VITA57标准.pdf

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vita57d1-r0d12-ansiapp.pdf

Introduction

Objectives

FMC Overview

Standard Terminology

FMC Definitions

References

Dimensions

FMC Compliance

FMC Mezzanine Module’s Minimum Features

FMC Carrier Card’s Minimum Features

FMC Mezzanine Module

Overview

Single Width Mezzanine Module

Double Width Mezzanine Module

Connectors

Variable stacking heights

Ground connections

Connector Pads and Labeling

Connector Assembly

Conduction Cooled Mezzanine Modules

Single Width Module

Double Width Module

Conduction Cooled

Thermal Interfaces

Air cooled and conduction cooled compatibility

FMC Front Panel Bezel

FMC Mezzanine Module to Carrier Card relationship

FMC Carrier Card

Overview

Carrier Card side 1 component height

Connector Pin Assignments

User Defined Pins

Differential Reference Clocks

Gigabit Interface

Gigabit Data Signals

Gigabit reference clocks

JTAG Signals

I2C Bus Signals

IPMI Support

Geographic Addresses

IO Mezzanine Module Present

Power Good Signals

Reserved Signals

Power Supply Requirements

Power Sequencing

3.3V Auxiliary Supply

IO Reference Voltage

IO Bank Supply Voltage

Electrical Requirements

Multi-standard Signal Banks

Supported Signaling Standards

Compatibility and interoperability

IO, VIO and VREF Grouping

VADJ and VIO_B_M2C

_CC signals and associated I/O signals

ANSI/VITA 57.1-2008 - Revisions Under Consideration The VITA 57.1 working group is considering the following changes to ANSI/VITA 57.1-2008 that would affect compliance and interoperability. NOTE: This information is provided for information only. While the working group is currently considering these changes, they may or may not be approved by the working group and may or may not become part of a revised standard. Contact VITA for more information. October 2008. Change of CLK*_C2M to CLK*_M2C Version 1.0 of the standard has defined clocks signals from the carrier card to the mezzanine card; CLK0_C2M_N, CLK0_C2M_P, CLK1_C2M_N, CLK1_C2M_P. It is proposed that these signals will now be redefined as additional ‘M2C’ signals. Original Signal Label (Version 1.0) CLK0_M2C_P CLK0_M2C_N CLK1_M2C_P CLK1_M2C_N CLK0_C2M_P CLK0_C2M_N CLK1_C2M_P CLK1_C2M_N New Signal Label (Version 1.1) CLK0_M2C_P CLK0_M2C_N CLK2_M2C_P CLK2_M2C_N CLK1_M2C_P CLK1_M2C_N CLK3_M2C_P CLK3_M2C_N A rule will also be added to state that the CLK*_M2C signals need to be populated starting at the lowest ordinal and working up Application Specific Signal A permission will be added to allow application specific signals to be added to the upper unused signals pins of the LA,HA and HB banks. However they will still need to meet the voltage rules for those banks. AC coupling to be placed on the mezzanine card All AC coupling for the DP signals will all be placed on the mezzanine card. No AC coupling will be placed on the carrier card. Information Only

ANSI/VITA 57.1-2008 American National Standard for FPGA Mezzanine Card (FMC) Standard Secretariat VMEbus International Trade Association Approved July 2008 American National Standards Institute, Inc. VMEbus International Trade Association PO Box 19658, Fountain Hills, AZ 85269 PH: 480-837-7486, FAX: Contact VITA Office E-mail: info@vita.com, URL: http://www.vita.com

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ANSI/VITA 57.1-2008 American National Standard for FPGA Mezzanine Card (FMC) Standard Secretariat VMEbus International Trade Association Approved July 2008 American National Standards Institute, Inc. Abstract This standard specifies a form factor and a pin assignment for FPGA mezzanine modules.

American National Standard Approval of an American National Standard requires verification by ANSI that the requirements for due process, consensus, and other criteria for approval have been met by the standards developer. Consensus is established when, in the judgment of the ANSI Board of Standards Review, substantial agreement has been reached by directly and materially affected interests. Substantial agreement means much more than a simple majority, but not necessarily unanimity. Consensus requires that all views and objections be considered, and that a concerted effort be made toward their resolution. The use of American National Standards is completely voluntary; their existence does not in any respect preclude anyone, whether he has approved the standards or not, from manufacturing, marketing, purchasing, or using products, processes, or procedures not conforming to the standards. The American National Standards Institute does not develop standards and will in no circumstances give an interpretation of any American National Standard. Moreover, no person shall have the right or authority to issue an interpretation of an American National Standard in the name of the American National Standard Institute. Requests for interpretations should be addressed to the secretariat or sponsor whose name appears on the title page of this standard. CAUTION NOTICE: This American National Standard may be revised or withdrawn at any time. The procedures of the American National Standards Institute require that action be taken periodically to reaffirm, revise, or withdraw this standard. Purchases of American National Standards may receive current information on all standard by calling or writing the American National Standards Institute. Published by VMEbus International Trade Association PO Box 19658, Fountain Hills, AZ 85269 Copyright © 2008 by VMEbus International Trade Association All rights reserved. No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without prior written permission of the publisher. Printed in the United States of America - R1.0, ISBN 1-885731-49-3

