TMS570开发板资料.pdf

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Table of Contents

Preface

1 Introduction

1.1 Scope of Document

1.2 TMS570LS31 HERCULES Development Kit (HDK) Features

1.3 HDK Board Block Diagram

1.4 TMS570LS31 HDK Contents

1.5 HDK Specifications

1.6 Basic Operation

1.7 Memory Map

1.8 Power Supply

2 Physical Description

2.1 Board Layout

2.2 Connectors

2.2.1 20-Pin ARM JTAG Header

2.2.2 Ethernet Interface

2.2.3 CAN Interface

2.2.4 J19, MIPI ETM Connector

2.2.5 J7, XDS100V2 USB JTAG Interface

2.2.6 P1, +5 V to +12 V Input

2.2.7 SCI Interface

2.2.8 Daughter Card Interface

2.3 LEDs

2.4 S2 DIP Switch

2.5 Jumpers

2.6 S4, Power On Reset Switch

2.7 S3, System Reset Switch

A Operation Notices

Important Notices

TMS570LS31x Hercules Development Kit (HDK) User's Guide Literature Number: SPNU509A September 2011–Revised September 2012

Contents 2 Preface ....................................................................................................................................... 4 Introduction ........................................................................................................................ 5 1 Scope of Document ......................................................................................................... 5 1.1 TMS570LS31 HERCULES Development Kit (HDK) Features ........................................................ 5 1.2 HDK Board Block Diagram ................................................................................................ 6 1.3 TMS570LS31 HDK Contents .............................................................................................. 6 1.4 HDK Specifications ......................................................................................................... 7 1.5 Basic Operation ............................................................................................................. 7 1.6 Memory Map ................................................................................................................. 7 1.7 Power Supply ................................................................................................................ 7 1.8 Physical Description ............................................................................................................ 8 Board Layout ................................................................................................................ 8 2.1 Connectors ................................................................................................................... 9 2.2 2.2.1 20-Pin ARM JTAG Header ...................................................................................... 10 2.2.2 Ethernet Interface ................................................................................................ 10 2.2.3 CAN Interface ..................................................................................................... 10 2.2.4 J19, MIPI ETM Connector ....................................................................................... 11 2.2.5 J7, XDS100V2 USB JTAG Interface ........................................................................... 12 2.2.6 P1, +5 V to +12 V Input .......................................................................................... 13 2.2.7 SCI Interface ...................................................................................................... 13 2.2.8 Daughter Card Interface ......................................................................................... 13 LEDs ........................................................................................................................ 16 2.3 S2 DIP Switch .............................................................................................................. 17 2.4 Jumpers ..................................................................................................................... 18 2.5 S4, Power On Reset Switch ............................................................................................. 18 2.6 S3, System Reset Switch ................................................................................................ 18 2.7 Operation Notices .............................................................................................................. 19 A 2 Contents Copyright © 2011–2012, Texas Instruments Incorporated SPNU509A–September 2011– Revised September 2012 Submit Documentation Feedback

www.ti.com List of Figures 1-1. 2-1. 2-2. 2-3. 2-4. 2-5. 2-6. 2-7. 2-8. TMS570LS31 HDK Board Block Diagram ............................................................................... 6 TMS570LS31 HDK Board, Interfaces Top Side ........................................................................ 8 Connectors on TMS570LS31 HDK ....................................................................................... 9 CAN Bus Termination..................................................................................................... 11 J2, J3 CAN Bus Interface (Screw Terminal) ........................................................................... 11 J19, 60 Pin MIPI ETM Header........................................................................................... 11 +12 V Input Jack........................................................................................................... 13 J9, J10, and J11 on HDK................................................................................................. 14 DIP Switch Settings ....................................................................................................... 17 List of Tables TMS570LS31 Memory Map ............................................................................................... 7 1-1. Power Test Points .......................................................................................................... 7 1-2. Connectors on HDK Board ................................................................................................ 9 2-1. 20-Pin ARM JTAG Header ............................................................................................... 10 2-2. J1, Ethernet Interface ..................................................................................................... 10 2-3. J19, MIPI Connector Signal Mapping................................................................................... 12 2-4. J7, XDS100V2 USB JTAG Interface.................................................................................... 12 2-5. Expansion Connector P2 (J10, Right, TopView) ...................................................................... 14 2-6. Expansion Connector P1 (J9, Left, TopView) ......................................................................... 15 2-7. Expansion Connector P3 (J11, Bottom One, TopView) .............................................................. 16 2-8. Demo LEDs ................................................................................................................ 17 2-9. 2-10. Other LEDs as Indicator .................................................................................................. 17 2-11. S2 DIP Switch Functions ................................................................................................. 18 Jumpers..................................................................................................................... 18 2-12. SPNU509A–September 2011– Revised September 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated List of Figures 3

