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Description
Features
Device Structure
Absolute Maximum Ratings
Application Conditions
USE RESTRICTION NOTICE
Optical Center
Pixel Arrangement
Block Diagram and Pin Configuration
Pin Description
Electrical Characteristics
DC Characteristics
Current Consumption
AC Characteristics
Master Clock Waveform (INCK)
System Clear (XCLR)
XVS / XHS Input Characteristics in Slave Mode (XMASTER pin = High)
XVS / XHS Input Characteristics in Master Mode (XMASTER pin = Low)
Serial Communication
I/O Equivalent Circuit Diagram
Spectral Sensitivity Characteristics
Image Sensor Characteristics
Image Sensor Characteristics Measurement Method
Measurement Conditions
Color Coding of Physical Pixel Array
Definition of standard imaging conditions
Measurement Method
Setting Registers Using Serial Communication
Description of Setting Registers (I2C)
Register Communication Timing (I2C)
Communication Protocol
Register Write and Read (I2C)
Single Read from Random Location
Single Read from Current Location
Sequential Read Starting from Random Location
Sequential Read Starting from Current Location
Single Write to Random Location
Sequential Write Starting from Random Location
Readout Drive mode
Operating mode
Variable Data Rate
Image Data Output Format (CSI-2 output)
Frame Format
Frame Structure
Embedded Data Line
Image Data Output Format
All-pixel mode
Horizontal/Vertical 2/2-line binning mode
Window Cropping Mode
Description of Various Function
Standby Mode
Slave Mode and Master Mode
Gain Adjustment Function
Black Level Adjustment Function
Normal Operation and Inverted Operation
Shutter and Integration Time Settings
Example of Integration Time Setting
Normal Exposure Operation (Controlling the Integration Time in 2H Units)
Long Exposure Operation (Control by Expanding the Number of Lines per Frame)
Example of Integration Time Settings
Signal Output
CSI-2 output
MIPI Transmitter
Number of Internal A/D Conversion Bits Setting
Output Signal Range
INCK Setting
Global Timing setting
Register Hold Setting
Mode Transitions
XSIZE_OVERLAP Setting
Other Function
Power-on and Power-off Sequence
Power-on sequence
Slew Rate Limitation of Power-on Sequence
Power-off sequence
Sensor Setting Flow
Setting Flow in Sensor Slave Mode
Setting Flow in Sensor Master Mode
Peripheral Circuit
Spot Pixel Specifications
Zone Definition
Notice on White Pixels Specifications
Measurement Method for Spot Pixels
Spot Pixel Pattern Specification
Marking
Notes On Handling
Package Outline
List of Trademark Logos and Definition Statements
Revision History
Diagonal 12.86 mm (Type 1/1.2) CMOS Solid-state Image Sensor with Square Pixel for Color Cameras IMX485LQJ-C Description The IMX485LQJ-C is a diagonal 12.8 mm (Type 1/1.2) CMOS active pixel type solid-state image sensor with a square pixel array and 8.42 M effective pixels. This chip operates with analog 2.9 V, digital 1.2 V, and interface 1.8 V triple power supply, and has low power consumption. High sensitivity, low dark current and no smear are achieved through the adoption of R, G and B primary color mosaic filters. This chip features an electronic shutter with variable charge-integration time. (Applications: Surveillance cameras, FA cameras, Industrial cameras) Features ◆ CMOS active pixel type dots ◆ Built-in timing adjustment circuit, H/V driver and serial communication circuit ◆ Input frequency: 6 to 27 MHz / 37.125 MHz / 74.25 MHz ◆ Number of recommended recording pixels: 3840 (H) × 2160 (V) approx. 8.29M pixel ◆ Readout mode CONFIDENTIAL only All-pixel scan mode Horizontal / Vertical 2/2-line binning mode Window cropping mode Horizontal / Vertical direction - Normal / Inverted readout mode ◆ Readout rate Maximum frame rate in All-pixel scan mode: 12 bit: 60 frame/s, 10 bit: 90 frame/s ◆ High dynamic range (HDR) function Multiple exposure HDR Digital overlap HDR ◆ Synchronizing sensors function ◆ Variable-speed shutter function (resolution 2H units) ◆ 10-bit / 12-bit A/D converter ◆ Conversion gain switching (HCG Mode / LCG Mode) ◆ CDS / PGA function 0 dB to 72 dB (step pitch 0.3 dB) ◆ Supports I/O CSI-2 serial data output (2 Lane / 4 Lane / 8Lane / 4Lane × 2ch) RAW10 / RAW12 output ◆ Recommended exit pupil distance: –30 mm to –∞ Sony Semiconductor Solutions Corporation reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony Semiconductor Solutions Corporation cannot assume responsibility for any problems arising out of the use of these circuits. Copyright 2018 Sony Semiconductor Solutions Corporation Copyright 2019 Sony Semiconductor Solutions Corporation 1 E19903B9X
Device Structure ◆ CMOS image sensor ◆ Image size Diagonal 12.8 mm (Type 1/1.2) approx. 8.40 M pixels, All pixels IMX485LQJ-C ◆ Total number of pixels 3864 (H) × 2200 (V) ◆ Number of effective pixels 3864 (H) × 2180 (V) ◆ Number of active pixels 3864 (H) × 2176 (V) approx.8.50 M pixels approx. 8.42 M pixels approx. 8.40 M pixels ◆ Number of recommended recording pixels 3840 (H) × 2160 (V) approx. 8.29 M pixels ◆ Unit cell size 2.9 μm (H) × 2.9 μm (V) ◆ Optical black Horizontal (H) direction: Front 0 pixels, rear 0 pixels Vertical (V) direction: Front 20 pixels, rear 0 pixels 2 ◆ Dummy Horizontal (H) direction: Front 0 pixels, rear 0 pixels Vertical (V) direction: Front 0 pixels, rear 0 pixels CONFIDENTIAL only ◆ Substrate material Silicon
Absolute Maximum Ratings IMX485LQJ-C Item Supply voltage (analog: 2.9 V) Supply voltage (interface: 1.8 V) Supply voltage (digital: 1.2 V) Input voltage Output voltage Operating temperature Storage temperature Symbol AVDD OVDD DVDD VI VO Topr Tstg Min. -0.3 -0.3 -0.3 -0.3 -0.3 -30 -40 Max. 3.3 3.3 2.0 OVDD + 0.3 OVDD + 0.3 85 85 Unit V V V V V ˚C ˚C Remarks Not exceed 3.3 V Not exceed 3.3 V Application Conditions Item Symbol Supply voltage (analog: 2.9 V) Supply voltage (interface: 1.8 V) Supply voltage (digital: 1.2 V) Performance guarantee temperature AVDD1 OVDD DVDD1 Tspec Min. 2.80 1.70 1.10 -10 Typ. 2.90 1.80 1.20 ─ Max. 3.00 1.90 1.30 60 Unit V V V ˚C CONFIDENTIAL only 3
