红米3原厂维修图纸(红米3 主板原理图电路图).pdf-资料库

D C B A 5 5 4 3 2 1 19.2M Y401 XTAL-19.2M-OZ19270001 PM_XO_THERM NC 4 1 3 2 GND XO_GND XO_GND TP-0.8MM TP2 1 KYPD_PWR_N MSM_RESIN_N PS_HOLD PM_RESIN_N CBL_PWR_N SPMI_CLK SPMI_DATA WTR_XO_CLK WCN_XO_CLK BBCLK_MSM_EN BB_CLK NFC_CLK GND GND F N 1 0 2 C F N 2 0 2 C XTAL_19M_IN XTAL_19M_OUT U402-B PM8916 XTAL_19M_IN XTAL_19M_OUT HK KPD_PWR_N PON_RST_N PS_HOLD RESIN_N CBL_PWR_N SPMI_CLK SPMI_DATA RF_CLK1 RF_CLK2 BB_CLK1_EN BB_CLK1 BB_CLK2 J1 H2 K10 F5 G5 C3 L10 A10 B10 L1 L2 E4 F2 F3 F N 2 3 2 C GND R201 100K +/-1% VREG_L6_1P8 PM_XO_THERM F u 1 . 0 0 1 2 C F n 1 9 0 2 C Dedicated VIA to Main GND GND 7 1 T H 1 2 T H XO_GND Close to Crystal K2 N10 XO_THERM GND_XOADC H3 GND_XO_ISO PMIC-PM8916(BGA176) Dedicated VIA to Main GND VREF_BAT_THERM % 1 K 3 1 2 1 2 R R214 100K R32 NF R31 4.02k 1% BAT_CON_TEMP BAT_CON_ID Dedicated VIA to Main GND C203 1.0uF HT1 VREF_BAT_THERM AVDD_BYP C2 AVDD_BYP +/-1% 10K R203 VREG_L6_1P8 VREF_BAT_THM BAT_THERM BAT_ID PA_THERM N14 M11 G9 F11 GND18 VREF_LPDDR VREG_XO VREG_RF_CLK SLEEP_CLK1 GND_XO GND_RF REF_BYP GND_REF G4 A2 K1 K3 G6 J2 J3 D1 D2 GND VREG_XO VREG_RF_CLK F u 1 . 0 4 0 2 C PA_THERM VREF_LPDDR3 SLEEP_CLK F u 0 . 1 5 0 2 C F u 0 . 1 6 0 2 C F N 7 0 2 C GND REF_BYP 6 1 T H F u 1 . 0 8 0 2 C 5 1 T H Dedicated VIA to Main GND Dedicated VIA to Main GND Dedicated VIA to Main GND 8 1 T H GND_REF D C B A 4 3 2 NOT TO BE USED, COPIED, REPRODUCED IN WHOLE OR IN PART, NOR ITS CONTENTS REVEALED IN ANY MANNER TO OTHERS WITHOUT THE EXPRESS WRITTEN PERMISSION OF QUALCOMM. QUALCOMM Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 U.S.A. Rev Sheet of Title Sheet Name Size Date: 1

5 4 3 2 1 D C B A Pins OPT_1 OPT_2 Hi Z No SMB1360 GND SMB1360 present No Ext APC buck (S5) Ext APC buck (S5) present SMB358 support OVP,PM8916 N13/P13 pulldown 100K R44 GND Dedicated sense trace to battery connector VBAT VPH_PWR C304 0.1uF GND USBIN(1) USBIN(2) VDDCAP OTGID STAT SCL SDA SUSP SYSOK DPLUS DMINUS USB1/5/HC EN U5 MID_USBIN BOOT SW(1) SW(2) SYS SYS SYS RETDRV CHGOUT CHGOUT CHGOUT CHARGER-SMB348-358-30PIN VBATT VCHG THERM BATTGOOD D N G P D N G P 5 A 5 E Already have 47K resistor in subboard Close to connector if using PMIC's linear charger C0301 should assemble 4.7uF/16V capacitor R0307 should assebble 0 ohm R0302 should NC R0312 should be 0ohm BAT THERM switch to PM8916 USB_VBUS_IN VDD_CAP 3 2 C F u 0 . 