Rockchip RV1108 Datasheet V1.1 20170320.pdf

发布时间：2022-06-14 发布人：admin 分类：说明书资料大小：1.88M 资料格式：pdf 举报版权申诉

5aa857a3-6d96-4d68-ac84-529822353501.pdf-第1页.png

第1页 / 共73页

5aa857a3-6d96-4d68-ac84-529822353501.pdf-第2页.png

第2页 / 共73页

5aa857a3-6d96-4d68-ac84-529822353501.pdf-第3页.png

第3页 / 共73页

5aa857a3-6d96-4d68-ac84-529822353501.pdf-第4页.png

第4页 / 共73页

5aa857a3-6d96-4d68-ac84-529822353501.pdf-第5页.png

第5页 / 共73页

5aa857a3-6d96-4d68-ac84-529822353501.pdf-第6页.png

第6页 / 共73页

5aa857a3-6d96-4d68-ac84-529822353501.pdf-第7页.png

第7页 / 共73页

5aa857a3-6d96-4d68-ac84-529822353501.pdf-第8页.png

第8页 / 共73页

Table of Content

Figure Index

Table Index

Warranty Disclaimer

Chapter 1 Introduction

1.1 Features

1.1.1 Microprocessor

1.1.2 Video/Image Digital Signal Processor

1.1.3 Memory Organization

1.1.4 Internal Memory

1.1.5 External Memory or Storage device

1.1.6 System Component

1.1.7 Camera interface

1.1.8 Video CODEC

1.1.9 JPEG CODEC

1.1.10 Image Enhancement (IEP module)

1.1.11 Graphics Engine

1.1.12 Video OUT

1.1.13 HDMI

1.1.14 MIPI DSI

1.1.15 Audio Interface

1.1.16 Connectivity

1.1.17 Others

1.2 Block Diagram

Chapter 2 Package Information

2.1 Ordering information

2.2 Top Marking

2.3 Dimension

2.4 Ball Map

2.5 Ball Pin Number Order

2.6 RV1108 Power/ground IO descriptions

2.7 RV1108 Function IO description

2.8 IO Pin Name Description

2.8.1 MISC

2.8.2 JTAG

2.8.3 SDMMC

2.8.4 SDIO

2.8.5 EMMC

2.8.6 DDR3

2.8.7 NAND FLASH

2.8.8 SPI FLASH

2.8.9 PCM

2.8.10 I2S

2.8.11 SPI

2.8.12 PWM

2.8.13 I2C

2.8.14 UART

2.8.15 GMAC

2.8.16 USB

2.8.17 EFUSE

2.8.18 HDMI

2.8.19 CODEC

2.8.20 CVBSIN

2.8.21 CVBSOUT

2.8.22 SAR-ADC

2.8.23 ADC

2.8.24 CIF

2.8.25 MIPI

2.8.26 LCDC

2.9 RV1108 IO Type

Chapter 3 Electrical Specification

3.1 Absolute Maximum Ratings

3.2 Recommended Operating Condition

3.3 DC Characteristics

3.4 Electrical Characteristics for General IO

3.5 Electrical Characteristics for PLL

3.6 Electrical Characteristics for USB Interface

3.7 Electrical Characteristics for DDR IO

3.8 Electrical Characteristics for eFuse

3.9 Electrical Characteristics for HDMI

3.10 Electrical Characteristics for VDAC

3.11 Electrical Characteristics for TSADC

3.12 Electrical Characteristics for MIPI DSI

3.13 Electrical Characteristics for MIPI CSI

3.14 Electrical Characteristics for SARADC

3.15 Electrical Characteristics for ACODEC

3.16 Electrical Characteristics for VIDEO ADC

Chapter 4 Thermal Management

4.1 Overview

4.2 Package Thermal Characteristics

RV1108 Datasheet Rev 1.1 Table of Content Table of Content ...................................................................................................... 3 Figure Index ........................................................................................................... 4 Table Index ............................................................................................................. 5 Warranty Disclaimer ................................................................................................. 6 Chapter 1 Introduction ..................................................................................... 7 1.1 Features ................................................................................................ 7 1.2 Block Diagram ...................................................................................... 17 Chapter 2 Package Information......................................................................... 19 2.1 Ordering information ............................................................................. 19 2.2 Top Marking ......................................................................................... 19 2.3 Dimension ............................................................................................ 20 2.4 Ball Map .............................................................................................. 22 2.5 Ball Pin Number Order ........................................................................... 31 2.6 RV1108 Power/ground IO descriptions ...................................................... 40 2.7 RV1108 Function IO description............................................................... 43 2.8 IO Pin Name Description ........................................................................ 55 2.9 RV1108 IO Type .................................................................................... 60 Chapter 3 Electrical Specification ...................................................................... 62 3.1 Absolute Maximum Ratings ..................................................................... 62 3.2 Recommended Operating Condition ......................................................... 62 3.3 DC Characteristics ................................................................................. 64 3.4 Electrical Characteristics for General IO .................................................... 66 3.5 Electrical Characteristics for PLL .............................................................. 66 3.6 Electrical Characteristics for USB Interface ................................................ 67 3.7 Electrical Characteristics for DDR IO......................................................... 68 3.8 Electrical Characteristics for eFuse ........................................................... 68 3.9 Electrical Characteristics for HDMI ........................................................... 68 3.10 Electrical Characteristics for VDAC ......................................................... 68 3.11 Electrical Characteristics for TSADC ........................................................ 69 3.12 Electrical Characteristics for MIPI DSI ..................................................... 69 3.13 Electrical Characteristics for MIPI CSI ..................................................... 70 3.14 Electrical Characteristics for SARADC ...................................................... 70 3.15 Electrical Characteristics for ACODEC ..................................................... 71 3.16 Electrical Characteristics for VIDEO ADC ................................................. 72 Chapter 4 Thermal Management ....................................................................... 73 4.1 Overview ............................................................................................. 73 4.2 Package Thermal Characteristics ............................................................. 73 Copyright 2017 @Fuzhou Rockchip Electronics Co., Ltd. 3

