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pcie card 3.0总线规范.pdf
PCI Express®
Card Electromechanical
Specification
Revision 3.0
July 21, 2013
1
Revision Revision History
1.0
1.0a
1.1
2.0
Initial release.
Incorporated WG Errata C1-C7 and E1.
Incorporated approved Errata and ECNs.
Added support for 5.0 GT/s data rate.
3.0
Added support for 8.0 GT/s data rate and incorporated approved Errata and
ECNs. Incorporated the PCI Express x16 Graphics 150W-ATX Specification
and the PCI Express 225 W/300 W High Power Card Electromechanical
Specification.
Re-imported all figures
Updated Figure 6-1 and Figure 6-3
Fixed text notes in Chapter 6 and 9 Figures (took notes out of Illustrator and
made them part of the Word file)
Changed 306.67 MAX dimension to 326.03 MIN in Figure 9-3
Date
7/22/2002
4/15/2003
3/28/2005
4/11/2007
7/21/2013
Contents
2.1.1.
2.1.2.
2.1.3.
2.1.4.
2.1.5.
2.1.6.
1. INTRODUCTION..................................................................................................................11
1.1. TERMS AND DEFINITIONS ................................................................................................... 12
1.2. REFERENCE DOCUMENTS ................................................................................................... 13
1.3. SPECIFICATION CONTENTS ................................................................................................. 14
1.4. OBJECTIVES............................................................................................................................. 14
1.5. ELECTRICAL OVERVIEW ..................................................................................................... 15
1.6. MECHANICAL OVERVIEW ................................................................................................... 16
1.7. 150 W OVERVIEW ................................................................................................................... 18
1.8. 225 W AND 300 W ADD-IN CARD OVERVIEW .................................................................. 19
1.9. SYSTEM POWER DELIVERY REQUIREMENTS ................................................................. 20
2. AUXILIARY SIGNALS ........................................................................................................21
2.1. REFERENCE CLOCK ............................................................................................................... 22
Low Voltage Swing, Differential Clocks .................................................................... 22
Spread Spectrum Clocking (SSC) ............................................................................... 23
REFCLK AC Specifications........................................................................................ 24
REFCLK Phase Jitter Specification for 2.5 GT/s Signaling Support ......................... 28
REFCLK Phase Jitter Specification for 5.0 GT/s Signaling Support ......................... 29
REFCLK Phase Jitter Specification for 8.0 GT/s Signaling Support ......................... 29
2.2. PERST# SIGNAL ...................................................................................................................... 29
Initial Power-Up (G3 to S0) ....................................................................................... 30
Power Management States (S0 to S3/S4 to S0) .......................................................... 30
Power Down ............................................................................................................... 32
2.3. WAKE# SIGNAL ...................................................................................................................... 33
2.4. SMBUS (OPTIONAL) ............................................................................................................... 37
2.4.1.
Capacitive Load of High-power SMBus Lines ........................................................... 37
2.4.2. Minimum Current Sinking Requirements for SMBus Devices.................................... 37
SMBus “Back Powering” Considerations ................................................................. 37
2.4.3.
2.4.4.
Power-on Reset .......................................................................................................... 38
2.5. JTAG PINS (OPTIONAL) ......................................................................................................... 38
2.6. AUXILIARY SIGNAL PARAMETRIC SPECIFICATIONS ................................................... 39
DC Specifications ....................................................................................................... 39
AC Specifications ....................................................................................................... 40
3. HOT INSERTION AND REMOVAL ..................................................................................41
2.2.1.
2.2.2.
2.2.3.
2.6.1.
2.6.2.