1 4.7uF C309 0.1uF C310 SMB_INT BUCK_SMB_I2C_SCL BUCK_SMB_I2C_SDA 6 2 R F N VREG_L5_1P8 8 2 R K 0 0 1 USB_HS_D_P USB_HS_D_M N _ R W P _ L B C Q2401 3 D 1 G L 2 T 1 4 5 3 K S 2 - N - T E F S 2 VDD_CAP F n 0 7 4 5 2 C 9 2 R M 1 R36 100K Q1 3 D 1 G L 2 T 1 4 5 3 K S 2 - N - T E F S 2 A1 B1 B4 E1 E6 E2 D3 E3 D2 A6 B6 C2 C3 R30 0 300 R20 R21 300 R27 100K U402-A PM8916 N13 P13 USB_IN1 USB_IN2 D5 H5 OPT_1 OPT_2 M12 N12 P12 VBAT_SNS VBAT1 VBAT2 PMIC-PM8916(BGA176) CHARGING VPRE_BYP P14 VPRE_BYP VCOIN L11 VCOIN C302 0.1uF GND 8 5 3 C F u 0 . 1 GND CHG_LED_SINK M13 C22 2.2uF C24 0.022uF L12 1 2 1.0UH R45 4.7 C28 1000PF reserve for VPH_PWR F u 0 1 8 0 3 C GND VBAT C26 10uF 100K R22 R34 10K VDD_CAP 4 2 R K 0 1 A2 A4 A3 B3 C4 C5 C6 B2 D4 D5 D6 E4 D1 C1 B5 VBAT 9 4 6 7 8 5 EP GND QSTRT SCL SDA ALRT BAT-FUEL-CW2015 3 1 2 VDD CTG CELL U4 6 0 1 5 R 0 0 1 9 2 C F u 0 . 1 5 0 1 5 R 0 7 4 F u 0 . 1 0 3 C BUCK_SMB_I2C_SCL BUCK_SMB_I2C_SDA INT_CW2015 VREG_L5_1P8 7 4 R F N TP-0.8MM TP33 TP-0.8MM TP34 1 TP-0.8MM TP32 TP-0.8MM TP31 1 1 1 2 1 TP-0.8MM TP36 2 S V T 1 VBAT F u 7 . 4 2 0 6 1 C F N 4 0 6 1 C GND BAT_SNS_M BAT_CON_ID BAT_CON_TEMP 6 6 0 1 C F N GND GND 2 1 S V T 1 TVS1104 TVS1105 J9 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 BTBS-BM25-4S/2-V(51) GND BATTERY CONNECTOR GND D C B A 5 4 3 2 NOT TO BE USED, COPIED, REPRODUCED IN WHOLE OR IN PART, NOR ITS CONTENTS REVEALED IN ANY MANNER TO OTHERS WITHOUT THE EXPRESS WRITTEN PERMISSION OF QUALCOMM. QUALCOMM Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 U.S.A. Rev Sheet of Title Sheet Name Size Date: 1

D C B A 5 5 4 4 3 2 1 UIM_BATT_ALM NFC_CLK_REQ EXT_BUCK_EN_GPIO_4 U402-C PM8916 J7 H6 N11 L8 GPIO1 GPIO2 GPIO3 GPIO4 PMIC-PM8916(BGA176) UI MPP1 MPP2 MPP3 MPP4 L4 K4 J4 J5 Only odd MPPs (MPP_01, MPP_03) can be configured as analog outputs. Only even MPPs(MPP_02, MPP_04) have current sink capability. R731 240k VDD_PX_BIAS_MPP