三星EMMC 5.1系列产品手册 datasheet.pdf

发布时间：2022-06-10 发布人：admin 分类：说明书资料大小：0.40M 资料格式：pdf 举报版权申诉

vestiges-10758556-16359648050087114891.pdf-第1页.png

第1页 / 共28页

vestiges-10758556-16359648050087114891.pdf-第2页.png

第2页 / 共28页

vestiges-10758556-16359648050087114891.pdf-第3页.png

第3页 / 共28页

vestiges-10758556-16359648050087114891.pdf-第4页.png

第4页 / 共28页

vestiges-10758556-16359648050087114891.pdf-第5页.png

第5页 / 共28页

vestiges-10758556-16359648050087114891.pdf-第6页.png

第6页 / 共28页

vestiges-10758556-16359648050087114891.pdf-第7页.png

第7页 / 共28页

vestiges-10758556-16359648050087114891.pdf-第8页.png

第8页 / 共28页

文本预览

SAMSUNG CONFIDENTIAL Rev. 1.0, Jul. 2015 KLMxGxJENB-B041 Samsung eMMC Product family eMMC 5.1 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other- wise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2015 Samsung Electronics Co., Ltd. All rights reserved. - 1 -

datasheet SAMSUNG CONFIDENTIAL Rev. 1.0 eMMC KLMxGxJENB-B041 Revision History Revision No. History 0.0 1.0 1. Initial issue 1. Customer Sample Draft Date Remark Editor Jun. 10, 2015 Target Jul. 15, 2015 Final S.M.Lee S.M.Lee IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. - 2 -

KLMxGxJENB-B041 Table Of Contents datasheet SAMSUNG CONFIDENTIAL Rev. 1.0 eMMC 1.0 PRODUCT LIST..........................................................................................................................................................4 2.0 KEY FEATURES.........................................................................................................................................................4 3.0 PACKAGE CONFIGURATIONS .................................................................................................................................5 3.1 153 Ball Pin Configuration ....................................................................................................................................... 5 3.1.1 11.5mm x 13mm x 0.8mm Package Dimension ............................................................................................... 6 3.1.2 11.5mm x 13mm x 1.0mm Package Dimension ............................................................................................... 6 3.1.3 11.5mm x 13mm x 1.2mm Package Dimension ............................................................................................... 7 3.2 Product Architecture ................................................................................................................................................ 8 4.0 HS400 mode...............................................................................................................................................................9 5.0 New eMMC5.1 Features .............................................................................................................................................10 5.1 Overview.................................................................................................................................................................. 10 5.2 Command Queuing ................................................................................................................................................. 10 5.2.1 CMD Set Description......................................................................................................................................... 10 5.2.2 New Response : QSR (Queue Status Register) .............................................................................................. 10 5.2.3 Send Status : CMD13 ...................................................................................................................................... 10 5.2.4 Mechanism of CMD Queue operation............................................................................................................... 11 5.2.5 CMD Queue Register description ..................................................................................................................... 11 5.3 Enhanced Strobe Mode........................................................................................................................................... 11 5.4 RPMB Throughput improve ..................................................................................................................................... 11 5.5 Secure Write Protection........................................................................................................................................... 12 6.0 Technical Notes ..........................................................................................................................................................13 6.1 S/W Algorithm.......................................................................................................................................................... 13 6.1.1 Partition Management ....................................................................................................................................... 13 6.1.1.1 Boot Area Partition and RPMB Area Partition ............................................................................................ 13 6.1.1.2 Enhanced Partition (Area) .......................................................................................................................... 13 6.1.2 Boot operation................................................................................................................................................... 14 6.1.3 User Density...................................................................................................................................................... 15 6.1.4 Auto Power Saving Mode.................................................................................................................................. 15 6.1.5 Performance...................................................................................................................................................... 16 7.0 REGISTER VALUE.....................................................................................................................................................17 7.1 OCR Register .......................................................................................................................................................... 17 7.2 CID Register ............................................................................................................................................................ 17 7.2.1 Product name table (In CID Register) ............................................................................................................... 17 7.3 CSD Register........................................................................................................................................................... 18 7.4 Extended CSD Register .......................................................................................................................................... 19 8.0 AC PARAMETER........................................................................................................................................................24 8.1 Timing Parameter .................................................................................................................................................... 24 8.2 Previous Bus Timing Parameters for DDR52 and HS200 mode are defined by JEDEC standard.......................... 24 8.3 Bus Timing Specification in HS400 mode ............................................................................................................... 24 8.3.1 HS400 Device Input Timing .............................................................................................................................. 24 8.3.2 HS400 Device Output Timing............................................................................................................................ 25 8.4 Bus signal levels...................................................................................................................................................... 26 8.4.1 Open-drain mode bus signal level..................................................................................................................... 26 8.4.2 Push-pull mode bus signal level eMMC ............................................................................................................ 26 9.0 DC PARAMETER .......................................................................................................................................................27 9.1 Active Power Consumption during operation .......................................................................................................... 27 9.2 Standby Power Consumption in auto power saving mode and standby state........................................................ 27 9.3 Sleep Power Consumption in Sleep State.............................................................................................................. 27 9.4 Bus Signal Line Load............................................................................................................................................... 28 IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. - 3 -

