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BES2300-ZP_Datasheet_v0.28规格书.pdf

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    BES2300-ZP Bluetooth Audio Platform with IBRT* for FWS* Product Specification Rev 0.28 *IBRT: BES Intelligent Bluetooth Retransmission Tech. *FWS: Fully Wireless Stereo Bestechnic (Shanghai) Co.,Ltd. Room 201, Building B, 2889 JinKe Road, Pudong New District, Shanghai 201203, China PHONE: (86)21 6886 7870 FAX: (86)21 6886 7870 - 617 Confidential and Proprietary – Bestechnic (Shanghai) Co, Ltd. DISCLAIMER: No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic retains the right to make changes to this document at any time, without notice. Bestechnic makes no warranty of any kind, expressed or implied, with regard to any information contained in this document, including, but not limited to, the implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the accuracy or completeness of the information, text, graphics, or other items contained within this document.
    BES2300-ZP Product Specification Datasheet Status Datasheet Status Product Status Revision Control Description Draft Development Rev 0.01 - 0.49 Datasheets contain pre-tapeout information from the objective design specification and is only for internal use. Preliminary Qualification Rev 0.50 - 0.99 Datasheets contain information on post-tapeout and pre-volume production products, and a revision of this document or supplementary information may be published at a later date. BESTECHNIC may make changes to these specifications at any time without notice. Released Production Rev1.xx Datasheets contain information on volume production products. BESTECHNIC may make changes to these specifications at any time without notice. Revision History Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The following table lists the technical content changes for all revisions. Revision Date Description 0.10 0.21 0.22 0.23 0.24 0.25 0.26 0.27 0.28 01/20/2019 01/03/2019 04/09/2019 04/12/2019 04/18/2019 04/23/2019 04/24/2019 16/07/2019 12/08/2019 Initial definition Modify Features Modify Ballmap Update figure 1-1 Update IBRT Update ball map Update ball map and pin list Update RF characteristics Update package size Rev 0.28 Page2 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
    BES2300-ZP Product Specification Table of contents Datasheet Status ................................................................................................................................................................... 2 Revision History .................................................................................................................................................................... 2 List of Tables ......................................................................................................................................................................... 5 List of Figures ........................................................................................................................................................................ 5 1 General Description ...................................................................................................................................................... 6 1.1 Applications ............................................................................................................................................................ 6 1.2 Features .................................................................................................................................................................. 7 2 Platform Feature ........................................................................................................................................................... 8 2.1 MCU Subsystem ...................................................................................................................................................... 8 2.2 Memory .................................................................................................................................................................. 8 2.3 System Peripherals.................................................................................................................................................. 9 2.4 Power Management ............................................................................................................................................... 9 2.5 Audio Interface ....................................................................................................................................................... 9 3 Bluetooth Modem Description ................................................................................................................................... 11 3.1 Radio ..................................................................................................................................................................... 11 3.2 Auxiliary feature .................................................................................................................................................... 11 3.3 Bluetooth Stack ..................................................................................................................................................... 11 4 Electrical Characteristics ............................................................................................................................................. 12 4.1 Electrical Characteristics ....................................................................................................................................... 12 4.2 Bluetooth Radio Electrical Characteristics ............................................................................................................ 13 4.3 Audio Codec Electrical Characteristics .................................................................................................................. 16 4.4 BUCK Electrical Characteristics ............................................................................................................................. 17 5 Pin Map & Application Schematic ............................................................................................................................... 18 5.1 Pin Description ...................................................................................................................................................... 18 6 Package Dimensions ................................................................................................................................................... 21 6.1 BGA Dimensions .................................................................................................................................................... 21 7 SMT Caution ................................................................................................................................................................ 22 7.1 Land Pad and Stencil Design ................................................................................................................................. 22 Rev 0.28 Page3 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
    BES2300-ZP Product Specification 7.2 Solder Reflow Profile ............................................................................................................................................ 22 7.3 RoHS Compliant .................................................................................................................................................... 23 7.4 ESD Sensitivity ....................................................................................................................................................... 23 7.5 Storage Alert ......................................................................................................................................................... 23 8 Ordering Information .................................................................................................................................................. 24 9 Tape and Reel Information ......................................................................................................................................... 25 9.1 Tape Orientation ................................................................................................................................................... 25 9.2 Reel Dimensions .................................................................................................................................................... 25 9.3 Tape Dimensions ................................................................................................................................................... 26 9.4 Moisture Sensitivity Level ..................................................................................................................................... 26 Rev 0.28 Page4 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