3.1. SCOPE 41
3.2. PRESENCE DETECT ................................................................................................................ 41
4. ELECTRICAL REQUIREMENTS .....................................................................................43
4.1. POWER SUPPLY REQUIREMENTS ...................................................................................... 43
4.2. POWER CONSUMPTION ........................................................................................................ 45
4.3. POWER BUDGETING CAPABILITY ..................................................................................... 46
4.4. POWER SUPPLY SEQUENCING ............................................................................................ 46
4.5. POWER SUPPLY DECOUPLING ............................................................................................ 47
4.6. ELECTRICAL TOPOLOGIES AND LINK DEFINITIONS .................................................... 47
Topologies .................................................................................................................. 47
Link Definition ............................................................................................................ 49
4.6.1.
4.6.2.
3
PCI EXPRESS CARD ELECTROMECHANICAL SPECIFICATION, REV. 3.0
4.7.1.
4.7.2.
4.7.3.
4.7.4.
4.7.5.
4.7.6.
4.7.7.
4.7.8.
4.7.9.
4.8.1.
4.8.2.
4.8.3.
4.8.4.
4.8.5.
4.8.6.
4.8.7.
4.8.8.
4.8.9.
4.8.10.
4.8.11.
4.8.12.
4.7. ELECTRICAL BUDGETS ........................................................................................................ 50
AC Coupling Capacitors ............................................................................................ 51
Insertion Loss Values (Voltage Transfer Function) ................................................... 51
Jitter Values ................................................................................................................ 51
Crosstalk ..................................................................................................................... 53
Lane-to-Lane Skew ..................................................................................................... 54
Transmitter Equalization ............................................................................................ 54
Skew within the Differential Pair ............................................................................... 55
Differential Data Trace Impedance............................................................................ 55
Differential Data Trace Propagation Delay .............................................................. 56
4.8. EYE DIAGRAMS AT THE ADD-IN CARD INTERFACE ..................................................... 56
Add-in Card Transmitter Path Compliance Eye Diagram at 2.5 GT/s ...................... 56
Add-in Card Transmitter Path Compliance Eye Diagrams at 5.0 GT/s .................... 57
Add-in Card Transmitter Path Compliance Eye Diagrams at 8.0 GT/s .................... 59
Add-in Card Minimum Receiver Path Sensitivity Requirements at 2.5 GT/s ............. 60
Add-in Card Minimum Receiver Path Sensitivity Requirements at 5.0 GT/s ............. 61
Add-in Card Minimum Receiver Path Sensitivity Requirements at 8.0 GT/s ............. 62
System Board Transmitter Path Compliance Eye Diagram at 2.5 GT/s .................... 65
System Board Transmitter Path Compliance Eye Diagram at 5.0 GT/s .................... 66
System Board Transmitter Path Compliance Eye Diagram at 8.0 GT/s .................... 69
System Board Minimum Receiver Path Sensitivity Requirements at 2.5 GT/s ........... 72
System Board Minimum Receiver Path Sensitivity Requirements at 5.0 GT/s ........... 73
System Board Minimum Receiver Path Sensitivity Requirements at 8.0 GT/s ........... 75
5. 150 W, 225 W, AND 300 W ADD-IN CARD POWER .......................................................77
5.1. 150 W ADD-IN CARD POWER-UP SEQUENCING .............................................................. 79
5.2. 225 W AND 300 W ADD-IN CARD POWER-UP SEQUENCING ......................................... 81
6. CARD CONNECTOR SPECIFICATION ..........................................................................86
6.1. CONNECTOR PINOUT ............................................................................................................ 86
6.2. CONNECTOR INTERFACE DEFINITIONS ........................................................................... 89
6.3. SIGNAL INTEGRITY REQUIREMENTS AND TEST PROCEDURES ................................ 94
Signal Integrity Requirements .................................................................................... 94
Signal Integrity Requirements and Test Procedures for 2.5 GT/s Support ................ 94
Signal Integrity Requirements and Test Procedures for 5.0 GT/s Support ................ 97
6.3.3.1
Test Fixture Requirements ...................................................................... 99
Signal Integrity Requirements and Test Procedures for 8.0 GT/s Support .............. 100
6.3.4.1
Test Fixture Requirements .................................................................... 101
6.4. CONNECTOR ENVIRONMENTAL AND OTHER REQUIREMENTS .............................. 101
6.4.1.
