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® Data Sheet PCapØ2A Single-chip Solution for Capacitance Measurement Volume 1: General Data and Front-end Description May 29, 2014, Version 1.6 Document-No: DB_PCapØ2A_Vol1_en.pdf
® PCapØ2A P u b l i s h e d b y a c a m - m e s s e l e c t r o n i c g m b h ©acam-messelectronic gmbh 2014 L i m i t a t i o n o f L i a b i l i t y / W a r r a n t y / C o p y r i g h t The information and data contained in this document are believed to be accurate and reliable. acam assumes no liability for errors and gives no warranty representation or guarantee regarding the suitability of its products for any particular purpose due to these specifications. Any information and data which may be provided in the document can and do vary in different applications, and actual performance may vary over time. All operating parameters must be validated for each customer application by customers’ technical experts. The information contained therein may be protected by copyright, patent, trademark and/or other intellectual property rights of acam. acam does not assume responsibility for patent infringements or other rights of third parties which may result from its use. acam reserves the right to review this document and to make changes to the document’s content at any time without obligation to notify any person or entity of such revision or changes. “Preliminary” product information describes a product which is not in full production so that full information about the product is not available yet. Do not use our products in life-supporting systems, aviation and aerospace applications! Unless explicitly agreed to otherwise in writing between the parties, acam’ products are not designed, intended or authorized for use as components in systems intended for surgical implants into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the product could create a situation where personal injury or death could occur. No part of this publication may be reproduced, photocopied, stored on a retrieval system or transmitted without the express written consent of acam. All rights not expressly granted remain reserved by acam., ,  and  are registered trademarks of acam. All other brand and product names in this document are trademarks or service marks of their respective owners. S u p p o r t / C o n t a c t For a complete listing of Direct Sales, Distributor and Sales Representative contacts, visit the acam web site at: http://www.acam.de/sales/distributors/ For technical support you can contact the acam support team in the headquarters in Germany or the Distributor in your country. The contact details of acam in Germany are: support@acam.de or by phone +49-7244-74190. acam messelectronic gmbh - Friedrich-List-Str.4 - 76297 Stutensee - Germany - www.acam.de
PCapØ2A Content 1 Overview .................................................................................................. 1-1 1.1 Features ............................................................................................. 1-1 1.2 Applications ........................................................................................ 1-2 1.3 Blockdiagram ...................................................................................... 1-2 2 Characteristics & Specifications ................................................................... 2-1 2.1 Electrical Characteristics ....................................................................... 2-1 2.2 CDC Precision ..................................................................................... 2-2 2.3 RDC Precision ..................................................................................... 2-3 2.4 Oscillators .......................................................................................... 2-4 2.5 Power Consumption .............................................................................. 2-1 2.6 Package Information ............................................................................. 2-2 2.7 QFN Packages ..................................................................................... 2-4 3 Converter Frontend .................................................................................... 3-1 3.1 CDC, Capacitance-to-Digital Converter ...................................................... 3-1 3.2 CDC Compensation Options .................................................................... 3-7 3.3 CDC Important Parameters .................................................................... 