RV1108 Datasheet Rev 1.1 Figure Index Fig. 1-1 RV1108 Block Diagram .......................................................................... 18 Fig. 2-1 RV1108 BGA359 Package Top View and bottom view .................................. 21 Fig. 2-2 RV1108 BGA359 Package Side View......................................................... 22 Fig. 2-3 RV1108 BGA359 Package Dimension ....................................................... 22 Fig. 2-4 RV1108A BGA 359 Ball Map .................................................................... 26 Fig. 2-5 RV1108G BGA 359 Ball Map ................................................................... 30 Copyright 2017 @Fuzhou Rockchip Electronics Co., Ltd. 4

RV1108 Datasheet Rev 1.1 Table Index Table 2-1 RV1108A BGA359 Pin Number Order Information .................................... 31 Table 2-2 RV1108G BGA359 Pin Number Order Information .................................... 35 Table 2-3 RV1108A Power/Ground IO information .................................................. 41 Table 2-4 RV1108G Power/Ground IO information ................................................. 41 Table 2-5 RV1108A function IO description ........................................................... 43 Table 2-6 RV1108G function IO description ........................................................... 49 Table 2-7 RV1108 IO Type List ............................................................................ 61 Table 3-1 RV1108 absolute maximum ratings ....................................................... 62 Table 3-2 RV1108 recommended operating condition ............................................. 62 Table 3-3 RV1108 DC Characteristics ................................................................... 64 Table 3-4 RV1108 Electrical Characteristics for Digital General IO ............................ 66 Table 3-5 RV1108 Electrical Characteristics for PLL ................................................ 66 Table 3-6 RV1108 Electrical Characteristics for DDR IO .......................................... 68 Table 3-7 RV1108 Electrical Characteristics for eFuse ............................................. 68 Table 3-8 RV1108 Electrical Characteristics for HDMI ............................................. 68 Table 3-9 RV1108 Electrical Characteristics for VDAC ............................................. 68 Table 3-10 RV1108 Electrical Characteristics for TSADC .......................................... 69 Table 3-11 RV1108 Electrical Characteristics for MIPI DSI ....................................... 69 Table 3-12 RV1108 Electrical Characteristics for MIPI CSI ....................................... 70 Table 3-13 RV1108 Electrical Characteristics for SARADC ........................................ 70 Table 3-14 RV1108 Electrical Characteristics for ACODEC ....................................... 71 Table 3-15 RV1108 Electrical Characteristics for VIDEO ADC ................................... 72 Table 4-1 RV1108A and RV1108G Thermal Resistance Characteristics ...................... 73 Copyright 2017 @Fuzhou Rockchip Electronics Co., Ltd. 5

RV1108 Datasheet Rev 1.1 Warranty Disclaimer Rockchip Electronics Co., Ltd makes no warranty, representation or guarantee (expressed, implied, statutory, or otherwise) by or with respect to anything in this document, and shall not be liable for any implied warranties of non-infringement, merchantability or fitness for a particular purpose or for any indirect, special or consequential damages. Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co.,Ltd assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. Rockchip Electronics Co., Ltd’s products are not designed, intended, or authorized for using as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Rockchip Electronics Co., Ltd’s product could create a situation where personal injury or death may occur, should buyer purchase or use Rockchip Electronics Co., Ltd’s products for any such unintended or unauthorized application, buyers shall indemnify and hold Rockchip Electronics Co.,Ltd and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees arising out of, either directly or indirectly, any claim of personal injury or death that may be associated with such unintended or unauthorized use, even if such claim alleges that Rockchip Electronics Co.,Ltd was negligent regarding the design or manufacture of the part. Copyright and Patent Right Information in this document is provided solely to enable system and software implementers to use Rockchip Electronics Co., Ltd’s products. There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Rockchip Electronics Co., Ltd does not convey any license under its patent rights nor the rights of others. All copyright and patent rights referenced in this document belong to their respective owners and shall be subject to corresponding copyright and patent licensing requirements. Trademarks Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltd’s products are trademarks of Rockchip Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to other companies and their products use trademarks owned by the respective companies and are for reference purpose only. Confidentiality The information contained herein (including any attachments) is confidential. The recipient hereby acknowledges the confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party. Reverse engineering or disassembly is prohibited. ROCKCHIP ELECTRONICS CO.,LTD. RESERVES THE RIGHT TO MAKE CHANGES IN ITS PRODUCTS OR PRODUCT SPECIFICATIONS WITH THE INTENT TO IMPROVE FUNCTION OR DESIGN AT ANY TIME AND WITHOUT NOTICE AND IS NOT REQUIRED TO UNDATE THIS DOCUMENTATION TO REFLECT SUCH CHANGES. Copyright © 2017 Rockchip Electronics Co., Ltd. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Rockchip Electronics Co., Ltd. Copyright 2017 @Fuzhou Rockchip Electronics Co., Ltd. 6