Environmental Requirements ................................................................................... 101
6.4.2. Mechanical Requirements ........................................................................................ 103
Current Rating Requirement .................................................................................... 104
6.4.3.
6.4.4.
Additional Considerations ........................................................................................ 104
7. PCI EXPRESS 2 X 3 AUXILIARY POWER CONNECTOR DEFINITION ...............106
7.1. 6-POSITION POWER CONNECTOR SYSTEM PERFORMANCE REQUIREMENTS ..... 106
7.2. 6-POSITION PCB HEADER ................................................................................................... 106
6-Position R/A Thru-Hole PCB Header Assembly ................................................... 106
6-Position R/A Thru-Hole Header Recommended PCB Footprint .......................... 108
6-Position R/A SMT PCB Header Assembly ............................................................ 109
R/A SMT Header Recommended PCB Footprint ..................................................... 110
6.3.1.
6.3.2.
6.3.3.
6.3.4.
7.2.1.
7.2.2.
7.2.3.
7.2.4.
4
PCI EXPRESS CARD ELECTROMECHANICAL SPECIFICATION, REV. 3.0
8.2.1.
8.2.2.
7.3. 6-POSITION CABLE ASSEMBLY ........................................................................................ 111
7.4. CONNECTOR MATING-UNMATING KEEP-OUT AREA (LATCH LOCK RELEASE) .. 112
7.5. 6-POSITION POWER CONNECTOR SYSTEM PIN ASSIGNMENT ................................. 113
7.6. ADDITIONAL CONSIDERATIONS ...................................................................................... 114
8. PCI EXPRESS 2 X 4 AUXILIARY POWER CONNECTOR DEFINITION ...............115
8.1. 2 X 4 AUXILIARY POWER CONNECTOR PERFORMANCE REQUIREMENTS ........... 118
8.2. 2 X 4 RECEPTACLE ............................................................................................................... 118
Connector Drawing .................................................................................................. 118
PCB Footprint .......................................................................................................... 120
8.3. CABLE ASSEMBLY ............................................................................................................... 121
8.4. CONNECTOR MATING-UNMATING KEEP-OUT AREA (LATCH LOCK RELEASE) .. 123
8.5. 2 X 4 AUXILIARY POWER CONNECTOR SYSTEM PIN ASSIGNMENT ....................... 124
8.6. ADDITIONAL CONSIDERATIONS ...................................................................................... 126
9. ADD-IN CARD FORM FACTORS AND IMPLEMENTATION ..................................127
9.1. ADD-IN CARD FORM FACTORS......................................................................................... 127
9.2. CONNECTOR AND ADD-IN CARD LOCATIONS ............................................................. 146
9.3. CARD INTEROPERABILITY ................................................................................................ 155
9.4. 150W-ATX THERMAL MANAGEMENT ............................................................................. 156
10. PCI EXPRESS 225 W/300 W ADD-IN CARD THERMAL AND ACOUSTIC
MANAGEMENT .................................................................................................................157
10.1. INLET TEMPERATURE ........................................................................................................ 157
10.2. CARD THERMAL CHARACTERIZATION PROCEDURE ................................................. 158
10.3. ACOUSTIC MANAGEMENT ................................................................................................ 162
