英飞凌IGBT驱动经典.pdf

发布时间：2022-05-29 发布人：admin 分类：说明书资料大小：3.92M 资料格式：pdf 举报版权申诉

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Table of Contents

List of Figures

List of Tables

1 Introduction

1.1 How to Order Hybrid Kit for HybridPACK™2

2 Design Features

2.1 Main Features

2.2 Dimensions

2.3 Key Components

2.3.1 Driver Board (6ED100HP2-FA)

2.3.2 Logic Board

2.3.3 HybridPACK™2

2.3.4 DC-Link Capacitor

2.3.5 Cooling Element

3 Hybrid Kit for the HybridPACK™2 Evaluation Driver Board

3.1 Main Features

3.2 Key Data

3.3 External Connector Pin Assignment

3.4 Mechanical Dimensions of the Driver Board

3.5 Operation of the Driver Board

3.5.1 Switching Mode Power Supply (SMPS)

3.5.2 Input Logic

3.5.3 IGBT Switch-off Behavior

3.5.4 Maximum Switching Frequency

3.5.5 Booster

3.5.6 Short Circuit Protection and Clamp Function

3.5.7 Fault Output

3.5.8 Temperature Measurement

3.5.9 DC Voltage Measurement

3.6 Switching Losses

3.7 Definition of Layers of Driver Board

3.8 Schematics, Layout and Bill of Material

3.8.1 Schematics

3.8.2 Assembly Drawing

3.8.3 Layout

3.8.4 Bill of Materials

4 Hybrid Kit for the HybridPACK™2 Logic Board

4.1 External Connector (X1-SIG1) Pin Assignment

4.2 Connector to the Driver Board (K1)

4.3 Power Supply

4.4 Microcontroller

4.4.1 Configuration of TC1767

4.4.1.1 Boot Configuration of TC1767

4.4.1.2 Selecting Serial/Parallel Interface

4.5 Watchdog

4.6 Phase Current Sensing

4.7 Resolver Interface

4.8 Encoder Interface

4.9 Hall Sensor Interface

4.10 GMR Interface

4.10.1 GMR SSC Interface Mode

4.10.2 GMR Encoder Interface Mode

4.10.3 GMR Hall Sensor Interface Mode

4.11 Definition of Layers for the Logic Board

4.12 Schematics, Layout and Bill of Materials

4.12.1 Schematics

4.12.2 Assembly Drawing

4.12.3 Layout

4.12.4 Bill of Materials

HybridPACK™ Hybrid Kit for HybridPACK™2 Evaluation Kit for Applications with HybridPACK™2 Module Application Note V2.2, 2010-03 System Engineering

Edition 2010-03 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

Hybrid Kit for HybridPACK™2 Evaluation Kit for Applications with HybridPACK™2 Module Hybrid Kit for HybridPACK™2 Revision History: 2010-03, V2.2 Previous Revision: V2.1 Page 45 Subjects (major changes since last revision) Added support for Logic Board v1.3b (Chapter 4) Many editorial changes Previous Revision: V2.0 Page 41 Subjects (major changes since last revision) Improved description for the connector X1-SIG1 (Chapter 4.3) Many editorial changes Trademarks of Infineon Technologies AG A-GOLD™, BlueMoon™, COMNEON™, CONVERGATE™, COSIC™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CONVERPATH™, CORECONTROL™, DAVE™, DUALFALC™, DUSLIC™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, E-GOLD™, EiceDRIVER™, EUPEC™, ELIC™, EPIC™, FALC™, FCOS™, FLEXISLIC™, GEMINAX™, GOLDMOS™, HITFET™, HybridPACK™, INCA™, ISAC™, ISOFACE™, IsoPACK™, IWORX™, M-GOLD™, MIPAQ™, ModSTACK™, MUSLIC™, my-d™, NovalithIC™, OCTALFALC™, OCTAT™, OmniTune™, OmniVia™, OptiMOS™, OPTIVERSE™, ORIGA™, PROFET™, PRO-SIL™, PrimePACK™, QUADFALC™, RASIC™, ReverSave™, SatRIC™, SCEPTRE™, SCOUT™, S-GOLD™, SensoNor™, SEROCCO™, SICOFI™, SIEGET™, SINDRION™, SLIC™, SMARTi™, SmartLEWIS™, SMINT™, SOCRATES™, TEMPFET™, thinQ!™, TrueNTRY™, TriCore™, TRENCHSTOP™, VINAX™, VINETIC™, VIONTIC™, WildPass™, X-GOLD™, XMM™, X-PMU™, XPOSYS™, XWAY™. Other Trademarks AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO. OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2009-10-19 is Application Note 3 V2.2, 2010-03

