Samsung Confidential
S5K2L8SX
1/2.8" 12M CMOS Image Sensor
Revision 0.00
Aug 2017
Data Sheet
2017 Samsung Electronics Co., Ltd. All rights reserved.
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Copyright 2017 Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd.
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Chip Handling Guide
Precaution against Electrostatic Discharge
When using semiconductor devices, ensure that the environment is protected against static electricity:
1. Wear antistatic clothes and use earth band.
2. All objects that are in direct contact with devices must be made up of materials that do not produce static
electricity.
3. Ensure that the equipment and work table are earthed.
4. Use ionizer to remove electron charge.
Contamination
Do not use semiconductor products in an environment exposed to dust or dirt adhesion.
Temperature/Humidity
Semiconductor devices are sensitive to:
Environment
Temperature
Humidity
High temperature or humidity deteriorates the characteristics of semiconductor devices. Therefore, do not store or
use semiconductor devices in such conditions.
Mechanical Shock
Do not to apply excessive mechanical shock or force on semiconductor devices.
Chemical
Do not expose semiconductor devices to chemicals because exposure to chemicals leads to reactions that
deteriorate the characteristics of the devices.
Light Protection
In non- Epoxy Molding Compound (EMC) package, do not expose semiconductor IC to bright light. Exposure to
bright light causes malfunctioning of the devices. However, a few special products that utilize light or with security
functions are exempted from this guide.
Radioactive, Cosmic and X-ray
Radioactive substances, cosmic ray, or X-ray may influence semiconductor devices. These substances or rays
may cause a soft error during a device operation. Therefore, ensure to shield the semiconductor devices under
environment that may be exposed to radioactive substances, cosmic ray, or X-ray.
EMS (Electromagnetic Susceptibility)
Strong electromagnetic wave or magnetic field may affect the characteristic of semiconductor devices during the
operation under insufficient PCB circuit design for Electromagnetic Susceptibility (EMS).
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Revision History
Revision No.
Date
Description
0.00
Aug 2017
Initial draft
Samsung Confidential
Author(s)
Shachaf Amir
Oren
Reinherz
YB Kim
MH Jang
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Table of Contents
1 PRODUCT OVERVIEW .................................................................................. 11
1.1 Introduction ................................................................................................................................................ 11
1.2 Features ..................................................................................................................................................... 12
2 PAD CONFIGURATION ................................................................................. 13
2.1 Pad Description .......................................................................................................................................... 14
2.2 Application Circuit ...................................................................................................................................... 18
2.3 Pixel Array Information ............................................................................................................................... 19
3 POWER SEQUENCE...................................................................................... 20
3.1 Operating Modes........................................................................................................................................ 20
3.2 Power-Up Sequence .................................................................................................................................. 22
3.3 Power-Down Sequence ............................................................................................................................. 24
3.4 Software Standby Mode Sequence ........................................................................................................... 26
3.5 Hibernation Mode ....................................................................................................................................... 26
4 CONTROL INTERFACE ................................................................................. 27
4.1 Camera Control Interface (CCI) ................................................................................................................. 28
4.2 SPI Control Interface .................................................................................................................................. 34
4.2.1 SPI Timing Definitions ........................................................................................................................ 35
4.2.2 SPI Sequences ................................................................................................................................... 37
4.2.3 Master SPI Control Interface .............................................................................................................. 37
5 FUNCTIONAL FEATURES ............................................................................. 38
5.1 Block Diagram ............................................................................................................................................ 38
5.2 Pixel Array Addresses ................................................................................................................................ 40
5.3 Horizontal Mirror and Vertical Flip.............................................................................................................. 41
5.4 Averaged Sub-Sampled Readout .............................................................................................................. 42
5.5 Frame Rate Control ................................................................................................................................... 43
5.5.1 Integration Time Control (Electronic Shutter Control) ........................................................................ 43
5.5.2 Functional Operation Modes .............................................................................................................. 44
5.6 PLL and Clock Generator .......................................................................................................................... 45
5.6.1 Clock Relationships ............................................................................................................................ 46
5.6.2 Master Clock Waveform Diagram ....................................................................................................... 48
5.7 Gain Control ............................................................................................................................................... 49
5.7.1 Analog Gain Control ........................................................................................................................... 49
5.7.2 Digital Gain Control............................................................................................................................. 49
5.8 Embedded Line .......................................................................................................................................... 50