Preface SPNU509A–September 2011–Revised September 2012 Read This First About This Manual This document describes the board level operations of the TMS570LS31 Hercules™ Development Kit (HDK). The HDK is based on the Texas Instruments TMS570LS3137 Microcontroller. The TMS570LS31 HDK is a table top card that allows engineers and software developers to evaluate certain characteristics of the TMS570LS3137 microcontroller to determine if the microcontroller meets the designer’s application requirements as well as begin early application development. Evaluators can create software to execute on board or expand the system in a variety of ways. Notational Conventions This document uses the following conventions. The TMS570LS31 HDK will sometimes be referred to as the HDK. Program listings, program examples, and interactive displays are shown in a special italic typeface. Here is a sample program listing: • • equations !rd = !strobe&rw Information About Cautions This book may contain cautions. This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software, or hardware, or other equipment. The information in a caution is provided for your protection. Please read each caution carefully. Related Documentation From Texas Instruments Information regarding this device can be found at the following Texas Instruments website: http://www.ti.com/tms570 Hercules, Code Composer Studio are trademarks of Texas Instruments. ARM is a registered trademark of ARM Limited. All other trademarks are the property of their respective owners. 4 Read This First Copyright © 2011–2012, Texas Instruments Incorporated SPNU509A–September 2011– Revised September 2012 Submit Documentation Feedback

Chapter 1 SPNU509A–September 2011–Revised September 2012 Introduction This development kit provides a product-ready hardware and software platform for evaluating the functionality of the Texas Instruments TMS570LS31 microcontroller family. Schematics, list of materials, and PCB layout are available to ease hardware development and reduce time to market. 1.1 Scope of Document This user's guide lists the contents of the development kit, points out the features of the major components, and provides the instructions necessary to verify your development kit is in working order. Any additional usage instructions or details fall outside the scope of this document. Additional resources will be listed at the end of this user's guide. 1.2 Integrated USB JTAG Emulator (XDS100v2) TMS570LS31 HERCULES Development Kit (HDK) Features The HDK comes with a full complement of on board devices that suit a wide variety of application environments. Key features include: • A Hercules TMS570LS3137 337-pin BGA microcontroller • • External JTAG Headers ( ARM® 20 pin and TI Compact 20-pin CTI) • • Two CAN transceivers (SN65HVDA541Q1) and screw terminal blocks • One ambient light sensor • One ambient temperature sensor • Microcontroller’s serial communication interface (SCI) universal asynchronous receiver/transmitter 10/100 Mbps Ethernet interface (UART) accessible through a USB virtual COM port • One 8MB SDRAM • Eight user programmable white LEDs around the MCU silicon • One user programmable pushbutton • Three expansion connectors for hardware prototyping • Reset pushbuttons (nPORRST and nRST) • One SD card slot (SPI mode) • Embedded trace macrocell (ETM) debug interface via MIPI connector • Configurable pin mux options • • Current measurement capability for 3.3 V IO, 1.2 V core, 1.2 V core, 1.2 V PLL, 3.3 V or 5 V ADC, and 5 V and 3.3 V analog-to-digital converter (ADC) option jumper 3.3 V VCCP • Accepts an external power supply between +5V and +12V SPNU509A–September 2011– Revised September 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Introduction 5

