DATA SHEET 
NVIDIA Jetson TX1 System-on-Module 
 
NVIDIA Tegra Processors: TD580D, TD570D, CD580M, CD570M 
Description 
The NVIDIA® Jetson TX1 System-on-Module (SoM) combines the NVIDIA Maxwell GPU architecture with an ARM® Cortex® -
A57 MPCore (Quad-Core) CPU cluster to deliver the performance and power efficiency required by next generation products 
targeting GPU computing, computer graphics and artificial intelligence (AI). 
Designed for power and space constrained applications, the Jetson TX1 integrates: 
  Parallel computing, computer vision and machine learning capabilities. 
  Advanced 3D graphics, video and image processing. 
 
32-bit and 64-bit operating capability. 
This combination of exceptional performance and power efficiency, integrated capabilities, rich I/O, and small-size enable new 
classes of products while reducing complexity in system integration. The Jetson TX1 is ideal for many applications, including: 
  Augmented Reality (AR) 
  Drones 
  Gaming Devices 
 
Intelligent Video Analytics (IVA) 
  Portable Medical Devices 
  Robotics 
  Smart Factory 
  Virtual Reality (VR) 
 
Ordering Information 
Part Number 
Description 
900-82180-0001-000 
900-82180-A401-000 
900-82180-A301-000 
Jetson TX1 System-on-Module (SoM) 
Jetson TX1 System-on-Module (SoM) for India ‡ 
Jetson TX1 System-on-Module (SoM) for Israel ‡ 
‡
  Region-specific SKU – supports full functionality 
 
 
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Jetson TX1 System-on-Module (SoM) 
 
>  Description 
Maxwell GPU 
Jetson TX1 Module 
256-core GPU | End-to-end lossless compression | OpenGL® 4.5 | OpenGL ES 3.1 | Vulkan™ 1.0 | CUDA® | GPGPU | Android™ Extension Pack (AEP) 
OpenGL ES Shader Performance (up to)   GFLOPS (fp16) 
CPU Subsystem 
ARM® Cortex® -A57 MPCore (Quad-Core) Processor with 
NEON Technology. Operating Frequency per Core (up to) 
1024
◊
 
1.73GHz
‡
 
L1 Cache: 48KB L1 instruction cache (I-cache) per core; 32KB L1 data cache (D-cache) per core | L2 Unified Cache: 2MB 
HD Video & JPEG  
Decode 
H.265: Main10 
 
H.265: Main 
H.264: Baseline, Main, High, Stereo SEI (half-res)  
H.264: MVC Stereo (per view) 
WEBM VP9 
WEBM VP8 
VC-1: Simple, Main, Advanced 
MPEG-2: Main 
Encode 
H.265 (I and P frames) 
H.264: Baseline, Main, High 
H.264: MVC Stereo (per view) 
WEBM VP8 
JPEG (Decode & Encode) 
Audio Subsystem 
2160p 60fps | 1080p 240fps 
2160p 60fps | 1080p 240fps 
2160p 60fps | 1080p 240fps 
2160p 30fps | 1080p 120fps 
2160p 60fps | 1080p 240fps 
2160p 60fps | 1080p 240fps 
1080p 120fps | 1080i 240fps 
2160p 60fps | 1080p 240fps | 1080i 240fps 
 
2160p 30fps | 1080p 120fps 
2160p 30fps | 1080p 120fps 
1440p 30fps | 1080p 60fps 
2160p 30fps | 1080p 120fps 
600 MP/sec 
Dedicated programmable audio processor | ARM Cortex A9 with NEON operating at up to 844MHz | Digital Audio Mixer: 10-in/5-out (up to 8 channels per stream) | 3 x I2S Stereo I/O | 
PDM Receiver: 3 x (Stereo) or 6 x (Mono) 
Display Controller Subsystem 
Two independent display controllers with support for DSI with VESA link compression (VESA DSC), HDMI, and eDP 
Captive Panel 
   MIPI-DSI (1.5Gbps/lane) 
   eDP 1.4 (HBR2 5.4Gbps) 
External Display 
   HDMI 2.0 (6Gbps) 
Imaging System 
Uncompressed: 24bpp 
VESA DSC Compression: 12bpp 
24bpp 
24bpp 
Support for Single x4 or Dual x4 links 
Single link (1x4) 4096x2160 at 60Hz 
4096x2160 at 60Hz 
Dedicated RAW to YUV processing engines process up to 1400Mpix/s | supports up to 24MP sensor 
MIPI CSI 2.0 up to 1.5Gbps (per lane) 
Support for x4 and x2 configurations (up to 3 x4-lane or 6 x2-lane cameras) 
Clocks 
System clock: 38.4 MHz | Sleep clock: 32.768 KHz | Dynamic clock scaling and clock source selection 
Boot Sources 
Internal eMMC and USB (recovery mode) 
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Jetson TX1 System-on-Module (SoM) 
 
