus- tries Association) or an ANSI Accredited Standards Committee. They may be accepted for separate standards, or incorporated into other standards activities. The principles of operation for the SFF Committee are not unlike those of an accredited standards committee. There are 3 levels of participation: - Attending the meetings is open to all, but taking part in discussions is limited to member companies, or those invited by member companies - The minutes and copies of material which are discussed during meetings are distributed only to those who sign up to receive documentation. - The individuals who represent member companies of the SFF Committee receive documentation and vote on issues that arise. Votes are not taken during meetings, only guidance on directions. All voting is by letter ballot, which ensures all members an equal opportunity to be heard. Material presented at SFF Committee meetings becomes public domain. There are no restrictions on the open mailing of material presented at committee meetings. In order to reduce disagreements and misunderstandings, copies must be provided for all agenda items that are discussed. Copies of the material presented, or revisions if completed in time, are included in the documentation mailings. The sites for SFF Committee meetings rotate based on which member companies volunteer to host the meetings. Meetings have typically been held during the INCITS T10 weeks. The meetings of the SFF Special Subject Work- ing Group on Transceivers have typically been held during INCITS T11 weeks. The funds received from the annual membership fees are placed in escrow, and are used to reimburse ENDL for the services to manage the SFF Committee. XFP (10 Gbit pluggable module SFF Page iii

Information Speciﬁcation INF-8077i, Revision 3.1 SFF Membership and Subscription application Membership includes voting privileges on SFF Specs under development. CD_Access Electronic documentation contains: - Minutes for the year-to-date plus all of last year - Email trafﬁc for the year-to-date plus all of last year - The current revision of all the SFF Speciﬁcations, as well as any previous revisions distributed during the current year. Meeting documentation contains: - Minutes for the current meeting cycle. - Copies of Speciﬁcations revised during the current meeting cycle. Each electronic document mailing obsoletes the previous mailing of that year e.g. July replaces May. To build a complete set of archives of all SFF documentation, retain the last SFF CD_Access mailing of each year. Name: __________________________________ Title: _________________________ Company: ______________________________________________________________ Address: _______________________________________________________________ _______________________________________________________________________ Phone: ____________________________ Fax: ________________________________ Email: _________________________________________________________________ Please register me with the SFF Committee for one year. ___ Voting Membership w/Electronic documentation $2,160 ___ Voting Membership w/Meeting documentation $1,800 ___ Non-voting Observer w/Electronic documentation $660 U.S. $760 Overseas ___ Non-voting Observer w/Meeting documentation $300 U.S. $400 Overseas Check Payable to SFF Committee for $_________ is Enclosed Please invoice me for $_________ on PO #: ___________________ MC/Visa/AmX______________________________________ Expires_________ Mail, FAX, or E-mail to: SFF Committee 14426 Black Walnut Ct. Saratoga, CA 95070 408-867-6630 408-867-2115Fx endlcom@acm.org XFP (10 Gbit pluggable module SFF Page iv

Information Speciﬁcation INF-8077i, Revision 3.1 Foreword for SFF documents: When 2 1/2" diameter disk drives were introduced, there was no commonality on external dimensions e.g. physical size, mounting locations, connector type, connector location, between vendors. The ﬁrst use of these disk drives was in speciﬁc applications such as laptop portable computers in which space was at a premium and time to market with the latest machine was an important factor. System integrators worked individually with vendors to develop the packaging. The result was wide diversity, and with space being such a major consideration in packaging, it was not possible to replace one vendor's drive with a competitive product. The desire to reduce disk drive sizes to even smaller dimensions such as 1.8" and 1.3" made it likely that devices would become even more constrained in dimensions because of a possibility that such small devices could be inserted into a socket, not unlike the method of retaining semiconductor devices. The problems faced by integrators, device suppliers, and component suppliers led to the formation of an industry ad hoc group to address the marketing and engineering considerations of the emerging new technology in disk drives. After two informal gatherings on the subject in the summer of 1990, the SFF Committee held its ﬁrst meet- ing in August. During the development of the form factor deﬁnitions, other activities were suggested because participants in the SFF Committee faced problems other than the physical form factors of disk drives. In November 1992, the mem- bers approved an expansion in charter to address any issues of general interest and concern to the storage indus- try. The SFF Committee became a forum for resolving industry issues that are either not addressed by the standards process or need an immediate solution. At the same time, the principle was adopted of restricting the scope of an SFF project to a narrow area, so that the majority of documents would be small and the projects could be completed in a rapid timeframe. If proposals are made by a number of contributors, the participating members select the best concepts and uses them to develop speciﬁcations which address speciﬁc issues in emerging storage markets. Those companies which have agreed to support a documented speciﬁcation are identiﬁed in the ﬁrst pages of each SFF Speciﬁcation. Industry consensus is not an essential requirement to publish an SFF Speciﬁcation because it is recognized that in an emerging product area, there is room for more than one approach. By making the documen- tation on competing proposals available, an integrator can examine the alternatives available and select the prod- uct that is felt to be most suitable. Suggestions for improvement of this document will be welcome. They should be sent to the SFF Committee, 14426 Black Walnut Ct, Saratoga, CA 95070. The suggestions should additionally be sent to the XFP Chair and Technical Editor. The development work on this speciﬁcation was done by the XFP Group, an industry MSA. XFP (10 Gbit pluggable module SFF Page v