VREG_L6_1P8 VREF_DAC_MPP PWM_OUT R401 30K R731 240k 82.5k 41.2k 22k 11k 3.92k R401 30k 30k 30k 30k 30k 30k ADC_in 0.2v 0.48v 0.758v 1.038v 1.317v 1.591v project S86047A1 S88047A1 S88047B1 S88047C1 S88047D1 S88047E1 GND GND13 GND14 GND15 GND16 GND17 H11 H12 J6 K5 K9 U402-G PM8916 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11 GND12 PMIC-PM8916(BGA176) D6 D7 D10 D11 E7 E9 G7 G8 G10 H7 H8 H10 GND GND D C B A NOT TO BE USED, COPIED, REPRODUCED IN WHOLE OR IN PART, NOR ITS CONTENTS REVEALED IN ANY MANNER TO OTHERS WITHOUT THE EXPRESS WRITTEN PERMISSION OF QUALCOMM. 3 2 QUALCOMM Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 U.S.A. Rev Sheet of Title Sheet Name Size Date: 1

D C B A 5 5 4 3 2 1 Reserved for RF-Desense Debug VREG1 U402-D PM8916 VDD_S1_1 VDD_S1_2 VDD_S1_3 GND_S1_1 GND_S1_2 GND_S1_3 VDD_S2_1 VDD_S2_2 VDD_S2_3 GND_S2_1 GND_S2_2 GND_S2_3 VDD_S3_1 VDD_S3_2 VDD_S3_3 GND_S3_1 GND_S3_2 VDD_S4_1 VDD_S4_2 VDD_S4_3 GND_S4_1 GND_S4_2 PMIC-PM8916(BGA176) A6 B6 C6 A4 B4 C4 A7 B7 C7 A9 B9 C9 M5 N5 P5 N3 P3 M6 N6 P6 N8 P8 VREG_S1 VSW_S1_1 VSW_S1_2 VSW_S1_3 VREG_S2 VSW_S2_1 VSW_S2_2 VSW_S2_3 VREG_S3 VSW_S3_1 VSW_S3_2 VSW_S3_3 VREG_S4 VSW_S4_1 VSW_S4_2 VSW_S4_3 E5 A5 B5 C5 F7 A8 B8 C8 J8 M4 N4 P4 K8 M7 N7 P7 VSW_S1 L501 1.0uH VSW_S2 1 L502 1.0uH 2 VSW_S3 VSW_S4 L503 2.2uH L504 2.2uH F N 5 2 5 C GND F N 6 2 5 C GND remote sense VREG_S1_1P15 2.5A F u 2 2 3 0 5 C F u 2 2 4 0 5 C GND remote sense C506_NC for PI simulation VREG_S2_1P15 3A F u 2 2 5 0 5 C F u 2 2 6 0 5 C F u 2 2 7 0 5 C Close to MSM GND VREG_S3_1P3 1.8A F N 7 2 5 C F u 2 2 9 0 5 C F u 2 2 0 1 5 C GND_S3 GND GND_S3 VREG_S4_2P1 1.5A F N 8 2 5 C F u 2 2 5 1 5 C F u 2 2 6 1 5 C GND_S4 GND GND_S4 VPH_PWR F u 2 2 1 0 5 C F u 2 2 2 0 5 C GND GND F N 1 2 5 C GND F N 2 2 5 C GND F N 3 2 5 C GND_S3 F u 2 . 2 1 1 5 C F u 2 . 2 2 1 5 C F u 2 . 2 3 1 5 C F u 2 . 