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TSM12S触摸芯片(SPECIFICATION VER. 1.0).pdf

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ADSemiconductor® TSM12S (12-CH Auto Sensitivity Calibration Capacitive Touch Sensor) TSM12S 12-CH Auto Sensitivity Calibration Capacitive Touch Sensor SPECIFICATION VER. 1.0 Feb. 2018 ADSemiconductor Confidential
ADSemiconductor® TSM12S (12-CH Auto Sensitivity Calibration Capacitive Touch Sensor) Revision History Rev. 1.0 First Creation Description of change Date Originator 18.02.28 CH LEE AD Semiconductor Confidential 2 / 32
ADSemiconductor® TSM12S (12-CH Auto Sensitivity Calibration Capacitive Touch Sensor) General The TSM12S is 12-Channel capacitive sensor with auto sensitivity calibration. And the supply voltage range is from 1.8 to 5.0V. The TSM12S has the SLEEP mode to save the consumption. And the current consumption is 8 uA. The TSM12S offers fast touch detection with fast response operation. The result of touch sensing can be checked by the I2C serial interface. And touch intensity can be detectable within 3 steps (Low, Middle and High). Block Diagram Feature  12-Channel capacitive sensor with auto sensitivity calibration  Selectable output operation (single mode / multi- mode)  Independently adjustable in 8 step sensitivity  Adjustable internal frequency with external resister  Adjustable response time and interrupt level by the control registers  I2C serial interface  Embedded high frequency noise elimination circuit  Typical current consumption xxx 45 uA (@3.0V)  Sleep mode current consumption 8 uA (@3.0V)  RoHS compliant 24QFN package Application  Mobile application (mobile phone / PDA / PMP etc)  Membrane switch replacement  Sealed control panels, keypads  Door key-lock matrix application  Touch screen replacement application Ordering Information Part No. TSM12S Package 24 QFN AD Semiconductor Confidential 3 / 32
ADSemiconductor® TSM12S (12-CH Auto Sensitivity Calibration Capacitive Touch Sensor) Content 2.1 8.1 8.2 7 4.1 4.2 Revision History ........................................................................................................................ 2 General ....................................................................................................................................... 3 1 Pin Configuration ............................................................................................................... 5 2 Pin Description ................................................................................................................... 6 Pin Map (24 QFN package) .................................................................................. 7 3 Absolute Maximum Rating ................................................................................................ 8 4 ESD & Latch-up Characteristics ........................................................................................ 8 ESD Characteristics .............................................................................................. 8 Latch-up Characteristics ....................................................................................... 8 5 Electrical Characteristics .................................................................................................... 9 6 TSM12S Implementation ................................................................................................. 10 6.1 RBIAS & SRBIAS implementation ................................................................... 10 6.2 CS implementation ............................................................................................. 11 6.3 SYNC implementation........................................................................................ 12 6.4 RESET implementation ...................................................................................... 13 I2C Interface ...................................................................................................................... 14 IRBIAS Implementation ..................................................................................... 14 7.1 7.2 Start & Stop Condition ....................................................................................... 15 Data validity........................................................................................................ 16 7.3 Byte Format ........................................................................................................ 16 7.4 Acknowledge ...................................................................................................... 16 7.5 7.6 First Byte ............................................................................................................ 17 Transferring Data ................................................................................................ 18 7.7 I2C write and read operations in normal mode ................................................... 