5.9 Wide Dynamic Range (WDR) Support ...................................................................................................... 50
5.10 NVM OTP Memory ................................................................................................................................... 50
5.11 Dual camera input Sync ........................................................................................................................... 51
5.12 Test Pattern .............................................................................................................................................. 52
5.13 Output Data Interface ............................................................................................................................... 52
6 ELECTRICAL CHARACTERISTICS............................................................... 53
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6.1 Absolute Maximum Rating ......................................................................................................................... 53
6.2 Operating Conditions ................................................................................................................................. 54
6.3 DC Characteristics ..................................................................................................................................... 55
6.4 AC Characteristics ..................................................................................................................................... 55
7 LENS SPECIFICATION (CRA: CHIEF RAY ANGLE SPEC.) ......................... 56
7.1 Target CRA ................................................................................................................................................ 56
7.2 Pixel-Shading Characteristics .................................................................................................................... 57
7.3 Spectral Response ..................................................................................................................................... 58
7.4 IR-cut Filter Selection ................................................................................................................................. 59
8 REGISTER DESCRIPTION ............................................................................ 60
8.1 Configuration Register ............................................................................................................................... 60
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List of Figures
Title
Page
Number
Figure
Number
Figure 1 Chip Dimension Top View ...................................................................................................................... 13
Figure 2 Module Application Circuit Top View ..................................................................................................... 18
Figure 3 Pixel Array Information ........................................................................................................................... 19
Figure 4 System State Diagram ........................................................................................................................... 20
Figure 5 Power-Up Sequence .............................................................................................................................. 22
Figure 6 Power-Down Sequence ......................................................................................................................... 24
Figure 7 CCI Timing ............................................................................................................................................. 28
Figure 8 CCI Write Timing Example ..................................................................................................................... 30
Figure 9 CCI Read Timing Example .................................................................................................................... 31
Figure 10 CCI Read Multiple Timing Example ..................................................................................................... 32
Figure 11 SPI Control Interface ............................................................................................................................ 34
Figure 12 SPI Write Timing Diagram Mode 11 .................................................................................................... 35
Figure 13 SPI Read Timing Diagram Mode 11 .................................................................................................... 35
Figure 14 SPI Write/Read Mode 00 ..................................................................................................................... 36
Figure 15 SPI WRITE Sequence (1 Cycle) .......................................................................................................... 37
Figure 16 SPI Read .............................................................................................................................................. 37
Figure 17 Function Block Diagram ....................................................................................................................... 38
Figure 18 Window of Interest on Pixel Array ........................................................................................................ 40
Figure 19 Object, Sensor and displayed image in Standard Readout ................................................................. 41
Figure 20 Four readout orders and displayed images ......................................................................................... 41
Figure 21 Example of 2 by 2 Averaged sub-sampled readout ............................................................................. 42
Figure 22 Virtual Frame Format Example ............................................................................................................ 43
Figure 23 Clock System Block Diagram ............................................................................................................... 45
Figure 24 Clock Relationships ............................................................................................................................. 46
Figure 25 PLL Frequency Synthesis .................................................................................................................... 46
Figure 26 Master Clock Waveform Diagram ........................................................................................................ 48
Figure 27 Dual sensor sync system ..................................................................................................................... 51
Figure 28 Target CRA .......................................................................................................................................... 56
Figure 29 Shading Characteristics of Green ........................................................................................................ 57
Figure 30 Shading Characteristics of Color ratio ................................................................................................. 57
Figure 31 Spectral Response ............................................................................................................................... 58
Figure 32 IR Response of Blue channel .............................................................................................................. 59
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