2 4 1 5 C F N 4 2 5 C GND_S4 GND_S3 GND GND GND_S4 5 2 T H 6 2 T H 7 2 T H 8 2 T H Dedicated VIAs to Main GND TP-0.5MM TP1 1 TP-0.5MM TP16 1 EXT_BUCK_EN_GPIO_4 EXT_BUCK_VSEL I2C Address FAN53555 : 0xC0 NCP6335D: 0x1C U8103 B4 A2 A1 B3 B2 AGND EN VSEL POWER_FAIL INTERRUPT AVIN PVIN PVIN PVIN SW SW SW SW PGND PGND PGND PGND FB NCP6335 / FAN53555 BUCK_SMB_I2C_SDA BUCK_SMB_I2C_SCL B1 A3 SDA SCL DCTODC-NCP6335 HEI252010A-R33M-Q8 Rdc24(18) Is=6.5(8.0) Ih=4.8(5.5) VPH_PWR 4 2 1 8 C F u 0 1 C337 must to be close to U302 L8107 0.33uH As short as possible and L307 as close as possible to L301, then connect to VPROC_PMU VREG_EXT_1P15 0 3 5 C F u 2 2 1 3 5 C F u 2 2 D1 D2 E1 E2 D3 D4 E3 E4 C1 C2 C3 C4 A4 4 3 2 NOT TO BE USED, COPIED, REPRODUCED IN WHOLE OR IN PART, NOR ITS CONTENTS REVEALED IN ANY MANNER TO OTHERS WITHOUT THE EXPRESS WRITTEN PERMISSION OF QUALCOMM. QUALCOMM Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 U.S.A. Rev Sheet of Title Sheet Name Size Date: 1 D C B A

D C B A 5 5 VREG_S3_1P3 VREG_S3_1P3 VREG_S4_2P1 VPH_PWR VREG_S4_2P1 VIB_DRV_N 4 4 U402-E PM8916 N2 VDD_L1_3 N1 VDD_L2 VREG2 N9 P9 E1 E2 B1 B2 M2 M3 VDD_L4_5_6_A VDD_L4_5_6_B VDD_L8_11_14_15_16_A VDD_L8_11_14_15_16_B VDD_L9_10_12_13_17_18_A VDD_L9_10_12_13_17_18_B VDD_XO_RFCLK VDD_L7 M14 VIB_DRV_N L13 GND_DRV GND PMIC-PM8916(BGA176) VREG_L1 VREG_L2 VREG_L3 VREG_L4_1 VREG_L4_2 VREG_L5 VREG_L6 VREG_L7 VREG_L8 VREG_L9 VREG_L10 VREG_L11 VREG_L12 VREG_L13 VREG_L14 VREG_L15 VREG_L16 VREG_L17 VREG_L18 P2 M1 P1 M9 M10 P10 M8 L3 F1 C1 D4 G3 B3 D3 G2 G1 E3 A3 A1 3 3 2 1 VDD_WTR_1P225 VREG_EXT_1P2 VREG_L3_1P15 VDD_WTR_2P05 VREG_L5_1P8 VREG_L6_1P8 VREG_L7_1P8 VREG_L8_2P9 VDD_WCN_3P0 VREG_L10_2P8 VREG_L11_SDC VREG_L12_SDC VREG_L13_3P075 VREG_L14_UIM1 VREG_L15_UIM2 VREG_L16_UIM3 VREG_L17_2P85 VREG_L18_2P7 1200mA 1200mA 900mA 300mA 300mA 300mA 150mA 600mA 600mA 150mA 600mA 150mA 50mA 50mA 50mA 50mA 600mA 150mA Software Caution: L16 Need to Config to 1.8V and turn on later than L17 C602 4.7uF C603 4.7uF C604 4.7uF C605 4.7uF C606 NF C607 NF C608 1.0uF C609 4.7uF C610 4.7uF C611 NF C612 4.7uF C613 1.0uF C614 1.0uF C615 1.0uF C616 NF C617 1.0uF C618 4.7uF C619 1.0uF GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND PSEUDO CAPLESS LDOs L4, L5, L6, L7, L8, L9, L10, L11, L12, L13, L14, L15, L16, L17, L18 Local output capacitor can NC/Remove depends on remote load capacitors and PCB layout LDOs L8, L9, L11, L17 each shall have total effective