>  Description 
Security 
Jetson TX1 Module 
Secure memory with video protection region for protection of intermediate results | Configurable secure DRAM regions for code and data protection | Hardware acceleration for AES 
128/192/256 encryption and decryption to be used for secure boot and multimedia Digital Rights Management (DRM) | Hardware acceleration for AES CMAC, SHA-1 and SHA-256 
algorithms | 2048-bit RSA HW for PKC boot| HW Random number generator (RNG) SP800-90 | TrustZone technology support for DRAM, peripherals | Dedicated HDCP HW 
Memory 
Dual Channel | Secure External Memory Access Using TrustZone Technology | System MMU 
Memory Type 
Maximum Memory Bus Frequency (up to)†† 
Memory Capacity 
Storage 
eMMC 5.1 Flash Storage 
Bus Width 
Maximum Bus Frequency  
Storage Capacity 
Connectivity 
WiFi 
Radio type 
Maximum data rate 
Bluetooth 
Version level 
Maximum transfer rate 
LAN 
10/100/1000 BASE-T Ethernet 
Peripheral Interfaces* 
4ch x 16-bit LPDDR4 
1600MHz 
4GB 
8-bit 
200MHz (HS400) 
16GB 
IEEE 802.11ac 2x2 
867Mbps 
4.0 
24Mbps 
XHCI host controller with integrated PHY: 2 x USB 3.0, 3 x USB 2.0 | USB 3.0 device controller with integrated PHY | EHCI controller with embedded hub for USB 2.0 |  5-lane PCIe: one 
x1 and one x4 controllers | SATA (1 port) | 2 x SD/MMC controllers (supporting eMMC 5.1, SD 4.0, SDHOST 4.0 and SDIO 3.0) | 3 x UART | 3 x SPI | 4 x I2C | 4 x I2S: support I2S, RJM, 
LJM, PCM, TDM (multi-slot mode) | GPIOs 
Operating Requirements 
Temperature Range 
Module Power 
Applications 
-25C – 80C** 
6.5 – 15 W** 
Embedded (Intelligent Video Analytics, Drones, Robotics, etc.), Automotive Research, Clamshells, Gaming, Internet TV, and more 
◊ 
‡ 
See Table 3 for Guaranteed GPU operation across supported temperature range. 
See Table 4 for Guaranteed CPU operating frequency across supported temperature range. 
††  Dependent on board layout. Refer to Interface Design Guide for layout guidelines. 
*  Refer to the Interface Design Guide and Technical Reference Manual to determine which peripheral interface options can be simultaneously exposed. 
**  Refer to the Product Design Guide and Thermal Design Guide for evaluating product power and thermal solution requirements 
 
 
 
 
 
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Jetson TX1 System-on-Module (SoM) 
 
Description 
Initial  Release 
Updated CPU operating frequency. Added Use Case Models. Updated Package Drawing and Dimensions: updated weight 
to include TTP base and top plate weight, changed MAX TTP height from 6.0 ± 0.25 to 6.25, corrected connector pin 
dimensions. 
Updated Electrical Characteristics section 
Description: changed camera sensor support from 128MP to 24MP to reflect current software support; extended RAW to 
YUV support from 1200Mpix/s to 1400Mpix/s   
Package Drawing and Dimensions: Corrected notes to reflect calculated mass for module with thermal interface material 
(TIM) paste: 88 ±2% Grams 
Added Reliability section 
PCIE Signal Descriptions table. The following names were inadvertently swapped in PCIe Controller #0 : PEX_RFU_TX+/- 
and PEX2_TX+/-; PEX_RFU_RX+/- and PEX2_RX+/- 
Absolute Maximum Ratings: add notes for voltage applied to any powered I/O pin to clarify usage before and after 
CARRIER_PWR_ON is high.  
Ordering Information: corrected part numbers for region specific SKUs 
Revision History 
Version 
Date 
v0.9 
v0.91 
v1.0 
AUG, 2015 
FEB, 2016 
SEP, 2016 
v1.1 
NOV, 2016 
 
 
 
 
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Table of Contents 
1.0 Module Overview 
Jetson TX1 System-on-Module (SoM) 
 