ANSI/VITA 57.1, FPGA Mezzanine Card (FMC) Standard TABLE OF CONTENTS 1 2 3 2.1. 2.2. 3.4.1. 3.4.2. 3.4.3. 3.4.4. Introduction ...............................................................................................................11 1.1. Objectives..........................................................................................................11 FMC Overview..................................................................................................12 1.2. Standard Terminology.......................................................................................12 1.3. 1.4. FMC Definitions ..............................................................................................14 1.5. References .........................................................................................................15 1.6. Dimensions........................................................................................................15 FMC Compliance ......................................................................................................16 FMC Mezzanine Module’s Minimum Features................................................16 FMC Carrier Card’s Minimum Features...........................................................16 FMC Mezzanine Module ..........................................................................................17 3.1. Overview ...........................................................................................................17 3.2. Single Width Mezzanine Module......................................................................20 3.3. Double Width Mezzanine Module ....................................................................21 3.4. Connectors.........................................................................................................24 Variable stacking heights ..........................................................................25 Ground connections...................................................................................27 Connector Pads and Labeling....................................................................27 Connector Assembly .................................................................................28 3.5. Conduction Cooled Mezzanine Modules ..........................................................29 Single Width Module ................................................................................29 Double Width Module...............................................................................32 Conduction Cooled....................................................................................34 Thermal Interfaces.....................................................................................34 Air cooled and conduction cooled compatibility ......................................35 FMC Front Panel Bezel.....................................................................................37 3.6.1. FMC Mezzanine Module to Carrier Card relationship .............................39 FMC Carrier Card .....................................................................................................40 4.1. Overview ...........................................................................................................40 Carrier Card side 1 component height.......................................................46 5 Connector Pin Assignments ......................................................................................48 5.1. User Defined Pins..............................................................................................53 5.2. Differential Reference Clocks...........................................................................56 5.3. Gigabit Interface................................................................................................58 Gigabit Data Signals..................................................................................58 Gigabit reference clocks............................................................................60 JTAG Signals ....................................................................................................61 I2C Bus Signals.................................................................................................62 IPMI Support.............................................................................................63 5.6. Geographic Addresses.......................................................................................66 5.7. IO Mezzanine Module Present..........................................................................67 5.8. Power Good Signals..........................................................................................67 5.9. Reserved Signals ...............................................................................................68 3.5.1. 3.5.2. 3.5.3. 3.5.4. 3.5.5. 5.3.1. 5.3.2. 5.4. 5.5. 5.5.1. 3.6. 4 4.1.1. Page 5

ANSI/VITA 57.1, FPGA Mezzanine Card (FMC) Standard 5.10. 5.11. 5.12. 5.13. 5.14. Power Supply Requirements .........................................................................68 Power Sequencing.........................................................................................71 3.3V Auxiliary Supply ..................................................................................71 IO Reference Voltage....................................................................................71 IO Bank Supply Voltage ...............................................................................72 Electrical Requirements ............................................................................................73 6.1. Multi-standard Signal Banks.............................................................................73 Supported Signaling Standards .................................................................74 Compatibility and interoperability ............................................................75 Appendix A Mezzanine/Carrier Card Compatibility Check List ..................................77 6 6.1.1. 6.1.2. Page 6

ANSI/VITA 57.1, FPGA Mezzanine Card (FMC) Standard List of Figures Figure 1. Typical example of single width commercial grade FMC Module................17 Figure 2. Typical example of double width commercial grade FMC Module ..............18 Figure 3. Dimensional descriptors for FMC Mezzanine Module..................................19 Figure 4. PCB regions of Mezzanine module................................................................19 Figure 5. Single Width Commercial Grade FMC Module Mechanical.........................20 Figure 6. Double Width Commercial Grade FMC Module Mechanical .......................22 Figure 7. Double width with only primary connector, P1 .............................................23 Figure 8. Double width with both connectors, P1 and P2 .............................................23 Figure 9. Board to board height limits: 10mm and 8.5mm heights...............................26 Figure 10. Carrier Card Connector Grid Labeling (Component Side View)...................28 Figure 11. FMC Module Connector Grid Labeling (Component Side View).................28 Figure 12. Typical example of single width conduction cooled FMC Module with primary and secondary thermal interfaces......................................................30 Figure 13. Single Width Conduction Cooled FMC Module Mechanical........................30 Figure 14. Example of double width conduction cooled FMC Module ..........................32 Figure 15. Double width Conduction Cooled FMC Mezzanine Module Mechanical.....33 Figure 16. FMC Front Panel Bezel Mechanical Dimensions ..........................................38 Figure 17. FMC Mezzanine Module to Carrier Card dimensions ...................................39 Figure 18. Typical 6U carrier card with double and single width module ......................40 Figure 19. Example of 6U carrier with no external mezzanine I/O.................................41 Figure 20. Typical 6U carrier card loaded with three single width commercial mezzanine modules ..........................................................................................................41 Figure 21. Typical 6U ruggedized carrier card loaded with three single width ruggedized mezzanine modules ........................................................................................42 Figure 22. Dimensions of cPCI carrier card example with two FMC sites.....................43 Figure 23. Example of 3U cPCI carrier with single with FMC Module .........................44 Figure 24. Dimensions of AMC with one FMC site and flush bezel ..............................45 Figure 25. Dimensions of AMC with one FMC site and no recess.................................46 Page 7

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