output capacitance of 4.7uF. Please refer to PM8916 training slides(80-NK808-21) for limits on LDO output trace resistance and inductance Rest of the LDOs shall each have total effective output capacitance of 1.0uF. The Pseudo capless LDOs must comply to following tolerable routing requirement: P50: R<400mOhms, L<45nH P150: R<200mOhms, L<20nH P300: R<150mOhms, L<18nH P600: R<150mOhms, L<18nH Please ensure when you DNI the output capacitor of Pseudo capless LDOs the effective total capacitance at load side shall match above requirement NC first NOT TO BE USED, COPIED, REPRODUCED IN WHOLE OR IN PART, NOR ITS CONTENTS REVEALED IN ANY MANNER TO OTHERS WITHOUT THE EXPRESS WRITTEN PERMISSION OF QUALCOMM. 2 QUALCOMM Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 U.S.A. Rev Sheet of Title Sheet Name Size Date: 1 D C B A

D C B A 5 5 4 3 2 1 U402-F PM8916 SPKR_P SPKR_M1 SPKR_M2 MIC_IN1 MIC_IN2 MIC_IN3 MIC_BIAS1 MIC_BIAS2 EAR_P EAR_M PDM_CLK PDM_SYNC PDM_TX PDM_RX0 PDM_RX1 PDM_RX2 CP_C1_P CP_C1_N CP_VNEG1 CP_VNEG2 HPH_PA_VNEG PMIC-PM8916(BGA176) F14 E12 E13 K13 K11 J10 L12 J11 F13 G13 F8 E8 E11 E10 F10 F9 B14 C14 D13 D14 J14 CDC VDD_CDC_IO VDD_HPH VDD_CP1 VDD_CP2 VDD_EAR_SPKR VREG_BOOST_1 VREG_BOOST_2 VDD_VBAT BOOST_SW1 BOOST_SW2 HPH_REF HPH_L HPH_P HS_DET GND_CP GND_CFILT GND_SPKR GND_BOOST1 GND_BOOST2 GND_CDC D12 H13 C11 C12 G14 A11 B11 A13 A12 B12 G11 F12 G12 K14 C13 J13 E14 A14 B13 J12 VREG_L5_1P8 VREG_S4_2P1 Close to H13 pin C702 F u 0 . 1 Close to C11/C12 pin F u 2 . 2 3 0 7 C F u 1 . 0 4 0 7 C GND GND GND_CP C708 2.2uF Close to G14 pin GND_SPK GND VPH_PWR CDC_HPH_REF F N 2 1 7 C GND F u 0 1 4 1 7 C GND_BST GND HPH_L HPH_P B704 B705 0 0 CDC_HPH_L CDC_HPH_R CDC_HS_DET Dedicated VIA to Main GND 2 T H R703 0 R705 NF GND_MIC CDC_HPH_REF Dedicated VIA to Main GND Dedicated trace to D2 pin first REF_GND GND GND GND GND_BST GND_SPK Dedicated VIA to Main GND GND_MIC Dedicated VIA to Main GND GND_CP MIC_IN1_P MIC_IN2_P MIC1_IN3_P MIC_BIAS1 MIC_BIAS2 8 3 7 C F N 9 3 7 C F N CDC_EAR_P CDC_EAR_M Route codec PDM signals with matching length on a inner layer shield between two GND layers. Do not add any test point. CDC_PDM_CLK CDC_PDM_SYNC CDC_PDM_TX CDC_PDM_RX0 CDC_PDM_RX1 CDC_PDM_RX2 C718 1.0uF CP_C1_P CP_C1_N CP_VNEG B706 120ohm CDC_PA_VNEG C719 F u 0 . 