AP6256 datasheet_V1.3_12202017.pdf-资料库

正基科技股份有限公司 SPECIFICATION SPEC. NO.： REV： 1.3 DATE： 12.20. 2017 PRODUCT NAME： AP6256 Customer APPROVED Company Representative Signature PREPARED PM REVIEW QA APPROVED DCC ISSUE AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:

AMPAK AP6256 WiFi 11ac + Bluetooth V5.0 Module Spec Sheet AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 1

Revision History AP6256 Datasheet Date 2017/06/13 2017/09/07 2017/12/15 2017/12/20 Revision Content Revised By Version - Preliminary - Modify WLAN Specification - Modify WLAN/BT Specification - Modify WLAN/BT Specification Richard Harry Harry Harry 1.0 1.1 1.2 1.3 AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 2

AP6256 Datasheet Contents 1. Introduction......................................................................................................... 4 2. Features............................................................................................................... 5 3. Deliverables ........................................................................................................ 6 3.1 Deliverables.................................................................................................... 6 3.2 Regulatory certifications ................................................................................. 6 4. General Specification......................................................................................... 7 4.1 General Specification...................................................................................... 7 4.2 Voltages.......................................................................................................... 7 4.2.1 Absolute Maximum Ratings.................................................................... 7 4.2.2 Recommended Operating Rating........................................................... 7 5. Wi-Fi RF Specification........................................................................................ 8 5.1 2.4GHz RF Specification................................................................................. 8 5.1 5GHz RF Specification.................................................................................... 9 6. Bluetooth Specification.................................................................................... 12 6.1 Bluetooth Specification ................................................................................. 12 7. Pin Assignments............................................................................................... 13 7.1 Pin Outline.................................................................................................... 13 7.2 Pin Definition ................................................................................................ 13 8. Dimensions ....................................................................................................... 15 8.1 Physical Dimensions..................................................................................... 15 8.2 Layout Recommendation.............................................................................. 16 9. External clock reference .................................................................................. 17 10.1 SDIO Pin Description.................................................................................. 17 10. Host Interface Timing Diagram........................................................................ 18 10.1 Power-up Sequence Timing Diagram ......................................................... 18 10.2 SDIO Default Mode Timing Diagram........................................................... 20 10.3 SDIO High Speed Mode Timing Diagram ................................................... 21 10.4 SDIO Bus Timing Specifications in SDR Modes ......................................... 22 10.5 SDIO Bus Timing Specifications in DDR50 Mode....................................... 25 11. Recommended Reflow Profile......................................................................... 27 12. Package Information........................................................................................ 30 12.1 Label........................................................................................................... 30 12.2 Dimension................................................................................................... 31 12.3 MSL Level / Storage Condition ................................................................... 33 AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 3

AP6256 Datasheet 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi, Bluetooth functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11a/b/g/n/ ac Access Points in the wireless LAN. The wireless module complies with IEEE 802.11 a/b/g/n/ac standard and it can achieve up to a speed of 433.3Mbps with single stream in 802.11ac draft to connect to the wireless LAN. The integrated module provides SDIO interface for Wi-Fi, UART / PCM interface for Bluetooth. This compact module is a total solution for a combination of Wi-Fi + BT technologies. The module is specifically developed for Smart phones and Portable devices. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 4

AP6256 Datasheet 2. Features IEEE 802.11a/b/g/n/ac dual-band radio with virtual-simultaneous dual-band operation   Single-stream spatial multiplexing up to 433.3 Mbps data rate.  Supports 20, 40, 80 MHz channels with optional SGI(256 QAM modulation)  Supports Bluetooth V5.0+EDR with integrated PA for Class 1.5 and Low Energy (BLE).  Concurrent Bluetooth, and WLAN operation  Simultaneous BT/WLAN receive with single antenna  Supports standard SDIO v3.0 and backward compatible with SDIO v2.0 host interfaces. - SDIO v3.0(4-bit) — up to 208 MHz clock rate in SDR104 mode  BT host digital interface: - UART (up to 4 Mbps) IEEE Co-existence technologies are integrated die solution   ECI — enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives A simplified block diagram of the module is depicted in the figure below. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 5

3. Deliverables AP6256 Datasheet 3.1 Deliverables The following products and software will be part of the product.  Module with packaging  Evaluation Kits  Software utility for integration, performance test.  Product Datasheet.  Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 6

AP6256 Datasheet 4. General Specification 4.1 General Specification Model Name Product Description Dimension WiFi Interface BT Interface Operating temperature Storage temperature Humidity AP6256 Support Wi-Fi/Bluetooth functionalities L x W x H: 12 x 12 x 1.5 (typical) mm SDIO v2.0/v3.0 UART / PCM -30°C to 85°C -40°C to 125°C Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing Optimal RF performance specified in the data sheet, however, is guaranteed only for -20~75℃ 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol VBAT VDDIO Description Input supply Voltage Digital/Bluetooth/SDIO/ I/O Voltage 4.2.2 Recommended Operating Rating The module requires two power supplies: VBAT and VDDIO. Min. Max. Unit V -0.5 V -0.5 6 3.9 Operating Temperature VBAT VDDIO Min. -30 3.2 1.62 Typ. 25 3.3 1.8 Max. 85 3.8 3.63 Unit deg.C V V AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 7

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AP6256 datasheet_V1.3_12202017.pdf

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