KLMxGxJENB-B041 datasheet INTRODUCTION SAMSUNG CONFIDENTIAL Rev. 1.0 eMMC SAMSUNG eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim- ple read and write to memory using MMC protocol v5.1 which is a industry standard. eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG eMMC supports 200MHz DDR – up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance. There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market. The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Samsung NAND flash and achieves optimal performance. 1.0 PRODUCT LIST [Table 1] Product List Capacities eMMC Part ID 16 GB 32 GB 64 GB 128 GB KLMAG1JENB-B041 KLMBG2JENB-B041 KLMCG4JENB-B041 KLMDG8JENB-B041 NAND Flash Type User Density (%) 128Gb MLC x 1 128Gb MLC x 2 128Gb MLC x 4 128Gb MLC x 8 91.0% 2.0 KEY FEATURES  embedded MultiMediaCard Ver. 5.1 compatible. Power System Package size Pin Configuration - Interface power : VDD (1.70V ~ 1.95V or 2.7V ~ 3.6V) - Memory power : VDDF (2.7V ~ 3.6V) 11.5mm x 13mm x 0.8mm 11.5mm x 13mm x 1.0mm 153FBGA 11.5mm x 13mm x 1.2mm  SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, HS200, HS400, Field Firmware Update. - Non-supported Features : Large Sector Size (4KB)  Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-eMMC systems)  Data bus width : 1bit (Default), 4bit and 8bit  MMC I/F Clock Frequency : 0 ~ 200MHz MMC I/F Boot Frequency : 0 ~ 52MHz  Temperature : Operation (-25C ~ 85C), Storage without operation (-40C ~ 85C)  Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V) IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. - 4 -

datasheet SAMSUNG CONFIDENTIAL Rev. 1.0 eMMC KLMxGxJENB-B041 3.0 PACKAGE CONFIGURATIONS 3.1 153 Ball Pin Configuration [Table 2] 153 Ball Information DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU NC DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU 1 2 3 DAT0 4 DAT1 5 DAT2 6 Vss 7 RFU 8 9 10 11 12 13 14 DAT3 DAT4 DAT5 DAT6 DAT7 VDDI Vss VDD RFU VDDF Vss VSF VSF VSF VDDF Vss Data Strobe Vss VSF VSF Vss VDDF RSTN RFU RFU Vss VDDF VSF VDD CMD CLK Vss VDD Vss VDD Vss VDD Vss VSF A B C D E F G H J K L M N P DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU DNU Pin NO A3 A4 A5 B2 B3 B4 B5 B6 K5 C6 M4 N4 P3 P5 E6 F5 J10 K9 C2 M5 H5 M6 J5 A6 C4 E7 G5 H10 K8 N2 N5 P4 P6 Name DAT0 DAT1 DAT2 DAT3 DAT4 DAT5 DAT6 DAT7 RSTN VDD VDD VDD VDD VDD VDDF VDDF VDDF VDDF VDDI CMD Data Strobe CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Figure 1. 153-FBGA  CLK : Clock input  Data Strobe : Newly assigned pin for HS400 mode. Data Strobe is generated from e.MMC to host. In HS400 mode, read data and CRC response are synchronized with Data Strobe.  CMD : A bidirectional signal used for device initialization and command transfers. Command operates in two modes, open-drain for initialization and push-pull for fast command transfer.  DAT0-7 : Bidirectional data channels. It operates in push-pull mode.  RST_n : H/W reset signal pin  VDDF(VCC) : Supply voltage for flash memory  VDD(VCCQ) : Supply voltage for memory controller  VDDi : Internal power node to stabilize regulator output to controller core logics  VSS : Ground connections IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. - 5 -

