AQG324_Rel_02_1_2019_15May2019电动汽车试验标准.pdf-资料库

ECPE Guideline AQG 324 Release 02.1/2019 ECPE Guideline AQG 324 Qualification of Power Modules for Use in Power Electronics Converter Units in Motor Vehicles Release no.: Release date: Contact: 02.1/2019 15.05.2019 ECPE European Center for Power Electronics e.V. Dipl.-Phys. Thomas Harder Landgrabenstrasse 94 90443 Nuremberg, Germany Email thomas.harder@ecpe.org Phone (+49) 911 8102 880 Page 1 of 70

ECPE Guideline AQG 324 Release 02.1/2019 Preface This Guideline was prepared by the ECPE Working Group ´Automotive Power Module Qualification´ comprising ECPE member companies active in the automotive market. The original version is based on the supply specification LV 324 which has been developed by German automotive OEMs together with representatives from the power electronics supplier industry in a joint working group of ECPE and the German ZVEI association. The industrial standards referenced in this document have consciously been selected in the specific versions or release years. This means they represent the technical state of the art of the industry, which was not prepared for automotive applications, but has been deemed suitable with regard to automotive applications. In particular, this avoids automotive-relevant details being omitted during revisions with a focus on non- automotive applications. The official version of the Guideline released by the ECPE Working Group is a public document available on the ECPE web site (www.ecpe.org). Legal disclaimer No liability shall attach to ECPE e.V. or its directors, employees, member organizations or members of the responsible ECPE working group for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication of, use of, or reliance upon, this ECPE Guideline or any other ECPE publications. ECPE guidelines and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action ECPE does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the ECPE guidelines or publications. The ECPE Guideline AQG 324 is owned by ECPE European Center for Power Electronics e.V. This ECPE Guideline AQG 324 is licensed under a Creative Commons license (license model CC BY ND) - with credit and sharing under the same conditions. Page 2 of 70

ECPE Guideline AQG 324 Release 02.1/2019 Modifications compared to AQG 324 Version V01.05 dated 12.04.2018 (tracking of changes) Chapter Modification (compared to AQG 324 Version V01.05) cover page - abbreviation ´(PCU)´ removed from title - replace ´Version no.´ by ´Release no.´ 1 3 4.1 4.2 4.3 4.4 4.5 4.6 5.1 6.1.7 6.1.9 - add preamble (background and spirit of AQG 324) - modifications in scope (for clarification) - list of standards updated and complemented, German DIN standards mostly replaced by IEC - add a definition of ´Power Electronics Control Unit (PCU)´ in 4.1.1 and renumber the following sub-chapters - chapter headline modified in ´Abbreviations - general´ - table 4.1 headline modified - electrical and thermal abbreviations moved to table 4.2 resp. 4.3 - chapter headline modified in ´Abbreviations - electrical parameters´ - table 4.2 headline modified - further electrical abbreviations added in table 4.2 (VGE,min , ICE,max , VGS,min , IDS,max , VR,max , VBR,R , IR,max , Lp , Ri) - abbreviations in table 4.2 renamed: VS => VR , IS,leak => IR,leak , PV => PL - chapter headline modified in ´Abbreviations - thermal parameters´ - table 4.3 headline modified - further thermal abbreviations added (Qcool , Rth,j-c , Rth,j-s , Rth,j-a , Rth,j-f) - chapter headline modified in ´Abbreviations - humidity´ - chapter headline modified in ´Test times´ - 1st paragraph modified (automotive maturity of the power semi- conductors used within the module to be shown by a chip technology qualification) - sentence in 1st paragraph deleted - chapter on breakdown voltage added (new) - add ´on module level´ in the 1st sentence of chapter 6.1.9 6.1.10 - chapter renumbered (formerly 6.1.9) 6 7.3.2 8.3 8.4.2 - footnote e) added in table 6.1 - correct translation error in short circuit type 2: replace ´at the latest´ by ´at the earliest´ - Replace the chapter text by ´Withdrawn for the time being´ - caption of figure 8.2 modified: ´Vibration profile, sinusoidal for combustion engine-mounted parts´ 9.2.2 - Power Cycling (PCsec): modification in text related to Page 3 of 70

ECPE Guideline AQG 324 Release 02.1/2019 9.3.2 IEC 60749-34:2011, section 5: Test procedure - table 9.1 modified (incl. footnotes) - Power cycling (PCmin): modification in text related to IEC 60749-34:2011, section 5: Test procedure - table 9.4 modified (incl. footnotes) 9.4.2 - High-temperature storage: footnote in table 9.7 modified 9.4.3, 9.5.3, 9.6.3, 9.7.3, 9.8.3 - modification of the repeated text block on requirements: The 1st sentence is changed to ´The data sheet parameters …´ and shifted to the end of the paragraph. 9.5.2 9.6.1 9.6.2 9.7.2 - Low-temperature storage: footnote in table 9.8 modified - HTRB: text modified (e.g. one sentence deleted) - HTRB: text modified (e.g. referenced standards added, notes added, last two bullets in ´Failure criterion´ deleted) - table 9.9 modified (incl. footnotes) - HTGB: text modified (e.g. referenced standard added, last bullet in ´Failure criterion´ deleted) - table 9.10 modified (incl. footnotes) 9.7.2.1 - headline with chapter number deleted 9.8.2 - H3TRB: text modified (e.g. referenced standards added, note added, last bullet in ´Set of data records´ on corrosive gas atmosphere and the following note deleted, last bullets in ´Failure criterion´ deleted) - table 9.11 modified (incl. footnotes): introduction of two test variants with 80V and 80% of VCE,max, VDS,max, VR,max. with a footnote ´Recommended for SiC´ for the 80% variant. 9.8.2.1 - headline with chapter number deleted - last paragraph deleted (drying of DUTs by heating process is not permitted) Page 4 of 70

