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IMX274LQC-C_Datasheet_E_Rev0.4.0.pdf
Description
Features
Device Structure
Optical Black Array and Readout Scan Direction
Absolute Maximum Ratings
Recommended Operating Conditions
USE RESTRICTION NOTICE
Contents
Optical Center
Pin Configuration
Pin Description
When using CSI-2
When using Sub-LVDS
I/O Equivalent Circuit Diagram
Peripheral Circuit
System Outline
When using CSI-2
When using Sub-LVDS
Electrical Characteristics when using CSI-2
1. DC Characteristics (CSI-2)
Current Consumption and Gain Variable Range (CSI-2)
Supply Voltage and I/O Voltage (CSI-2)
2. AC Characteristics (CSI-2)
INCK, XCLR (CSI-2)
XHS, XVS (Output) (CSI-2)
I2C Communication (CSI-2)
DMCKP / DMCKN，DMO (CSI-2)
Electrical Characteristics When Using Sub-LVDS
1. DC Characteristics (Sub-LVDS)
Current Consumption and Gain Variable Range (Sub-LVDS)
Supply Voltage and I/O Voltage (Sub-LVDS)
LVDS Output DC Characteristics (Sub-LVDS)
2. AC Characteristics (Sub-LVDS)
INCK, XCLR, XVS (input), XHS (input) (Sub-LVDS)
Serial Communication (Sub-LVDS)
Sub-LVDS Output (Sub-LVDS)
Spectral Sensitivity Characteristics (CSI-2 and Sub-LVDS)
Image Sensor Characteristics (CSI-2 and Sub-LVDS)
1. Zone Definition of Image Sensor Characteristics
Image Sensor Characteristics Measurement Method (CSI-2 and Sub-LVDS)
1. Measurement Conditions
2. Color Coding of this Image Sensor and Readout
3. Definition of Standard Imaging Conditions
Setting Registers Using I2C Communication (When Using CSI-2)
Description of Setting Registers When Using I2C Communication
Pin Connection of Serial Communication Operation Specifications When Using I2C Communication
Register Communication Timing When Using I2C Communication
I2C Communication Protocol
Register Write and Read
Single Read from Random Location
Single Read from Current Location
Sequential Read Starting from Random Location
Sequential Read Starting from Current Location
Single Write to Random Location
Sequential Write Starting from Random Location
Register Value Reflection Timing to Output Data (CSI-2)
Setting Registers Using Serial Communication (When Using Sub-LVDS)
Setting Registers Using Serial Communication (Sub-LVDS)
Register Value Reflection Timing to Output Data (Sub-LVDS)
Register Map
1. Description of Register
2. Register Setting for Each Readout Drive Mode
Readout Drive Modes (CSI-2 and Sub-LVDS)
1. Readout Drive Modes
2. Relationship between Arithmetic Processing and the Number of Output Bits in Each Readout Drive Mode
Image Data Output Format When Using CSI-2
Frame Format (CSI-2)
Frame Structure (CSI-2)
Embedded Data Line (CSI-2)
CSI-2 serial Output Setting (CSI-2)
MIPI Transmitter (CSI-2)
Detailed Specification of Each Mode (CSI-2)
1. Horizontal/Vertical Operation Period in Each Readout Drive Mode (CSI-2)
2. Frame Rate Adjustment (CSI-2)
3. Image Data Output Format (CSI-2)
Vertical Arbitrary Cropping Function (CSI-2)
Horizontal Arbitrary Cropping Function (CSI-2)
Electronic Shutter Timing When Using CSI-2
1. SHR, SVR, SMD Setting When Using CSI-2
1-1. SHR, SVR Setting (CSI-2)
1-2. Electronic Shutter Drive Mode (CSI-2)
2. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSI-2
2-1. Integration Time in Each Readout Drive Mode (CSI-2)
2-2. Operation when Changing the Readout Drive Mode (CSI-2)
2-3. Low Power Consumption Drive in Integration Time When Using Rolling Shutter Operation (CSI-2)
Image Data Output Format When Using Sub-LVDS
1. Sync Signals and Data Output Timing (Sub-LVDS)
2. Output Range of LVDS Output Data (Sub-LVDS)
Detailed Specification of Each Mode (Sub-LVDS)
1. Horizontal/Vertical Operation Period in Each Readout Drive Mode (Sub-LVDS)
2. Frame Rate Adjustment (Sub-LVDS)
3. Image Data Output Format (Sub-LVDS)
Vertical Arbitrary Cropping (Sub-LVDS)
Horizontal arbitrary cropping function (Sub-LVDS)
Electronic Shutter Timing When Using Sub-LVDS
1. SHR, SVR Setting (Sub-LVDS)
2. SVR Operation (Sub-LVDS)
3. Electronic Shutter Drive Mode (Sub-LVDS)
