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Copyright and Warranty Notice The information in this document is subject to change without notice and does not represent a commitment on part of the vendor, who assumes no liability or responsibility for any errors that may appear in this manual. No warranty or representation, either expressed or implied, is made with respect to the quality, accuracy or fitness for any particular part of this document. In no event shall the manufacturer be indirect, special, incidental or consequential damages arising from any defect or error in this manual or product. liable for direct, Product names appearing in this manual are for identification purpose only and trademarks and product names or brand names appearing in this document are property of their respective owners. This document contains materials protected under International Copyright Laws. All rights reserved. No part of this manual may be reproduced, transmitted or transcribed without the expressed written permission of the manufacturer and authors of this manual. If you do not properly set the motherboard settings causing the motherboard to malfunction or fail, we cannot guarantee any responsibility.

CX6 Motherboard User’s Manual Chapter 1. Introduction of CX6 Features 1-1. Features of this Motherboard 1-2. Specifications 1-3. Layout Diagram 1-4. The System Block Diagram Chapter 2. Installing the Motherboard 2-1. Installing the Motherboard to the Chassis 2-2. Installation of the Pentium II/III CPU 2-3. Installing System Memory 2-4. Connectors, Headers and Switches Chapter 3. Introduction of The BIOS 3-1. CPU Soft Menu™ II 3-2. Standard CMOS Features Setup Menu 3-3. Advanced BIOS Features Setup Menu 3-4. Advanced Chipset Features Setup Menu 3-5. Integrated Peripherals 3-6. Power Management Setup Menu 3-7. PnP/PCI Configurations 3-8. PC Health Status 3-9. Load Fail-Safe Defaults 3-10. Load Optimized Defaults 3-11. Set Password 3-12. Save & Exit Setup 3-13. Exit Without Saving Table of Contents 1-1 1-1 1-6 1-9 1-10 2-1 2-2 2-3 2-4 2-7 3-1 3-4 3-8 3-13 3-18 3-21 3-27 3-35 3-38 3-40 3-40 3-41 3-42 3-43 MN-170-2A0-41 Rev. 1.00

Appendix A Intel INF Installation Utility for Windows® 98 SE Appendix B Installing the Audio Driver for Windows® 98 SE Appendix C Installing the Audio Drivers for the Windows® NT Appendix D BIOS Flashing User Instructions Appendix E Installing the HighPoint XStore Pro Utility Appendix F Hardware Monitoring Function (Installing the Winbond Hardware Doctor Utility) Appendix G Installation Guide for Suspend to RAM Appendix H Troubleshooting (Need Assistance?) Appendix I How to Get Technical Support

Introduction of CX6 Features 1-1 Chapter 1. Introduction of CX6 Features 1-1.Features of this Motherboard This motherboard is designed for the new generation of CPUs. It supports the Intel SLOT1 structure (Pentium II/III processor), up to 1GB of memory, super I/O, and Green PC functions. The motherboard provides high performance for server systems and meets the requirements for future multimedia desktop systems. The CX6 uses the new generation Intel® 820 chipset (Camino) for more efficiency and high integration of the system. What are the main features of the Intel® Camino chipset? Its structure is shown in Figure 1-2. 133 MHz System Bus ! The Intel® 820 platform supports the new 133 MHz system bus " Up to 33% increased peak bandwidth over the Intel® 440BX platform. AGP 4x Graphics ! Up to 1GB/Sec transfer rate " Twice the peak bandwidth of AGP 2x of the 440BX AGPset ! Broad industry support for AGP 4x from all leading graphics IHVs " NVIDIA, 3Dfx, S3, ATI, Intel, Matrox, etc. RDRAM Memory ! Provides memory bandwidth to keep up with ever increasing application demands " Faster processors, graphics, and I/O ! RDRAM delivers up to 3x the effective bandwidth of PC100 SDRAM " 1.6 GByte/sec for PC800 RDRAM ! RDRAM provides the required headroom for further application improvement " Constant Computing " More realistic environments " Platform longevity and stability The Intel® 820 chipset is a combination of three chips: the FW82820, FW82801 and FW82802. The FW82820 is called MCH chip (Memory Controller Hub), FW82801 is called ICH chip (I/O Controller Hub), FW82802 is called FWH chip (FirmWare Hub). MCH (Memory Controller Hub) The MCH provides the host interface, DRAM interface, I/O interface, and AGP interface in a Camino platform. Camino MCH is optimized for the Katmai or Coppermine processor. It supports a single channel of direct Rambus memory technology. Its AGP interface is fully compliant with AGP 2.0 specification. Communication to ICH is over a private interface or the hub interface (link). The Camino MCH contains the following functionality: User’s Manual ➠ ➠ ➠