1 C720 F u 0 . 1 GND GND_CP D C B A 4 3 2 NOT TO BE USED, COPIED, REPRODUCED IN WHOLE OR IN PART, NOR ITS CONTENTS REVEALED IN ANY MANNER TO OTHERS WITHOUT THE EXPRESS WRITTEN PERMISSION OF QUALCOMM. QUALCOMM Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 U.S.A. Rev Sheet of Title Sheet Name Size Date: 1

D C B A 5 5 4 3 2 1 For BBCLK1,AD35 will be the first load and AL34 will be the final load Should be a daisy chain route U401-A 3620 vs 3680B R450 NF 0 R451 0 NF CLK_OUT R450 R451 0 NF MSM_RESIN_N MSM_RESOUT_N 1 1 TP8 TP-0.8MM TP26 TP-0.8MM BB_CLK BBCLK_MSM_EN SLEEP_CLK PS_HOLD JTAG_RESOUT_N JTAG_TCK JTAG_TDI JTAG_TDO JTAG_TMS JTAG_TRST_N VREF_LPDDR3 Star routing from C0803 to PINs NC others CAPs first VREF_LPDDR3 F N 1 0 8 C F N 2 0 8 C F u 1 . 0 3 0 8 C GND GND AR8 AL34 A36 G36 F35 AV1 WLAN_XO CXO CXO_EN SLEEP_CLK RESIN_N RESOUT_N AU32 AT31 MODE_0 MODE_1 E36 PS_HOLD K1 M1 M3 J2 L2 K3 J12 H21 J26 SRST_N TCK TDI TDO TMS TRST_N EBI_VREF_CA EBI_VREF_D0_D2 EBI_VREF_D1_D3 AN8 DNC1 BA36 AY35 DNC2 DNC3 BBIC-MSM8939(760NSP) CONTROL SDC1_CLK SDC1_CMD AE36 AH35 N20267871 R802 0 SDC1_DATA_0 SDC1_DATA_1 SDC1_DATA_2 SDC1_DATA_3 SDC1_DATA_4 SDC1_DATA_5 SDC1_DATA_6 SDC1_DATA_7 SDC2_CLK SDC2_CMD SDC2_DATA_0 SDC2_DATA_1 SDC2_DATA_2 SDC2_DATA_3 USB_HS_DM USB_HS_DP NC46 USB_HS_REXT USB_HS_SYSCLOCK N25012351 AD37 AE38 AG34 AH37 AG40 AG38 AF39 AF35 R4 N6 P3 R6 T7 P7 AC40 AB39 AA40 AC38 AD35 PMIC_SPMI_CLK PMIC_SPMI_DATA AK37 AJ36 Close to MSM R804 0 USB_HS_REXT R803 200 +/-1% GND BB_CLK SDC1_CLK SDC1_CMD SDC1_DATA_0 SDC1_DATA_1 SDC1_DATA_2 SDC1_DATA_3 SDC1_DATA_4 SDC1_DATA_5 SDC1_DATA_6 SDC1_DATA_7 SDC2_SDCARD_CLK SDC2_SDCARD_CMD SDC2_SDCARD_D0 SDC2_SDCARD_D1 SDC2_SDCARD_D2 SDC2_SDCARD_D3 USB_HS_D_M USB_HS_D_P SPMI_CLK SPMI_DATA GND SPMI Data trace length should be within +/-2mm of SMPI Clock trace length. 33pF shunt caps must be no more than 2mm away from the MSM. D C B A 4 3 2 NOT TO BE USED, COPIED, REPRODUCED IN WHOLE OR IN PART, NOR ITS CONTENTS REVEALED IN ANY MANNER TO OTHERS WITHOUT THE EXPRESS WRITTEN PERMISSION OF QUALCOMM. QUALCOMM Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 U.S.A. Rev Sheet of Title Sheet Name Size Date: 1