KLMxGxJENB-B041 datasheet 3.1.1 11.5mm x 13mm x 0.8mm Package Dimension 11.50±0.10 0.08 MAX SAMSUNG CONFIDENTIAL Rev. 1.0 eMMC 11.50±0.10 0.50 x 13 = 6.50 11 4 7 6 5 89 14 1312 10 #A1 INDEX MARK A B 3 2 1 #A1 (Datum A) . 0 1 0 ± 0 0 3 1 . . 0 1 0 ± 0 0 3 1 . (Datum B) 5 2 3 . A B C D E F G H J K L M N P 0 5 . 0 . 0 5 6 = 3 1 x 0 5 . 0 . 0 1 0 ± 0 0 3 1 . 153-0.30±0.05 3.25 0.50 0.2 M A B  0.22±0.05 0.70±0.10 TOP VIEW BOTTOM VIEW 3.1.2 11.5mm x 13mm x 1.0mm Package Dimension Figure 2. 11.5mm x 13mm x 0.8mm Package Dimension 11.50±0.10 11.50±0.10 0.08 MAX 0.50 x 13 = 6.50 11 4 7 6 5 89 14 1312 10 #A1 INDEX MARK A B 3 2 1 0 5 . 6 = 3 1 x 0 5 . 0 . 0 1 0 ± 0 0 . 3 1 #A1 (Datum A) . 0 1 0 ± 0 0 . 3 1 . 0 1 0 ± 0 0 . 3 1 (Datum B) 5 2 . 3 A B C D E F G H J K L M N P 0 5 . 0 153-0.30±0.05 3.25 0.50 0.2 M A B  0.22±0.05 0.90±0.10 TOP VIEW BOTTOM VIEW Figure 3. 11.5mm x 13mm x 1.0mm Package Dimension IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. - 6 -

KLMxGxJENB-B041 datasheet 3.1.3 11.5mm x 13mm x 1.2mm Package Dimension 11.50±0.10 0.08 MAX SAMSUNG CONFIDENTIAL Rev. 1.0 eMMC 11.50±0.10 0.50 x 13 = 6.50 11 4 7 6 5 89 14 1312 10 #A1 INDEX MARK A B 3 2 1 . 0 5 6 = 3 1 x 0 5 . 0 . 0 1 0 ± 0 0 3 1 . #A1 (Datum A) . 0 1 0 ± 0 0 3 1 . . 0 1 0 ± 0 0 3 1 . (Datum B) 5 2 3 . A B C D E F G H J K L M N P 0 5 . 0 153-0.30±0.05 3.25 0.50 0.2 M A B  0.22±0.05 1.10±0.10 TOP VIEW BOTTOM VIEW Figure 4. 11.5mm x 13mm x 1.2mm Package Dimension IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. - 7 -

KLMxGxJENB-B041 datasheet SAMSUNG CONFIDENTIAL Rev. 1.0 eMMC 3.2 Product Architecture - eMMC consists of NAND Flash and Controller. VDD (VCCQ) is for Controller power and VDDF (VCC)is for flash power l k c o B O / I D N A N VDDF CVDDF VDD CVDD RESET CReg Data Strobe CLK CMD DAT[7:0] l k c o B O / I C M M Core Regulator (Required for 3.3V VDD) VDDi Core Logic Block MMC Controller l k c o B O / I D N A N Control Signal Data Bus Figure 5. eMMC Block Diagram Parameter Voltage 1 Voltage 2 VDD cap. value VDDF cap. Value VDDi cap. Value Symbol VDD VDDF CVDD CVDDF CReg Min 1.70 2.7 2 2 1 Memory Max 1.95 3.6 - - 4.7 Unit V V uF uF uF IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. - 8 -

分享到：

赞收藏

资料库

三星EMMC 5.1系列产品手册 datasheet.pdf

相关推荐

存储

热门标签

最新资料