USE RESTRICTION NOTICE IMX485LQJ-C This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the image sensor products ("Products") set forth in this specifications book. Sony Semiconductor Solutions Corporation ("SSS") may, at any time, modify this Notice which will be available to you in the latest specifications book for the Products. You should abide by the latest version of this Notice. If a SSS subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or distributor of SSS on such a use restriction notice when you consider using the Products. Use Restrictions  The Products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by SSS from time to time.  You should not use the Products for critical applications which may pose a life- or injury-threatening risk or are highly likely to cause significant property damage in the event of failure of the Products. You should consult your sales representative beforehand when you consider using the Products for such critical applications. In addition, you should not use the Products in weapon or military equipment.  SSS disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the Products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. Design for Safety  SSS is making continuous efforts to further improve the quality and reliability of the Products; however, failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social damage as a result of such failure. CONFIDENTIAL only Export Control  If the Products are controlled items under the export control laws or regulations of various countries, approval may be required for the export of the Products under the said laws or regulations. You should be responsible for compliance with the said laws or regulations. No License Implied  The technical information shown in this specifications book is for your reference purposes only. The availability of this specifications book shall not be construed as giving any indication that SSS and its licensors will license any intellectual property rights in such information by any implication or otherwise. SSS will not assume responsibility for any problems in connection with your use of such information or for any infringement of third-party rights due to the same. It is therefore your sole legal and financial responsibility to resolve any such problems and infringement. Governing Law  This Notice shall be governed by and construed in accordance with the laws of Japan, without reference to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the court of first instance. Other Applicable Terms and Conditions  The terms and conditions in the SSS additional specifications, which will be made available to you when you order the Products, shall also be applicable to your use of the Products as well as to this specifications book. You should review those terms and conditions when you consider purchasing and/or using the Products. General-0.0.9 4
IMX485LQJ-C CONFIDENTIAL Contents Description ............................................................................................................................................................................. 1 Features ................................................................................................................................................................................. 1 Device Structure ..................................................................................................................................................................... 2 Absolute Maximum Ratings .................................................................................................................................................... 3 Application Conditions ............................................................................................................................................................ 3 USE RESTRICTION NOTICE ................................................................................................................................................ 4 Optical Center ........................................................................................................................................................................ 7 Pixel Arrangement .................................................................................................................................................................. 8 Block Diagram and Pin Configuration ..................................................................................................................................... 9 Pin Description ...................................................................................................................................................................... 11 Electrical Characteristics ...................................................................................................................................................... 14 DC Characteristics ............................................................................................................................................................ 14 Current Consumption ........................................................................................................................................................ 15 AC Characteristics ............................................................................................................................................................ 16 Master Clock Waveform (INCK) .................................................................................................................................... 16 System Clear (XCLR) .................................................................................................................................................... 17 XVS / XHS Input Characteristics in Slave Mode (XMASTER pin = High) ...................................................................... 18 XVS / XHS Input Characteristics in Master Mode (XMASTER pin = Low) .................................................................... 18 Serial Communication ................................................................................................................................................... 19 I/O Equivalent Circuit Diagram ............................................................................................................................................. 21 Spectral Sensitivity Characteristics ...................................................................................................................................... 22 Image Sensor Characteristics .............................................................................................................................................. 23 Image Sensor Characteristics Measurement Method........................................................................................................... 