3-9 3.4 RDC Resistance-to-Digital Converter ...................................................... 3-12 3.5 RDC Important Parameters .................................................................. 3-15 4 Interfaces (Serial & PDM/PWM) .................................................................. 4-1 4.1 4.2 4.3 4.4 Serial Interfaces................................................................................... 4-1 I²C Compatible Interface ........................................................................ 4-2 SPI interface ....................................................................................... 4-3 Special Timings .................................................................................... 4-5 4.5 OTP Timings ........................................................................................ 4-7 4.6 GPIO and PDM/PWM ......................................................................... 4-10 4.7 Interfaces Parameters ........................................................................ 4-15 5 Configuration & Read Registers .................................................................... 5-1 5.1 Configuration registers .......................................................................... 5-1 5.2 Configuration Registers in Detail ............................................................. 5-4 5.3 Oscillator Configuration ....................................................................... 5-20 5.4 Low Battery Detection (LBD) ................................................................ 5-21 5.5 Read Registers .................................................................................. 5-22 6 DSP & Memory.......................................................................................... 6-1 6.1 Memory Map ....................................................................................... 6-2 6.2 Memory Management ........................................................................... 6-3 6.3 Getting started .................................................................................... 6-5 acam messelectronic gmbh - Friedrich-List-Str.4 - 76297 Stutensee - Germany - www.acam.de 1
® PCapØ2A 7 Miscellaneous ........................................................................................... 7-1 7.1 Bug Report ......................................................................................... 7-1 7.2 7.3 I²C Bug with POR directly after rd/wr OTP/SRAM ...................................... 7-1 Limitation of Parameter2 ....................................................................... 7-1 7.4 History ............................................................................................... 7-2 2 acam messelectronic gmbh - Friedrich-List-Str.4 - 76297 Stutensee - Germany - www.acam.de
PCapØ2A 1 Overview PCapØ2Y is a capacitance-to-digital converter (CDC) with integrated digital signal processor (DSP) for on-chip data post-processing. Its front end is based on acam‘s patented ® principle. This conversion principle offers outstanding flexibility with respect to power consumption, resolution and speed. This datasheet describes PCapØ2A, in its basic converter functionality. The DSP description is reduced to the standard firmware that calculates pure capacitance ratios. A detail ed DSP and memory description is given in datasheet volume 2. PCapØ2 can be used for single and differential sensors in grounded and floating application. Compensation of internal and external stray capacitance is implemented as well as for parallel resistance. Additionally, the temperature can be measured by means of internal thermistors or external sensors. 1.1 Features  Digital measuring principle in CMOS  Dedicated ports for precision technology  Up to 8 capacitances in grounded mode  Up to 4 capacitances in floating mode temperature measurement (with Pt1000 sensors, the resolution is 0.005 K)  Serial interface (SPI or IIC compatible) (potential- free and with zero bias voltage)  Two 10/12/14/16 bit PDM/PWM outputs for analog interfaces   Integrated reference capacitance 1 pF to 31 pF  Self-boot capability  Single power supply (2.1 to 3.6 V), Integrated discharge resistors up to 1 MOhm integrated 1.8 V regulator for improved PSRR.  