Hybrid Kit for HybridPACK™2 Evaluation Kit for Applications with HybridPACK™2 Module Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 How to Order Hybrid Kit for HybridPACK™2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Design Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Key Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Driver Board (6ED100HP2-FA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 HybridPACK™2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 DC-Link Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Cooling Element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Hybrid Kit for the HybridPACK™2 Evaluation Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Key Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 External Connector Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Mechanical Dimensions of the Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Operation of the Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Switching Mode Power Supply (SMPS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Input Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 IGBT Switch-off Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Maximum Switching Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Booster . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Short Circuit Protection and Clamp Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Fault Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 DC Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Switching Losses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Definition of Layers of Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Schematics, Layout and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Assembly Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Hybrid Kit for the HybridPACK™2 Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 External Connector (X1-SIG1) Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Connector to the Driver Board (K1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Configuration of TC1767 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Boot Configuration of TC1767 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Selecting Serial/Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Phase Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 1 1.1 2 2.1 2.2 2.3 2.3.1 2.3.2 2.3.3 2.3.4 2.3.5 3 3.1 3.2 3.3 3.4 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.5.6 3.5.7 3.5.8 3.5.9 3.6 3.7 3.8 3.8.1 3.8.2 3.8.3 3.8.4 4 4.1 4.2 4.3 4.4 4.4.1 4.4.1.1 4.4.1.2 4.5 4.6 Application Note 4 V2.2, 2010-03

Hybrid Kit for HybridPACK™2 Evaluation Kit for Applications with HybridPACK™2 Module Table of Contents Resolver Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Encoder Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Hall Sensor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 GMR Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 GMR SSC Interface Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 GMR Encoder Interface Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 GMR Hall Sensor Interface Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Definition of Layers for the Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Schematics, Layout and Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Assembly Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 4.7 4.8 4.9 4.10 4.10.1 4.10.2 4.10.3 4.11 4.12 4.12.1 4.12.2 4.12.3 4.12.4 Application Note 5 V2.2, 2010-03

Hybrid Kit for HybridPACK™2 Evaluation Kit for Applications with HybridPACK™2 Module List of Figures List of Figures The Hybrid Kit for HybridPACK™2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 1 Block Diagram of Hybrid Kit for HybridPACK™2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 2 Dimensions of the Hybrid Kit for HybridPACK™2 (all dimensions are in mm) . . . . . . . . . . . . . . . . 12 Figure 3 HybridPACKTM2 IGBT Six-Pack Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 4 DC-Link Capacitor for HybridPACK™2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 5 Example of Water Cooling Element for HybridPACK™2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 6 Water Cooling System Technical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 7 Driver Board Mounted on the Top of the HybridPACK™2 Module. . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 8 External Connector on the Driver Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 9 Dimensions of the Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 10 PCB Mounting Stand-offs of HybridPACK™2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 11 Hybrid Kit for the HybridPACKTM2 Evaluation Driver Board Block Diagram . . . . . . . . . . . . . . . . . 21 Figure 12 Figure 13 Schematic of the Input Logic Block of the Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 14 Maximal Switch-off Current at Different DC-Link Voltages (Gate Resistance as a Parameter) . . . 23 Figure 15 Temperature of Gate Resistors vs. Switching Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Desaturation Protection and Active Clamping Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 16 a) Short Circuit w/o Active Clamp (DC Voltage=275V, Voltage Overshoot=628V) Figure 17 b) With Active Clamp Function (DC Voltage=400V, Voltage Overshoot=604V) ............................26 Fault Output of a Single Driver IC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 18 Fault Output During: a) Normal Operation b) Operation under Short Circuit . . . . . . . . . . . . . . . . 27 Figure 19 Characteristics of the Temperature Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 20 Characteristics of the DC Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 21 Copper and Isolation for Layers of Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 22 Schematics Block Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 23 SMPS - Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 24 External Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 25 Fault Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Figure 26 Input Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 27 IGBT Driver - Bottom Transistor of Phase U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 28 IGBT Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 29 DC Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Figure 30 IGBT Module Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 31 Assembly Drawing of the Driver Board (Top) - part 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 32 Assembly Drawing of the Driver Board (Top) - part 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 33 Assembly Drawing of the Driver Board (Bottom) - part 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Figure 34 Assembly Drawing of the Driver Board (Bottom) - part 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Figure 35 Driver Board - Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 36 Driver Board - Layer 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 37 Driver Board - Layer 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 38 Driver Board - Layer 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 39 Driver Board - Layer 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 40 Driver Board - Bottom Layer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 41 Hybrid Kit for the HybridPACK™2 Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Figure 42 Hybrid Kit for the HybridPACK™2 Logic Board v1.3b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Figure 43 Block Diagram of the Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Figure 44 External Connector Pin Assignment Logic Board v1.2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Figure 45 Figure 46 External Connector Pin Assignment Logic Board v1.3b. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Figure 47 Overvoltage and Wrong Polarity Protection Circuit (same for Logic Board v1.2 and v1.3b) . . . . . 53 Figure 48 HW Boot Configuration of TC1767 DIP-Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Application Note 6 V2.2, 2010-03