4. Integration Time in Each Readout Drive Mode and Mode Changes When Using Sub-LVDS
4-1. Integration Time in Each Readout Drive Mode (Sub-LVDS)
4-2. Operation when Changing the Readout Drive Mode (Sub-LVDS)
4-3. Recommended Global Reset Shutter Operation Sequence (Sub-LVDS)
4-4. Interruptive Mode Change (Sub-LVDS)
4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)
Power-on/off Sequence when using CSI-2
1. Power-on Sequence (CSI-2)
2. Slew Rate Limitation of Power-on Sequence (CSI-2)
3. Power-off Sequence (CSI-2)
Standby Cancel Sequence when using CSI-2
Power-on/off Sequence when using Sub-LVDS
1. Power-on Sequence (Sub-LVDS)
2. Slew Rate Limitation of Power-on Sequence (Sub-LVDS)
3. Power-off Sequence (Sub-LVDS)
Standby Cancel Sequence (Sub-LVDS)
Spot Pixel Specifications
Spot Pixel Zone Definition
Notice on White Pixels Specifications
Measurement Method for Spot Pixels
1. Black or white pixels at high light
2. White pixels in the dark
3. Black pixels at signal saturated
Spot Pixel Pattern Specifications
Stain Specifications
Stain Zone Definition
Stain Measurement Method
Relation between Image Height and target CRA
Marking
Notes on Handling
Package Outline
List of Trademark Logos and Definition Statements
Diagonal 7.20 mm (Type 1/2.5) CMOS Image Sensor with Square Pixel for Color
Cameras
TENTATIVE
Description
IMX274LQC-C
The IMX274LQC-C is a diagonal 7.20 mm (Type 1/2.5) CMOS image sensor with a color square pixel array and
approximately 8.51 M effective pixels. 12-bit digital output makes it possible to output the signals of approximately
8.51 M effective pixels with high definition for shooting still pictures.
It also operates with three power supply voltages: analog 2.8 V, digital 1.2 V, and 1.8 V for I/O interface and achieves
low power consumption.
Furthermore, it realizes 12-bit digital output for shooting high-speed and high-definition moving pictures by horizontal
and vertical addition and subsampling. Realizing high-sensitivity, low dark current, this sensor also has an electronic
shutter function with variable storage time.
(Application: Surveillance, FA cameras, Industrial cameras)
Features
◆ CMOS active pixel type pixels
◆ Input clock frequency 6 to 27 MHz (CSI-2), 12/24/36/72 MHz (Sub-LVDS)
◆ Both MIPI Specifications (CSI-2 high-speed serial interface) and Sub-LVDS supported
◆ All-pixel scan mode 12-bit, 10-bit
Horizontal/vertical 2/2-line binning mode 12-bit, 10-bit
Vertical 2/3 subsampling binning horizontal 3 binning mode
Vertical 2/8 subsampling horizontal 3 binning mode
◆ High-sensitivity, low dark current, no smear, excellent anti-blooming characteristics
◆ Vertical and horizontal arbitrary cropping function
◆ Variable-speed shutter function (minimum unit: 1 horizontal period)
◆ Low power consumption
◆ High dynamic range (HDR) function: Digital overlap HDR
◆ H driver, V driver and serial communication circuit on chip
◆ CDS/PGA on chip: Gain +27 dB (step pitch 0.1 dB)
◆ 10-bit/12-bit A/D conversion on chip
◆ R, G, B primary color mosaic filters on chip
◆ All-pixel simultaneous reset supported
◆ 92-pin high-precision ceramic package
1
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
IMX274LQC-C
Device Structure
◆ CMOS image sensor
◆ Image size
Diagonal 7.20 mm (Type 1/2.5)
◆ Total number of pixels
3864 (H) × 2218 (V) approx. 8.57 M pixels
◆ Number of effective pixels
3864 (H) × 2202 (V) approx. 8.51 M pixels
◆ Number of active pixels
3864 (H) × 2196 (V) approx. 8.49 M pixels diagonal 7.20 mm
◆ Number of recommended recording pixels
3840 (H) × 2160 (V) 8.29 M pixels aspect ratio 16:9
◆ Chip size
8.365 mm (H) × 6.615 mm (V) (include scribe area)
◆ Unit cell size
1.62 μm (H) × 1.62 μm (V)
◆ Optical black
Horizontal (H) direction : Front 0 pixel, rear 0 pixel
Vertical (V) direction : Front 16 pixels, rear 0 pixel
◆ Substrate material
Silicon
Optical Black Array and Readout Scan Direction
(Top View)
Note) Arrows in the figure indicate scanning direction during normal readout in the vertical direction.