Information Speciﬁcation INF-8077i, Revision 3.1 SFF Speciﬁcations There are several projects active within the SFF Committee. At the date of printing, document numbers had been assigned to the following projects. The status of Speciﬁcations is dependent on committee activities. F = Forwarded P = Published A = Approved C = Canceled The document has been approved by the members for forwarding to a formal standards body. The document has been balloted by members and is available as a published SFF Speci- ﬁcation. The document has been approved by ballot of the members and is in preparation as an SFF Speciﬁcation. The project was canceled, and no Speciﬁcation was Published. D = Development The document is under development at SFF. E = Expired e = electronic i = Information The document has been published as an SFF Speciﬁcation, and the members voted against re-publishing it when it came up for annual review. Used as a sufﬁx to indicate an SFF Speciﬁcation which has Expired but is still available in electronic form from SFF e.g. a speciﬁcation has been incorporated into a draft or pub- lished standard which is only available in hard copy. The document has no SFF project activity in progress, but it deﬁnes features in developing industry standards. The document was provided by a company, editor of an accredited standard in development, or an individual. It is provided for broad review (comments to the author are encouraged). s = submitted The document is a proposal to the members for consideration to become an SFF Speciﬁcation. Spec # SFF-8000 INF-8001i INF-8002i SFF-8003 SFF-8004 SFF-8005 SFF-8006 SFF-8007 SFF-8008 SFF-8009 SFF-8010 INF-8011i SFF-8012 SFF-8013 SFF-8014 SFF-8015 Rev E E E E E E E E 4.1 E E 3.0 E C E List of Speciﬁcations as of March 3, 2003 SFF Committee Information 44-pin ATA (AT Attachment) Pinouts for SFF Drives 68-pin ATA (AT Attachment) for SFF Drives SCSI Pinouts for SFF Drives Small Form Factor 2.5" Drives Small Form Factor 1.8" Drives Small Form Factor 1.3" Drives 2mm Connector Alternatives 68-pin Embedded Interface for SFF Drives Unitized Connector for Cabled Drives Small Form Factor 15mm 1.8" Drives ATA Timing Extensions for Local Bus 4-Pin Power Connector Dimensions ATA Download Microcode Command Unitized Connector for Rack Mounted Drives SCA Connector for Rack Mounted SFF SCSI Drives XFP (10 Gbit pluggable module SFF Page vi