RV1108 Datasheet Rev 1.1 Chapter 1 Introduction RV1108 is a high performance low power application processor. It is embedded with a new generation DSP for digital process and an ARM Cortex-A7 single core processor for system and application. Especially, it is a high-integration and cost efficient SoC which can support H.264 video encoder/decoder up to 1440p, up to 4 camera inputs simultaneously, merge different camera sources together and display on one screen. It is designed for varies application scenario such as car DVR, sports DV, secure camera and UAV camera. RV1108 support lots of camera interface such as MIPI-CSI, CVBS in and 12-bit parallel raw and it also support lots of display interface such as MIPI-DSI, HDMI 1.4, CVBS out and serial/parallel RGB. RV1108G package with 16bit DDR3 chip to meet a high-performance up to 800MHz and make cost lower. 1.1 Features The features listed below which may or may not be present in actual product, may be subject to the third party licensing requirements. Please contact Rockchip for actual product feature configurations and licensing requirements. 1.1.1 Microprocessor  Single-core ARM Cortex-A7 Core processor, a high-performance, low-power and cached application processor  Full implementation of the ARM architecture v7-A instruction set, ARM Neon Advanced SIMD (single instruction, multiple data) support for accelerated media and signal processing computation  Separately integrated NEON and FPU  32KB/32KB L1 I-Cache/D-Cache  Unified 128KB L2 Cache.  Trustzone technology support 1.1.2 Video/Image Digital Signal Processor  32KB I-TCM and 32KB I-cache  128KB D-TCM 1.1.3 Memory Organization  Internal on-chip memory  BootRom  Internal SRAM  External off-chip memory①  DDR3/DDR3L  Async NAND Flash 1.1.4 Internal Memory  Internal BootRom  Size : 10KB  Support system boot from the following device :  8bits Async NAND Flash  SPI interface  eMMC interface  SDMMC interface  Support system code download by the following interface:  USB OTG interface Copyright 2017 @Fuzhou Rockchip Electronics Co., Ltd. 7

RV1108 Datasheet Rev 1.1  Internal SRAM  Size : 12KB 1.1.5 External Memory or Storage device  Dynamic Memory Interface (DDR3/DDR3L)  Compatible with JEDEC standard DDR3-1600/DDR3L-1600 SDRAM  Supports 16 Bits data width, 1 ranks (chip selects), totally 512MB (max) address space.  Programmable timing parameters to support DDR3/DDR3L SDRAM from various vendor  Advanced command reordering and scheduling to maximize bus utilization  Low power modes, such as power-down and self-refresh for DDR3 SDRAM; Compensation for board delays and variable latencies through programmable pipelines  Programmable output and ODT impedance with dynamic PVT compensation  NAND Flash Interface  Support 8bits async NAND flash  16bits hardware ECC  For async NAND flash, support configurable interface timing,  maximum data rate is 8bit/cycle  Embedded AHB master interface to do data transfer by DMA method  eMMC Interface  Compatible with standard iNAND interface  Support MMC4.51 protocol  Provide eMMC boot sequence to receive boot data from external eMMC device  Support FIFO over-run and under-run prevention by stopping card clock automatically  Support CRC generation and error detection  Embedded clock frequency division control to provide programmable baud rate  Support block size from 1 to 65535Bytes  8bits data bus width  SD/MMC Interface  Compatible with SD3.0, MMC ver4.51  Support FIFO over-run and under-run prevention by stopping card clock automatically  Support CRC generation and error detection  Support block size from 1 to 65535Bytes  Data bus width is 4bits 1.1.6 System Component  CRU (clock & reset unit)  Support clock gating control for individual components inside RV1108  One oscillator with 24MHz clock input and 3 embedded PLLs  Support global soft-reset control for whole SOC, also individual soft-reset for every components  Timer  2 on-chip 64bits Timers in SoC with interrupt-based operation  Provide two operation modes: free-running and user-defined count  Support timer work state checkable  Fixed 24MHz clock input  PWM  Eight on-chip PWMs with interrupt-based operation  Programmable pre-scaled operation to bus clock and then further scaled Copyright 2017 @Fuzhou Rockchip Electronics Co., Ltd. 8

分享到：

赞收藏

资料库

Rockchip RV1108 Datasheet V1.1 20170320.pdf

相关推荐

开发技术

热门标签

最新资料