7 
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
 Tegra X1 SoC .............................................................................................................................................. 8 
 Memory ........................................................................................................................................................ 8 
 Storage ........................................................................................................................................................ 8 
 Connectivity ................................................................................................................................................. 8 
 Networking ................................................................................................................................................... 9 
 Power ........................................................................................................................................................... 9 
 Thermal Transfer Plate ................................................................................................................................ 9 
 Board-to-board Connector ........................................................................................................................... 9 
 WiFi/BT Antenna Connector ........................................................................................................................ 9 
2.0 Power and System Management 
10 
 Use Case Models ...................................................................................................................................... 10 
 Power Rails................................................................................................................................................ 11 
2.2.1 VDD_IN ........................................................................................................................................ 11 
2.2.2 VDD_RTC .................................................................................................................................... 11 
2.2.3 IO Rail Voltages ........................................................................................................................... 11 
 Power Sequencing .................................................................................................................................... 11 
2.3.1 Power Up ..................................................................................................................................... 11 
2.3.2 Power Down ................................................................................................................................. 12 
 Power States ............................................................................................................................................. 12 
2.4.1 ON State ...................................................................................................................................... 13 
2.4.2 OFF State ..................................................................................................................................... 13 
2.4.3 SLEEP State ................................................................................................................................ 13 
 Thermal Management ............................................................................................................................... 14 
 Clocks ........................................................................................................................................................ 14 
 WiFi Power States ..................................................................................................................................... 15 
2.7.1 STA Mode .................................................................................................................................... 15 
2.7.2 P2P Group-owner Powersave States .......................................................................................... 15 
 Bluetooth Power States ............................................................................................................................. 15 
 Ethernet ..................................................................................................................................................... 15 
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.1
3.2
3.3
3.0 Interface and Signal Descriptions 
16 
 SD/eMMC Controller ................................................................................................................................. 16 
 Serial ATA (SATA) Controller .................................................................................................................... 17 
 Display Interfaces ...................................................................................................................................... 17 
3.3.1 MIPI Display Serial Interface (DSI) .............................................................................................. 17 
3.3.2 High-Definition Multimedia Interface (HDMI) and DisplayPort (DP) Interfaces ........................... 18 
3.3.3 Embedded DisplayPort (eDP) Interface ....................................................................................... 20 
 Audio Interfaces ......................................................................................................................................... 20 
 USB Interfaces........................................................................................................................................... 21 
 PCI Express (PCIe) Interface .................................................................................................................... 22 
 Serial Peripheral Interface ......................................................................................................................... 23 
 Inter-Chip Communication (I2C) Controller ............................................................................................... 25 
 UART Controller ........................................................................................................................................ 25 
 Video Input Interfaces .............................................................................................................................. 26 
3.10.1 MIPI Camera Serial Interface (CSI) ........................................................................................... 26 
3.10.2 Camera / VI (Video Input) .......................................................................................................... 27 
 Miscellaneous Interfaces ......................................................................................................................... 28 
3.11.1 Debug ......................................................................................................................................... 28 
3.11.2 Pulse Width/Frequency Modulation (PWFM) ............................................................................. 28 
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
 
 
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4.0 Pin Definitions 
Jetson TX1 System-on-Module (SoM) 
 
29 
4.1
4.2
4.3
4.4
4.5
 Power-on Reset Behavior .......................................................................................................................... 30 
 Deep Sleep Behavior ................................................................................................................................. 30 
 GPIO Controller ......................................................................................................................................... 31 
 Pin Assignments ........................................................................................................................................ 32 
 Pin Descriptions ......................................................................................................................................... 33 
5.0 Physical / Electrical Characteristics 
40 
5.1
5.2
5.3
5.4
5.5
 Absolute Maximum Ratings ....................................................................................................................... 40 
 Digital Logic ............................................................................................................................................... 41 
 Thermal ...................................................................................................................................................... 41 
 Reliability ................................................................................................................................................... 41 
 Package Drawing and Dimensions ........................................................................................................... 42 
 
 
 
 
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Jetson TX1 System-on-Module (SoM) 
 
1.0  Module Overview 
The Jetson TX1 incorporates the following components and interfaces: 
  NVIDIA Tegra X1 SoC 
-  NVIDIA Maxwell GPU 
-  Quad-core ARM Cortex-A57 CPU 
 
 
 
LPDDR4 memory 
eMMC 5.1 storage 
802.11ac 2x2 WiFi 
  Gigabit Ethernet 
  PMIC 
 
 
Thermal Transfer Plate (TTP) (primary thermal interface) 
400-pin board-to-board connector (exposes both high-speed and low-speed industry standard I/O) 
  WiFi/BT antenna connectors 
Table 1  Manufacturers and Part Numbers for 3rd Party Components Integrated on the Jetson TX1 Module 
Component 
Manufacturer 
Part Number 
WiFi 802.11ac Client/BT 
Broadcom Corp. 
Ethernet Controller 10/100/1000 Mbps 
Realtek Semiconductor Corp. 
Power Management IC (PMIC) 
Maxim Integrated 
400 pin Board-to-board connector 
Samtec 
◊ 
Mating connector for OEM carrier board is REF-186138-02. 
BCM4354 
RTL8153 
MAX77620 
REF-186137-03
◊
 