    BES2300-ZP Product Specification List of Tables Table 4-1 Operating Conditions (a) .............................................................................................................................. 12 Table 4-2 Absolute Maximum Ratings (c) ..................................................................................................................... 12 Table 4-3 Power Consumption (a) ................................................................................................................................ 12 Table 4-4 Receiver Characteristics - Basic Data Rate (a) .............................................................................................. 13 Table 4-5 Transmitter Characteristics - Basic Data Rate (a) ......................................................................................... 13 Table 4-6 Receiver Characteristics - Enhanced Data Rate (a) ..................................................................................... 14 Table 4-7 Transmitter Characteristics - Enhanced Data Rate (a) .................................................................................. 14 Table 4-8 Bluetooth LE Receiver Specifications .......................................................................................................... 15 Table 4-9 Bluetooth LE Transmitter Specifications ..................................................................................................... 16 Table 4-10 Digital to Analogue Converter under 1.95V (b) .......................................................................................... 16 Table 4-11 Codec - Analogue to Digital Converter under 1.95V ................................................................................. 17 Table 5-1 BES2300-ZP Pins Description ...................................................................................................................... 18 Table 7-1 Package peak reflow temperature - Sn/Pb ................................................................................................. 22 Table 7-2 Package peak reflow temperature - Pb-Free (a)........................................................................................... 22 Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 23 List of Figures Figure 1-1 BES2300-ZP Top View .................................................................................................................................. 6 Figure 2-1 Platform Architecture .................................................................................................................................. 8 Figure 5-1 BES2300-ZP Pinout Diagram ...................................................................................................................... 18 Figure 6-1 BES2300-ZP Dimension .............................................................................................................................. 21 Figure 7-1 Solder Reflow Profile ................................................................................................................................. 22 Figure 9-1 Tape Orientation ........................................................................................................................................ 25 Figure 9-2 Reel Dimensions (All dimensions in millimeters) ....................................................................................... 25 Figure 9-3 Tape Dimensions (All dimensions in millimeters) ...................................................................................... 26 Rev 0.28 Page5 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
    BES2300-ZP Product Specification 1 General Description BES2300-ZP is a highly integrated SoC with Bluetooth 5.0 dual-mode and high performance Cortex-M4F 300MHz Dual- Core for wireless audio and voice application. It is also optimized for FWS (Fully Wireless Stereo) and IBRT (Intelligent Bluetooth Retransmission) application, which is BES’s stereo connection technology between Cell Phone, primary and secondary Voice Box. BES2300-ZP minimizes the external components and BOM cost by highly integrating RF transceiver, high performance audio codec and Cap-less headphone driver. It also integrates serial Flash and powerful Cortex-M4F MCU to support various software features and product customization. BES2300-ZP is manufactured with advanced low power CMOS process and assembled with a 4.5*6.2mm 80-ball BGA package. Figure 1-1 BES2300-ZP Top View 1.1 Applications  High-end Full Wireless headset  High-end Bluetooth headset  Smart BT/WIFI music box  BT boom box  Other portable audio device  IOT platform Rev 0.28 Page6 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd FLASHROM/RAMConnectivity/StoragePeripheralDC/DCLDOCRYSTALBTMAC/PHY BT_RFCODEC DIGDAC_LDAC_RANC ADCMCU(Dual Core)
    BES2300-ZP Product Specification 1.2 Features CPU Features  CMOS Single-chip Fully-integrated RF, PMU, Audio Codec and Cortex-M4F CPU  Up to 300MHz Dual-core ARM Cortex-M4F Processor  Dual-core Cortex-M4F with On-chip Boot-ROM and RAM   4MB serial flash On-chip for Custom Program Security Boot to Protect Custom IP BT Features  Bluetooth 5.0 dual-mode compliant Audio Features  Support BES Intelligent Bluetooth Retransmission (IBRT)   Support FWS Support FF ANC  Dual MICs Noise Reduction   Echo Cancellation Support low power voice activity detection  Multi-band EQ and Bass enhancement  Immersive audio with 3D or virtual surround sound  Support Active Crossover  Crossover filter: DSP Adjustable  Active Crossover Two-way application: Sports Bluetooth & FWS Bluetooth    Support talk through 24-bit audio processing Support USB Audio Playback  HiFi Stereo Audio DAC:  120dB SNR  110dB DNR  Samples rates from 8 kHz to 384 kHz  HiFi Stereo Audio ADC:  100dB SNR  Samples rates from 8 kHz to 384 kHz  Dual/single Mic noise suppression and ANC  Support ambient awareness  3D recording Interface Features  USB 2.0 HS device PMU Features   3.1V-5.5V Input for VBAT Internal LPO for low power mode  DCXO with internal oscillator circuit  Internal temperature sensor Rev 0.28 Page7 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
    BES2300-ZP Product Specification 2 Platform Feature BES2300-ZP is designed for high-resolution wireless audio MCU system as shown in Figure 2-1. Figure 2-1 Platform Architecture 2.1 MCU Subsystem BES2300-ZP is embedded with the ARM Cortex-M4F processor, which provides best trade-off between system performance and power consumption. For large amount of data transfer, high performance Direct Memory Access (DMA) is implemented, which greatly enhances the data movement speed while reducing MCU processing load.       Dual-Core Cortex-M4F high performance processor with float and HW DSP instruction Unified cache High performance multi-layer AMBA bus Operating frequency up to 300MHz On-chip boot ROM for factory flash programming Security boot support  Watchdog Timer (WDT) for system crash recovery   General-purpose Timers DMA for audio/voice data transfer 2.2 Memory BES2300-ZP integrates internal memory and serial flash on-chip with various operating frequencies.   Internal ROM 448KB for critical constants and code Internal SRAM 992KB for critical data and code Rev 0.28 Page8 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd Cortex-M4F_0BT 5.0MACPHYAHB2APBAHBDMA1SRAMFLASHBOOT ROMI2CGPIOGPADCTIMERSPI1APBUARTCMUWDTCODECPCMPWMCortex-M4F_1
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