ECPE Guideline AQG 324 Release 02.1/2019 Contents Scope Overview Referenced standards Terms and definitions Definitions Abbreviations - general Abbreviations - electrical parameters Abbreviations - thermal parameters Abbreviations - humidity Test times Standard tolerances Standard values 7 9 11 12 12 14 15 16 17 17 18 18 19 General part 19 Prerequisites for chip usage in the module Technology qualification 19 Qualification of special designs (of power el. modules) based on discrete devices 20 20 Sampling rates and measured value resolutions 20 Design of insulation properties 21 Interface description Physical analysis 21 21 Procedure limitations Module test QM – 01 Module test Characterizing module testing QC-01 Determining parasitic stray inductance (Lp) QC-02 Determining thermal resistance (Rth value) QC-03 Determining short-circuit capability QC-04 Insulation test QC-05 Determining mechanical data Test sequence Environmental testing Use of generic data QE-01 Thermal shock test (TST) QE-02 Contactability (CO) QE-03 Vibration (V) QE-04 Mechanical shock (MS) Lifetime testing Use of generic data QL-01 Power cycling (PCsec) QL-02 Power cycle (PCmin) QL-03 High-temperature storage (HTS) QL-04 Low-temperature storage (LTS) QL-05 High-temperature reverse bias (HTRB) QL-06 High-temperature gate bias (HTGB) QL-07 High-humidity, high-temperature reverse bias (H3TRB) 22 22 26 26 26 29 32 34 35 36 36 36 38 38 44 46 46 46 51 56 57 58 60 61 Page 5 of 70 1 2 3 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 5 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 6 6.1 7 7.1 7.2 7.3 7.4 7.5 7.6 8 8.1 8.2 8.3 8.4 8.5 9 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8

ECPE Guideline AQG 324 Annex A Test flow chart (normative) Annex B Delta qualification matrix (normative) Annex C Documentation of tests (normative) Annex D References (informative) Annex E Typical aspects for physical analysis (informative) Release 02.1/2019 64 66 67 70 70 Page 6 of 70

ECPE Guideline AQG 324 Release 02.1/2019 1 Scope Preamble The AQG324 represents an industry guideline based on best practices and outstanding requirement engineering alignment through the automotive supply chain for power electronic converter units. It also acts as blueprint for further approaches within the automotive transformation to overcome innovation blocking hurdles and to close gaps in product capability or corresponding assurance processes. With the continuously increasing complexity of automotive electronics systems it is necessary to combine the expertise and to standardize approaches along the whole supply chain – different to outdated approaches where the alignment primarily occurred within a design hierarchical level, rather than from a complete system perspective. Consequently, a core achievement has been and still is to define the same technical language as was only possible through jointly define and tune terms, definitions and processes. This document defines requirements, test conditions and tests for validating properties, including the lifetime of power electronics modules and equivalent special designs based on discrete devices, for use in power electronics converter units (PCUs) of motor vehicles up to 3.5 t gross vehicle weight The described tests concern the module design as well as the qualification of devices on module level (i.e. the assembly), but not the qualification of semiconductor chips or manufacturing processes. These tests do not replace the qualification tests for complete vehicle PCUs. The qualification requirements shall be extended or adapted, as necessary, on use of technologically novel designs. The requirements, test conditions and tests listed in this document essentially refer to power modules based on Si power semiconductors while wide bandgap power semiconductors (e.g. SiC or GaN) are not yet fully covered. Future releases of this guideline will address these alternative semiconductor technologies, as well as novel assembly and interconnection technologies where other failure mechanisms become important compared to the todays technologies. The tests listed in this document also apply for validating power module properties when using a thermal interface between the power module and the cooling system on PCU- level, if this interface is not a part of the module structure as a result of the design. Corresponding tests must be conducted on a reference test setup recommended and documented by the module manufacturer, and any equivalent/generic test setups must be specified and documented. Note: If the thermal interface to the cooling system is implemented in the PCU and not in the power module, the module manufacturer cannot validate this interface. However, the module manufacturer must demonstrate the module qualification in case of a connection as per the specification (recommended reference that his module passes Page 7 of 70

ECPE Guideline AQG 324 Release 02.1/2019 test setups). The PCU manufacturer must ensure that the thermal interface selected by it complies with the specifications from the module manufacturer. Example: Validation of the thermal interface of power electronics modules, which are applied to a heat sink using a thermal interface material (TIM), is considered through specified reference test setups (including materials) in this document. Validation of the thermal interface of power electronics modules with a pin-fin base plate located directly in the cooling medium is considered in this document. Page 8 of 70

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