Refer to the manufacturer’s documentation for specific component details and specifications. All features supported by a 3rd 
party component may not be enabled on the Jetson TX1 module. 
Figure 1  Jetson TX1 Block Diagram – General Application 
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Jetson TX1Gigabit EthernetLPDDR44GBeMMC 5.116GBRJ45 w/MagneticsUSB 2.0Micro ABUSB 3.0Type ASATA3.3V/5VPre-Regs19V JackWiFi/BTSD CardAudio CodecPCIe x4CameraModule(s)VDD_INDebugSerial PortUSB0USB1PEX1USB2GBE_MDII2S2SATASDIOUART2AUDIO_MCLKI2S0PEX0/2/3I2C_CAMI2C_GP0CSI[5:0]DP1SDMMCUSB_SS0DP0SPI1I2S1UART0JTAGI2C_GP1UART1DSI[3:0]SPI0SPI2USB_SS1CAMx_MCLKDisplayWiFi/ModemMisc ExpansionDisplay / TouchCodec, MiscWiFi / ModemBluetoothPowerSubsystemPMICCPU Reg uP1665PGPU Reg uP1665PDSI – 2x4DP/HDMIeDPGPIOs/ControlGPIOs/ControlGPIOs/ControlGPIOs/ControlGPIOs/ControlGPIOs/ControlGPIOs/ControlI2C_PMAntenna Conn. #1Antenna Conn. #2Tegra X1ThermalSensorPower MonitorsVoltage Monitor
Jetson TX1 System-on-Module (SoM) 
 
1.1  
Tegra X1 SoC 
The NVIDIA Tegra® X1 SoC couples the latest NVIDIA Maxwell™ GPU architecture with an ARM®v8 CPU cluster to deliver 
high performance and power efficiency. The Maxwell GPU implements a number of architectural enhancements designed to 
extract maximum performance per watt consumed. Designed for use in power-limited environments, Tegra X1 processors 
enable industry-leading visual computing capabilities, 32-bit and 64-bit operating capability, and integrate advanced multi-
function audio, video and image processing pipelines that exceed performance targets for next generation small form factor 
(SFF) devices. 
1.2  
Memory 
On-board 4GB of LPDDR4, over a 4 channel x 16-bit interface. The maximum frequency is 1600MHz. The theoretical peak 
memory bandwidth is 25.6 GB/s. 
1.3  
Storage 
On-board 16GB of eMMC 5.1 flash storage. The theoretical peak bandwidth is 400 MB/s 
1.4  
Connectivity 
WiFi/Bluetooth integrated on the Jetson TX1 module supports: 
  WiFi Ready 
- 
- 
- 
802.11ac compliant (backwards compatible with legacy 802.11b/g/a/n devices) 
867Mbps PHY maximum data rate 
2x2 MIMO 
  Bluetooth Ready 
- 
Bluetooth 4.0 ready (can connect to Bluetooth 4.0 enabled devices) 
-  HIDP 
-  RFKILL 
Table 2 lists the WiFi frequency ranges, modes, and channels supported on the Jetson TX1 module. Table also includes the 
equivalent isotropically radiated power (EIRP) for each mode. 
Table 2  Jetson TX1 WiFi Power and Channel Specification 
Frequency(MHz)  Mode 
EIRP(mW)  Total Supported Channels  Channel List 
2412~2472 
2412~2472 
2412~2472 
5180~5320 
5180~5320 
5190~5310 
5180~5320 
5190~5310 
5190~5310 
802.11b 
802.11g 
802.11n HT20 
802.11a 
802.11n HT20 
802.11n HT40 
802.11ac VHT20 
802.11ac VHT40 
802.11ac VHT80 
48.5 
30.5 
38.5 
96.5 
52.0 
92.0 
52.0 
92.0 
123.0 
11 
11 
11 
8 
8 
4 
8 
4 
2 
1,2,3,4,5,6,7,8,9,10,11 
1,2,3,4,5,6,7,8,9,10,11 
1,2,3,4,5,6,7,8,9,10,11 
36,40,44,48,52,56,60,64 
36,40,44,48,52,56,60,64 
38,46,54,62 
36,40,44,48,52,56,60,64 
38,46,54,62 
42,58 
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