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cc1310中文.pdf
1 器件概述
1.1 特性
1.2 应用
1.3 说明
1.4 功能框图
内容
2 修订历史记录
3 Device Comparison
3.1 Related Products
4 Terminal Configuration and Functions
4.1 Pin Diagram – RSM Package
4.2 Signal Descriptions – RSM Package
4.3 Pin Diagram – RHB Package
4.4 Signal Descriptions – RHB Package
4.5 Pin Diagram – RGZ Package
4.6 Signal Descriptions – RGZ Package
5 Specifications
5.1 Absolute Maximum Ratings
5.2 ESD Ratings
5.3 Recommended Operating Conditions
5.4 Power Consumption Summary
5.5 RF Characteristics
5.6 Receive (RX) Parameters, 861 MHz to 1054 MHz
5.7 Receive (RX) Parameters, 431 MHz to 527 MHz
5.8 Transmit (TX) Parameters, 861 MHz to 1054 MHz
5.9 Transmit (TX) Parameters, 431 MHz to 527 MHz
5.10 PLL Parameters
5.11 ADC Characteristics
5.12 Temperature Sensor
5.13 Battery Monitor
5.14 Continuous Time Comparator
5.15 Low-Power Clocked Comparator
5.16 Programmable Current Source
5.17 DC Characteristics
5.18 Thermal Characteristics
5.19 Timing and Switching Characteristics
5.19.1 Reset Timing
5.19.2 Switching Characteristics: Wakeup and Timing
5.19.3 Clock Specifications
5.19.3.1 24-MHz Crystal Oscillator (XOSC_HF)
5.19.3.2 32.768-kHz Crystal Oscillator (XOSC_LF)
5.19.3.3 48-MHz RC Oscillator (RCOSC_HF)
5.19.3.4 32-kHz RC Oscillator (RCOSC_LF)
5.19.4 Flash Memory Characteristics
5.19.5 Synchronous Serial Interface (SSI) Characteristics
5.20 Typical Characteristics
6 Detailed Description
6.1 Overview
6.2 Main CPU
6.3 RF Core
6.4 Sensor Controller
6.5 Memory
6.6 Debug
6.7 Power Management
6.8 Clock Systems
6.9 General Peripherals and Modules
6.10 Voltage Supply Domains
6.11 System Architecture
7 Application, Implementation, and Layout
7.1 TI Design
8 器件和文档支持
8.1 器件命名规则
8.2 工具与软件
8.3 文档支持
8.4 德州仪器 (TI) 低功耗射频网站
8.5 低功耗射频电子新闻简报
8.6 其他信息
8.7 社区资源
8.8 商标
8.9 静电放电警告
8.10 出口管制提示
8.11 Glossary
9 机械、封装和可订购信息
9.1 封装信息
Important Notice
CC1310 SimpleLink™ 超超低低功功耗耗低低于于 1GHz 无无线线 MCU
CC1310
ZHCSEB0C –SEPTEMBER 2015–REVISED OCTOBER 2016
1 器器件件概概述述
1.1 特特性性
• 微控制器
1
– 强大的 ARM® Cortex®-M3 处理器
– EEMBC CoreMark®评分：142
– EEMBC ULPBench™评分：158
– 时钟速率最高可达 48MHz
– 32KB、64KB 和 128KB 系统内可编程闪存
– 8KB 缓存静态随机存取存储器 (SRAM)
（或用作通用 RAM）
– 20KB 超低泄漏 SRAM
– 2 引脚 cJTAG 和 JTAG 调试
– 支持无线 (OTA) 升级
• 超低功耗传感器控制器
– 可独立于系统其余部分自主运行
– 16 位架构
– 2KB 超低泄漏代码和数据 SRAM
• 有效的代码尺寸架构，在 ROM 中放置
TI-RTOS、驱动程序、引导加载程序的部件
• 与 RoHS 兼容的封装
– 7mm × 7mm RGZ VQFN48 封装（30 个通用输
入/输出 (GPIO)）
– 5mm × 5mm RHB VQFN32 封装（15 个
– 4mm × 4mm RSM VQFN32 封装（10 个
GPIO）
GPIO）
• 外设
– 所有数字外设引脚均可连接任意 GPIO
– 四个通用定时器模块
（8 × 16 位或 4 × 32 位，均采用脉宽调制
(PWM)）
– 12 位模数转换器 (ADC)、200MSPS、8 通道模
拟多路复用器
– 持续时间比较器
– 超低功耗时钟比较器
– 可编程电流源
– UART
– 2 个同步串行接口 (SSI)（SPI、MICROWIRE 和
TI）
– I2C、I2S
– 实时时钟 (RTC)
– AES-128 安全模块
– 真随机数发生器 (TRNG)
– 支持八个电容感测按钮
– 集成温度传感器
空白
空白
空白
空白
• 外部系统
• 低功耗
– 片上内部 DC-DC 转换器
– 无缝集成 SimpleLink™CC1190 范围扩展器
– 宽电源电压范围：1.8 至 3.8V
– RX：5.4mA
– TX（+10dBm 时）：13.4mA
– Coremark 运行时的 48MHz 有源模式微控制器