18 7.8 I2C timing diagram ............................................................................................. 19 7.9 8 TSM12S control register .................................................................................................. 20 I2C Register Map ................................................................................................ 20 Details ................................................................................................................. 21 9 Recommended TSM12S Initialize Flow (Example) ........................................................ 25 10 Recommended Circuit Diagram ....................................................................................... 26 10.1 Application Example in clean power environment ............................................ 26 10.2 Application Example in noisy environment ....................................................... 27 10.3 Example – Power Line Split Strategy PCB Layout ............................................ 28 11 MECHANICAL DRAWING ........................................................................................... 29 11.1 AMKOR Mechanical Drawing of TSM12S (24 QFN) ...................................... 29 11.2 GREATEK Mechanical Drawing of TSM12S (24 QFN)................................... 30 12 MARKING DESCRIPTION ............................................................................................ 31 12.1 Marking Description of TSM12S (24 QFN) ...................................................... 31 NOTES: ................................................................................................................................... 32 AD Semiconductor Confidential 4 / 32
ADSemiconductor® TSM12S (12-CH Auto Sensitivity Calibration Capacitive Touch Sensor) 1 Pin Configuration TSM12S (24 QFN) AD Semiconductor Confidential 5 / 32
ADSemiconductor® TSM12S (12-CH Auto Sensitivity Calibration Capacitive Touch Sensor) 2 Pin Description VDD, VSS Supply voltage and ground pin. I_VDD Supply voltage pin for IO pads. RND Reference channel capacitive sensor input pin. CS1 ~ CS12 Capacitive sensor input pins. SCL, SDA SCL is I2C clock input pin and SDA is I2C data input-output pin. INT Touch sensing interrupt output pin. RBIAS Internal bias adjust input. SL_RB Internal bias adjust input for the SLEEP mode. RBIAS Internal bias adjust input. RST System reset input. I2C_EN I2C Enable input. The I2C block is enabled when I2C_EN pin goes low. CHIPID I2C address selection input. SYNC The output mode selection input and sync pulse input/output for the sync operation. AD Semiconductor Confidential 6 / 32
ADSemiconductor® TSM12S (12-CH Auto Sensitivity Calibration Capacitive Touch Sensor) 2.1 Pin Map (24 QFN package) Pin Number PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Name Name CS4 CS5 CS6 CS7 CS8 CS9 CS10 CS11 CS12 SL_RB RBIAS GND VDD I_VDD RST INT SCL SDA SYNC CHIPID RND CS1 CS2 CS3 I/O I/O Description Description Analog Input CH4 capacitive sensor input Analog Input CH5 capacitive sensor input Analog Input CH6 capacitive sensor input Analog Input CH7 capacitive sensor input Analog Input CH8 capacitive sensor input Analog Input CH9 capacitive sensor input Analog Input CH10 capacitive sensor input Analog Input CH11 capacitive sensor input Analog Input CH12 capacitive sensor input Analog Input SLEEP Mode Internal bias adjust input Analog Input Internal bias adjust input Ground Supply ground Power Power Power (2.5V~5.0V) IO PAD Power (2.5V~5.0V) Digital Input System reset (High reset) Digital Output Interrupt output (Open drain) Digital Input I2C clock input Digital Input/Output Digital Input/Output Digital Input I2C data (Open drain) Sync pulse input /output I2C address selection Analog Input Ref. Ch capacitive sensor input Analog Input CH1 capacitive sensor input Analog Input CH2 capacitive sensor input Analog Input CH3 capacitive sensor input Note 1 : Refer to 6.3 SYNC implementation Protection Protection VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD GND GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND VDD/GND AD Semiconductor Confidential 7 / 32
ADSemiconductor® TSM12S (12-CH Auto Sensitivity Calibration Capacitive Touch Sensor) 3 Absolute Maximum Rating 5.5V Maximum supply voltage VDD+0.3 Maximum voltage on any pin 100mA Maximum current on any PAD Power Dissipation 800mW -50 ~ 150℃ Storage Temperature -40 ~ 85℃ Operating Temperature 150℃ Junction Temperature Note Unless any other command is noted, all above are operated in normal temperature. 4 ESD & Latch-up Characteristics 4.1 ESD Characteristics Mode Polarity H.B.M Pos / Neg M.M Pos / Neg C.D.M Pos / Neg 4.2 Latch-up Characteristics Mode I Test V supply over 5.0V Polarity Positive Negative Positive Max 8000V 8000V 8000V 400V 400V 400V 800V 800V Max 200mA -200mA 8.25V Reference VDD VSS P to P VDD VSS P to P DIRECT Test Step 25mA 1.0V AD Semiconductor Confidential 8 / 32
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