HDK Board Block Diagram 1.3 HDK Board Block Diagram Figure 1-1 illustrates the HDK block diagram. www.ti.com Figure 1-1. TMS570LS31 HDK Board Block Diagram 1.4 TMS570LS31 HDK Contents The kit contains everything needed to develop and run applications for TMS570LS3137 microcontrollers including: • Board: – TMS570LS31 Card • Cables and Accessories – 12 V power supply with power adapters for US, or Europe – Type A to mini B USB cable for using on board XDS100V2 JTAG emulator – Ethernet cable – Flashlight for light sensor demo • CCS DVD Containing: – Texas Instruments’ Code Composer Studio™ Integrated Development Environments (IDE) • Hercules DVD Containing: – Hercules Safety Demos – Hardware Abstraction Layer Code Generator (HALCoGen) – Training Videos – Device Documentation 6 Introduction Copyright © 2011–2012, Texas Instruments Incorporated SPNU509A–September 2011– Revised September 2012 Submit Documentation Feedback SDRAMCAN1ETMSPI/ADCJTAGPORRSTPWRUSBEMUEXPConn1SPI2SDSlotXDS100V2CPLDFTDI2332Ext JTAGEMIF/ETM/SPI2ENETRJ45ENETPHYMII/RMIICANPHYEXPConn2EXPConn3PinmuxDIPPIN MUXTMS570LS3137180MHzPINMUXCAN/FRAY/LIN/GIO/HETLightSensorTempSensorCAN2CANPHYGIOButton3.3V/5VA/D3.3V I/O1.2V Core

www.ti.com 1.5 HDK Specifications • Board supply voltage: 5 V–12 V Vdc • Board supply current: 130 mA typ (fully active, CPU at 180 MHz) • Dimensions: 4.90” x 4.30” x 0.85” (LxWxH) 1.6 Basic Operation HDK Specifications The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDE communicates with the board through the embedded emulator or an external JTAG emulator. To start, follow the instructions in the Quick Start Guide to install Hercules-specific software. This process will install all of the necessary development tools, documentation and drivers. 1.7 Memory Map The TMS570LS31 family of MCUs have a large byte addressable address space. Table 1-1 shows the address space of a TMS570LS3137 microcontroller on the left with specific details of how each region is used by the HDK on the right. By default, the internal memory sits at the beginning of the address space. The SDRAM is mapped into CS0 space on the EMIF. CS[4:2] are used for synchronous memory for example SRAM, NOR Flash, NAND Flash, and so forth. To use EMIF, the MPU has to be enabled, and the CS regions have to be configured as “device mode” or “strongly ordered mode” through MPU. Table 1-1. TMS570LS31 Memory Map Start Address 0x0000 0000 0x0800 0000 0x0840 0000 0x6000 0000 0x6400 0000 0x6800 0000 0x8000 0000 End Address 0x002F FFFF 0x0803 FFFF 0x0843 FFFF 0x63FF FFFF 0x67FF FFFF 0x7BFF FFFF 0x87FF FFFF HDK Flash RAM RAM-ECC CS2 Async RAM CS3 Async RAM CS4 Async RAM CS0 Sync SDRAM 1.8 Power Supply The HDK board operates from a single +12 V external power supply connected to the main power input (P1), a 2.5 mm, barrel-type plug. Internally, the +12 V input is converted into +1.2 V, +3.3 V and +5.0 V using Texas Instruments swift voltage regulators and PTH power module. The +1.2 V supply is used for the MCU core while the +3.3 V supply is used for the MCU's I/O buffers and other module on the board. The +5.0 V supply is used for ADC power (second option) and USB VBUS. There are multiple power test points on the HDK board. The three main test point pairs provide a convenient mechanism to check the HDK’s current for each supply. Table 1-2 shows the voltages for each test point and what the supply is used for. Table 1-2. Power Test Points Test Point Pair TP14 and TP15 TP16 and TP17 TP18 and TP19 TP20 and TP21 TP22 and TP23 Voltage 1.2 V 3.3 V 1.2 V 3.3 V Voltage Use MCU core MCU IO and logic MCU PLL MCU Flash pump 3.3 V or 5.0 V (J8 to enable 5 V) MCU MibADC, and ADREFHI SPNU509A–September 2011– Revised September 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Introduction 7

Chapter 2 SPNU509A–September 2011–Revised September 2012 Physical Description This section describes the physical layout of the TMS570LS31 HDK board and its interfaces. 2.1 Board Layout The TMS570LS31 HDK board is a 4.9 x 4.3 inch (125 x 109 mm) eight layer printed circuit board that is powered by an external +5 V to approximately +12 V only power supply. Figure 2-1 shows the layout of the TMS570LS31 HDK board. Figure 2-1. TMS570LS31 HDK Board, Interfaces Top Side 8 Physical Description Copyright © 2011–2012, Texas Instruments Incorporated SPNU509A–September 2011– Revised September 2012 Submit Documentation Feedback HerculesTMS570LS3137

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