(MCU)：2.5mA (51µA/MHz)
– 有源模式 MCU：48.5 CoreMark/mA
– 有源模式传感器控制器（24 MHz）：
0.4mA + 8.2μA/MHz
– 传感器控制器，每秒唤醒一次来执行一次 12 位
– 待机电流：0.7μA（实时时钟 (RTC) 运行，RAM
ADC 采样：0.95µA
和 CPU 保持）
– 关断电流：185nA（发生外部事件时唤醒）
• 射频 (RF) 部分
– 出色的接收器灵敏度：远距离模式下为
-124dBm；50kbps 时为 -110dBm
（低于 1GHz）
– 出色的可选择性 (±100kHz)：56dB
– 出色的阻断性能 (±10MHz)：
90dB
– 可编程输出功率：时最高可达 +9dBm
– 单端或差分 RF 接口
– 适用于符合全球射频规范的系统
– ETSI EN 300 220 和 EN 303 204（欧洲）
– FCC CFR47 第 15 部分（美国）
– ARIB STD-T108（日本）
– 无线 M 总线以及所选 IEEE®802.15.4g PHY
• 工具和开发环境
– 功能全面的低成本开发套件
– 针对不同 RF 配置的多种参考设计
– 数据包监听器 PC 软件
– Sensor Controller Studio
– SmartRF™Studio
– SmartRF Flash Programmer2
– IAR Embedded Workbench®（用于 ARM）
– Code Composer Studio™
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SWRS181
ProductFolderOrderNowTechnicalDocumentsTools &SoftwareSupport &CommunityReferenceDesign
CC1310
ZHCSEB0C –SEPTEMBER 2015–REVISED OCTOBER 2016
1.2 应应用用
•
315、433、470、500、779、868、915、
920MHz 工业、科学和医疗 (ISM) 及短程设备
(SRD) 系统
• 信道间隔为 50kHz 至 5MHz 的
低功耗无线系统
• 家庭和楼宇自动化
• 无线警报和安全系统
• 工业用监控和控制
• 智能电网和自动抄表
• 无线医疗保健 应用
1.3 说说明明
www.ti.com.cn
• 无线传感器网络
• 有源 RFID
•
IEEE 802.15.4g、支持 IP 的智能对象
(6LoWPAN)、无线仪表总线、KNX 系统、
Wi-SUN™及专有系统
• 能量收集 应用
• 电子货架标签 (ESL)
• 远距离传感器 应用
• 热量分配表
CC1310 属于德州仪器 (TI) CC26xx 和 CC13xx 系列器件中的 经济高效型超低功耗 2.4GHz 和低于 1GHz
的 RF 器件。™。它具有极低的有源 RF 和微控制器 (MCU) 电流消耗，除了灵活的低功耗模式外，可确保
卓越的电池使用寿命，适用于由小型纽扣电池供电的远距离操作以及能源采集型 应用。
CC1310 是经济高效型、超低功耗无线 MCU 中低于 1GHz 系列的首款器件。CC1310 器件在支持多个物理
层和 RF 标准的平台中将灵活的超低功耗 RF 收发器和强大的 48MHz Cortex®-M3 微控制器相结合。专用无
线控制器 (Cortex®-M0) 处理 ROM 或 RAM 中存储的低层 RF 协议命令，从而确保超低功耗和灵活度。
CC1310 器件不会以牺牲 RF 性能为代价来实现低功耗；CC1310 器件具有出色的灵敏度和稳定性（可选择
性和阻断）性能。
CC1310 器件是一款高度集成、真正的单片解决方案，其整合了一套完整的 RF 系统及一个片上 DC-DC 转
换器。
传感器可由专用的超低功耗自主 MCU 以超低功耗方式进行处理，该 MCU 可配置为处理模拟和数字传感
器，因此主 MCU (Cortex-M3) 能够最大限度地延长休眠时间。
CC1310 电源和时钟管理以及无线系统需要采用特定配置并由软件处理才能正确运行，这一切均已在 TI-
RTOS 中实现。TI 建议将此软件框架应用于针对器件的全部应用程序开发过程。完整的 TI-RTOS 和器件驱
动程序以源代码形式免费提供。
产产品品型型号号
CC1310F128RGZ
CC1310F128RHB
CC1310F128RSM
CC1310F64RGZ
CC1310F64RHB
CC1310F64RSM
CC1310F32RGZ
CC1310F32RHB
CC1310F32RSM
(1) 详细信息请见节 9。
器器件件信信息息(1)
封封装装
VQFN (48)
VQFN (32)
VQFN (32)
VQFN (48)
VQFN (32)
VQFN (32)
VQFN (48)
VQFN (32)
VQFN (32)
封封装装尺尺寸寸（（标标称称值值））
7.00mm x 7.00mm
5.00mm x 5.00mm
4.00mm x 4.00mm
7.00mm x 7.00mm
5.00mm x 5.00mm
4.00mm x 4.00mm
7.00mm x 7.00mm
5.00mm x 5.00mm
4.00mm x 4.00mm
2
器件概述
版权 © 2015–2016, Texas Instruments Incorporated
www.ti.com.cn
1.4 功功能能框框图图
图 1-1 所示为 CC1310 器件框图。
CC1310
ZHCSEB0C –SEPTEMBER 2015–REVISED OCTOBER 2016
图图 1-1. CC1310 框框图图
版权 © 2015–2016, Texas Instruments Incorporated
器件概述
3
SimpleLinkTM CC1310 Wireless MCUMain CPU:32-, 64-,128-KBFlashSensor ControllercJTAG 20-KBSRAMROMARM®Cortex®-M3 DC-DC ConverterRF coreARM®Cortex®-M0DSP Modem4-KB SRAMROMSensor Controller Engine2x Analog Comparators12-Bit ADC, 200ks/sConstant Current SourceSPI / I2C Digital Sensor IF2-KB SRAMTime-to-Digital ConverterGeneral Peripherals / Modules2x SSI (SPI,W,TI)Watchdog TimerTemp. / Batt. MonitorRTC I2CUART I2S10 / 15 / 30 GPIOsAESADCADCDigital PLLTRNG8-KBCacheCopyright © 2016, Texas Instruments Incorporated4x 32-Bit Timers32 ch. PDMA