10.3.1. Background and Scope ............................................................................................. 162
10.3.2. Card Acoustic Characterization Procedure ............................................................. 162
10.3.3. Acoustic Recommendations and Guidelines ............................................................. 163
A. INSERTION LOSS VALUES (VOLTAGE TRANSFER FUNCTION)
(INFORMATIONAL ONLY) .............................................................................................164
B. 8.0 GT/S TEST CHANNELS ..............................................................................................167
11. ACKNOWLEDGEMENTS ................................................................................................168
5
PCI EXPRESS CARD ELECTROMECHANICAL SPECIFICATION, REV. 3.0
Figures
FIGURE 2-2: EXAMPLE CURRENT MODE REFERENCE CLOCK SOURCE TERMINATION 23
FIGURE 2-3: SINGLE-ENDED MEASUREMENT POINTS FOR ABSOLUTE CROSS POINT
AND SWING ............................................................................................................... 25
FIGURE 2-4: SINGLE-ENDED MEASUREMENT POINTS FOR DELTA CROSS POINT .......... 26
FIGURE 2-5: SINGLE-ENDED MEASUREMENT POINTS FOR RISE AND FALL TIME
MATCHING ................................................................................................................ 26
FIGURE 2-6: DIFFERENTIAL MEASUREMENT POINTS FOR DUTY CYCLE AND PERIOD 26
FIGURE 2-7: DIFFERENTIAL MEASUREMENT POINTS FOR RISE AND FALL TIME .......... 27
FIGURE 2-8: DIFFERENTIAL MEASUREMENT POINTS FOR RINGBACK ............................. 27
FIGURE 2-9: REFERENCE CLOCK SYSTEM MEASUREMENT POINT AND LOADING ....... 27
FIGURE 2-10: POWER UP ................................................................................................................ 30
FIGURE 2-11: POWER MANAGEMENT STATES ......................................................................... 31
FIGURE 2-12: OUT-OF-TOLERANCE THRESHOLD WINDOWS ............................................... 32
FIGURE 2-13: POWER DOWN ......................................................................................................... 33
FIGURE 2-14: WAKE# RISE AND FALL TIME MEASUREMENT POINTS ............................... 40
FIGURE 3-1: PRESENCE DETECT IN A HOT-PLUG ENVIRONMENT ...................................... 42
FIGURE 4-1: PCI EXPRESS ON THE SYSTEM BOARD ............................................................... 48
FIGURE 4-2: PCI EXPRESS CONNECTOR ON SYSTEM BOARD WITH AN ADD-IN CARD . 48
FIGURE 4-3: PCI EXPRESS CONNECTOR ON A RISER CARD WITH AN ADD-IN CARD .... 49
FIGURE 4-4: LINK DEFINITION FOR TWO COMPONENTS ...................................................... 50
FIGURE 4-5: JITTER BUDGET ........................................................................................................ 51
FIGURE 4-6: ADD-IN CARD TRANSMITTER PATH COMPLIANCE EYE DIAGRAM ............ 57
FIGURE 4-7: ADD-IN CARD TRANSMITTER PATH COMPLIANCE EYE DIAGRAM ............ 59
FIGURE 4-8: REPRESENTATIVE COMPOSITE EYE DIAGRAM FOR ADD-IN CARD
RECEIVER PATH COMPLIANCE ............................................................................ 61
FIGURE 4-9: REPRESENTATIVE COMPOSITE EYE DIAGRAM FOR ADD-IN CARD
RECEIVER PATH COMPLIANCE ............................................................................ 62
FIGURE 4-10: SYSTEM BOARD TRANSMITTER PATH COMPOSITE COMPLIANCE EYE
DIAGRAM .................................................................................................................. 65
FIGURE 4-11: TWO PORT MEASUREMENT FUNCTIONAL BLOCK DIAGRAM.................... 66
FIGURE 4-12: SYSTEM BOARD TRANSMITTER PATH COMPOSITE COMPLIANCE EYE