24 Measurement Conditions .................................................................................................................................................. 24 Color Coding of Physical Pixel Array ................................................................................................................................ 24 Definition of standard imaging conditions ......................................................................................................................... 24 Measurement Method ....................................................................................................................................................... 25 Setting Registers Using Serial Communication .................................................................................................................... 26 Description of Setting Registers (I2C) ............................................................................................................................... 26 Register Communication Timing (I2C) ............................................................................................................................... 27 Communication Protocol ................................................................................................................................................... 28 Register Write and Read (I2C) .......................................................................................................................................... 29 Single Read from Random Location ............................................................................................................................. 29 Single Read from Current Location ............................................................................................................................... 29 Sequential Read Starting from Random Location ......................................................................................................... 30 Sequential Read Starting from Current Location ........................................................................................................... 30 Single Write to Random Location .................................................................................................................................. 31 Sequential Write Starting from Random Location ......................................................................................................... 31 Register Map ........................................................................................................................................................................ 32 Readout Drive mode ............................................................................................................................................................ 47 Operating mode ................................................................................................................................................................ 47 Variable Data Rate ........................................................................................................................................................ 47 Image Data Output Format (CSI-2 output) ........................................................................................................................ 48 Frame Format ............................................................................................................................................................... 48 Frame Structure ............................................................................................................................................................ 48 Embedded Data Line .................................................................................................................................................... 49 Image Data Output Format ............................................................................................................................................... 51 All-pixel mode ................................................................................................................................................................ 52 Horizontal/Vertical 2/2-line binning mode ...................................................................................................................... 62 Window Cropping Mode ................................................................................................................................................ 68 Description of Various Function ............................................................................................................................................ 71 Standby Mode................................................................................................................................................................... 71 Slave Mode and Master Mode .......................................................................................................................................... 72 Gain Adjustment Function ................................................................................................................................................. 74 Black Level Adjustment Function ...................................................................................................................................... 75 Normal Operation and Inverted Operation ........................................................................................................................ 76 Shutter and Integration Time Settings ............................................................................................................................... 77 Example of Integration Time Setting ............................................................................................................................. 77 only 5
