1 Introduction
1.1 Objectives
1.2 VITA 46 Overview
1.3 Terminology
1.3.1 Specification Key Words
1.3.2 VITA 46 Definitions
1.4 References
2 VITA 46 Compliance
3 System
3.1 Safety Ground
3.2 Power Supply
3.2.1 Capacity
3.2.1.1 Plug-In Module/Backplane Power Return Current Capacity
3.2.2 Voltage Levels
3.2.2.1 3U Primary Power Input
3.2.2.2 6U Primary Power Input
3.2.2.3 Auxiliary Power Inputs
3.2.2.3.1 3.3V_AUX
3.2.2.3.2 12V Auxiliary Supplies
3.2.3 Dielectric Separation
3.3 System Controller (SYS_CON)
3.4 System-wide Connections
3.4.1 Reference Clock (REF_CLK+/-)
3.4.1.1 Reference Clock Generator (Optional)
3.4.2 JTAG Pin Allocation
3.4.3 System Management Connections (Optional)
3.4.4 Non-Volatile Memory Read Only (Optional)
3.4.5 SYSRESET*
3.5 Status Indicators
3.6 Slot Type Indication
4 Common Requirements
4.1 Overview
4.2 Connectors
4.3 Form Factor and Outline
4.4 Alignment and Keying
4.4.1 Background and Assumptions
4.4.1.1 Philosophy
4.4.1.2 Backplane Key
4.4.1.3 Plug-in Module Key
4.4.2 Definitions
4.4.3 Keying Rules
4.5 Two Level Maintenance (Optional)
4.6 Connector Pin Definition - P0
4.7 Electrical Budgets for Protocol Standards
4.8 Signal Definition – P0
4.8.1 Power
4.8.1.1 High Voltage Power Inputs
4.8.1.1.1 6U High Voltage Power Input
4.8.1.1.2 6U Use of 48V for High Voltage Power Input
4.8.1.1.3 6U Use of 12V for High Voltage Power Input
4.8.1.1.4 3U High Voltage Power Input
4.8.1.2 Vs3
4.8.2 Geographical Addressing
4.8.3 System Controller (SYS_CON)
4.8.4 Reference Clock (Optional)
4.8.4.1 Reference Clock Generator (Optional)
4.8.4.2 Reference Clock Receiver (Optional)
4.8.5 Non-Volatile Memory Read Only (Optional)
4.8.6 Auxiliary Clock
4.8.7 JTAG Pin Allocation (Optional)
4.8.8 System Management Connections (Optional)
4.8.9 3.3V_AUX
4.8.10 12V_AUX (+ and -) (Optional)
4.8.11 SYSRESET*
4.8.12 Electrical standards
4.8.12.1 Low Current Open Collector Electrical Characteristics
4.8.12.2 High Current Open Collector Electrical Characteristics
4.8.12.3 Totem Pole Electrical Characteristics
4.8.12.4 Power Supply Monitor Electrical Characteristics
4.9 Connector Pin Definition - P1
4.9.1 Bussed GPIO (GDiscrete1)
4.9.2 P1-VBAT
4.9.3 P1-REF_CLK_SE
5 3U Module
5.1 Overview – 3U Module
5.2 Connectors – 3U Module
5.3 Alignment and Keying – 3U Module
5.4 Connector Pin Definition – 3U Module P2
5.4.1 Standard Connector P2
5.4.2 Recommended Location on 3U module for Application-Specific Connector
5.4.2.1 Differential Connector Allocation
5.4.2.2 Single-ended Connector Allocation
6 6U Module
6.1 Overview
6.2 Connectors
6.3 Alignment and Keying
6.4 Connector Pin Definition
6.4.1 Connector P2
6.4.1.1 Differential Connector Allocation
6.4.1.2 Single-ended Connector Allocation
6.4.2 Connector P3
6.4.2.1 Differential Connector Allocation
6.4.2.2 Single-ended Connector Allocation
6.4.3 Connector P4
6.4.3.1 Differential Connector Allocation
6.4.3.2 Single-ended Connector Allocation
6.4.4 Connector P5
6.4.4.1 Differential Connector Allocation
6.4.4.2 Single-ended Connector Allocation
6.4.5 Connector P6
6.4.5.1 Differential Connector Allocation
6.4.5.2 Single-ended Connector Allocation
6.4.6 Locations on 6U module for User Defined Application-Specific Connectors
7 Backplanes
7.1 Overview
7.1.1 Backplane Dimensions
7.1.2 Power Delivery
7.1.3 Connector Selection
7.2 VITA 46 slot numbering
7.3 Required Connections
7.3.1 Reference Clock (REF_CLK+/-)
7.3.2 The System Controller and the SYS_CON Signal
7.3.3 Auxiliary Clock
7.3.4 JTAG Pin Allocation
7.3.5 System Management Connections
7.3.6 Non-Volatile Memory Read Only
7.3.7 3.3V_AUX
7.3.8 12V_AUX (+ and -)
7.3.9 SYSRESET*
7.3.10 Bussed GPIO (GDiscrete1)
7.3.11 P1-REF_CLK_SE
7.3.12 P1-VBAT
7.4 Backplane Fabric Connections Electrical Requirements
7.5 Hybrid Backplane
7.6 Backplane Pin Mappings (Reference Only)
7.7 Five Slot Fabric Full Mesh Backplane Routing (Optional – Reference Only)
7.8 Backplane Keying
7.9 Preventing Damage from Backwards Plug-in Module Insertion
Appendix A Plug-in Module Assembly Drawings
Appendix B Backplane Printed Circuit Board Fabrication Drawings
Appendix C Plug-in Module Printed Circuit Board Fabrication Drawings
Appendix D Design Concepts to Prevent Damage from Backwards Air Cooled Plug-in Module Insertion