DIAGRAM .................................................................................................................. 68
FIGURE 4-13: TWO PORT MEASUREMENT FUNCTIONAL BLOCK DIAGRAM.................... 69
FIGURE 4-14: SYSTEM BOARD TRANSMITTER PATH COMPOSITE COMPLIANCE EYE
DIAGRAM .................................................................................................................. 71
FIGURE 4-15: REPRESENTATIVE COMPOSITE EYE DIAGRAM FOR SYSTEM BOARD
RECEIVER PATH COMPLIANCE ............................................................................ 74
FIGURE 5-1: PCI EXPRESS 150W-ATX POWER-UP SEQUENCE .............................................. 79
FIGURE 6-1: CONNECTOR FORM FACTOR ................................................................................. 90
FIGURE 6-2: RECOMMENDED FOOTPRINT ................................................................................ 91
FIGURE 6-3: ADD-IN CARD EDGE-FINGER DIMENSIONS ....................................................... 92
FIGURE 6-4: ILLUSTRATION OF ADJACENT PAIRS ................................................................. 97
FIGURE 6-5: CONTACT RESISTANCE MEASUREMENT POINTS .......................................... 102
FIGURE 7-1: 6-POSITION R/A THRU-HOLE PCB HEADER...................................................... 107
FIGURE 7-2: 6-POSITION R/A THRU-HOLE HEADER RECOMMENDED PCB FOOTPRINT108
FIGURE 7-3: R/A SMT PCB HEADER ........................................................................................... 109
FIGURE 7-4: SMT HEADER RECOMMENDED PCB FOOTPRINT ........................................... 110
FIGURE 7-5: CABLE CONNECTOR HOUSING ........................................................................... 111
6
PCI EXPRESS CARD ELECTROMECHANICAL SPECIFICATION, REV. 3.0
FIGURE 7-6: CONNECTOR MATING-UNMATING KEEP-OUT AREA (LATCH LOCK
RELEASE) ................................................................................................................. 112
FIGURE 7-7: 150W-ATX POWER CONNECTOR ......................................................................... 113
FIGURE 8-1: 2 X 4 PLUG MATING WITH A 2 X 4 RECEPTACLE............................................ 115
FIGURE 8-2: 2 X 3 PLUG MATING WITH A 2 X 4 RECEPTACLE............................................ 116
FIGURE 8-3: 2 X 4 PLUG IS PHYSICALLY PREVENTED FROM MATING WITH A 2 X 3
RECEPTACLE .......................................................................................................... 117
FIGURE 8-4: 2 X 4 R/A THROUGH-HOLE RECEPTACLE DRAWING ..................................... 119
FIGURE 8-5: 2 X 4 R/A THROUGH-HOLE RECPTACLE RECOMMENDED PCB FOOTPRINT120
FIGURE 8-6: CABLE PLUG CONNECTOR HOUSING ............................................................... 121
FIGURE 8-7: MODULAR PLUG CONNECTOR HOUSING (ALL DIMENSIONS IN MM
[INCHES]) ................................................................................................................. 122
FIGURE 8-8: CONNECTOR MATING-UNMATING KEEP-OUT AREA (LATCH LOCK
RELEASE) ................................................................................................................. 123
FIGURE 8-9: 2 X 4 AUXILIARY POWER CONNECTOR PLUG SIDE PIN-OUT ...................... 124
FIGURE 8-10: 2 X 4 AUXILIARY POWER CONNECTOR RECEPTACLE SIDE PIN-OUT ..... 124
FIGURE 8-11: 2 X 3 AUXILIARY POWER CONNECTOR PIN-OUT ......................................... 125
FIGURE 9-1: STANDARD HEIGHT PCI EXPRESS ADD-IN CARD WITHOUT THE I/O
BRACKET ................................................................................................................. 128
FIGURE 9-2: CHASSIS INTERFACE ZONES ON RIGHT/EAST EDGE OF ADD-IN CARD ... 129