1-2 Chapter1 Supports the Katmai and Coppermine processors at 100/133MHz for Slot 1 Supports an IOQ (In-Order Queue) depth of 6 GTL+ host bus supporting 32-bit host addressing Single Direct Rambus channel optimized for 300, 356 and 400 MHz operation 1GB DRAM supported with 256Mbit memory technology AGP 2.0 interface with 1x/2x/4x data transfer and 2x/4x fast write capability The hub interface (link) to ICH Fully optimized data paths and buffering Distributed arbitration for highly concurrent operation ACPI 1.0 power management compliant ICH (I/O Controller Hub) The ICH is a highly integrated multifunctional component supporting the following functions and capabilities: PCI Rev. 2.2 compliant with support for 33MHz PCI operations Supports up to 6 Req/Gnt pairs (PCI Slots) Integrated IDE controller with Ultra DMA/66 support USB host interface with support for 2 USB ports AC '97 2.1 compliant link for audio and telephony CODECs Firmware Hub (FWH) interface support FWH (FirmWare Hub) The FWH component is part of several integrated Intel® chipsets. The FWH is key to enabling future security and manageability infrastructures for the PC platform. The device operates under the FWH interface/protocol. The hardware features of this device include a Random Number Generator (RNG), five General Purpose Inputs (GPIs), register-based block locking, and hardware-based locking. An integrated combination of logic features and non-volatile memory enables better protection for the storage/update of platform code/data, adds platform flexibility through additional GPIs and allows for quicker introduction of new security/manageability features into the current and future Intel® architecture platform. It's available in 8Mbit (82802AC), 4Mbit (82802AB), and 2Mbit (82802AA) densities. It uses the 32L PLCC or 40L TSOP industry standard packages. AMR (Audio/Modem Riser) The CX6 has one AMR slot onboard, called the Audio/Modem Riser (AMR) slot. The Audio/Modem Riser is an open industry-standard specification that defines a hardware CX6 ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠ ➠

Introduction of CX6 Features 1-3 scalable Original Equipment Manufacturer (OEM) motherboard riser board and interface, which supports both audio and modem functions. The specification's main objective is to reduce the baseline implementation cost of audio and modem functionality. In accordance with PC user's demands for feature-rich PCs, combined with the industry's current trend towards lower cost PCs, all of theses functions are built into the motherboard. But motherboard integration of the modem subsystem has been problematic to date, in large part due to FCC and other international telecom certification processes that may delay the introduction of a motherboard. Resolving the homologation/certification issue for modems is one of the AMR specification's key objectives. In the future, not only OEM motherboards will have an AMR design, the AMR card will appear in the market and you can make a choice in buying this kind of card according to your budget. But your motherboard must have an AMR slot to be able to plug an AMR card. The CX6 insures this expansibility for this issue. Yamaha YMF752-S audio chip YMF752 is an AC’97 Audio CODEC LSI, which is fully compliant with the industry standard “Audio CODEC ’97” component specification (Revision 2.1). YMF752 includes a SRC (Sampling Rate Converter) for support variable sampling rate, which can work the A/D and D/A converter at different rate. YMF752 has an AC-Link serial interface, which can be used with digital controller LSI. Therefore, YMF752 is the best audio solution for both laptops and desktop PCs as well as AMR (Audio Modem Riser) and MDC (Mobile Daughter Card). YMF752 also supports low power consumption while normal operating and allows for controlling the power down mode. Direct Rambus Technology During the past few years, computer main memory has become the speed bottleneck that has blocked improved system performance. This is true despite the fact that DRAM densities have been accelerating sharply from yesterday's 1Kbit per chip to today's 64Mbit devices. While that aspect of DRAM technology has advanced by a factor of 1,000 in the past 10 years, the time it takes to access main memory has improved by only a factor of five. The result is that memory bandwidth, the number of bytes per second that can be moved across memory I/O, has been hobbled. That sluggish performance improvement is now a severe drag on systems powered by microprocessors that have improved CPU performance 200 fold in the same timeframe. User’s Manual

1-4 Chapter1 DRAM synchronization has set the stage for system designers to move from a 66MHz to a 100 MHz system bus, partially closing the speed gap between processor and memory. But even as engineering teams wrestle with this design challenge, microprocessors are advancing to speeds of 300MHz, 400MHz, and beyond. Memory technologists are now developing new DRAM architectures that are expected to be fast enough to unleash the power of tomorrow's processors. These architectures add special registers to each DRAM pin and special controller functions to the DRAM array core. Currently, the most fully developed of these architectures is Direct Rambus DRAM (Direct RDRAM) which uses a special controller, layout, and bus to achieve high I/O bandwidth. While other firms were employing techniques such as SRAM caches, parallel arrays of DRAMs, and expensive frame buffers to increase memory bandwidth, Rambus, Inc. took an entirely different tack. Rambus targeted a two-byte wide data path, 800MHz transfer rate, and a 95% protocol efficiency. The development resulted in a new chip-to-chip bus, termed the Direct Rambus Channel (DRC) which includes a controller and one or more Direct RDRAMs connected together via a common bus. Using a limited number of high-speed signals to carry all address, data, and control information, DRC links main memory to system devices that have a need to access memory, including microprocessors, DSPs, graphics processors, and ASICs. Low voltage swing signaling is used with conventional PCB technology to permit data transfer up to 800Mbits/s/pin, resulting in the 1.6GB/s peak bandwidth that will be required for Intel's projected 1999 high-end systems. Table 1-1 Direct Rambus Technology Features Frequency Maximum Device Bandwidth Data Width Protocol Efficiency for 32-byte Transfers Voltage 800 MHz 1.6 Gbytes/sec 16 or 18 bits 95-100% 2.5/1.8V STR (Suspend to RAM) The CX6 supports the STR function. The STR function enables a PC to achieve the S3 state during idle periods, then quick “wake up” and retrieve the last “state” of the system before it went to sleep. When idle, STR-enabled systems consume only a small fraction of the power used for full operation. Instead of shutting down the system to save power when not in use and then having to reboot later, users can let the STR function take over and not have to worry about using power to run all the electronics, fans and disks. When needed, a PC with STR function can restore all applications and features to an operational state within a few seconds. CX6

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