CC1310
ZHCSEB0C –SEPTEMBER 2015–REVISED OCTOBER 2016
www.ti.com.cn
5
4
1 器器件件概概述述.................................................... 1
1.1 特性................................................... 1
1.2 应用................................................... 2
1.3 说明................................................... 2
1.4 功能框图 .............................................. 3
2 修修订订历历史史记记录录............................................... 5
3 Device Comparison ..................................... 6
Related Products ..................................... 6
3.1
Terminal Configuration and Functions.............. 7
Pin Diagram – RSM Package ........................ 7
4.1
Signal Descriptions – RSM Package................. 8
4.2
Pin Diagram – RHB Package ........................ 9
4.3
Signal Descriptions – RHB Package................ 10
4.4
Pin Diagram – RGZ Package ....................... 11
4.5
Signal Descriptions – RGZ Package................ 12
4.6
Specifications........................................... 14
Absolute Maximum Ratings......................... 14
5.1
ESD Ratings ........................................ 14
5.2
Recommended Operating Conditions............... 14
5.3
Power Consumption Summary...................... 15
5.4
RF Characteristics .................................. 15
5.5
Receive (RX) Parameters, 861 MHz to 1054 MHz . 16
5.6
Receive (RX) Parameters, 431 MHz to 527 MHz .. 17
5.7
Transmit (TX) Parameters, 861 MHz to 1054 MHz. 19
5.8
Transmit (TX) Parameters, 431 MHz to 527 MHz .. 20
5.9
5.10 PLL Parameters..................................... 20
5.11 ADC Characteristics................................. 20
5.12 Temperature Sensor ................................ 21
5.13 Battery Monitor...................................... 21
5.14 Continuous Time Comparator....................... 22
5.15 Low-Power Clocked Comparator ................... 22
5.16 Programmable Current Source ..................... 22
内内容容
5.17 DC Characteristics .................................. 22
5.18 Thermal Characteristics............................. 24
5.19 Timing and Switching Characteristics............... 24
5.20 Typical Characteristics .............................. 28
6 Detailed Description ................................... 32
Overview ............................................ 32
6.1
6.2 Main CPU ........................................... 32
RF Core ............................................. 33
6.3
Sensor Controller ................................... 34
6.4
6.5 Memory.............................................. 35
Debug ............................................... 35
6.6
Power Management................................. 36
6.7
Clock Systems ...................................... 38
6.8