IMX485LQJ-C Normal Exposure Operation (Controlling the Integration Time in 2H Units) ...................................................................... 78 Long Exposure Operation (Control by Expanding the Number of Lines per Frame) ......................................................... 79 Example of Integration Time Settings ............................................................................................................................... 80 Signal Output .................................................................................................................................................................... 81 CSI-2 output...................................................................................................................................................................... 81 MIPI Transmitter ............................................................................................................................................................... 85 Number of Internal A/D Conversion Bits Setting ............................................................................................................ 86 Output Signal Range ..................................................................................................................................................... 86 INCK Setting ..................................................................................................................................................................... 87 Global Timing setting ........................................................................................................................................................ 88 Register Hold Setting ........................................................................................................................................................ 89 Mode Transitions .............................................................................................................................................................. 90 XSIZE_OVERLAP Setting ................................................................................................................................................ 91 Other Function .................................................................................................................................................................. 92 Power-on and Power-off Sequence ...................................................................................................................................... 93 Power-on sequence .......................................................................................................................................................... 93 Slew Rate Limitation of Power-on Sequence .................................................................................................................... 94 Power-off sequence .......................................................................................................................................................... 95 Sensor Setting Flow .......................................................................................................................................................... 96 Setting Flow in Sensor Slave Mode .............................................................................................................................. 96 Setting Flow in Sensor Master Mode ............................................................................................................................ 97 Peripheral Circuit .................................................................................................................................................................. 98 Spot Pixel Specifications ...................................................................................................................................................... 99 Zone Definition .................................................................................................................................................................. 99 Notice on White Pixels Specifications ................................................................................................................................ 100 Measurement Method for Spot Pixels ................................................................................................................................ 101 Spot Pixel Pattern Specification ......................................................................................................................................... 102 Marking .............................................................................................................................................................................. 103 Notes On Handling ............................................................................................................................................................. 104 Package Outline ................................................................................................................................................................. 106 List of Trademark Logos and Definition Statements ........................................................................................................... 107 CONFIDENTIAL only 6
Optical Center Top View Package center Optical center Package reference (H, V) Chip area Effective pixel area IMX485LQJ-C Package outline H direction Package outline V direction m m 5 7 0 . 0 ± 3 1 3 . 8 20.00 ± 0.1 mm 9.303 ± 0.075 mm A1-Pin N1-Pin CONFIDENTIAL only Sensor scanning V direction (normal) Sensor scanning H direction (normal) N11-Pin A11-Pin Optical Center 7 m m 1 . 0 ± 0 8 6 1 .
Pixel Arrangement Top View N1 pin GR G B GR G B 9 Effective margin for color processing IMX485LQJ-C Reference pin A1 pin G R GB G R GB Total number of pixels: 3864(H) × 2200(V) = 8.50 M Number of effective pixels: 3864(H) × 2180(V) = 8.42 M Number of active pixels: 3864(H) × 2176(V) = 8.40 M Number of recommended recording pixels: 3840(H) × 2160(V) = 8.29 M 2160 e d s l i i e x p e v i t c e f f e f o a e r a d e r o n g I i g n s s e c o r p l r o o c r o f i n g r a m e v i t c e f f E 0 12 G B G R G B R G ) l a m r o N ( n o i t c e r i d n a c s l a c i t r e V N11 pin i g n s s e c o r p l r o o c r o f i n g r a m e v i t c e f f E e d s l i i e x p e v i t c e f f e f o a e r a d e r o n g I 13 0 B G G R B G G R A11 pin Effective margin for color processing 8 3840 Recording Pixel area CONFIDENTIAL only Effective pixel ignored area OB side ignored area 11 9 4 Vertical(V) direction effective OB Horizontal scan direction (Normal) * Reference pin number is consecutive numbering of package pin array. See the Pin Configuration for the number of each pin. The last Effective line and column are not read-out. Pixel Arrangement 8
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