Information Speciﬁcation INF-8077i, Revision 3.1 Spec # SFF-8016 SFF-8017 SFF-8018 SFF-8019 INF-8020i INF-8028i SFF-8029 SFF-8030 SFF-8031 SFF-8032 INF-8033i INF-8034i INF-8035i INF-8036i INF-8037i INF-8038i INF-8039i SFF-8040 SFF-8041 SFF-8042 SFF-8043 SFF-8045 SFF-8046 SFF-8047 SFF-8048 SFF-8049 INF-8050i INF-8051i INF-8052i SFF-8053 SFF-8054 INF-8055i SFF-8056 SFF-8057 SFF-8058 SFF-8059 SFF-8060 SFF-8061 SFF-8062 SFF-8065 Rev C E E E E E E 1.8 1.5 E E E E E E E 1.2 C C E 4.5 E C C E 1.0 E E 5.5 E C E E E 1.1 1.1 C List of Speciﬁcations as of March 3, 2003 Small Form Factor 10mm 2.5" Drives SCSI Wiring Rules for Mixed Cable Plants ATA Low Power Modes Identify Drive Data for ATA Disks up to 8 GB ATA Packet Interface for CD-ROMs - Errata to SFF-8020 Rev 2.5 - Errata to SFF-8020 Rev 1.2 SFF Committee Charter Named Representatives of SFF Committee Members SFF Committee Principles of Operation Improved ATA Timing Extensions to 16.6 MBs High Speed Local Bus ATA Line Termination Issues Self-Monitoring, Analysis & Reporting Technology ATA Signal Integrity Issues Intel Small PCI SIG Intel Bus Master IDE ATA Speciﬁcation Phoenix EDD (Enhanced Disk Drive) Speciﬁcation 25-pin Asynchronous SCSI Pinout SCA-2 Connector Backend Conﬁgurations VHDCI Connector Backend Conﬁgurations 40-pin MicroSCSI Pinout 40-pin SCA-2 Connector w/Parallel Selection 80-pin SCA-2 Connector for SCSI Disk Drives 40-pin SCA-2 Connector w/Serial Selection 80-pin SCA-2 Connector w/Parallel ESI 80-conductor ATA Cable Assembly Bootable CD-ROM Small Form Factor 3" Drives ATA Interface for 3" Removable Devices GBIC (Gigabit Interface Converter) Automation Drive Interface Connector SMART Application Guide for ATA Interface 50-pin 2mm Connector Unitized ATA 2-plus Connector Unitized ATA 3-in-1 Connector 40-pin ATA Connector SFF Committee Patent Policy Emailing drawings over the SFF Reﬂector Rolling Calendar of SSWGs and Plenaries 40-pin SCA-2 Connector w/High Voltage XFP (10 Gbit pluggable module SFF Page vii

Information Speciﬁcation INF-8077i, Revision 3.1 Spec # SFF-8066 SFF-8067 INF-8068i SFF-8069 INF-8070i SFF-8072 SFF-8073 INF-8074i SFF-8075 SFF-8076 INF-8077i SFF-8078 SFF-8080 SFF-8082 INF-8090i SFF-8101 SFF-8110 SFF-8111 SFF-8120 SFF-8200e SFF-8201e SFF-8212e SFF-8221 SFF-8222 SFF-8223 SFF-8225 SFF-8300 SFF-8301 SFF-8302e SFF-8323 SFF-8332e SFF-8337e SFF-8342e INF-8350i SFF-8400 SFF-8410 SFF-8411 SFF-8412 SFF-8415 SFF-8416 Rev C 3.0 1.0 E 1.3 1.2 C 1.0 1.0 - 3.0 E 5.4 C C 1.3 2.6 1.1 1.3 1.2 2.0 1.1 0.4 C 1.2 1.4 1.1 0.4 1.2 1.2 1.3 6.1 C 16.1 12.1 4.1 0.1 List of Speciﬁcations as of March 3, 2003 80-pin SCA-2 Connector w/High Voltage 40-pin SCA-2 Connector w/Bidirectional ESI Guidelines to Import Drawings into SFF Specs Fax-Access Instructions ATAPI for Rewritable Removable Media 80-pin SCA-2 for Fibre Channel Tape Applications 20-pin SCA-2 for GBIC Applications SFP (Small Formfactor Pluggable) Transceiver PCI Card Version of SFP Cage SFP Additional IDs XFP XFP-E ATAPI for CD-Recordable Media Labeling of Ports and Cable Assemblies ATAPI for DVD (Digital Video Data) 3 Gbs and 4 Gbs Signal Characteristics 5V Parallel 1.8" drive form factor 1.8" drive form factor (60x70mm) 1.8" drive form factor (78x54mm) 2 1/2" drive form factors (all of 82xx family) 2 1/2" drive form factor dimensions 2 1/2" drive w/SFF-8001 44-pin ATA Connector Pre-Aligned 2.5" Drive >10mm Form Factor 2.5" Drive w/SCA-2 Connector 2.5" Drive w/Serial Attachment Connector 2.5" Single Voltage Drive 3 1/2" drive form factors (all of 83xx family) 3 1/2" drive form factor dimensions 3 1/2" Cabled Connector locations 3 1/2" drive w/Serial Attachment Connector 3 1/2" drive w/80-pin SFF-8015 SCA Connector 3 1/2" drive w/SCA-2 Connector 3 1/2" drive w/Serial Unitized Connector 3 1/2" Packaged Drives VHDCI (Very High Density Cable Interconnect) High Speed Serial Testing for Copper Links High Speed Serial Testing for Backplanes HSOI (High Speed Optical Interconnect) Testing HPEI (High Performance Electrical Interconnect) HPEI Measurement of Bulk Cable XFP (10 Gbit pluggable module SFF Page viii

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