General Peripherals and Modules .................. 38
6.9
6.10 Voltage Supply Domains............................ 39
6.11 System Architecture................................. 39
7 Application, Implementation, and Layout ......... 40
TI Design............................................ 41
8 器器件件和和文文档档支支持持 .......................................... 42
8.1 器件命名规则........................................ 42
8.2 工具与软件 .......................................... 43
8.3 文档支持............................................. 44
8.4 德州仪器 (TI) 低功耗射频网站....................... 44
8.5 低功耗射频电子新闻简报............................ 44
8.6 其他信息............................................. 44
8.7 社区资源............................................. 45
8.8 商标.................................................. 45
8.9 静电放电警告........................................ 46
8.10 出口管制提示........................................ 46
8.11 Glossary............................................. 46
9 机机械械、、封封装装和和可可订订购购信信息息................................ 46
9.1 封装信息............................................. 46
7.1
4
内容
版权 © 2015–2016, Texas Instruments Incorporated
www.ti.com.cn
2 修修订订历历史史记记录录
CC1310
ZHCSEB0C –SEPTEMBER 2015–REVISED OCTOBER 2016
注：之前版本的页码可能与当前版本有所不同。
Changes from October 28, 2015 to October 27, 2016
Page
• 已添加 32KB 和 64KB 至系统内可编程闪存的特性要点 ......................................................................... 1
• 已更改 至正确引脚数（位于特性要点 与 RoHS 兼容的封装 .................................................................... 1
• 已更改 CC1310 框图 ................................................................................................................. 3
• Changed Figure 4-2, corrected typo in pin name................................................................................. 9
• Changed the table note in Section 5.1 from: VDDS to: ground ............................................................... 14
• Changed ESD ratings for all pins in Section 5.2 ................................................................................ 14
• Added OOK modulation power consumption to Section 5.4 .................................................................. 15
• Added OOK modulation sensitivity to Section 5.6 .............................................................................. 17
• Added receive parameters for 431-MHz to 527-MHz band in Section 5.7 .................................................. 17
• Added transmit parameters for 431-MHz to 527-MHz band in Section 5.9 ................................................. 20
• Changed ADC reference voltage to correct value in Section 5.11 ........................................................... 21
• Added thermal characteristics for RHB and RSM packages in Section 5.18 ............................................... 24
• Changed Figure 5-5 by extending the temperature............................................................................. 28