Optical Black Array and Readout Scan Direction
2
HVM1M10A10A1 (1PIN)CMOS Image SensorVertical direction normal readoutObjectLensOptical BlackVertical direction inversion readout
IMX274LQC-C
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage (Analog)
Supply voltage (Digital 1)
Supply voltage (Digital 2)
Input voltage (Digital)
Output voltage (Digital)
Guaranteed operating temperature
Storage guarantee temperature
VADD
*1
VDDD1
*2
VDDD2
*3
VI
VO
TOPR
TSTG
–0.3 to +3.3
–0.5 to +2.0
–0.5 to +3.3
–0.3 to VDDD2 + 0.3
–0.3 to VDDD2 + 0.3
–30 to +75
–30 to +80
Performance guarantee temperature
TSPEC
–10 to +60
V
V
V
V
V
˚C
˚C
˚C
Recommended Operating Conditions
Item
Symbol
Rating
Unit
Supply voltage (Analog)
Supply voltage (Digital 1)
Supply voltage (Digital 2)
VADD
*1
VDDD1
*2
VDDD2
*3
2.8 ± 0.1
1.2 ± 0.1
1.8 ± 0.1
Input voltage (Digital)
VI
–0.1 to VDDD2 + 0.1
V
V
V
V
*1 VADD: VDDSUB, VDDHCM, VDDHPX, VDDHDA, VDDHCP (2.8 V power supply)
*2 VDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VDDLPL2 to 3, VDDLIF (1.2 V power supply)
*3 VDDD2: VDDMIO, VDDMIF (1.8 V power supply)
3
USE RESTRICTION NOTICE
IMX274LQC-C
4
This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the image sensor products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may, at any time, modify this Notice which will be available to you in the latest specifications book for the Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or distributor of Sony on such a use restriction notice when you consider using the Products. Use Restrictions The Products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by Sony from time to time. You should not use the Products for critical applications which may pose a life- or injury-threatening risk or are highly likely to cause significant property damage in the event of failure of the Products. You should consult your sales representative beforehand when you consider using the Products for such critical applications. In addition, you should not use the Products in weapon or military equipment. Sony disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the Products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. Design for Safety Sony is making continuous efforts to further improve the quality and reliability of the Products; however, failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social damage as a result of such failure. Export Control If the Products are controlled items under the export control laws or regulations of various countries, approval may be required for the export of the Products under the said laws or regulations. You should be responsible for compliance with the said laws or regulations. No License Implied The technical information shown in this specifications book is for your reference purposes only. The availability of this specifications book shall not be construed as giving any indication that Sony and its licensors will license any intellectual property rights in such information by any implication or otherwise. Sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third-party rights due to the same. It is therefore your sole legal and financial responsibility to resolve any such problems and infringement. Governing Law This Notice shall be governed by and construed in accordance with the laws of Japan, without reference to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the court of first instance. Other Applicable Terms and Conditions The terms and conditions in the Sony additional specifications, which will be made available to you when you order the Products, shall also be applicable to your use of the Products as well as to this specifications book. You should review those terms and conditions when you consider purchasing and/or using the Products. General-0.0.8
Contents
IMX274LQC-C
Description -------------------------------------------------------------------------------------------------------------------------------------------- 1
Features ----------------------------------------------------------------------------------------------------------------------------------------------- 1
Device Structure ------------------------------------------------------------------------------------------------------------------------------------- 2
Optical Black Array and Readout Scan Direction --------------------------------------------------------------------------------------------- 2
Absolute Maximum Ratings ----------------------------------------------------------------------------------------------------------------------- 3
Recommended Operating Conditions ----------------------------------------------------------------------------------------------------------- 3
USE RESTRICTION NOTICE -------------------------------------------------------------------------------------------------------------------- 4
Contents ----------------------------------------------------------------------------------------------------------------------------------------------- 5
Optical Center ---------------------------------------------------------------------------------------------------------------------------------------- 8
Pin Configuration ------------------------------------------------------------------------------------------------------------------------------------ 8
Pin Description --------------------------------------------------------------------------------------------------------------------------------------- 9
When using CSI-2 ........................................................................................................................................................9
When using Sub-LVDS ............................................................................................................................................... 12
I/O Equivalent Circuit Diagram-------------------------------------------------------------------------------------------------------------------15
Peripheral Circuit -----------------------------------------------------------------------------------------------------------------------------------19