FIGURE 9-3: STANDARD HEIGHT PCI EXPRESS ADD-IN CARD WITH THE I/O BRACKET
AND CARD RETAINER .......................................................................................... 130
FIGURE 9-4: ADDITIONAL FEATURE AND KEEPOUTS FOR A HIGH MASS CARD .......... 132
FIGURE 9-5: STANDARD ADD-IN CARD I/O BRACKET ......................................................... 134
FIGURE 9-6: LOW PROFILE PCI EXPRESS ADD-IN CARD WITHOUT THE I/O BRACKET 136
FIGURE 9-7: CHASSIS INTERFACE ZONE ON RIGHT/EAST EDGE OF LOW PROFILE ADD-
IN CARD ................................................................................................................... 137
FIGURE 9-8: LOW PROFILE PCI EXPRESS ADD-IN CARD WITH THE I/O BRACKET ....... 138
FIGURE 9-9: LOW PROFILE I/O BRACKET ................................................................................ 139
FIGURE 9-10: FULL HEIGHT I/O BRACKET FOR LOW PROFILE CARDS ............................ 140
FIGURE 9-11: PCI EXPRESS DUAL-SLOT ADD-IN CARD DIMENSIONAL DRAWING ...... 141
FIGURE 9-12: PCI EXPRESS TRIPLE-SLOT ADD-IN CARD DIMENSIONAL DRAWING .... 142
FIGURE 9-13: DETAILED TWO-SLOT I/O BRACKET DESIGN ................................................ 143
FIGURE 9-14: TWO-SLOT I/O BRACKET EXAMPLE (ISOMETRIC VIEW) ........................... 143
FIGURE 9-15: DETAILED THREE-SLOT I/O BRACKET DESIGN ............................................ 144
FIGURE 9-16: THREE-SLOT I/O BRACKET EXAMPLE (ISOMETRIC VIEW) ........................ 145
FIGURE 9-17: EXAMPLE OF A PC SYSTEM IN MICROATX FORM FACTOR ...................... 146
FIGURE 9-18: INTRODUCTION OF A PCI EXPRESS CONNECTOR IN A MICROATX
SYSTEM .................................................................................................................... 147
FIGURE 9-19: MORE PCI EXPRESS CONNECTORS ARE INTRODUCED ON A MICROATX
SYSTEM BOARD ..................................................................................................... 148
FIGURE 9-20: PCI EXPRESS CONNECTOR LOCATION IN A MICROATX SYSTEM WITH
ONE PCI EXPRESS CONNECTOR ......................................................................... 149
FIGURE 9-21: PCI EXPRESS CONNECTOR LOCATION IN A MICROATX SYSTEM WITH
TWO PCI EXPRESS CONNECTORS...................................................................... 150
FIGURE 9-22: STANDARD HEIGHT CONNECTOR OPENING IN CHASSIS .......................... 151
FIGURE 9-23: LOW PROFILE CONNECTOR OPENING IN CHASSIS ..................................... 152
FIGURE 9-24: CHASSIS I/O CABLE KEEPOUT .......................................................................... 153
FIGURE 9-25: IMPACT OF STRUCTURAL SHAPES IN THE SYSTEM ................................... 154
FIGURE 9-26: CARD ASSEMBLED IN CONNECTOR ................................................................ 155
7
PCI EXPRESS CARD ELECTROMECHANICAL SPECIFICATION, REV. 3.0
FIGURE 10-1: EXAMPLE OF HIGH-POWER CARD SHOWING TEMPERATURE SENSOR
PLACEMENTS AT THE THERMAL SOLUTION INLET ..................................... 157
FIGURE 10-2: THERMAL CHARACTERIZATION FIXTURE – DUAL-SLOT VERSION ....... 159
FIGURE 10-3: THERMAL CHARACTERIZATION FIXTURE – TRIPLE-SLOT VERSION ..... 160
FIGURE 10-4: THERMAL CHARACTERIZATION FIXTURE – TANDEM DUAL-SLOT
VERSION .................................................................................................................. 161
FIGURE A-1: EXAMPLE INTERCONNECT TERMINATED AT THE CONNECTOR
INTERFACE.............................................................................................................. 164
FIGURE A-2: INSERTION LOSS BUDGETS ................................................................................ 165
8
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