• Changed BOD restriction footnote in Table 6-2—restriction does not apply to die revision B and later................. 36
• Added Section 6.10 ................................................................................................................. 39
• 已更改 图 8-1 ........................................................................................................................ 42
Changes from September 30, 2015 to October 28, 2015
Page
• Added the RSM and RHB packages............................................................................................... 7
Changes from August 31, 2015 to September 30, 2015
Page
• 已更改 器件状态，从“产品预览”更改为“量产数据”................................................................................ 1
• Removed the RSM and RHB packages ........................................................................................... 7
版权 © 2015–2016, Texas Instruments Incorporated
修订历史记录
5
CC1310
ZHCSEB0C –SEPTEMBER 2015–REVISED OCTOBER 2016
3 Device Comparison
Table 3-1 lists the device family overview.
www.ti.com.cn
Table 3-1. Device Family Overview
DEVICE
CC1310F128RGZ
CC1310F64RGZ
CC1310F32RGZ
CC1310F128RHB
CC1310F64RHB
CC1310F32RHB
CC1310F128RSM
CC1310F64RSM
CC1310F32RSM
PHY SUPPORT
Proprietary, Wireless M-Bus, IEEE 802.15.4g
Proprietary, Wireless M-Bus, IEEE 802.15.4g
Proprietary, Wireless M-Bus, IEEE 802.15.4g
Proprietary, Wireless M-Bus, IEEE 802.15.4g
Proprietary, Wireless M-Bus, IEEE 802.15.4g
Proprietary, Wireless M-Bus, IEEE 802.15.4g
Proprietary, Wireless M-Bus, IEEE 802.15.4g
Proprietary, Wireless M-Bus, IEEE 802.15.4g
Proprietary, Wireless M-Bus, IEEE 802.15.4g
FLASH
(KB)
128
64
32
128
64
32
128
64
32
RAM
(KB)
20
16
16
20
16
16
20
16
16
GPIOs
PACKAGE SIZE
30
30
30
15
15
15
10
10
10
7 mm × 7 mm
5 mm × 5 mm
4 mm × 4 mm
3.1 Related Products
Wireless Connectivity The wireless connectivity portfolio offers a wide selection of
low-power RF
solutions suitable for a broad range of application. The offerings range from fully customized
solutions to turnkey offerings with precertified hardware and software (protocol).
Sub-1 GHz Long-range,
low power wireless connectivity solutions are offered in a wide range of
Sub-1 GHz ISM bands.
Companion Products Review products that are frequently purchased or used with this product.
Reference Designs for CC1310 The TI Designs Reference Design Library is a robust reference design
library spanning analog, embedded processor, and connectivity. Created by TI experts to
help you jump-start your system design, all TI Designs include schematic or block diagrams,
BOMs and design files to speed your time to market. Search and download designs at
ti.com/tidesigns.
6
Device Comparison
Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1310
www.ti.com.cn
4 Terminal Configuration and Functions
4.1 Pin Diagram – RSM Package
Figure 4-1 shows the RSM pinout diagram.