System Outline --------------------------------------------------------------------------------------------------------------------------------------20
When using CSI-2 ...................................................................................................................................................... 20
When using Sub-LVDS ............................................................................................................................................... 20
Electrical Characteristics when using CSI-2 --------------------------------------------------------------------------------------------------21
1. DC Characteristics (CSI-2) ...................................................................................................................................... 21
Current Consumption and Gain Variable Range (CSI-2) ........................................................................................... 21
Supply Voltage and I/O Voltage (CSI-2) ................................................................................................................... 21
2. AC Characteristics (CSI-2) ...................................................................................................................................... 22
INCK, XCLR (CSI-2) ............................................................................................................................................... 22
XHS, XVS (Output) (CSI-2) ..................................................................................................................................... 22
I2C Communication (CSI-2) ..................................................................................................................................... 23
DMCKP / DMCKN，DMO (CSI-2)............................................................................................................................ 23
Electrical Characteristics When Using Sub-LVDS -------------------------------------------------------------------------------------------24
1. DC Characteristics (Sub-LVDS) .............................................................................................................................. 24
Current Consumption and Gain Variable Range (Sub-LVDS) .................................................................................... 24
Supply Voltage and I/O Voltage (Sub-LVDS) ............................................................................................................ 24
LVDS Output DC Characteristics (Sub-LVDS) .......................................................................................................... 24
2. AC Characteristics (Sub-LVDS) ............................................................................................................................... 25
INCK, XCLR, XVS (input), XHS (input) (Sub-LVDS) ................................................................................................. 25
Serial Communication (Sub-LVDS) .......................................................................................................................... 25
Sub-LVDS Output (Sub-LVDS) ................................................................................................................................ 26
Spectral Sensitivity Characteristics (CSI-2 and Sub-LVDS) -------------------------------------------------------------------------------27
Image Sensor Characteristics (CSI-2 and Sub-LVDS)--------------------------------------------------------------------------------------28
1. Zone Definition of Image Sensor Characteristics...................................................................................................... 28
Image Sensor Characteristics Measurement Method (CSI-2 and Sub-LVDS) ---------------------------------------------------------29
1. Measurement Conditions ........................................................................................................................................ 29
2. Color Coding of this Image Sensor and Readout ..................................................................................................... 29
3. Definition of Standard Imaging Conditions ............................................................................................................... 29
Setting Registers Using I2C Communication (When Using CSI-2) -----------------------------------------------------------------------31
Description of Setting Registers When Using I2C Communication ................................................................................ 31
Pin Connection of Serial Communication Operation Specifications When Using I2C Communication ............................. 31
Register Communication Timing When Using I2C Communication ................................................................................ 31
I2C Communication Protocol ....................................................................................................................................... 32
Register Write and Read ............................................................................................................................................ 33
Single Read from Random Location ........................................................................................................................ 33
Single Read from Current Location .......................................................................................................................... 33
Sequential Read Starting from Random Location ..................................................................................................... 34
Sequential Read Starting from Current Location ....................................................................................................... 34
Single Write to Random Location ............................................................................................................................. 35
Sequential Write Starting from Random Location ..................................................................................................... 35