Hybrid Kit for HybridPACK™2 Evaluation Kit for Applications with HybridPACK™2 Module List of Figures Figure 49 The Boot Configuration Switch (SW1) and Serial/Parallel Interface Select Switch (SW2) . . . . . . . 55 Figure 50 GMR SSC Interface (Logic Board v1.3b only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Figure 51 GMR SSC Interface - Proposal Using TLE5012. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Picture of Possible Physical Implementation of the GMR Sensor . . . . . . . . . . . . . . . . . . . . . . . . . 58 Figure 52 Definition of the Layers for the Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Figure 53 Figure 54 Definition of the Layers for the Logic Board v1.3b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Schematics Block Overview Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Figure 55 Schematics Block Overview Logic Board v1.3b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Figure 56 Figure 57 Power Supply Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Power Supply Logic Board v1.3b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Figure 58 Figure 59 JTAG Debug Connector (same for Logic Board v1.2 and v1.3b) . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Figure 60 Watchdog (same for Logic Board v1.2 and v1.3b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Figure 61 Resolver Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Resolver Logic Board v1.3b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Figure 62 Level Shifter for Adapting 3.3V to 5V Logic Levels Logic Board v1.2. . . . . . . . . . . . . . . . . . . . . . . 65 Figure 63 Level Shifter for Adapting 3.3V to 5V Logic Levels Logic Board v1.3b. . . . . . . . . . . . . . . . . . . . . . 66 Figure 64 Figure 65 Connector to the Driver Board (same for Logic Board v1.2 and v1.3b) . . . . . . . . . . . . . . . . . . . . . 66 Figure 66 Microcontroller Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Figure 67 Microcontroller Logic Board v1.3b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Input Filter Logic Board v1.2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Figure 68 Figure 69 Input Filter Logic Board v1.3b. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Figure 70 Microcontroller TC1767 Pin Assignment Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Figure 71 Microcontroller TC1767 Pin Assignment Logic Board v1.3b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Figure 72 EEPROM (same for Logic Board v1.2 and Logic Board v1.3b) . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Figure 73 On-Board Temperature Measurement (Logic Board v1.3b only) . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Assembly Drawing of the Logic Board v1.2 (Top) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Figure 74 Assembly Drawing of the Logic Board v1.3b (Top) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Figure 75 Assembly Drawing of the Logic Board v1.2 (Bottom) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Figure 76 Figure 77 Assembly Drawing of the Logic Board v1.3b (Bottom) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Logic Board v1.2 - Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Figure 78 Logic Board v1.2 - Layer 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Figure 79 Logic Board v1.2 - Layer 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Figure 80 Figure 81 Logic Board v1.2 - Bottom Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Logic Board v1.3b - Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Figure 82 Logic Board v1.3b - Layer 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Figure 83 Figure 84 Logic Board v1.3b - Layer 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Logic Board v1.3b - Layer 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Figure 85 Logic Board v1.3b - Layer 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Figure 86 Figure 87 Logic Board v1.3b - Bottom Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Application Note 7 V2.2, 2010-03

Hybrid Kit for HybridPACK™2 Evaluation Kit for Applications with HybridPACK™2 Module List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Key Data of DC-Link Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Key Data and Characteristic Values (Typical Values) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Bill of Materials for Hybrid Kit for the HybridPACK™2 Evaluation Driver Board . . . . . . . . . . . . . . 43 External Connection Pin Assignment Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 External Connector Pin Assignment Logic Board v1.3b. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 User Startup Modes for TC1767 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Selecting Serial/Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Bill of Materials for Hybrid Kit for the HybridPACK™2 Logic Board v1.2 . . . . . . . . . . . . . . . . . . . . 88 Bill of Materials for hybrid Kit for HybridPACK™2 Logic Board v1.3v . . . . . . . . . . . . . . . . . . . . . . 90 Application Note 8 V2.2, 2010-03

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