D C B A 5 5 4 4 3 2 1 Place R0901 close to MSM Pin EBI_CAL_REXT R901 240 +/-1% EBI0_ODT GND EBI0_CS0_N EBI0_CS1_N EBI0_CLK_C EBI0_CLK_T EBI0_CKE0 EBI0_CKE1 EBI0_DM0 EBI0_DM1 EBI0_DM2 EBI0_DM3 EBI0_DQS0_C EBI0_DQS0_T EBI0_DQS1_C EBI0_DQS1_T EBI0_DQS2_C EBI0_DQS2_T EBI0_DQS3_C EBI0_DQS3_T EBI0_CA0 EBI0_CA1 EBI0_CA2 EBI0_CA3 EBI0_CA4 EBI0_CA5 EBI0_CA6 EBI0_CA7 EBI0_CA8 EBI0_CA9 U401-B EBI_CS0_N EBI_CS1_N EBI_CKB EBI_CK EBI_CKE_0 EBI_CKE_1 EBI_DM_0 EBI_DM_1 EBI_DM_2 EBI_DM_3 EBI_DQS_0B EBI_DQS_0 EBI_DQS_1B EBI_DQS_1 EBI_DQS_2B EBI_DQS_2 EBI_DQS_3B EBI_DQS_3 EBI_CA_0 EBI_CA_1 EBI_CA_2 EBI_CA_3 EBI_CA_4 EBI_CA_5 EBI_CA_6 EBI_CA_7 EBI_CA_8 EBI_CA_9 BBIC-MSM8939(760NSP) B7 B9 D11 C10 A8 A10 F23 E24 B19 B31 B25 C24 D25 E26 D19 E18 D31 E32 E10 E8 C6 D9 E6 B13 C12 D13 B11 E14 EBI0 EBI_CAL_REXT EBI_ODT EBI_DQ_0 EBI_DQ_1 EBI_DQ_2 EBI_DQ_3 EBI_DQ_4 EBI_DQ_5 EBI_DQ_6 EBI_DQ_7 EBI_DQ_8 EBI_DQ_9 EBI_DQ_10 EBI_DQ_11 EBI_DQ_12 EBI_DQ_13 EBI_DQ_14 EBI_DQ_15 EBI_DQ_16 EBI_DQ_17 EBI_DQ_18 EBI_DQ_19 EBI_DQ_20 EBI_DQ_21 EBI_DQ_22 EBI_DQ_23 EBI_DQ_24 EBI_DQ_25 EBI_DQ_26 EBI_DQ_27 EBI_DQ_28 EBI_DQ_29 EBI_DQ_30 EBI_DQ_31 F11 H13 E20 E22 A20 D21 B21 D23 B23 A24 E28 C26 A26 B29 D29 C28 A30 E30 B17 B15 A14 A18 D15 C14 D17 E16 C34 F33 C36 D35 E34 B35 A34 B33 EBI0_DQ0 EBI0_DQ1 EBI0_DQ2 EBI0_DQ3 EBI0_DQ4 EBI0_DQ5 EBI0_DQ6 EBI0_DQ7 EBI0_DQ8 EBI0_DQ9 EBI0_DQ10 EBI0_DQ11 EBI0_DQ12 EBI0_DQ13 EBI0_DQ14 EBI0_DQ15 EBI0_DQ16 EBI0_DQ17 EBI0_DQ18 EBI0_DQ19 EBI0_DQ20 EBI0_DQ21 EBI0_DQ22 EBI0_DQ23 EBI0_DQ24 EBI0_DQ25 EBI0_DQ26 EBI0_DQ27 EBI0_DQ28 EBI0_DQ29 EBI0_DQ30 EBI0_DQ31 D C B A NOT TO BE USED, COPIED, REPRODUCED IN WHOLE OR IN PART, NOR ITS CONTENTS REVEALED IN ANY MANNER TO OTHERS WITHOUT THE EXPRESS WRITTEN PERMISSION OF QUALCOMM. 3 2 QUALCOMM Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 U.S.A. Rev Sheet of Title Sheet Name Size Date: 1

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红米3原厂维修图纸(红米3 主板原理图电路图).pdf

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