Register Value Reflection Timing to Output Data (CSI-2) ............................................................................................. 36
5
IMX274LQC-C
Setting Registers Using Serial Communication (When Using Sub-LVDS) -------------------------------------------------------------37
Setting Registers Using Serial Communication (Sub-LVDS) ......................................................................................... 37
Register Value Reflection Timing to Output Data (Sub-LVDS) ...................................................................................... 38
Register Map ----------------------------------------------------------------------------------------------------------------------------------------39
1. Description of Register ........................................................................................................................................... 43
2. Register Setting for Each Readout Drive Mode ........................................................................................................ 51
Readout Drive Modes (CSI-2 and Sub-LVDS) -----------------------------------------------------------------------------------------------55
1. Readout Drive Modes ............................................................................................................................................. 55
2. Relationship between Arithmetic Processing and the Number of Output Bits in Each Readout Drive Mode ................ 56
Image Data Output Format When Using CSI-2 ----------------------------------------------------------------------------------------------58
Frame Format (CSI-2) ................................................................................................................................................ 58
Frame Structure (CSI-2) ............................................................................................................................................. 58
Embedded Data Line (CSI-2) ...................................................................................................................................... 59
CSI-2 serial Output Setting (CSI-2) ............................................................................................................................. 61
MIPI Transmitter (CSI-2) ............................................................................................................................................. 62
Detailed Specification of Each Mode (CSI-2) -------------------------------------------------------------------------------------------------63
1. Horizontal/Vertical Operation Period in Each Readout Drive Mode (CSI-2) ............................................................... 63
2. Frame Rate Adjustment (CSI-2) .............................................................................................................................. 64
3. Image Data Output Format (CSI-2) ......................................................................................................................... 65
Vertical Arbitrary Cropping Function (CSI-2) --------------------------------------------------------------------------------------------------69
Horizontal Arbitrary Cropping Function (CSI-2) ----------------------------------------------------------------------------------------------72
Electronic Shutter Timing When Using CSI-2-------------------------------------------------------------------------------------------------74
1. SHR, SVR, SMD Setting When Using CSI-2 ............................................................................................................ 74
1-1. SHR, SVR Setting (CSI-2) ................................................................................................................................ 74
1-2. Electronic Shutter Drive Mode (CSI-2) .............................................................................................................. 75
2. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSI-2 ............................................. 76
2-1. Integration Time in Each Readout Drive Mode (CSI-2) ....................................................................................... 76
2-2. Operation when Changing the Readout Drive Mode (CSI-2) .............................................................................. 77
2-3. Low Power Consumption Drive in Integration Time When Using Rolling Shutter Operation (CSI-2) ..................... 78
Image Data Output Format When Using Sub-LVDS ----------------------------------------------------------------------------------------79
1. Sync Signals and Data Output Timing (Sub-LVDS) .................................................................................................. 79
2. Output Range of LVDS Output Data (Sub-LVDS) ..................................................................................................... 81
Detailed Specification of Each Mode (Sub-LVDS) -------------------------------------------------------------------------------------------82
1. Horizontal/Vertical Operation Period in Each Readout Drive Mode (Sub-LVDS) ........................................................ 82
2. Frame Rate Adjustment (Sub-LVDS) ....................................................................................................................... 83
3. Image Data Output Format (Sub-LVDS) .................................................................................................................. 84
Vertical Arbitrary Cropping (Sub-LVDS) --------------------------------------------------------------------------------------------------------91
Horizontal arbitrary cropping function (Sub-LVDS) ------------------------------------------------------------------------------------------94
Electronic Shutter Timing When Using Sub-LVDS-------------------------------------------------------------------------------------------96
