高通超声波指纹识别技术sample介绍.pdf

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21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr Electronic Costing & Technology Experts August 2016 – Version 1 – Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Return to TOC Glossary 1. Overview / Introduction – – Executive Summary Reverse Costing Methodology 2. Company Profile – Qualcomm 3. Physical Analysis – – Synthesis of the Physical Analysis LeEco LeMax Pro X820 disassembly Fingerprint sensor Removal Fingerprint sensor assembly view Fingerprint sensor Cross Section – – – – Sensor Die – – – – – – Sensor Die View, Marking & Dimensions Sensor Die PMUT Sensor Die Edge Contacts Sensor Delayering & main Blocs Sensor Die Process Sensor Die Cross‐Section – IC Control Unit – – – – – – – Package View, Marking & Dimensions Die View, Marking & Dimensions Die Overview & Delayering Die Main Blocks ID Die Process Die Cross‐Section Process Characteristics 4. Sensor Manufacturing Process – Sensor Die Front‐End Process & Fabrication Unit © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4 10 13 15 41 67 86 – – – – – ASIC Die Front‐End Process & Fabrication Unit Final Test & Packaging Fabrication unit Synthesis of the main parts Ultrasonic Sensor – Process Flow Fingerprint Assembly – Process Flow 5. Cost Analysis – – – – Synthesis of the cost analysis Main steps of economic analysis Yields Explanation & Hypotheses QBIC Component – – – QBIC Die Wafer Cost QBIC Die Cost QBIC Component Packaging Cost – Sensor die – – – – Sensor Die Front‐End Cost Sensor Die Probe Test, Thinning & Dicing Sensor Die Wafer Cost Sensor Die Cost – Complete Module Fingerprint – – – – Assembled Components Cost Synthesis of the assembling Fingerprint Component Cost Fingerprint Component Price 6. Fingerprint sensors Comparison 7. Related Reports Contact [New] Customer Satisfaction Survey 99 104 108 114 124 130 134 2 Qualcomm Snapdragon Sense ID Fingerprint sensor

Return to TOC • • • • • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Qualcomm Snapdragon Sense ID Ultrasonic Fingerprint Sensor. The fingerprint sensor die has been first introduced in the LeEco LeMax Pro. Located on the back of the device under 400 µm of metal and supported by stainless metal, the fingerprint sensor uses ultrasonic technology developed by Qualcomm offering 3D imaging of the fingerprint. The sensor has a resolution of 14,400 pixels with a pixel density of 508ppi. It uses the Qualcomm Ultrasonic Sensing Principle to take an image of the fingerprint providing a more secure, reliable alternative to capacitive‐based fingerprint sensor. The sensor die is manufactured on glass with LTPS technology and it is connected to flex PCB. The solution features a QBIC (Qualcomm Biometric Integrated Circuit) designed to protect user’ biometric information enhancing the user experience with convenient, secure alternative to password and by consistently scanning through common fingerprint contaminants, including water and oil. The report includes comparisons with the latest Huawei’s, Samsung’s and Apple’s fingerprints buttons. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3 Qualcomm Snapdragon Sense ID Fingerprint sensor

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