Compensation of internal (grounded) and  Integrated voltage measurement external parasitic capacities (floating)  Pre-charge option for slow charging  No need for a clock  RISC processor core using Harvard architec-  Self-test capability for differential sensors ture:  High resolution: up to 15 aF at 2.5 Hz and 10 pF base capacitance or, 17 bit resolution at 5 Hz with 100 pF base capacitance and 10 pF excitation  High measurement rate: up to 500 kHz  Extremely low current consumption possible: Down to 2.5 μA at 2.5 Hz with 13.1 bit resolution  128 x 48/24 bit RAM Data (80x48 free)  4k x 8 bit SRAM program memory for high-speed operation (40 to 85 MHz)  4k (+4k for ECC)x 8 bit OTP (one-time programmable) program memory for normal speed operation (up to 40 MHz)  128 byte EEPROM for calibration data and user data (serial number etc.)  High stability with temperature, low offset drift (down to 20 aF per Kelvin), low gain drift when all compensation options are activated. acam messelectronic gmbh - Friedrich-List-Str.4 - 76297 Stutensee - Germany - www.acam.de 1-1
PCapØ2A  Tilt sensors  Angle sensors  Wireless applications  Level sensors  Microphones  MEMS sensors ® 1.2 Applications  Humidity sensors  Position sensors  Pressure sensors  Force sensors  Acceleration sensors  Inclination sensors 1.3 Blockdiagram Figure 1-1 Blockdiagram 1-2 acam messelectronic gmbh - Friedrich-List-Str.4 - 76297 Stutensee - Germany - www.acam.de RDCUnit(Temperature)4x Raw dataCDCUnit(Capacitance)17x Raw dataRAM128 wordsDSP48 bitConfigurationReg. ParameterReg. OTP4k x 8 bitSRAM4k x 8 bitEEPROM128 byte1.8V voltageregulatorOscillator Control UnitExt. Quartz InternalIIC/SPIGPIOPDM/PWMPC0PC1PC2PC3PC4PC5PC6PC7PCAUXPT0PT1PT2REFIIC_ENINTNSCK_SCLSSN_PG0MISO_PG1MOSI_SDAPG2PG3PG4PG5VDD18VDD33OXIN OXOUTInternal:PC8PC910µF4.7µFPTOUT10nFC0G3.3V
PCapØ2A 2 Characteristics & Specifications 2.1 Electrical Characteristics 2.1.1 Absolute Maximum Ratings Supply voltage VDD-to-GND - 0.3 to 4.0 V Storage temperature Tstg - 55 to 150 °C ESD rating (HBM), each pin > 2 kV Junction temperature (Tj) max. 125 °C OTP Data Retention Period 10 years at 95 °C temperature EEPROM Data Retention Period 10 years at 95 °C temperature 2.1.2 Recommended Operating Conditions Table 2-1 Operating conditions Quantity Supply voltage Symbol Remarks VDD Min. 2.1 Typ. Max. 3.6 Unit V Vio_digital Relative to ground - 0.6 3.3 VDD +0.6 V HIGH LOW LOW HIGH Between “VPP_OTP” port and ground. Do not expo- se other ports to pro- gramming voltage. Clock frequency for the 4- wire SPI bus operation Speed (data rate) of the 2-wire I²C bus operation Bit hold time for OTP write Rise time of the input signal put to general- purpose I/O Rise time of the output signal from a general- purpose I/O MR1 0.3 * VDD 0.7 * VDD ≤ 3.6 - 0.6 VDD +0.6 6.5 ≤ 3.6 7.0 V V 0 0 30 0 6 20 MHz 100 kHz 500 500 μs ns t.b.d. ns 40 µs Digital port voltage Digital ports switching level Analog port voltage OTP Programming voltage Vio_analog VOTP SPI bus frequency fSPI-bus I²C bus frequency OTP Bit hold time GPIO input rise time GPIO output rise time CDC discharge time acam messelectronic gmbh - Friedrich-List-Str.4 - 76297 Stutensee - Germany - www.acam.de 2-1
® RDC discharge time Junction Temperature Ambient Temperature Tj Ta Junction temperature must not exceed +125 °C At VDD = 2.4V -/+ 0.3V 0 - 40 - 40 PCapØ2A 100 µs + 125 °C + 125 °C 2.2 CDC Precision 2.2.1 RMS Noise and Resolution vs. Output Data Rate Table 2-2 Typical capacitive noise & resolution vs. output data rate, 10 pF base + 1 pF span, fast settle, MR1, V = 3.0 V Output Data Rate [Hz] 2.5 5 10 25 100 250 1,000 2,000 4,000 10,000 25,000 FLOATING Fully compensated RMS Noise [aF] Eff. Resolu- tion 10 pF base [Bits] Eff. Resolution 1 pF span GROUNDED Internally compensated Eff. Resolu- tion 10 pF base [Bits] RMS Noise [aF] 15 23 35 48 134 172 330 438 603 838 19.3 18.7 18.1 17.7 16.2 15.8 14.9 14.5 14.0 13.5 [Bits] 16.0 15.4 14.8 14.4 12.9 12.5 11.6 11.2 10.7 10.2 15 23 50 81 116 147 230 327 566 817 19.3 18.7 17.6 16.9 16.4 16.0 15.4 14.9 14.1 13.6 Eff. Resolution 1 pF span [Bits] 16.0 15.4 14.3 13.6 13.1 12.7 12.1 11.6 10.8 10.3 The table gives the root mean-square (RMS) noise in aF as a function of output data rate in Hz, measured at 3.0 V supply voltage using the maximum possible sample size for in - chip averaging at the minimum possible cycle time. Bit values are calculated as a binary logarithm of noise over the span (BITs = ln(span/noise)/ln(2)). The measurements have been done with the PCapØ2 evaluation board, with fixed C0G ceramic capacitors. Both, sensor and reference are connected “floating” or “grounded”, as indicated. When floating, compensation mechanisms for both internal and external stray capacitances are activated, when grounded, internal ones only. 2-2 acam messelectronic gmbh - Friedrich-List-Str.4 - 76297 Stutensee - Germany - www.acam.de
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