1. SHR, SVR Setting (Sub-LVDS) ............................................................................................................................... 96
2. SVR Operation (Sub-LVDS) .................................................................................................................................... 97
3. Electronic Shutter Drive Mode (Sub-LVDS) .............................................................................................................. 97
4. Integration Time in Each Readout Drive Mode and Mode Changes When Using Sub-LVDS ...................................... 98
4-1. Integration Time in Each Readout Drive Mode (Sub-LVDS) ................................................................................ 98
4-2. Operation when Changing the Readout Drive Mode (Sub-LVDS) ....................................................................... 99
4-3. Recommended Global Reset Shutter Operation Sequence (Sub-LVDS) ........................................................... 100
4-4. Interruptive Mode Change (Sub-LVDS) ........................................................................................................... 101
4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS) ........................................................................ 102
Power-on/off Sequence when using CSI-2 -------------------------------------------------------------------------------------------------- 103
1. Power-on Sequence (CSI-2) ................................................................................................................................. 103
2. Slew Rate Limitation of Power-on Sequence (CSI-2) ............................................................................................. 103
3. Power-off Sequence (CSI-2) ................................................................................................................................. 104
Standby Cancel Sequence when using CSI-2 ---------------------------------------------------------------------------------------------- 105
Power-on/off Sequence when using Sub-LVDS -------------------------------------------------------------------------------------------- 106
1. Power-on Sequence (Sub-LVDS) .......................................................................................................................... 106
2. Slew Rate Limitation of Power-on Sequence (Sub-LVDS) ...................................................................................... 106
3. Power-off Sequence (Sub-LVDS) .......................................................................................................................... 107
Standby Cancel Sequence (Sub-LVDS) ----------------------------------------------------------------------------------------------------- 108
6
IMX274LQC-C
Spot Pixel Specifications ------------------------------------------------------------------------------------------------------------------------ 109
Spot Pixel Zone Definition......................................................................................................................................... 109
Notice on White Pixels Specifications -------------------------------------------------------------------------------------------------------- 110
Measurement Method for Spot Pixels -------------------------------------------------------------------------------------------------------- 111
1. Black or white pixels at high light ........................................................................................................................... 111
2. White pixels in the dark ......................................................................................................................................... 111
3. Black pixels at signal saturated ............................................................................................................................. 111
Spot Pixel Pattern Specifications -------------------------------------------------------------------------------------------------------------- 112
Stain Specifications ------------------------------------------------------------------------------------------------------------------------------ 113
Stain Zone Definition ................................................................................................................................................ 113
Stain Measurement Method ...................................................................................................................................... 113
Relation between Image Height and target CRA ------------------------------------------------------------------------------------------ 114
Marking --------------------------------------------------------------------------------------------------------------------------------------------- 115
Notes on Handling -------------------------------------------------------------------------------------------------------------------------------- 116
Package Outline ---------------------------------------------------------------------------------------------------------------------------------- 118
List of Trademark Logos and Definition Statements--------------------------------------------------------------------------------------- 119
7
Optical Center
(Top View)
IMX274LQC-C
* See page 118 “Package Outline” for details
Optical Center
Pin Configuration
(Bottom View)
Pin Configuration
8
PKG 1pinA1M1A10M1010.70 ± 0.1 mmOptical center5.257 ± 0.075 mm4.146 ± 0.075 mm8.50 ± 0.1 mmPackage outline23456789110ABCDEFGHJKLM1pin indexBottom ViewNCVRLTVSSHPX2NCDLO4PDLO6PDLO7PVSSHPX1DLO8PVDDHDAVDDSUBVDDLSC1VSSLSC1VDDLPL3VDDLIFTEST4NCNCVSSLSC4VSSMIF1DLO1PDLO4MDLO6MDLO7MNCNCVRLSDLO8MDLO5MBIASRESVBGRVSSLPAXCLRVSSLPL3VSSLIF1VSSHDADMO4NDMO4PTEST5NCTEST3XCETEST2VDDLPAVDDLPL2VSSLPL2NCTEST1DMO2NDMO2PNCNCVSSLPL1VDDLPL1VDDMIODLO1MDLCKMDLCKPDLO9PDLO5PDLO9MNCNCVSSHPX3VDDHPXDLO3PDLO3MDLO0MNCSDOXVSNCDMCKNDMCKPXHSSDI/SDASCK/SCLVSSLCBVSSLIF2DMO1NDMO1PVDDLCNVSSLCNVDDHCPDLO2PDLO2MDLO0PNCNCNCNCVSSHCPVSSLSC2VSSMIF2VDDMIFVSSLSC3VDDLSC2VDDHCMINCKDMO3NDMO3PNCNCNCNC
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