CC1310
ZHCSEB0C –SEPTEMBER 2015–REVISED OCTOBER 2016
Figure 4-1. RSM (4-mm × 4-mm) Pinout, 0.4-mm Pitch
Top View
I/O pins marked in Figure 4-1 in bold have high-drive capabilities; they are as follows:
• Pin 8, DIO_0
• Pin 9, DIO_1
• Pin 10, DIO_2
• Pin 13, JTAG_TMSC
• Pin 15, DIO_3
• Pin 16, DIO_4
I/O pins marked in Figure 4-1 in italics have analog capabilities; they are as follows:
• Pin 22, DIO_5
• Pin 23, DIO_6
• Pin 24, DIO_7
• Pin 25, DIO_8
• Pin 26, DIO_9
Copyright © 2015–2016, Texas Instruments Incorporated
Terminal Configuration and Functions
7
Submit Documentation Feedback
Product Folder Links: CC1310
2829273021202219181312141145367261525163110329232241178DIO_6VSSDIO_5RESET_NVSSVDDS_DCDCDCDC_SWDIO_7VDDR_RFX24M_PX24M_NVSSVDDRDIO_9VDDSDIO_8DIO_1JTAG_TCKCDIO_2JTAG_TMSCVDDS2DIO_3DIO_4RF_PRF_NVSSX32K_Q2VSSDIO_0RX_TXX32K_Q1DCOUPL
CC1310
ZHCSEB0C –SEPTEMBER 2015–REVISED OCTOBER 2016
4.2 Signal Descriptions – RSM Package
www.ti.com.cn
PIN
NAME
DCDC_SW
DCOUPL
DIO_0
DIO_1
DIO_2
DIO_3
DIO_4
DIO_5
DIO_6
DIO_7
DIO_8
DIO_9
EGP
JTAG_TMSC
JTAG_TCKC
RESET_N
RF_N
RF_P
RX_TX
VDDS
VDDS2
VDDS_DCDC
VDDR
VDDR_RF
VSS
NO.
18
12
8
9
10
15
16
22
23
24
25
26
–
13
14
21
2
1
4
27
11
19
28
32
3, 7, 17,
20, 29
Table 4-1. Signal Descriptions – RSM Package
TYPE
Power
Power
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital or analog I/O
Digital or analog I/O
Digital or analog I/O
Digital or analog I/O
Digital or analog I/O
Power
Digital I/O
Digital I/O
Digital input
RF I/O
RF I/O
RF I/O
Power
Power
Power
Power
Power
Power
DESCRIPTION
Output from internal DC-DC(1)
1.27-V regulated digital-supply decoupling capacitor(2)
GPIO, Sensor Controller, high-drive capability
GPIO, Sensor Controller, high-drive capability
GPIO, Sensor Controller, high-drive capability
GPIO, high-drive capability, JTAG_TDO
GPIO, high-drive capability, JTAG_TDI
GPIO, Sensor Controller, analog
GPIO, Sensor Controller, analog
GPIO, Sensor Controller, analog
GPIO, Sensor Controller, analog
GPIO, Sensor Controller, analog
Ground; exposed ground pad
JTAG TMSC
JTAG TCKC
Reset, active low. No internal pullup.
Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
Optional bias pin for the RF LNA
1.8-V to 3.8-V main chip supply(1)
1.8-V to 3.8-V GPIO supply(1)
1.8-V to 3.8-V DC-DC supply
1.7-V to 1.95-V supply, connect to output of internal DC-DC(2)(3)
1.7-V to 1.95-V supply, connect to output of internal DC-DC(2)(4)
Ground
5
6
30
31
32-kHz crystal oscillator pin 1
32-kHz crystal oscillator pin 2
24-MHz crystal oscillator pin 1
24-MHz crystal oscillator pin 2
X32K_Q1
X32K_Q2
X24M_N
X24M_P
(1) See the technical reference manual listed in 节 8.3 for more details.
(2) Do not supply external circuitry from this pin.
(3)
(4)
Analog I/O
Analog I/O
Analog I/O
Analog I/O
If internal DC-DC is not used, this pin is supplied internally from the main LDO.
If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.
8
Terminal Configuration and Functions
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